Abstract: A data migration and integration system is disclosed. In various embodiments, the system includes a memory configured to store a mapping from a source schema to a target schema; and a processor coupled to the memory and configured to migrate to a target schema an instance of source data organized according to the source schema, including by using a chase engine to perform an ordered sequence of steps comprising adding a bounded layer of new elements to a current canonical chase state associated with migrating the source data to the target schema; adding coincidences associated with one or more of the target schema data integrity constraints and a mapping from the source schema to the target schema; and merging equal elements based on the coincidences; and repeat the preceding ordered sequence of steps iteratively until an end condition is met.

Abstract: System and methods are described for performing sequences of computations in an infrastructure-agnostic manner. In one implementation, a method comprises: receiving a dispatch request for executing a user-defined pipeline; computing a performance metric based on the dispatch request; and determining, based at least partially on the performance metric, whether to execute the user-defined pipeline locally by the pipeline engine or transmit the dispatch request back to the network adapter.

Abstract: A system for visual inspection, which includes a processor that receives a sensitivity level relating to an image of an item on an inspection line, the image being displayed on the user interface device, and calculates a minimal defect size visible in the image at the received sensitivity level. The calculated minimal defect size is then displayed on a user interface. This visual demonstration of minimal detectable size, which changes as the user changes sensitivity level, enables the user to easily obtain a desired minimal detectable defect size.

Abstract: An appliance for concurrent automated visual inspection of at least two items comprising: at least two inspection assemblies each comprising a camera assembly, wherein each one of the at least two items is inspected by one of the at least two Inspection assemblies; a controller in data communication with the at least two inspection assemblies, wherein the controller is a computing device, wherein the appliance is adapted to be automatically configured for inspecting the at least two items using the at least two inspection assemblies.

Abstract: Embodiments of the invention provide a visual inspection process in which motion is detected in an image of an item on an inspection line and the origin of the motion is determined. Determining the origin of motion in an image enables to provide a user with specific and clear indications on how to eliminate motion in the images and thus facilitates the visual inspection process.

Abstract: A system for visual inspection, which includes a processor that receives a sensitivity level relating to an image of an item on an inspection line, the image being displayed on the user interface device, and calculates a minimal defect size visible in the image at the received sensitivity level. The calculated minimal defect size is then displayed on a user interface. This visual demonstration of minimal detectable size, which changes as the user changes sensitivity level, enables the user to easily obtain a desired minimal detectable defect size.

Abstract: A visual inspection process which includes receiving a plurality of reference images, each of the reference images including a same-type item on an inspection line, comparing the reference images to each other and displaying to a user a status of the visual inspection process based on the comparison of the reference images to each other.

Abstract: Embodiments of the invention provide automatic detection of same-type objects on an inspection line and automatically capture and/or display an image of the object once it is detected. Additionally, embodiments of the invention automatically provide the outline of an object to a user, enabling the user to either confirm or easily correct the outline. The confirmed or corrected outline is then automatically applied to all images of inspected items of the same-type, allowing optimization of inspection tasks such as defect detection, for all inspected items, based on a short, possibly a one-time, input, from the user.

Abstract: An appliance for concurrent automated visual inspection of at least two items comprising: at least two inspection assemblies each comprising a camera assembly, wherein each one of the at least two items is inspected by one of the at least two Inspection assemblies; a controller in data communication with the at least two inspection assemblies, wherein the controller is a computing device, wherein the appliance is adapted to be automatically configured for inspecting the at least two items using the at least two inspection assemblies.

Abstract: An embodiment includes generating a sense signal that represents a first vibration of a platform, and reducing a level of the first vibration by generating, in response to the sense signal, a second vibration in the platform. For example, a sensor generates a sense signal representing a first vibration induced (e.g., a shock-induced vibration) in the platform. And a vibration-cancel circuit reduces or eliminates a level of the first vibration in response to the sense signal. For example, the vibration-cancel circuit reduces a magnitude of a first vibration induced in a platform, or eliminates the first vibration altogether, by generating, in the platform, a second vibration having a magnitude approximately equal to the magnitude of the first vibration and having a phase approximately opposite to the phase of the first vibration. That is, the second vibration cancels the first vibration to reduce the net vibration that the platform experiences.

Abstract: An embodiment includes generating a sense signal that represents a first vibration of a platform, and reducing a level of the first vibration by generating, in response to the sense signal, a second vibration in the platform. For example, a sensor generates a sense signal representing a first vibration induced (e.g., a shock-induced vibration) in the platform. And a vibration-cancel circuit reduces or eliminates a level of the first vibration in response to the sense signal. For example, the vibration-cancel circuit reduces a magnitude of a first vibration induced in a platform, or eliminates the first vibration altogether, by generating, in the platform, a second vibration having a magnitude approximately equal to the magnitude of the first vibration and having a phase approximately opposite to the phase of the first vibration. That is, the second vibration cancels the first vibration to reduce the net vibration that the platform experiences.

Abstract: An embodiment of an assembly includes a platform (e.g., a printed circuit board (PCB)), a sensor, and a vibration-cancel circuit. The sensor is mounted to the platform and is configured to generate a sense signal that represents a vibration induced (e.g., a shock-induced vibration) in the platform. And the vibration-cancel circuit is configured to reduce or eliminate a level of the vibration in response to the sense signal. For example, such a vibration-cancel circuit is configured to reduce a magnitude of a vibration induced in platform, or to eliminate the vibration altogether, by generating, in the platform, a counter vibration that has a magnitude approximately equal to the magnitude of the induced vibration and that has a phase approximately opposite to the phase of the induced vibration. That is, the counter vibration cancels the induced vibration to reduce the net vibration that the platform experiences.

