Intel Patents

Intel Corporation designs and manufactures microprocessors and chipsets for computing and communications equipment manufacturers. Its products may be found in desktops, servers, tablets, smartphones and other devices.

Intel Patents by Type
  • Intel Patents Granted: Intel patents that have been granted by the United States Patent and Trademark Office (USPTO).
  • Intel Patent Applications: Intel patent applications that are pending before the United States Patent and Trademark Office (USPTO).
  • Patent number: 11967086
    Abstract: A method for trajectory generation based on player tracking is described herein. The method includes determining a temporal association for a first player in a captured field of view and determining a spatial association for the first player. The method also includes deriving a global player identification based on the temporal association and the spatial association and generating a trajectory based on the global player identification.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: April 23, 2024
    Assignee: INTEL CORPORATION
    Inventors: Yikai Fang, Qiang Li, Wenlong Li, Chenning Liu, Chen Ling, Hongzhi Tao, Yumeng Wang, Hang Zheng
  • Patent number: 11968380
    Abstract: An apparatus for encoding and decoding video receives a request to decode a current video frame. The apparatus determines whether encoding is within a threshold for a previous video frame. Additionally, the apparatus waits for the encoding to start if the encoding is within the threshold. Further, the apparatus provides a signal to begin encoding the current video frame. Also, the apparatus submits a decode workload to a graphics processor unit (GPU) for the current video frame. The apparatus additionally submits, in parallel with submitting the decode workload to the GPU, an encode workload to the GPU for the previous video frame.
    Type: Grant
    Filed: June 29, 2016
    Date of Patent: April 23, 2024
    Assignee: INTEL CORPORATION
    Inventors: Jiaping Wu, Kin-Hang Cheung, Bo Zhao
  • Patent number: 11966860
    Abstract: Disclosed examples include after a first tuning of hyperparameters in a hyperparameter space, selecting first hyperparameter values for respective ones of the hyperparameters; generating a polygonal shaped failure region in the hyperparameter space based on the first hyperparameter values; setting the first hyperparameter values to failure before a second tuning of the hyperparameters; and selecting second hyperparameter values for the respective ones of the hyperparameters in a second tuning region after the second tuning of the hyperparameters in the second tuning region, the second tuning region separate from the polygonal shaped failure region.
    Type: Grant
    Filed: March 4, 2022
    Date of Patent: April 23, 2024
    Assignee: Intel Corporation
    Inventors: Kevin Tee, Michael McCourt, Patrick Hayes, Scott Clark
  • Patent number: 11968689
    Abstract: Methods, systems, and storage media are described for monitoring downlink control information (DCI). In particular, some embodiments may be directed to monitoring DCI for an indication of channel occupancy time (COT) information. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: April 23, 2024
    Assignee: Intel Corporation
    Inventors: Yongjun Kwak, Bishwarup Mondal, Daewon Lee, Hwan-Joon Kwon, Lopamudra Kundu, Hong He
  • Patent number: 11966681
    Abstract: The computer executable instructions include a command that accepts multiple user input through various command options. The command encapsulates and implements multiple original software algorithms that convert trunking design intent, expressed via the command options, into trunks on multiple layers of a process technology node. Once executed, the command generates shapes of trunks of specified topology on specified layers. The command includes a set of options to generate a simple or complex trunking topology. The command accepts topology, set of zones, nets and many other options that the user provides to the command to yield trunks of a desired topology. The topology description is relative; thus, it can easily adjust as design changes. The command together with its options represents trunk creation intent.
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: April 23, 2024
    Assignee: Intel Corporation
    Inventors: Sergei Babokhov, Charles Magnuson
  • Patent number: 11968559
    Abstract: A device to host a service producer in a 5G system (or 5G system architecture), a method to be performed at the device, and a non-transitory storage device storing instructions to be executed at the device. The method includes: decoding a request from a service consumer to manage one or more 5G quality of service (QoS) indicators (5QIs), each 5QI including a 5QI value and corresponding 5QI characteristics; configuring one or more network functions (NFs) of the 5GS with the 5QIs based on the request; and encoding for transmission to the service consumer a message including a result of managing the one or more 5QIs.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: April 23, 2024
    Assignee: Intel Corporation
    Inventors: Yizhi Yao, Joey Chou
  • Patent number: 11966286
    Abstract: A memory device that performs internal ECC (error checking and correction) can selectively return read data with application of the internal ECC or without application of the internal ECC, in response to different read commands from the memory controller. The memory device can normally apply ECC and return corrected data in response to a normal read command. In response to a retry command, the memory device can return the read data without application of the internal ECC.
