Patents by Inventor Kurt Edward Petersen

Kurt Edward Petersen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9605965
    Abstract: A method of fabricating a gyroscope may involve depositing conductive material on a substrate, forming an anchor on the substrate, forming a drive frame on the anchor and forming pairs of drive beams on opposing sides of the anchor. The drive beams may be configured to constrain the drive frame to rotate substantially in the plane of the drive beams. The method may involve forming a proof mass around the drive frame and forming a plurality of sense beams that connect the drive frame to the proof mass. The sense beams may be tapered sense beams having a width that decreases with increasing distance from the anchor. The tapered sense beams may be configured to allow sense motions of the proof mass in a sense plane substantially perpendicular to the plane of the drive beams in response to an applied angular rotation. Some components may be formed from plated metal.
    Type: Grant
    Filed: October 15, 2013
    Date of Patent: March 28, 2017
    Assignee: SnapTrack, Inc.
    Inventors: Cenk Acar, Ravindra V. Shenoy, Justin Phelps Black, Kurt Edward Petersen, Srinivasan Kodaganallur Ganapathi, Philip Jason Stephanou
  • Patent number: 9459099
    Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using gyroscopes. Such gyroscopes may include a sense frame, a proof mass disposed outside the sense frame, a pair of anchors and a plurality of drive beams. The plurality of drive beams may be disposed on opposing sides of the sense frame and between the pair of anchors. The drive beams may connect the sense frame to the proof mass. The drive beams may be configured to cause torsional oscillations of the proof mass substantially in a first plane of the drive beams. The sense frame may be substantially decoupled from the drive motions of the proof mass. Such devices may be included in a mobile device, such as a mobile display device.
    Type: Grant
    Filed: July 31, 2013
    Date of Patent: October 4, 2016
    Assignee: Qualcomm MEMS Technologies, Inc.
    Inventors: Cenk Acar, Ravindra V. Shenoy, Justin Phelps Black, Kurt Edward Petersen, Srinivasan Kodaganallur Ganapathi, Philip Jason Stephanou
  • Patent number: 9410805
    Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using gyroscopes. Such gyroscopes may include a central anchor, a sense frame disposed around the central anchor, a plurality of sense beams configured for connecting the sense frame to the central anchor and a drive frame disposed around and coupled to the sense frame. The gyroscope may include pairs of drive beams disposed on opposing sides of the sense frame. The gyroscope may include a drive frame suspension for substantially restricting a drive motion of the drive frame to that of a substantially linear displacement along the first axis. The sense frame may be substantially decoupled from drive motions of the drive frame. Such devices may be included in a mobile device, such as a mobile display device.
    Type: Grant
    Filed: July 31, 2013
    Date of Patent: August 9, 2016
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventors: Cenk Acar, Ravindra V. Shenoy, Justin Phelps Black, Kurt Edward Petersen, Srinivasan Kodaganallur Ganapathi, Philip Jason Stephanou
  • Patent number: 9021880
    Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using x-axis gyroscopes, y-axis gyroscopes, z-axis gyroscopes, two-axis accelerometers and three-axis accelerometers. Combining fabrication processes for such devices can enable the monolithic integration of six inertial sensing axes on a single substrate, such as a single glass substrate. Such devices may be included in a mobile device, such as a mobile display device.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: May 5, 2015
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventors: Philip Jason Stephanou, Cenk Acar, Ravindra Vaman Shenoy, David William Burns, Justin Phelps Black, Kurt Edward Petersen, Srinivasan Kodaganallur Ganapathi
  • Patent number: 8724038
    Abstract: This disclosure provides systems, methods and apparatus for a combined sensor device. In some implementations, a combined sensor device includes a wrap-around configuration wherein an upper flexible substrate has patterned conductive material on an extended portion to allow routing of signal lines, electrical ground, and power. One or more integrated circuits or passive components, which may include connecting sockets, may be mounted onto the flexible layer to reduce cost and complexity. Such implementations may eliminate a flex cable and may allow a bezel-less configuration.
