Publication number: 20240092981
Abstract: A problem of heat dissipation in motors, converters, high-luminance LEDs, power devices, power supplies, and the like becomes significant. Provided is a means for capable of providing a product, which has favorable workability, segregation stability, storage stability, and the like, penetrates into a gap in a coil portion, an interface in casing, and the like without any gaps, enhances thermal conductivity/heat dissipation properties of a molded product thus obtained, and is excellent in electrical characteristics, toughness/elastic modulus, thermal resistance, thermal cycle properties, and the like, in the case of using the product for a cast molding resin, a pottingmaterial (sealingmaterial), an adhesive, grease, and the like.
Type:
Application
Filed:
October 20, 2023
Publication date:
March 21, 2024
Applicant:
Takagi Chemicals, Inc.
Inventors:
Noriaki Takagi, Masakuni Takagi, Yuusuke Nagatani, Yuuta Terao, Daisuke Watanabe, Kazuo Matsuyama
Publication number: 20240098962
Abstract: A semiconductor device including a first electrode, a second electrode, an oxide semiconductor disposed between the first electrode and the second electrode, and a first oxide layer containing a predetermined element, oxygen, and an additional element and disposed between the first electrode and the oxide semiconductor, wherein the predetermined element is at least one of tantalum, boron, hafnium, silicon, zirconium, or niobium, and the additional element is at least one of phosphorus, sulfur, copper, zinc, gallium, germanium, arsenic, selenium, silver, indium, tin, antimony, tellurium, or bismuth.
Type:
Application
Filed:
February 7, 2023
Publication date:
March 21, 2024
Applicant:
Kioxia Corporation
Inventors:
Daisuke WATANABE, Akifumi GAWASE, Takeshi IWASAKI, Kazuhiro KATONO, Yusuke MUTO, Yusuke MIKI, Akinori KIMURA