    Type: Grant
    Filed: April 7, 2022
    Date of Patent: April 23, 2024
    Assignee: Intel Corporation
    Inventors: Kuljit S. Bains, Rajat Agarwal, Jongwon Lee
  • Patent number: 11966268
    Abstract: Apparatus and methods for thermal management of electronic user devices are disclosed herein. An example apparatus includes at least one of a user presence detection analyzer to identify a presence of a user relative to an electronic device based on first sensor data generated by a first sensor or at least one of an image data analyzer or a motion data analyzer to determine a gesture of the user relative to the device based on second sensor data generated by a second sensor; a thermal constraint selector to select a thermal constraint for a temperature of an exterior surface of the electronic device based on one or more of the presence of the user or the gesture; and a power source manager to adjust a power level for a processor of the electronic device based on the thermal constraint.
    Type: Grant
    Filed: April 28, 2022
    Date of Patent: April 23, 2024
    Assignee: Intel Corporation
    Inventors: Columbia Mishra, Carin Ruiz, Helin Cao, Soethiha Soe, James Hermerding, II, Bijendra Singh, Navneet Singh
  • Patent number: 11966281
    Abstract: Systems, methods, and devices for isolating a misbehaving accelerator circuit, such as an accelerator function unit or an accelerated function context, are provided. An integrated circuit may include a region that includes an accelerator circuit. When the accelerator circuit issues a request, another region of the integrated circuit or a processor connected to the integrated circuit may determine whether there is a misbehavior associated with the request and, in response to determining that there is a misbehavior associated with the request, may perform a misbehavior response to mitigate a negative impact of the misbehavior of the accelerator circuit.
    Type: Grant
    Filed: April 18, 2022
    Date of Patent: April 23, 2024
    Assignee: Intel Corporation
    Inventors: Sundar Nadathur, Pratik M. Marolia, Henry M. Mitchel, Joseph J. Grecco, Utkarsh Y. Kakaiya, David A. Munday
  • Patent number: 11967980
    Abstract: Techniques are described related to digital radio control and operation. The various techniques described herein enable high-frequency local oscillator (LO) signal generation using injection locked cock multipliers (ILCMs). The techniques also include the use of LO signals for carrier aggregation applications for phased array front ends. Furthermore, the disclosed techniques include the use of array element-level control using per-chain DC-DC converters. Still further, the disclosed techniques include the use of adaptive spatial filtering and optimal combining of analog-to-digital converters (ADCs) to maximize dynamic range in digital beamforming systems.
    Type: Grant
    Filed: August 4, 2021
    Date of Patent: April 23, 2024
    Assignee: Intel Corporation
    Inventors: Ashoke Ravi, Benjamin Jann, Satwik Patnaik
  • Patent number: 11966998
    Abstract: Examples described herein relate to a graphics processing apparatus that includes a memory device and a graphics processing unit (GPU). In some examples, the GPU is configured to execute a shader program that is to identify at least two code blocks that are independent from each other and cause execution of an unexecuted independent code block with available data based on use of a scoreboard to track data availability for independent code blocks. In some examples, execution of the shader program is to cause the GPU to select a first code block identifier for tracking completion of a dependency of the first independent code block. In some examples, execution of the shader program is to cause the GPU to identify an offset to a first instruction position in a sequence of instructions of the first independent code block in an instruction queue.
    Type: Grant
    Filed: May 27, 2020
    Date of Patent: April 23, 2024
    Assignee: Intel Corporation
    Inventors: Rafal Rudnicki, Przemyslaw Szymanski
  • Patent number: 11967580
    Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate, a first die coupled to the package substrate with first interconnects, and a second die coupled to the first die with second interconnects, wherein the second die is coupled to the package substrate with third interconnects, a communication network is at least partially included in the first die and at least partially included in the second die, and the communication network includes a communication pathway between the first die and the second die.
