Abstract: A method of patterning the surface of a substrate with at least one organic semiconducting compound including: (a) providing a stamp having a surface including a plurality of indentations formed therein defining an indentation pattern contiguous with a stamping surface and defining a stamping pattern, (b) coating the stamping surface with at least one compound (C1) capable of binding to the surface of the substrate and at least one organic semiconducting compound (S), (c) contacting at least a portion of the surface of a substrate with the stamping surface to allow deposition of the compound (C1) on the substrate, (d) removing the stamping surface to provide a pattern of binding sites on the surface of the substrate, (e) applying a plurality of crystallites of the organic semiconducting compound (S) to the surface of the substrate to bind at least a portion of the applied crystallites to the binding sites on the surface of the substrate.

Abstract: Techniques including steps of: providing a support body; forming an organic semiconductor composition body including an organic semiconductor composition on the support body, no more than 10% by weight of the organic semiconductor composition being pentacene; providing a first organic dielectric composition mobilized in a first liquid medium, the organic semiconductor composition being insoluble in the first liquid medium; and forming a first organic dielectric composition body from the first organic dielectric composition on the organic semiconductor composition body. Techniques in which an organic semiconductor composition body is formed on an organic dielectric composition body. Apparatus having an organic dielectric composition body on an organic semiconductor composition body.

Abstract: The present invention relates to a method of depositing nanowires on the surface of a substrate, comprising the steps of: contacting defined regions of the substrate with at least one compound (C1) capable of binding to the surface of the substrate and of binding the nanowires to provide a pattern of binding sites on the surface of the substrate and/or contacting defined regions of the substrate with at least one compound (C2) capable of binding to the surface of the substrate and preventing the binding of nanowires to provide a pattern of non-binding sites on the surface of the substrate, and contacting the surface of the substrate with a suspension of nanowires in a liquid medium to enable at least a portion of the applied nanowires to bind to at least a portion of the surface of the substrate covered with (C1) and/or not covered with (C2).

Abstract: A method of patterning the surface of a substrate with at least one organic semiconducting compound, comprising the steps of: (a) providing a stamp having a surface including a plurality of indentations formed therein defining an indentation pattern, said indentations being contiguous with a stamping surface and defining a stamping pattern, (b) coating said stamping surface with at least one compound (C1) capable of binding to the surface of the substrate and of binding at least one organic semiconducting compound (S), (c) contacting at least a portion of the surface of a substrate with said stamping surface to allow deposition of said compound (C1) on the substrate, (d) removing said stamping surface to provide a pattern of binding sites on the surface of the substrate, (e) applying a plurality of crystallites of the organic semiconducting compound (S) to the surface of the substrate to enable at least a portion of the applied crystallites to bind to at least a portion of the binding sites on the surface of

Abstract: Techniques including steps of: providing a support body; forming an organic semiconductor composition body including an organic semiconductor composition on the support body, no more than 10% by weight of the organic semiconductor composition being pentacene; providing a first organic dielectric composition mobilized in a first liquid medium, the organic semiconductor composition being insoluble in the first liquid medium; and forming a first organic dielectric composition body from the first organic dielectric composition on the organic semiconductor composition body. Techniques in which an organic semiconductor composition body is formed on an organic dielectric composition body. Apparatus having an organic dielectric composition body on an organic semiconductor composition body.

Abstract: Apparatus including a support body; and an organic semiconductor composition body including at least one of the group including polystyrene, poly(9,9?-dioctylfluorene-co-bithiophene) (“F8T2”) and a cellulose, and an organic molecule including a chain-like core region having two ends and having at least three conjugated aromatic rings; and including at the two ends, branched or unbranched groups R1 and R2 respectively, each including a branched or unbranched C5- to C20-alkyl group. Printing inks including such molecule.

Abstract: A process for preparing polymer dispersions of at least one of the polymerizable monomers from the groups consisting of alkyl (meth)acrylates, vinyl esters of carboxylic acids having 1-20 carbon atoms, vinylaromatic compounds, nitrites, vinyl halides, vinyl ethers, hydrocarbons having 2-8 carbon atoms, and hydroxyl-containing monomers in emulsion polymerization technology at a polymerization temperature of at least 40° C., in the presence of a free-radical polymerization initiator, which comprises preparing the polymer, which forms to at least 85% by weight from one or more of these monomers. In a first stage, water, as reaction-inert solvent, dispersing assistants where appropriate, seed where appropriate, and a first portion of monomer(s), where appropriate, are introduced.

Abstract: The use of an aqueous emulsion paint having a pigment content of from 40 to 200 parts by weight per 100 parts by weight of polymer to coat buildings or building parts, wherein said polymer comprises an emulsion copolymer containing from 0.5 to 30% by weight of monomers of the formula I where R1 is a hydrogen atom or a methyl group, X is a divalent organic polyalkylene oxide group comprising from 1 to 50 alkylene oxide units, and R2 is a hydrogen atom or an aliphatic or aromatic hydrocarbon group having 1 to 20 carbon atoms.

Abstract: The use of an aqueous emulsion paint having a pigment content of from 40 to 200 parts by weight per 100 parts by weight of polymer to coat buildings or building parts, wherein said polymer comprises an emulsion copolymer containing from 0.