    Type: Grant
    Filed: October 11, 2011
    Date of Patent: May 13, 2014
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventors: Srinivasan Kodaganallur Ganapathi, Nicholas Ian Buchan, Kurt Edward Petersen, Ravindra V. Shenoy, Peng Cheng Lin, Ericson Cheng
  • Publication number: 20140041174
    Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using gyroscopes. Some gyroscopes include a drive frame, a central anchor and a plurality of drive beams disposed on opposing sides of the central anchor. The drive beams may connect the drive frame to the central anchor. The drive beams may include a piezoelectric layer and may be configured to cause the drive frame to oscillate torsionally in a plane of the drive beams. The gyroscope may also include a proof mass and a plurality of piezoelectric sense beams. At least some components may be formed from plated metal. The drive frame may be disposed within the proof mass. The drive beams may constrain the drive frame to rotate substantially in the plane of the drive beams. Such devices may be included in a mobile device, such as a mobile display device.
    Type: Application
    Filed: October 15, 2013
    Publication date: February 13, 2014
    Applicant: QUALCOMM MEMS Technologies, Inc.
    Inventors: Cenk Acar, Ravindra V. Shenoy, Justin Phelps Black, Kurt Edward Petersen, Srinivasan Kodaganallur Ganapathi, Philip Jason Stephanou
  • Publication number: 20140013557
    Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using gyroscopes. Such gyroscopes may include a sense frame, a proof mass disposed outside the sense frame, a pair of anchors and a plurality of drive beams. The plurality of drive beams may be disposed on opposing sides of the sense frame and between the pair of anchors. The drive beams may connect the sense frame to the proof mass. The drive beams may be configured to cause torsional oscillations of the proof mass substantially in a first plane of the drive beams. The sense frame may be substantially decoupled from the drive motions of the proof mass. Such devices may be included in a mobile device, such as a mobile display device.
    Type: Application
    Filed: July 31, 2013
    Publication date: January 16, 2014
    Applicant: QUALCOMM MEMS Technologies, Inc.
    Inventors: Cenk Acar, Ravindra V. Shenoy, Justin Phelps Black, Kurt Edward Petersen, Srinivasan Kodaganallur Ganapathi, Philip Jason Stephanou
  • Publication number: 20130333175
    Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using gyroscopes. Such gyroscopes may include a central anchor, a sense frame disposed around the central anchor, a plurality of sense beams configured for connecting the sense frame to the central anchor and a drive frame disposed around and coupled to the sense frame. The gyroscope may include pairs of drive beams disposed on opposing sides of the sense frame. The gyroscope may include a drive frame suspension for substantially restricting a drive motion of the drive frame to that of a substantially linear displacement along the first axis. The sense frame may be substantially decoupled from drive motions of the drive frame. Such devices may be included in a mobile device, such as a mobile display device.
    Type: Application
    Filed: July 31, 2013
    Publication date: December 19, 2013
    Applicant: QUALCOMM MEMS Technologies, Inc.
