Abstract: A signal conditioning circuit for monitoring at least one parameter of an electrical signal in an electrical conductor. The signal conditioning circuit can include an integrator circuit having an input for receiving a signal from a current sensor coupled to the electrical conductor. A first analog switch has an input coupled to the output of the integrator circuit, wherein the first analog switch is controlled by the output of a time delay circuit. A power stage circuit has an input coupled to the output of the first analog switch. The signal conditioning circuit can be used for line fault detection.

Abstract: An enclosed low temperature cofired ceramic current sensor with planar signal pads incorporating shield plates protecting an inner positioned circumference offset herringbone wound coil connected to a pair of bottom signal pads, and a central axis stacked power conductor connected to a pair of bottom power pads outside of the top and bottom shield plates.

Abstract: Provided is an insulation resistance monitoring device that enables measurement of insulation resistance using a mega tester without removing the insulation resistance monitoring device. The insulation resistance monitoring device that monitors the insulation resistance of an object to be measured such as a motor includes: a current detecting unit that is connected between the power supply line and the ground line of the motor and detects a current flowing through the insulation resistance of the motor; a voltage generating unit connected between the power supply line and the ground line of the motor; and a switch for opening and closing the connection path between the power supply line or the ground line of the motor and the voltage generating unit, wherein the off resistance when the connection path is opened is 100 M? or more.

Abstract: An electronic assembly has a host wafer having a first circuit including wafer transistors and passive, non-transistor devices. Chiplets have a second circuit including at least one radio frequency (RF) transistor device. Electrical interconnects are between the chiplets and wafer. The electrical interconnects electrically connect the first circuit to the second circuits. Oscillators that have the wafer transistor, the RF transistor and the electrical interconnects produce a signal for built-in self-test circuits for testing an assembly design of the electronic assembly and speeds of the RF chiplet transistors.

Abstract: A current sensor configured to measure current in a current-carrying conductor. The current sensor includes a Rogowski coil having plurality of conductor segments. The plurality of conductor segments are positionable to form a substantially complete loop. A first conductor segment of the plurality of conductor segments is electrically isolated from a second conductor segment of the plurality of conductor segments.

Abstract: Complicated system fault diagnosis method and system based on a multi-stage model are provided. The method includes: establishing an integer-order mathematical model, a 0.1-level fractional order mathematical model, and a 0.01-level fractional order mathematical model of a permanent magnet synchronous motor system; designing an integer-order status observer based on the integer-order mathematical model, designing a 0.1-level fractional order status observer based on the 0.1-level fractional order mathematical model, and designing a 0.01-level fractional order status observer based on the 0.01-level fractional mathematical model; corresponding residual values can be obtained by the observers and compared with corresponding threshold values to judge whether there is a fault. The system includes first through third modules. Observers with different accuracy degrees are set up and the permanent magnet synchronous motor system is diagnosed through the observers.

Abstract: A sensor probe. The probe includes a central loop and a plurality of peripheral loops disposed peripherally relative to the central loop. To maximize far-field suppression, current flows in a first direction through the central loop and in a second direction through each one of the plurality of peripheral loops, the first direction opposite to the second direction, and current through the central loop equals current through the plurality of peripheral loops.

Abstract: The invention relates to a signal-processing circuit (1), comprising at least one signal path (2) between an input (3) and an output (4) of the signal-processing circuit (1), wherein: the signal path (2) has a first passive integrating element (5) and an active integrator (6); the active integrator (6) is designed as a non-inverting active integrator (6); the first passive integrating element (5) and the active integrator (6) are connected in series within the signal path (2). According to the invention, the signal path (2) additionally has a second passive integrating element (7) and a differentiating element (20).

Abstract: A thermal conditioning device (100) is proposed, wherein a process heat-conductive fluid (110) is caused to circulate in a plurality of extensible elements (105); a pressure of the process heat-conductive fluid (110) is regulated to lengthen the extensible elements (105) so that they are pressed against corresponding electronic devices under test (205) for conditioning them thermally. A test apparatus (200) comprising this thermal conditioning device (100) is also proposed. Moreover, a corresponding method for condition electronic devices under test (105) thermally and a corresponding method for testing electronic devices (205) are proposed.

Abstract: Apparatuses for characterizing system channels and associated methods and systems are disclosed. In one embodiment, a tester is coupled to an adaptor configured to plug into a CPU socket of a system platform (e.g., a motherboard). The motherboard includes a memory socket that is connected to the CPU socket through system channels. The adaptor may include a connector configured to physically and electrically engage with the CPU socket, an interface configured to receive test signals from the tester, and circuitry configured to internally route the test signals to the connector. The adaptor, if plugged into the CPU socket, can facilitate the tester to directly assess signal transfer characteristics of the system channels. Accordingly, the tester can determine optimum operating parameters for the memory device in view of the system channel characteristics.