Abstract: An embodiment of an assembly includes a platform (e.g., a printed circuit board (PCB)), a sensor, and a vibration-cancel circuit. The sensor is mounted to the platform and is configured to generate a sense signal that represents a vibration induced (e.g., a shock-induced vibration) in the platform. And the vibration-cancel circuit is configured to reduce or eliminate a level of the vibration in response to the sense signal. For example, such a vibration-cancel circuit is configured to reduce a magnitude of a vibration induced in platform, or to eliminate the vibration altogether, by generating, in the platform, a counter vibration that has a magnitude approximately equal to the magnitude of the induced vibration and that has a phase approximately opposite to the phase of the induced vibration. That is, the counter vibration cancels the induced vibration to reduce the net vibration that the platform experiences.

Abstract: An accelerometer as disclosed herein includes a support wafer, a bottom wafer, a top wafer, and an inductive pick-off. The support wafer may define a plane and may comprise a first side, a second side, and a proof mass. The proof mass may be configured to move in the plane defined by the support wafer. The bottom wafer may comprise a first side and a second side, and the first side may be positioned over the first side of the support wafer. The top wafer may comprise a first side and a second side, and the first side may be positioned over the second side of the support wafer. The inductive pick-off may comprise a near field resonant conductive coupling mechanism and may be configured to output a signal indicative of an amount of displacement of the proof mass to electronics.

Abstract: An accelerometer as disclosed herein includes a support wafer, a bottom wafer, a top wafer, and an inductive pick-off. The support wafer may define a plane and may comprise a first side, a second side, and a proof mass. The proof mass may be configured to move in the plane defined by the support wafer. The bottom wafer may comprise a first side and a second side, and the first side may be positioned over the first side of the support wafer. The top wafer may comprise a first side and a second side, and the first side may be positioned over the second side of the support wafer. The inductive pick-off may comprise a near field resonant conductive coupling mechanism and may be configured to output a signal indicative of an amount of displacement of the proof mass to electronics.

Abstract: A system for determining in-plane acceleration of an object. The system includes an in-plane accelerometer with a substrate rigidly attached to an object, and a proof mass—formed from a single piece of material—movably positioned a predetermined distance above the substrate. The proof mass includes a plurality of electrode protrusions extending downward from the proof mass to form a gap of varying height between the proof mass and the substrate. The proof mass is configured to move in a direction parallel to the upper surfaces of each of the plurality of substrate electrodes when the object is accelerating, which results in a change in the area of the gap, and a change in capacitance between the substrate and the proof mass. The in-plane accelerometer can be fabricated using the same techniques used to fabricate an out-of-plane accelerometer and is suitable for high-shock applications.

Abstract: A sensor for monitoring external loads acting on a pin assembly includes a pin having an axial interior bore defined therein and having a length defined from a first end to an opposed second end thereof. A core pin is mounted axially within the interior bore of the pin spaced radially inwardly from the interior bore for relative displacement with respect to the pin. A capacitor is provided having an inner capacitor plate mounted to the core pin, and an outer capacitor plate mounted to the pin, such that relative displacement of the core and the pin due to external loading on the pin results in relative displacement of the inner and outer capacitor plates. The capacitor is configured and adapted to be connected to an electrical circuit to produce signals indicative of external loading on the pin based on relative displacement of the inner and outer capacitor plates.

Abstract: A system for determining in-plane acceleration of an object. The system includes an in-plane accelerometer with a substrate rigidly attached to an object, and a proof mass—formed from a single piece of material—movably positioned a predetermined distance above the substrate. The proof mass includes a plurality of electrode protrusions extending downward from the proof mass to form a gap of varying height between the proof mass and the substrate. The proof mass is configured to move in a direction parallel to the upper surfaces of each of the plurality of substrate electrodes when the object is accelerating, which results in a change in the area of the gap, and a change in capacitance between the substrate and the proof mass. The in-plane accelerometer can be fabricated using the same techniques used to fabricate an out-of-plane accelerometer and is suitable for high-shock applications.

Abstract: A sensor for monitoring external loads acting on a pin assembly includes a pin having an axial interior bore defined therein and having a length defined from a first end to an opposed second end thereof. A core pin is mounted axially within the interior bore of the pin spaced radially inwardly from the interior bore for relative displacement with respect to the pin. A capacitor is provided having an inner capacitor plate mounted to the core pin, and an outer capacitor plate mounted to the pin, such that relative displacement of the core and the pin due to external loading on the pin results in relative displacement of the inner and outer capacitor plates. The capacitor is configured and adapted to be connected to an electrical circuit to produce signals indicative of external loading on the pin based on relative displacement of the inner and outer capacitor plates.

Abstract: The subject invention is related to wireless proximity sensor and sensing system for detecting the position of an object. The system includes a transceiver for providing wireless communication with a passive wireless surface acoustic wave (SAW) proximity sensor. The wireless proximity sensor receives a wireless signal from the transceiver, which powers the SAW device and in turn transmits a signal back to the transceiver that includes information about the position of an object. The wireless proximity sensor uses one or more SAW devices with a sensing element made of magnetostrictive material, in conjunction with one or more magnets and one or more targets that are positioned relative to an object. The movement of the target(s) in relation to the proximity sensor operatively produces a mechanical response due to the shift in the magnetic field of the sensing element.