    Type: Grant
    Filed: September 29, 2022
    Date of Patent: April 23, 2024
    Assignee: Intel Corporation
    Inventors: Adel A. Elsherbini, Amr Elshazly, Arun Chandrasekhar, Shawna M. Liff, Johanna M. Swan
  • Patent number: 11966742
    Abstract: Systems, methods, and apparatuses relating to instructions to reset software thread runtime property histories in a hardware processor are described. In one embodiment, a hardware processor includes a hardware guide scheduler comprising a plurality of software thread runtime property histories; a decoder to decode a single instruction into a decoded single instruction, the single instruction having a field that identifies a model-specific register; and an execution circuit to execute the decoded single instruction to check that an enable bit of the model-specific register is set, and when the enable bit is set, to reset the plurality of software thread runtime property histories of the hardware guide scheduler.
    Type: Grant
    Filed: May 3, 2023
    Date of Patent: April 23, 2024
    Assignee: Intel Corporation
    Inventors: Eliezer Weissmann, Mark Charney, Michael Mishaeli, Robert Valentine, Itai Ravid, Jason W. Brandt, Gilbert Neiger, Baruch Chaikin, Efraim Rotem
  • Patent number: 11966503
    Abstract: Systems, apparatuses, and methods to mitigate effects of glitch attacks on a broadcast communication bus are provided. The voltage levels of the communication bus are repeatedly sampled to identify glitch attacks. The voltage level on the communication bus can be overdriven or overwritten to either corrupt received messages or correct received messages.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: April 23, 2024
    Assignee: Intel Corporation
    Inventors: Marcio Juliato, Vuk Lesi, Christopher Gutierrez, Shabbir Ahmed, Qian Wang, Manoj Sastry
  • Patent number: 11966473
    Abstract: Methods, apparatus, systems and articles of manufacture to identify a side-channel attack are disclosed. Example instructions cause one or more processors to generate an event vector based on one or more counts corresponding to tasks performed by a central processing unit; determine distances between the event vector and weight vectors of neurons in a self-organizing map; select a neuron of the neurons that results based on a determined distance; identify neurons that neighbor the selected neuron; and update at least one of a weight vector of the selected neuron or weight vectors of the neighboring neurons based on the determined distance of the selected neuron.
    Type: Grant
    Filed: July 26, 2021
    Date of Patent: April 23, 2024
    Assignee: INTEL CORPORATION
    Inventors: Mohammad Mejbah Ul Alam, Justin Gottschlich, Shengtian Zhou
  • Patent number: 11967129
    Abstract: Apparatuses, methods and storage medium associated with multi-camera devices are disclosed herein. In embodiments, a multi-camera device may include 3 or more camera sensors disposed on a world facing side of the multi-camera device. Further, the multi-camera device may be configured to provide a soft shutter button at a location on an opposite side to the world facing side, coordinated with locations of the 3 or more camera sensors that reduces likelihood of blocking of one or more of the 3 or more camera sensors. Other embodiments may be disclosed or claimed.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: April 23, 2024
    Assignee: Intel Corporation
    Inventors: Russell S. Love, Peter W. Winer, James Granger, Gerald A. Pham, Ka-Kei Wong, Varun Nasery, Kabeer R. Manchanda, Yu-Tseh Chi, Ali Mehdizadeh
  • Patent number: 11966330
    Abstract: Examples described herein relate to processor circuitry to issue a cache coherence message to a central processing unit (CPU) cluster by selection of a target cluster and issuance of the request to the target cluster, wherein the target cluster comprises the cluster or the target cluster is directly connected to the cluster. In some examples, the selected target cluster is associated with a minimum number of die boundary traversals. In some examples, the processor circuitry is to read an address range for the cluster to identify the target cluster using a single range check over memory regions including local and remote clusters. In some examples, issuance of the cache coherence message to a cluster is to cause the cache coherence message to traverse one or more die interconnections to reach the target cluster.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: April 23, 2024
    Assignee: Intel Corporation
    Inventors: Vinit Mathew Abraham, Jeffrey D. Chamberlain, Yen-Cheng Liu, Eswaramoorthi Nallusamy, Soumya S. Eachempati
  • Patent number: 11966334
    Abstract: Systems, methods, and apparatuses relating to linear address masking architecture are described. In one embodiment, a hardware processor includes an address generation unit to generate a linear address for a memory access request to a memory, at least one control register comprising a user mode masking bit and a supervisor mode masking bit, a register comprising a current privilege level indication, and a memory management unit to mask out a proper subset of bits inside an address space of the linear address for the memory access request based on the current privilege level indication and either of the user mode masking bit or the supervisor mode masking bit to produce a resultant linear address, and output the resultant linear address.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: April 23, 2024
    Assignee: Intel Corporation
    Inventors: Ron Gabor, Igor Yanover
  • Patent number: 11966843
    Abstract: Methods, apparatus, systems and articles of manufacture for distributed training of a neural network are disclosed. An example apparatus includes a neural network trainer to select a plurality of training data items from a training data set based on a toggle rate of each item in the training data set. A neural network parameter memory is to store neural network training parameters. A neural network processor is to generate training data results from distributed training over multiple nodes of the neural network using the selected training data items and the neural network training parameters. The neural network trainer is to synchronize the training data results and to update the neural network training parameters.