    Inventors: Cenk Acar, Ravindra V. Shenoy, Justin Phelps Black, Kurt Edward Petersen, Srinivasan Kodaganallur Ganapathi, Philip Jason Stephanou
  • Patent number: 8584522
    Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using gyroscopes. Some gyroscopes include a drive frame, a central anchor and a plurality of drive beams disposed on opposing sides of the central anchor. The drive beams may connect the drive frame to the central anchor. The drive beams may include a piezoelectric layer and may be configured to cause the drive frame to oscillate torsionally in a plane of the drive beams. The gyroscope may also include a proof mass and a plurality of piezoelectric sense beams. At least some components may be formed from plated metal. The drive frame may be disposed within the proof mass. The drive beams may constrain the drive frame to rotate substantially in the plane of the drive beams. Such devices may be included in a mobile device, such as a mobile display device.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: November 19, 2013
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventors: Cenk Acar, Ravindra Vaman Shenoy, Justin Phelps Black, Kurt Edward Petersen, Srinivasan Kodaganallur Ganapathi, Philip Jason Stephanou
  • Patent number: 8516886
    Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using gyroscopes. Such gyroscopes may include a sense frame, a proof mass disposed outside the sense frame, a pair of anchors and a plurality of drive beams. The plurality of drive beams may be disposed on opposing sides of the sense frame and between the pair of anchors. The drive beams may connect the sense frame to the proof mass. The drive beams may be configured to cause torsional oscillations of the proof mass substantially in a first plane of the drive beams. The sense frame may be substantially decoupled from the drive motions of the proof mass. Such devices may be included in a mobile device, such as a mobile display device.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: August 27, 2013
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventors: Cenk Acar, Ravindra Vaman Shenoy, Justin Phelps Black, Kurt Edward Petersen, Srinivasan Kodaganallur Ganapathi, Philip Jason Stephanou
  • Patent number: 8516887
    Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using gyroscopes. Such gyroscopes may include a central anchor, a sense frame disposed around the central anchor, a plurality of sense beams configured for connecting the sense frame to the central anchor and a drive frame disposed around and coupled to the sense frame. The gyroscope may include pairs of drive beams disposed on opposing sides of the sense frame. The gyroscope may include a drive frame suspension for substantially restricting a drive motion of the drive frame to that of a substantially linear displacement along the first axis. The sense frame may be substantially decoupled from drive motions of the drive frame. Such devices may be included in a mobile device, such as a mobile display device.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: August 27, 2013
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventors: Cenk Acar, Ravindra Vaman Shenoy, Justin Phelps Black, Kurt Edward Petersen, Srinivasan Kodaganallur Ganapathi, Philip Jason Stephanou
  • Publication number: 20130127879
    Abstract: This disclosure provides systems, methods and apparatus for glass-encapsulated pressure sensors. In one aspect, a glass-encapsulated pressure sensor may include a glass substrate, an electromechanical pressure sensor, an integrated circuit device, and a cover glass. The cover glass may be bonded to the glass substrate with an adhesive, such as epoxy, glass frit, or a metal bond ring. The cover glass may have any of a number of configurations. In some configurations, the cover glass may partially define a port for the electromechanical pressure sensor at an edge of the glass-encapsulated pressure sensor. In some configurations, the cover glass may form a cavity to accommodate the integrated circuit device that is separate from a cavity that accommodates the electromechanical pressure sensor.
    Type: Application
    Filed: November 18, 2011
    Publication date: May 23, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: David William Burns, Philip Jason Stephanou, Ravindra V. Shenoy, Kurt Edward Petersen
  • Publication number: 20130050228
    Abstract: This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, fabricating a glass package includes joining a cover glass panel to a glass substrate panel, and singulating the joined panels to form individual glass packages, each including one or more encapsulated devices and one or more signal transmission pathways. In another aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass.
    Type: Application
    Filed: August 30, 2011
    Publication date: February 28, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Kurt Edward Petersen, Ravindra V. Shenoy, Justin Phelps Black, David William Burns, Srinivasan Kodaganallur Ganapathi, Philip Jason Stephanou, Nicholas Ian Buchan
  • Publication number: 20130050155
    Abstract: This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass, one or more devices encapsulated between the glass substrate and the cover glass, and bond pads configured to attach to a flexible connector and in electrical communication with an encapsulated device. In some implementations, a flexible connector may be used to electrically connect a device within the glass package to an electrical component, such as an integrated circuit (IC) device or PCB, outside the glass package.
    Type: Application
    Filed: August 30, 2011
    Publication date: February 28, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Kurt Edward Petersen, Ravindra V. Shenoy, Justin Phelps Black, David William Burns, Srinivasan Kodaganallur Ganapathi, Philip Jason Stephanou, Nicholas Ian Buchan
  • Publication number: 20130050227
    Abstract: This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass. The cover glass may be bonded to the glass substrate with an adhesive such as an epoxy, or a metal bond ring. The glass package also may include one or more signal transmission pathways between the one or more devices and the package exterior. In some implementations, a glass package including an EMS and/or IC device is configured to be directly attached to a printed circuit board (PCB) or other integration substrate by surface mount technology.
