Abstract: The process of the present invention allows interconnecting one conductive layer to another in a Multichip Module. The process uses bumps formed by wire bonding, or any other means of forming bumps of 0.002"-0.004" height with comparable diameter. These bumps create an opening through dielectric insulating layers, thereby allowing one conductive layer to be electrically connected to the next conductive layer.

Abstract: An assembly for holding a squeegee blade provides a levelness control of the squeegee blade and a pressure control on the squeegee blade. The assembly includes a wedge having a length approximately equal to that of the squeegee blade. The wedge also has a right triangle shape along its longitudinal axis. The wedge is positioned between an upper stationary body and the squeegee blade. There is also a pressure adjustment for moving the wedge in either direction along its longitudinal axis, such that the motion of the wedge produces pressure on the squeegee blade; thus, providing the pressure control. The leveling control is accomplished by a micrometer attached to a rigid plate. The micrometer being rotatable along its longitudinal axis. A gear, which is attached to the upper stationary body, is rotatable about a pivot point on the ridged plate by the rotation of the micrometer.