Patents Examined by Timothy J Thompson
  • Patent number: 11939461
    Abstract: A non-ohmic composition including a base elastomer and a plurality of non-ohmic particles, wherein, in a case of comparing volume resistivities ? for the non-ohmic composition within a range of E?Eth for the non-ohmic composition not elongated, the E being an electric field strength applied to the non-ohmic composition, the ? being the volume resistivity of the non-ohmic composition, and the Eth being a threshold electric field strength at a point where an absolute value of a variation in a slope of log ? with respect to log E is maximum, the volume resistivity ? for the non-ohmic composition uniaxially elongated by 50% is 50 times or less the volume resistivity ? for the non-ohmic composition not elongated.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: March 26, 2024
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Shuhei Yasuda, Takanori Yamazaki, Shinya Nishikawa
  • Patent number: 11942241
    Abstract: An improved electric cable is disclosed herein. The resistance of the electric cable of the present disclosure is surprisingly decreased despite a reduction in the cross-sectional area of the conductor when at least one metal slug is positioned at an end of the cable. Conductor wires, which may or may not be individually insulated, may extend around a metal slug or through an aperture of the slug. In combination with at least one metal slug, the cross-sectional area of individual wires or the amount of wires within a stranded wire cable may be substantially reduced without seeing an expected proportionate increase in electrical resistance, and surprisingly, a decrease in resistance may be observed.
    Type: Grant
    Filed: May 20, 2021
    Date of Patent: March 26, 2024
    Inventor: Lubomir Dostal
  • Patent number: 11942658
    Abstract: A battery system for an electric vehicle includes a fixed cover, and a removable cover arranged over battery modules and a high voltage distribution system. The battery system includes a busbar arranged at least partially over a region of the battery modules and under the removable cover. The busbar includes a fixed section and a movable section, or a hinge, such that the busbar can be repositioned out of the way. The support tray includes a link between the fixed and movable sections. Floating fasteners, allowing at least one of radial float and axial float are used to secure the link to the support tray, thereby avoiding safety hazards and reducing the potential for short circuits in high voltage distribution systems or conductors thereof. The floating fasteners include a head, a neck, an engagement section, and a washer, which prevent removal from a component once installed.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: March 26, 2024
    Assignee: Rivian IP Holdings, LLC
    Inventors: Ehsan Baseri, Kyle Butterfield, Luke Rayment Morrow, Akshay Kishor Murkute, Jonathan Verghese
  • Patent number: 11943865
    Abstract: A transparent conductive film (TCF) and methods for creating the TCF. The TCF includes a substrate having a surface, a metal mesh layer over at least a portion of the surface of the substrate, and a conductive layer over the metal mesh layer. The conductive layer includes carbon nanotubes and a binder.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: March 26, 2024
    Assignee: Chasm Advanced Materials, Inc.
    Inventors: Richard P. Heroux, Timothy Alan Turner, David Joseph Arthur, Sean Patrick Arthur
  • Patent number: 11935671
    Abstract: The disclosed technology relates to a cable configured for high current applications. The cable includes a conducting member having a conductor surrounded by an insulating layer, and a cooling conduit having a tubular portion and a coolant. The coolant is configured to flow within the tubular portion to cool the conductor. The conducting member is spiral wound around the cooling conduit along a length of the cooling conduit to increase a contact area between the conducting member and the cooling conduit to thereby improve a transfer of heat from the conducting member to the cooling conduit.
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: March 19, 2024
    Assignee: Apple Inc.
    Inventors: Guan Che Ting, Jacob F. Gowan, Venus K. Garg, Tyson B. Manullang
  • Patent number: 11931930
    Abstract: The present embodiments generally describe a monolithic, e.g., integral, box unit and methods of manufacturing monolithic box units. The monolithic box unit has a ring portion and a body portion, both of which are molded and set simultaneously. The method proceeds with filling a female oriented cavity with a Polymer mixture, allowing both the ring portion and body portion to fill and cure at the same time. Once ejected from the cavity, the entire unit can be trimmed and then add hardware and cover to complete the box.
    Type: Grant
    Filed: December 23, 2022
    Date of Patent: March 19, 2024
    Assignee: Newbasis, LLC
    Inventors: Martin Harrington, Matt Stockbridge, Adrian Garcia
  • Patent number: 11936174
    Abstract: A device to be attached to an overhead power line for the purpose of manipulating movement of the overhead power line comprises an electric power source; a base, defining a base plane; and a clamp, secured to the base, to be attached to a section of the overhead power line. The device further comprises a flywheel, having a rotational axis; an actuator, arranged to adjust the rotational axis of the flywheel in dependency of an actuator control signal; and an electric motor, arranged to rotate the flywheel about the rotational axis in dependency of a motor control signal. The device further comprises an acceleration sensing device, secured to the base, providing an acceleration signal; and a controller device, arranged to receive the acceleration signal and to provide the motor control signal and the actuator control signal. The controller device is configured to operate in an overhead power line stabilizing mode.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: March 19, 2024
    Assignee: A&M Utvikling AS
    Inventors: Andreas Fors Haugen, Magnus Haugen
  • Patent number: 11936171
    Abstract: Disclosed are methods and apparatus for providing and installing electrical wire connector clamps that may be inserted into knockout holes from the inside of an electrical box or panel, that are capable of holding multiple wires or cables, that may be run through the connector before it is slotted into the hole, and that use only a minimal amount of interior space of the electrical box or panel. Embodiments of the present invention include semi-cylindrical units that may be folded together around one or more wires for secure engagement with the wires and with a knockout hole of an electrical box or panel. Embodiments may be used in new construction, and to replace existing connector clamps in an electrical box or panel from the inside without damaging the walls surrounding the box or panel, in order to securely hold wires in an electrical box or panel, add new wire(s), hold multiple wires, and/or increase available space inside the box or panel.
