Patents by Inventor Alexander POPESCU

Alexander POPESCU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power semiconductor device and method for producing a power semiconductor device
    Patent number: 9111900
    Abstract: A power semiconductor device comprising a power semiconductor module and a heat sink and a method for its manufacture. The heat sink has a first cooling housing component, with a cutout passing therethrough, and a second cooling housing component, with a cooling plate arranged in the cutout. The first and second cooling housing components are configured and arranged relative to one another so that a cavity is formed at the side of the cooling plate facing away from the power semiconductor components. The cooling plate is connected to the first cooling housing component by a first weld seam which extends circumferentially therearound. The first weld seam seals the cooling plate in relation to the first cooling housing component, and the second cooling housing component is connected to the first cooling housing component. The inventive power semiconductor device has good heat conduction from the power semiconductor components to a heat sink.
    Type: Grant
    Filed: September 3, 2014
    Date of Patent: August 18, 2015
    Assignee: Semikron Elektronik GmbH & Co., KG
    Inventors: Ingo Bogen, Markus Beck, Hartmut Kulas, Alexander Popescu, Reinhard Helldörfer
  • Power semiconductor device and method for producing a power semiconductor device
    Publication number: 20150061112
    Abstract: A power semiconductor device comprising a power semiconductor module and a heat sink and a method for its manufacture. The heat sink has a first cooling housing component, with a cutout passing therethrough, and a second cooling housing component, with a cooling plate arranged in the cutout. The first and second cooling housing components are configured and arranged relative to one another so that a cavity is formed at the side of the cooling plate facing away from the power semiconductor components. The cooling plate is connected to the first cooling housing component by a first weld seam which extends circumferentially therearound. The first weld seam seals the cooling plate in relation to the first cooling housing component, and the second cooling housing component is connected to the first cooling housing component. The inventive power semiconductor device has good heat conduction from the power semiconductor components to a heat sink.
    Type: Application
    Filed: September 3, 2014
    Publication date: March 5, 2015
    Inventors: Ingo BOGEN, Markus BECK, Hartmut KULAS, Alexander POPESCU, Reinhard HELLDÖRFER