Patents by Inventor Carl Arft
Carl Arft has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11909354Abstract: One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate—in effect, heating the MEMS component and optionally related circuitry to a steady-state “oven” temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).Type: GrantFiled: May 25, 2022Date of Patent: February 20, 2024Assignee: SiTime CorporationInventors: Carl Arft, Aaron Partridge, Markus Lutz, Charles I. Grosjean
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Patent number: 11543301Abstract: A micromachined apparatus includes micromachined thermistor having first and second ends physically and thermally coupled to a substrate via first and second anchor structures to enable a temperature-dependent resistance of the micromachined thermistor to vary according to a time-varying temperature of the substrate. The micromachined thermistor has a length, from the first end to the second end, greater than a linear distance between the first and second anchor structures.Type: GrantFiled: September 10, 2019Date of Patent: January 3, 2023Assignee: SiTime CorporationInventors: Carl Arft, Aaron Partridge, Paul M. Hagelin
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Publication number: 20220360218Abstract: One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate—in effect, heating the MEMS component and optionally related circuitry to a steady-state “oven” temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).Type: ApplicationFiled: May 25, 2022Publication date: November 10, 2022Inventors: Carl Arft, Aaron Partridge, Markus Lutz, Charles I. Grosjean
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Patent number: 11374535Abstract: One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate—in effect, heating the MEMS component and optionally related circuitry to a steady-state “oven” temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).Type: GrantFiled: November 29, 2019Date of Patent: June 28, 2022Assignee: SiTime CorporationInventors: Carl Arft, Aaron Partridge, Markus Lutz, Charles I. Grosjean
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Publication number: 20200186084Abstract: One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate—in effect, heating the MEMS component and optionally related circuitry to a steady-state “oven” temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).Type: ApplicationFiled: November 29, 2019Publication date: June 11, 2020Inventors: Carl Arft, Aaron Partridge, Markus Lutz, Charles I. Grosjean
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Patent number: 10458858Abstract: A micromachined apparatus includes micromachined thermistor having first and second ends physically and thermally coupled to a substrate via first and second anchor structures to enable a temperature-dependent resistance of the micromachined thermistor to vary according to a time-varying temperature of the substrate. The micromachined thermistor has a length, from the first end to the second end, greater than a linear distance between the first and second anchor structures.Type: GrantFiled: March 8, 2018Date of Patent: October 29, 2019Assignee: SiTime CorporationInventors: Carl Arft, Aaron Partridge, Paul M. Hagelin
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Patent number: 9945734Abstract: A micromachined apparatus includes micromachined thermistor having first and second ends physically and thermally coupled to a substrate via first and second anchor structures to enable a temperature-dependent resistance of the micromachined thermistor to vary according to a time-varying temperature of the substrate. The micromachined thermistor has a length, from the first end to the second end, greater than a linear distance between the first and second anchor structures.Type: GrantFiled: May 22, 2017Date of Patent: April 17, 2018Assignee: SiTime CorporationInventors: Carl Arft, Aaron Partridge, Paul M. Hagelin
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Patent number: 9677948Abstract: A micromachined apparatus includes micromachined thermistor having first and second ends physically and thermally coupled to a substrate via first and second anchor structures to enable a temperature-dependent resistance of the micromachined thermistor to vary according to a time-varying temperature of the substrate. The micromachined thermistor has a length, from the first end to the second end, greater than a linear distance between the first and second anchor structures.Type: GrantFiled: April 8, 2015Date of Patent: June 13, 2017Assignee: SiTime CorporationInventors: Carl Arft, Aaron Partridge, Paul M. Hagelin
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Patent number: 9022644Abstract: The present inventions, in one aspect, are directed to a temperature sensing apparatus comprising a micromachined thermistor configured to output voltage and/or current signals which are/is correlated to an ambient temperature. The micromachined thermistor includes a micromachined thermistor structure suspended over and released from the substrate, wherein the micromachined thermistor structure includes a temperature dependent characteristic (e.g., resistance to an electrical current), and electrical contacts connected to the micromachined thermistor structure, wherein the electrical contacts are adapted to conduct the voltage and/or current signals. The apparatus, in one aspect, includes measurement circuitry, to generate data which is representative of the ambient temperature using the electrical resistance of the micromachined thermistor structure.Type: GrantFiled: September 7, 2012Date of Patent: May 5, 2015Assignee: SiTime CorporationInventors: Carl Arft, Aaron Partridge, Paul M. Hagelin