    Type: Grant
    Filed: June 16, 2023
    Date of Patent: March 19, 2024
    Assignee: Genwire LLC
    Inventors: James Henry Finn, III, Fraser McKay
  • Patent number: 11937364
    Abstract: A highly heat-dissipating flexible printed circuit board (GFPCB) efficiently emits heat transferred from a heat source such as an LED to the flexible printed circuit board. The highly heat-dissipating flexible printed circuit board comprises: a flexible board layer which is formed in a flexibly bendable thin-film form by bonding a polyimide (PI) film to the lower side of a copper (Cu) film using an adhesive and has a heat element installed on the upper side thereof; and a heat dissipation layer which is formed in a thin-film form by coating any one of graphitic carbon and a graphite powder binder on the upper side of an aluminum (Al) film and is bonded to the lower side of the flexible board layer using a pressure sensitive adhesive (PSA) to receive heat generated and transferred from the heat element and emit the heat to the outside.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: March 19, 2024
    Assignees: SOLUETA
    Inventor: Seong Hwan Jung
  • Patent number: 11929354
    Abstract: A power semiconductor module includes a half-bridge circuit having a first power semiconductor element and a second power semiconductor element that are connected in series with each other. The power semiconductor module also includes first to third external terminals, a first wiring member that connects a high-potential-side main electrode of the first power semiconductor element to the first external terminal, a second wiring member that connects a low-potential-side main electrode of the second power semiconductor element to the second external terminal, a third wiring member that connects an output of the half-bridge circuit to a third external terminal, and at least one of a first corrosion sensor disposed in an installation environment of the first wiring member, a second corrosion sensor disposed in an installation environment of the second wiring member, or a third corrosion sensor disposed in an installation environment of the third wiring member.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: March 12, 2024
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Masanari Fujii
  • Patent number: 11923109
    Abstract: The present disclosure describes a grommet formed of a polymeric material and adapted for securing a cable within a cable hanger. The grommet includes a main body having a generally cylindrical profile surrounding an interior cavity, the main body further having a length, a thickness, and a longitudinal axis, a slot extending the length of the main body which provides an entry point for the cable to be inserted into the interior cavity, a plurality of flex retention members extending into the interior cavity configured to grip and secure the cable within the interior cavity, and one or more grip enhancement features residing between an inner surface of the main body and the flex retention members. The grip enhancement features are configured to provide additional support to the flex retention members when a cable is inserted into the interior cavity.
    Type: Grant
    Filed: March 15, 2022
    Date of Patent: March 5, 2024
    Assignee: CommScope Technologies LLC
    Inventors: Ronald A. Vaccaro, Aviral Joshi
  • Patent number: 11923128
    Abstract: An electronic component includes an insulating layer, a low voltage conductor pattern formed inside the insulating layer, a high voltage conductor pattern formed inside the insulating layer such as to face the low voltage conductor pattern in an up/down direction, and a withstand voltage enhancement structure of conductive property formed inside the insulating layer and along the high voltage conductor pattern such as to protrude further outside than the low voltage conductor pattern in plan view.
    Type: Grant
    Filed: December 6, 2022
    Date of Patent: March 5, 2024
    Assignee: ROHM CO., LTD.
    Inventors: Taketoshi Tanaka, Kosei Osada, Masahiko Arimura
  • Patent number: 11923112
    Abstract: A shielded electrical ribbon cable includes adjacent first and second longitudinal conductor sets where each conductor set includes two or more insulated conductors. The first conductor set also includes a ground conductor that generally lies in the plane of the insulated conductors of the first conductor set. At least 90% of the periphery of each conductor set is encompassed by a shielding film. First and second non-conductive polymeric films are disposed on opposite sides of the cable and form cover portions substantially surrounding each conductor set, and pinched portions on each side of each conductor set. When the cable is laid flat, the distance between the center of the ground conductor of the first conductor set and the center of the nearest insulated conductor of the second conductor set is ?1, the center-to-center spacing of the insulated conductors of the second conductor set is ?2, and ?1/?2 is greater than 0.7.
    Type: Grant
    Filed: April 7, 2022
    Date of Patent: March 5, 2024
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Douglas B. Gundel, Rocky D. Edwards, Mark M. Lettang, Charles F. Staley
  • Patent number: 11925099
    Abstract: A flexible substrate, a manufacturing method thereof, and a flexible display device are provided. The method includes: step S10, forming a first aerogel layer with a cross-linked structure and a nanoporous structure on a substrate; step S20: forming an inorganic layer on the first aerogel layer; step S30, forming a second flexible substrate layer on the first aerogel layer, and allowing the second flexible substrate layer to cover the inorganic layer; and step S40, peeling the first aerogel layer, the inorganic layer, and the second flexible substrate layer from the substrate to form the flexible substrate.