    Type: Grant
    Filed: June 13, 2022
    Date of Patent: April 23, 2024
    Assignee: Intel Corporation
    Inventors: Meenakshi Arunachalam, Arun Tejusve Raghunath Rajan, Deepthi Karkada, Adam Procter, Vikram Saletore
  • Patent number: 11967615
    Abstract: Embodiments of the present invention are directed to dual threshold voltage (VT) channel devices and their methods of fabrication. In an example, a semiconductor device includes a gate stack disposed on a substrate, the substrate having a first lattice constant. A source region and a drain region are formed on opposite sides of the gate electrode. A channel region is disposed beneath the gate stack and between the source region and the drain region. The source region is disposed in a first recess having a first depth and the drain region disposed in a second recess having a second depth. The first recess is deeper than the second recess. A semiconductor material having a second lattice constant different than the first lattice constant is disposed in the first recess and the second recess.
    Type: Grant
    Filed: December 23, 2015
    Date of Patent: April 23, 2024
    Assignee: Intel Corporation
    Inventors: Hsu-Yu Chang, Neville L. Dias, Walid M. Hafez, Chia-Hong Jan, Roman W. Olac-Vaw, Chen-Guan Lee
  • Publication number: 20240126691
    Abstract: Technologies for cryptographic separation of MMIO operations with an accelerator device include a computing device having a processor and an accelerator. The processor establishes a trusted execution environment. The accelerator determines, based on a target memory address, a first memory address range associated with the memory-mapped I/O transaction, generates a second authentication tag using a first cryptographic key from a set of cryptographic keys, wherein the first key is uniquely associated with the first memory address range. An accelerator validator determines whether the first authentication tag matches the second authentication tag, and a memory mapper commits the memory-mapped I/O transaction in response to a determination that the first authentication tag matches the second authentication tag. Other embodiments are described and claimed.
    Type: Application
    Filed: September 7, 2023
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventors: Luis S. Kida, Reshma Lal, Soham Jayesh Desai
  • Publication number: 20240126615
    Abstract: Embodiments for orchestrating execution of workloads on a distributed computing infrastructure are disclosed herein. In one example, environment data is received for compute devices in a distributed computing infrastructure. The environment data is indicative of an operating environment of the respective compute devices and a physical environment of the respective locations of the compute devices. Future operating conditions of the compute devices are predicted based on the environment data, and workloads are orchestrated for execution on the distributed computing infrastructure based on the predicted future operating conditions.
    Type: Application
    Filed: December 13, 2023
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventors: Sundar Nadathur, Akhilesh Thyagaturu, Jonathan L. Kyle, Scott M. Baker, Woojoong Kim
  • Publication number: 20240126695
    Abstract: Various embodiments are generally directed to virtualized systems. A first guest memory page may be identified based at least in part on a number of accesses to a page table entry for the first guest memory page in a page table by an application executing in a virtual machine (VM) on the processor, the first guest memory page corresponding to a first byte-addressable memory. The execution of the VM and the application on the processor may be paused. The first guest memory page may be migrated to a target memory page in a second byte-addressable memory, the target memory page comprising one of a target host memory page and a target guest memory page, the second byte-addressable memory having an access speed faster than an access speed of the first byte-addressable memory.