Abstract: According to one embodiment, a sensor includes a base including a first face, and a first structure body fixed to the first face. The first structure body includes first and second support portions, a first movable portion, and a first fixed electrode. The first support portion is fixed to the first surface. The second support portion is fixed to the first face and provided around the first support portion. The first movable portion is supported by the first and second support portions and apart from the base. The first fixed electrode is fixed to the first face. The first movable portion includes a first movable electrode and a first conductive member. A first current is configured to flow the first conductive member. The first fixed electrode faces the first movable electrode. A first gap is provided between the first fixed electrode and the first movable portion.

Abstract: In embodiments, it is provided an integrated device for providing a measure of a quantity dependent on current through an electrical conductor, having: a sensing and processing sub-system; an electrical conductor to conduct a current; an insulating material encapsulating the sensing and processing sub-system and maintaining the electrical conductor in a fixed and spaced relationship to the sensing and processing sub-system, wherein the insulating material is configured to insulate the electrical conductor from the sensing and processing sub-system; sensing circuitry comprising a plurality of magnetic field sensing elements arranged on the sensing and processing sub-system adjacent to the electrical conductor, wherein the sensing circuitry is configured to provide a measure of the quantity as a weighted sum and/or difference of outputs of the magnetic field sensing elements caused by the current flowing through the electrical conductor adjacent to the plurality of magnetic field sensing elements; a voltage sen

Abstract: A system current sensor module can accurately sense or measure system current flowing through a sense current resistor by shunting current through a gain-setting resistor and using an amplifier to measure a resulting voltage, with an output transistor controlled by the amplifier controlling current through the gain setting resistor in a manner that tends to keep the amplifier inputs at the same voltage. The resistors can be thermally coupled to maintain similar temperatures when a system current is flowing. The thermal coupling can include conducting heat from a first resistor layer carrying the current sense resistor to a thermal cage layer located beyond a second resistor layer carrying the gain-setting resistor. This preserves accuracy, including during aging.

Abstract: A method of calibrating a thermal sensor device is provided. The method includes extracting an incremental voltage to temperature curve for a diode array from a first incremental voltage of the diode array at a first temperature. The diode array and a device under test (DUT) which includes a thermal sensor are heated. After heating the diode array, a first incremental temperature is determined from the incremental voltage to temperature curve for the diode array and a second incremental voltage of the diode array after heating the diode array. An incremental voltage to temperature curve is extracted for the DUT from the first incremental temperature, a first incremental voltage for the DUT at the first temperature, and a second incremental voltage of the DUT after heating the device under test. A temperature error for the thermal sensor is determined from the incremental voltage to temperature curve for the DUT.

Abstract: A testing apparatus including a base and a preheating unit arranged on the base is provided. The preheating unit includes a gas generator, a blocking mechanism and a heating device. The gas generator is configured to discharge air toward the base to form an air wall. The blocking mechanism is located above the air wall and forms a heat preservation space with the air wall. The heating device is arranged in the heat preservation space.

Abstract: An apparatus that detects a rotor input is provided. The apparatus includes a rotor comprising at least a portion which is configured to rotate around an axis of rotation; a reactance element disposed in the rotor, a sensing medium member disposed in the rotor, and a motion conversion member configured to move in the rotor based on a rotation of the portion of the rotor, and configured to move together with the sensing medium member to change a reactance of the reactance element according to the rotation of the portion of the rotor.

Abstract: A Rogowski coil is used for determining the magnitude of the electrical current of a conductor of a low-voltage AC circuit, which outputs an analogue voltage which is equivalent to the magnitude of the electrical current of the conductor. The Rogowski coil is connected to an analogue integrator, which is followed by an analogue-digital converter, which converts the integrated analogue voltage into a digital signal which is further processed by a microprocessor in such a way that the phase shift generated by the Rogowski coil and the components connected downstream of the Rogowski coil is compensated such that there are in-phase current values for the detection of error situations in order to protect the low-voltage AC circuit, in particular for a low-voltage power switch or an arc fault detection unit.

Abstract: A test carrier that accommodates a device under test (DUT) and has a through-hole facing the DUT, including: a movable valve that: opens by suction through the through hole such that the DUT is sucked through the through hole.

Abstract: A testing module for a semiconductor wafer-form package includes a circuit board structure, first connectors, a first connecting structure, second connectors, third connectors and a first bridge connector. The circuit board structure includes two edge regions and a main region located therebetween. The first connectors are located over the edge regions and connected to the circuit board structure. The first connecting structure is located over and distant from the circuit board structure. The second connectors and third connectors are located over and connected to the first connecting structure, where the third connectors are configured to transmit electric signals for testing the semiconductor wafer-form package being placed over the main region. The first bridge connector is electrically coupling the circuit board structure and the first connecting structure by connecting the second connectors and the first connectors.

Abstract: Disclosed herein are thermal heads and corresponding test systems for independently controlling a one or more components while testing one or more devices under test. In some embodiments, a thermal head comprises a plurality of adapters, one or more heaters, and one or more thermal controllers for independently controlling temperatures of the components. The thermal controllers may control the temperatures of at least some of the components independently such that thermal control of one component does not affect the thermal control of the other component. In some embodiments, the thermal control is by way of one or more cold plates, and the thermal head comprises one or more cold plates. Embodiments of the disclosure further include independent control of one or more forces using one or more force mechanisms.