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: March 5, 2024
    Assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
    Inventor: Linshuang Li
  • Patent number: 11924980
    Abstract: A method for manufacturing a multilayer substrate including first and second insulating resin base material layers including different materials, includes configuring a conductor film-attached insulating resin base material with a conductor film on the first insulating resin base material layer, or a second conductor film-attached insulating resin base material with a conductor film on a main surface of the first insulating resin base material layer including a main surface of a stacked body including at least the first insulating resin base material layer, and stacking the first or second conductor film-attached insulating resin base material and another base material layer such that the conductor film is in contact with the second insulating resin base material layer. An adhesion strength of the first insulating resin base material layer to the conductor film is higher than an adhesion strength of the second insulating resin base material layer to the conductor film.
    Type: Grant
    Filed: January 14, 2022
    Date of Patent: March 5, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yusuke Kamitsubo, Tomohiro Furumura
  • Patent number: 11916240
    Abstract: A secondary battery includes: an electrode assembly including electrode sheets and a separator interposed between the electrode sheets; a pouch-like battery casing in which the electrode assembly is received; an electrode lead connected to the electrode assembly and protruding out from the battery casing; and a lead film covering the electrode lead and interposed between the electrode lead and the battery casing, wherein the lead film includes an outer layer covering the electrode lead and an inner layer disposed inside of the outer layer, and the inner layer includes a material having a higher air permeability as compared to the outer layer.
    Type: Grant
    Filed: December 8, 2021
    Date of Patent: February 27, 2024
    Assignee: LG Energy Solution, Ltd.
    Inventors: Hun-Hee Lim, Sang-Hun Kim, Min-Hyeong Kang, Hyung-Kyun Yu
  • Patent number: 11917797
    Abstract: The disclosure relates to capacitive heatsink devices and systems. In one embodiment, the heat sink capacitor includes a positive (P) bus plate; a negative (N) bus plate; a first dielectric material; a second dielectric material; and a heat sink comprising a first side and a second side, the first side of the heat sink attached to the first dielectric material and the second dielectric material, wherein the first dielectric material and the second dielectric material are separated by a portion of the heat sink, wherein the first dielectric material electrically insulates the P bus plate from the first side of the heat sink to form a first capacitor, and wherein the second dielectric material electrically insulates the N bus plate from the first side of the heat sink to form a second capacitor.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: February 27, 2024
    Assignee: The Florida State University Research Foundation, Inc.
    Inventors: Yanjun Shi, Sam Yang
  • Patent number: 11909192
    Abstract: An electronic module is provided with a housing with an inlet to conduct alternating current (AC) power and an outlet to conduct direct current (DC) power to charge a vehicle battery, the housing defining a cavity. A circuit board assembly is supported within the cavity to convert the AC power to DC power. At least two power distribution wires are connected between the circuit board assembly and the outlet. A base is supported by the housing and extends between the at least two power distribution wires and the circuit board assembly to shield the DC power from electromagnetic interference generated by the circuit board assembly. A plurality of walls extend transversely from the base and are spaced apart from each other to define at least two channels, each channel is sized to receive one of the at least two power distribution wires.
    Type: Grant
    Filed: June 8, 2021
    Date of Patent: February 20, 2024
    Assignee: LEAR CORPORATION
    Inventors: Parminder Brar, Michael Scott Duco, Rutunj Rai, Jared Pieknik
  • Patent number: 11898621
    Abstract: A wire guide device A includes a wire guide body 15 that is formed by coupling a plurality of link members 17 in series such that the link members 17 can rotate relative to each other, and inside which an accommodation space 16 for a wire W is formed. The link member 17 includes a link body 20 and a lid 31. The link body 20 is provided with an opening 29 through which the accommodation space 16 is open toward the outside of the wire guide body 15. The lid 31 is locked to the link body 20 and thereby closes the opening 29. The openings 29 and the lids 31 are arranged on surfaces of the link members 17 that are located on an inner side of a curved portion of the wire guide body 15 when the wire guide body 15 is curved.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: February 13, 2024
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Kazuma Isoda, Hiroki Uno
  • Patent number: 11903145
    Abstract: A wiring board may include a core portion having first and second surfaces, and first and second buildup portions on the first and second surfaces, respectively. Each of the first and second buildup portions may include a first insulating layer on the core portion, a wire pattern on the first insulating layer, a second insulating layer on the first insulating layer to cover the wire pattern, and a protection layer covering the second insulating layer and exposing a portion of the wire pattern. The second insulating layer may include a resin layer and inorganic fillers distributed in the resin layer. The fillers may not be provided in the protection layer, and the resin layer of the second insulating layer and the protection layer may be formed of the same material. The wire patterns of the first and second buildup portions may be electrically connected to each other.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: February 13, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Seung-Yeol Yang