    Type: Application
    Filed: December 21, 2023
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventors: Yao Zu DONG, Kun TIAN, Fengguang WU, Jingqi LIU
  • Publication number: 20240126357
    Abstract: Embodiments provided a blend circuit configured to perform a power optimized blend using blend circuitry configured such that the dynamic power consumed during the blending of two input color values is reduced when the input colors are close in value. When blending two identical input color values, a portion of the blend circuit can be bypassed and clock and/or data gated.
    Type: Application
    Filed: December 20, 2023
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventor: Theo Drane
  • Publication number: 20240126964
    Abstract: Described herein is a technique for automated detection of case-splitting opportunities in RTL. The techniques described herein facilitate the integration of case-splitting into a hardware design tool flow, allowing the generation of hardware designs that do not suffer from timing violations. One embodiment provides a method comprising analyzing a first hardware description in a hardware description language to identify a critical path in a circuit represented by the hardware description, automatically detecting a case-splitting opportunity within the critical path, generating hardware description language for a case split having determined operator domain restrictions, and outputting a second hardware description including the hardware description language for the case split, wherein the second hardware description has a reduced operator hardware cost for the critical path relative to the first hardware description.
    Type: Application
    Filed: December 22, 2023
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventors: Samuel Coward, Theo Drane, George A. Constantinides
  • Publication number: 20240126967
    Abstract: Described herein are techniques to automatically create a software model which covers the core functionality of a semiconductor design to be formally verified and can be easily consumed by a formal verification tool for software or semiconductor designs. These techniques enable verification engineers to expand the scope of formal verification to fix both software and RTL bugs, saving significant design time and reducing the time to market of for new products.
    Type: Application
    Filed: December 22, 2023
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventors: Disha Puri, Sparsa Roychowdhury, Geethabai Biradar, Theo Drane, Achutha Kiran Kumar M V
  • Publication number: 20240128982
    Abstract: A hardware accelerator device is provided with circuitry to perform one or more reversible data transforms on data based on a request and compress the transformed data to generate compressed transformed data. The hardware accelerator device generates an output including the compressed transformed data and transform metadata indicating the set of reversible data transforms applied to the compressed transformed data.
    Type: Application
    Filed: December 27, 2023
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventors: Smita Kumar, Patrick Fleming
  • Publication number: 20240127478
    Abstract: Technologies for performing sensor fusion include a compute device. The compute device includes circuitry configured to obtain detection data indicative of objects detected by each of multiple sensors of a host system. The detection data includes camera detection data indicative of a two or three dimensional image of detected objects and lidar detection data indicative of depths of detected objects. The circuitry is also configured to merge the detection data from the multiple sensors to define final bounding shapes for the objects.
    Type: Application
    Filed: December 4, 2023
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventors: Soila Kavulya, Rita Chattopadhyay, Monica Lucia Martinez-Canales
  • Publication number: 20240126519
    Abstract: Described herein is a technique and associated tool for automatic program code optimization for high-level synthesis. The tool can efficiently explore multiple representations of an input program using e-graph rewriting and determine an HLS-efficient representation of program code for input into high-level synthesis tools.
    Type: Application
    Filed: December 26, 2023
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventors: Jianyi Cheng, Samuel Coward, Lorenzo Chelini, Rafael Barbalho, Theo Drane
  • Publication number: 20240128023
    Abstract: Disclosed herein are IC structures with one or more decoupling capacitors based on dummy TSVs provided in a support structure. An example decoupling capacitor includes first and second capacitor electrodes and a capacitor insulator between them. The first capacitor electrode is a liner of a first electrically conductive material on sidewalls and a bottom of an opening in the support structure, the opening in the support structure extending from the first side towards, but not reaching, the second side. The capacitor insulator is a liner of a dielectric material on sidewalls and a bottom of the opening in the support structure lined with the first electrically conductive material. The second capacitor electrode is a second electrically conductive material filling at least a portion of the opening in the support structure lined with the first electrically conductive material and with the dielectric material.
    Type: Application
    Filed: December 27, 2023
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventor: Changyok Park
  • Publication number: 20240128340
    Abstract: Disclosed herein are integrated circuit (IC) contact structures, and related devices and methods. For example, in some embodiments, an IC contact structure may include an electrical element, a metal on the electrical element, and a semiconductor material on the metal. The metal may conductively couple the semiconductor material and the electrical element.