    Type: Application
    Filed: August 30, 2011
    Publication date: February 28, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Kurt Edward Petersen, Ravindra V. Shenoy, Justin Phelps Black, David William Burns, Srinivasan Kodaganallur Ganapathi, Philip Jason Stephanou, Nicholas Ian Buchan
  • Publication number: 20130050226
    Abstract: This disclosure provides systems, methods and apparatus for providing electrical connections through glass substrates. In one aspect, a through-glass via including a peripheral through-glass via hole and sidewall metallization is provided. Sidewall metallization can include multiple conductive lines facilitating increased interconnect density. In another aspect, one or more methods of forming peripheral through-glass vias are provided. In some implementations, the methods include double-sided processes to form aligned via holes in a glass substrate that together form a through-glass via hole, followed by sidewall metallization and dicing through the through-glass via hole.
    Type: Application
    Filed: August 30, 2011
    Publication date: February 28, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Ravindra Vaman Shenoy, David William Burns, Kurt Edward Petersen
  • Publication number: 20120234093
    Abstract: This disclosure provides systems, apparatus, and devices and methods of fabrication for electromechanical devices. In one implementation, an apparatus includes a metal proof mass and a piezoelectric component as part of a MEMS device. Such apparatus can be particularly useful for MEMS gyroscope devices. For instance, the metal proof mass, which may have a density several times larger than that of silicon, is capable of reducing the quadrature and bias error in a MEMS gyroscope device, and capable of increasing the sensitivity of the MEMS gyroscope device.
    Type: Application
    Filed: March 15, 2011
    Publication date: September 20, 2012
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Justin Phelps Black, Srinivasan Kodaganallur Ganapathi, Philip Jason Stephanou, Kurt Edward Petersen, Cenk Acar, Ravindra Vaman Shenoy, Nicholas Ian Buchan
  • Publication number: 20120092294
    Abstract: This disclosure provides systems, methods and apparatus implementations of a display device with a cover glass apparatus that serves as a single or multi-touch sensor, as a handwriting (or note capture) input device, and in some configurations as a fingerprint sensor. Sensor functionality and resolution can be tailored to specific locations on the cover glass apparatus. In some such implementations, the area in which the fingerprint sensing elements are located may provide not only fingerprint detection, but also handwriting and touch functionality. In some other implementations, the fingerprint sensor may be segregated into a separate, high-resolution zone that only provides fingerprint functionality.
    Type: Application
    Filed: October 11, 2011
    Publication date: April 19, 2012
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Srinivasan Kodaganallur Ganapathi, Nicholas Ian Buchan, Kurt Edward Petersen, David William Burns
  • Publication number: 20120090757
    Abstract: Fabrication methods for combined sensor devices include substantially transparent substrates and materials to increase the optical performance of underlying displays. A substantially transparent elastomeric material may be disposed between the substantially transparent substrates. Some fabrication processes utilize flexible substrates for at least a portion of the sensor device, and lend themselves to roll-to-roll processing for low cost.
    Type: Application
    Filed: October 11, 2011
    Publication date: April 19, 2012
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Nicholas Ian Buchan, Srinivasan Kodaganallur Ganapathi, Kurt Edward Petersen
  • Publication number: 20120092350
    Abstract: This disclosure provides systems, methods and apparatus for a combined sensor device. In some implementations, a combined sensor device includes a wrap-around configuration wherein an upper flexible substrate has patterned conductive material on an extended portion to allow routing of signal lines, electrical ground, and power. One or more integrated circuits or passive components, which may include connecting sockets, may be mounted onto the flexible layer to reduce cost and complexity. Such implementations may eliminate a flex cable and may allow a bezel-less configuration.
    Type: Application
    Filed: October 11, 2011
    Publication date: April 19, 2012
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Srinivasan Kodaganallur Ganapathi, Nicholas Ian Buchan, Kurt Edward Petersen, Ravindra V. Shenoy, Peng Cheng Lin, Ericson Cheng