    Type: Application
    Filed: December 26, 2023
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventors: Patrick Morrow, Glenn A. Glass, Anand S. Murthy, Rishabh Mehandru
  • Publication number: 20240127414
    Abstract: Systems and methods for tone mapping of high dynamic range (HDR) images for high-quality deep learning based processing are disclosed. In one embodiment, a graphics processor includes a media pipeline to generate media requests for processing images and an execution unit to receive media requests from the media pipeline. The execution unit is configured to compute an auto-exposure scale for an image to effectively tone map the image, to scale the image with the computed auto-exposure scale, and to apply a tone mapping operator including a log function to the image and scaling the log function to generate a tone mapped image.
    Type: Application
    Filed: October 20, 2023
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventor: Attila Tamas Afra
  • Publication number: 20240128255
    Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface, and a die secured to the package substrate, wherein the die has a first surface and an opposing second surface, the die has first conductive contacts at the first surface and second conductive contacts at the second surface, and the first conductive contacts are coupled to conductive pathways in the package substrate by first non-solder interconnects.
    Type: Application
    Filed: December 27, 2023
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventors: Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan, Arun Chandrasekhar
  • Publication number: 20240130002
    Abstract: Various technologies relating to wireless sensor networks (WSNs) are disclosed, including, but not limited to, device onboarding and authentication, network association and synchronization, data logging and reporting, asset tracking, and automated flight state detection.
    Type: Application
    Filed: March 3, 2022
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventors: Rahul Khanna, Yi Qian, Greeshma Pisharody, Raju Arvind, Jiejie Wang, Laura M. Rumbel, Christopher R. Carlson, Jennifer M. Williams, Prince Adu Agyeman
  • Publication number: 20240128247
    Abstract: Embodiments described herein enable a microelectronic assembly that includes: a first substrate comprising glass and at least one inductor, the first substrate having a first side and an opposing second side; a second substrate coupled to the first side of the first substrate; and a plurality of integrated circuit (IC) dies. A first subset of the plurality of IC dies is directly coupled to the second side of the first substrate, a second subset of the plurality of IC dies is directly coupled to the second substrate adjacent to the first substrate, and a third subset of the plurality of IC dies is embedded in the second substrate between the first substrate and the second subset of the plurality of IC dies.
    Type: Application
    Filed: October 14, 2022
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventors: Brandon C. Marin, Kristof Kuwawi Darmawikarta, Srinivas V. Pietambaram, Gang Duan, Jeremy Ecton, Suddhasattwa Nad, Hiroki Tanaka
  • Publication number: 20240130068
    Abstract: Technologies for a flexible three-dimensional power plane in a chassis are disclosed. In one embodiment, a flexible ribbon cable is laid along a circuit board tray. The flexible ribbon cable is secured to the tray using power bosses. The power bosses connect to one or more conductors on the ribbon cable. When the circuit board is mounted on the circuit board tray, the power bosses extend through holes in the circuit board and mate with power clips on the surface of the circuit board tray. The ribbon cable, power bosses, and power clips can distribute power to various locations on the circuit board, without requiring large traces that take up space on the circuit board.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventors: Nan Wang, Zhichao Z. Zhang, Lihui Wu, Jialiang Xu, Xiaoguo Liang, Bo Chen, Haifeng Gong
  • Publication number: 20240127031
    Abstract: A graph neural network (GNN) model is used in a scheduling process for compiling a deep neural network (DNN). The DNN, and parameter options for scheduling the DNN, are represented as a graph, and the GNN predicts a set of parameters that is expected to have a low cost. Using the GNN-based model, a compiler can produce a schedule for compiling the DNN in a relatively short and predictable amount of time, even for DNNs with many layers and/or many parameter options. For example, the GNN-based model reduces the overhead of exploring every parameter combination and does not exclude combinations from consideration like prior heuristic-based approaches.
    Type: Application
    Filed: December 22, 2023
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventors: Hamza Yous, Ian Hunter, Alessandro Palla
  • Publication number: 20240128138
    Abstract: Semiconductor packages and methods for forming semiconductor packages are disclosed. An example semiconductor package includes a substrate and a core. An insulator material is present over the core, and along a direction perpendicular to a first surface of the core, a portion of the insulator material is between the core and a first surface of the substrate. A via extends between the first surface of the core and a second surface of the core in the direction perpendicular to the first surface of the core. A bridge die is in a recess in the substrate. The bridge die is coupled with the via. An electronic component is coupled to an end of the via at a second surface of the substrate.
    Type: Application
    Filed: December 21, 2023
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventors: Robert L. Sankman, Rahul N. Manepalli, Robert Alan May, Srinivas Venkata Ramanuja Pietambaram, Bharat P. Penmecha
  • Publication number: 20240127408
    Abstract: Embodiments are generally directed to an adaptive deformable kernel prediction network for image de-noising. An embodiment of a method for de-noising an image by a convolutional neural network implemented on a compute engine, the image including a plurality of pixels, the method comprising: for each of the plurality of pixels of the image, generating a convolutional kernel having a plurality of kernel values for the pixel; generating a plurality of offsets for the pixel respectively corresponding to the plurality of kernel values, each of the plurality of offsets to indicate a deviation from a pixel position of the pixel; determining a plurality of deviated pixel positions based on the pixel position of the pixel and the plurality of offsets; and filtering the pixel with the convolutional kernel and pixel values of the plurality of deviated pixel positions to obtain a de-noised pixel.
    Type: Application
    Filed: November 20, 2023
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventors: Anbang Yao, Ming Lu, Yikai Wang, Xiaoming Chen, Junjie Huang, Tao Lv, Yuanke Luo, Yi Yang, Feng Chen, Zhiming Wang, Zhiqiao Zheng, Shandong Wang
  • Publication number: 20240128181
    Abstract: Embodiments of a microelectronic assembly that includes: a package substrate comprising a plurality of layers of organic dielectric material and conductive traces alternating with conductive vias in alternate layers of the organic dielectric material; and a plurality of integrated circuit dies coupled to a first side of the package substrate by interconnects, in which: the plurality of layers of the organic dielectric material comprises at least a first layer having a conductive via and a second layer having a conductive trace in contact with the conductive via, the second layer is not coplanar with the first layer, sidewalls of the conductive via are orthogonal to the conductive trace, and two opposing sidewalls of the conductive via separated by a width of the conductive via protrude from respectively proximate edges of the conductive trace by a protrusion that is at least ten times less than the width of the conductive via.
    Type: Application
    Filed: October 17, 2022
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventors: Jeremy Ecton, Brandon C. Marin, Srinivas V. Pietambaram, Hiroki Tanaka, Haobo Chen
  • Publication number: 20240129804
    Abstract: For example, an Access Point (AP) may be configured to process network slicing information including slice identification information and Service Level Agreement (SLA) information, wherein the slice identification information is to identify one or more Quality of Service (QoS) network slices. For example, the AP may be configured to determine a configuration of one or more radio resource allocations to be assigned to the one or more QoS network slices, and to transmit a network slicing advertisement including network slicing assignment information to indicate an assignment of the one or more radio resource allocations to the one or more QoS network slices.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventors: Roya Doostnejad, Ehud Reshef, Laurent Cariou
  • Publication number: 20240129058
    Abstract: For example, an apparatus may include a segment parser to parse scrambled data bits of a PPDU into a first plurality of data bits and a second plurality of data bits, the PPDU to be transmitted in an OFDM transmission over an aggregated bandwidth comprising a first channel in a first frequency band and a second channel in a second frequency band; a first baseband processing block to encode and modulate the first plurality of data bits according to a first OFDM MCS for transmission over the first channel in the first frequency band; and a second baseband block to encode and modulate the second plurality of data bits according to a second OFDM MCS for transmission over the second channel in the second frequency band.
    Type: Application
    Filed: October 17, 2023
    Publication date: April 18, 2024
    Applicant: INTEL CORPORATION
    Inventors: Alexander W. Min, Thomas J. Kenney, Laurent Cariou, Shahrnaz Azizi, Xiaogang Chen, Robert J. Stacey, Qinghua Li
  • Publication number: 20240129496
    Abstract: Methods, systems, and articles are described herein related to video coding. The method comprises receiving compressed image data of video frames including a block of image data of at least one of the frames. The method also comprises receiving first partition data to be used to decode the compressed image data and indicating a partition in the block. This method comprises detecting whether or not the block has an illegal block partition. Also, the method comprises generating second partition data to indicate the illegal block partition of the block is to be ignored. Further, the method includes decoding the block at least according to the second partition data.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventor: Tsung-Han Yang
  • Publication number: 20240129503
    Abstract: Described herein is a data processing system having a multisample antialiasing compressor coupled to a texture unit and shader execution array. In one embodiment, the data processing system includes a memory device to store a multisample render target, the multisample render target to store color data for a set of sample locations of each pixel in a set of pixels; and general-purpose graphics processor comprising a multisample antialiasing compressor to apply multisample antialiasing compression to color data generated for the set of sample locations of a first pixel in the set of pixels and a multisample render cache to store color data generated for the set of sample locations of the first pixel in the set of pixels, wherein color data evicted from the multisample render cache is to be stored to the multisample render target.
    Type: Application
    Filed: October 23, 2023
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventors: Prasoonkumar Surti, Abhishek R. Appu, Michael J. Norris, Eric G. Liskay
  • Publication number: 20240129944
    Abstract: For example, a wireless communication device may be configured to determine an expected interference-based value corresponding to an Uplink (UL) transmission from a wireless communication station (STA) in a Trigger-Based (TB) Multi-User (MU) UL transmission to be communicated from a plurality of STAs to the wireless communication device; to determine one or more transmit (Tx) configuration parameters for the STA based on the expected interference-based value corresponding to the UL transmission from the STA; and to transmit a trigger frame to trigger the TB MU UL transmission, the trigger frame including the one or more Tx configuration parameters to configure the UL transmission from the STA.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 18, 2024
    Applicant: INTEL CORPORATION
    Inventors: Alexander W. Min, Arik Klein, Rath Vannithamby, Ziv Avital
  • Patent number: 11960887
    Abstract: Techniques related to packing pieces of data having variable bit lengths to serial packed data using a graphics processing unit and a central processing unit are discussed. Such techniques include executing bit shift operations for the pieces of data in parallel via execution units of the graphics processing unit and packing the bit shifted pieces of data via the central processing unit.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Bin Wang, Bo Peng
  • Patent number: 11962320
    Abstract: A semiconductor chip providing on-chip self-testing of an Analog-to-Digital Converter, ADC, implemented in the semiconductor chip is provided. The semiconductor chip comprises the ADC and a Digital-to-Analog Converter, DAC, configured to generate and supply a radio frequency test signal to the ADC via a supply path. The ADC is configured to generate digital output data based on the radio frequency test signal. The semiconductor chip further comprises a reference data generation circuit configured to generate digital reference data. Additionally, the semiconductor chip comprises a comparator circuit configured to compare the digital output data to the digital reference in order to determine error data.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Kameran Azadet, Martin Clara, Daniel Gruber, Albert Molina, Hundo Shin
  • Patent number: 11962644
    Abstract: In one embodiment, an apparatus comprises circuitry, wherein the circuitry is configured to: receive, via a communications network, context information for a first set of one or more edge devices, wherein the context information identifies an operating environment of the first set of edge devices based on information from one or more sensors; receive, via the communications network, workload information for a second set of one or more edge devices; determine workload assignments for the first set of edge devices based on the context information for the first set of edge devices and based on the workload information for the second set of edge devices; and transmit, via the communications network, the workload assignments to the first set of edge devices.
    Type: Grant
    Filed: July 2, 2016
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Katalin Klara Bartfai-Walcott, Hassnaa Moustafa
  • Patent number: 11957974
    Abstract: Described herein is a cloud-based gaming system in which graphics processing operations of a cloud-based game can be performed on a client device. Client-based graphics processing can be enabled in response to a determination that the client includes a graphics processor having a performance that exceeds a minimum threshold. When a game is remotely executed and streamed to a client, the client is configurable to provide network feedback that can be used to adjust execution and/or encoding for the game.
    Type: Grant
    Filed: February 5, 2021
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Makarand Dharmapurikar, Rajabali Koduri, Vijay Bahirji, Toby Opferman, Scott G. Christian, Rajeev Penmatsa, Selvakumar Panneer
  • Patent number: D1023975
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: April 23, 2024
    Assignee: Intel Corporation
    Inventors: Samantha Rao, Harish Jagadish, Arvind S