Metal-depositing Composition Or Substrate-sensitizing Compositions For Metal-depositing Compositions Patents (Class 106/1.05)
  • Patent number: 11648526
    Abstract: A lightweight modified filter material, a preparation method therefor and use thereof, the lightweight modified filter material being prepared from the following components in parts by mass: 75-100 parts of waste glass, 5-20 parts of a metal oxide modifier and 1-10 parts of a foamer. The lightweight modified filter material has the advantages of being lightweight, having large specific surface area, a high isoelectric point, porosity and the like, increasing the isoelectric point and service life of the filter material. The added metal oxide can be combined with SiO2 in the glass to form Si—O-Me (Me metal ions) and enter the glass network.
    Type: Grant
    Filed: April 11, 2018
    Date of Patent: May 16, 2023
    Inventors: Yang Cui, Jun Soo He, Xuelie Cui
  • Patent number: 11427727
    Abstract: Disclosed herein are ink compositions for making a conductive copper structure. The ink composition comprise a copper metal precursor compound, a chelating agent, and a reducing agent. In some embodiments, the redox potential of the reducing agent is adjusted for controlled reduction of copper ion in the copper metal precursor to metal copper metal. Also disclosed herein are methods for making the ink compositions and methods for using the same.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: August 30, 2022
    Assignee: ELECTRONINKS INCORPORATED
    Inventors: Steven Brett Walker, Leonardo Zornberg
  • Patent number: 11045494
    Abstract: An agent in the form of potassium hydroxide (KOH) in a pharmaceutically acceptable composition is used in the dermal treatment of actinic keratosis. The composition may be an aqueous alkaline solution of potassium hydroxide and topically applied to the skin or on the scalp, within the face, the neck, the nose, as well as on the bosom.
    Type: Grant
    Filed: July 10, 2015
    Date of Patent: June 29, 2021
    Assignee: Infectopharm Arzneimittel und Consilium GmbH
    Inventors: Thomas Wimmer, Bertil Wachall, Philip Zoeller, Alessandro Giunta
  • Patent number: 11037763
    Abstract: There is provision of a member used in a plasma processing apparatus configured to generate plasma from a gas in a processing vessel and to process a substrate disposed on a mounting base in the processing vessel using the plasma. The member includes a surface exposed to the plasma in the processing vessel in a state installed in the processing vessel, and a coating layer including cobalt which covers a part of the surface.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: June 15, 2021
    Assignee: Tokyo Electron Limited
    Inventors: Yuki Sugawara, Masanori Asahara, Masafumi Urakawa
  • Patent number: 10669467
    Abstract: Included are drilling fluids for drilling in a subterranean formation. A drilling fluid may include: an aqueous base fluid and a betaine shale stabilizer comprising glycine betaine HCl.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: June 2, 2020
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Maria Celeste Rellamas Tria, Catherine Martin Santos
  • Patent number: 10450665
    Abstract: A plating solution including a soluble salt containing at least a stannous salt; an acid selected from organic acid and inorganic acid or a salt thereof; and an additive containing a specific ammonium salt is provided.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: October 22, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Mami Watanabe, Kiyotaka Nakaya
  • Patent number: 10428406
    Abstract: Cobalt-based alloy compositions are described herein having properties compatible with thermal spray and sintering techniques. Such alloy compositions can provide claddings to a variety of metallic substrates having complex geometries, wherein the claddings exhibit desirable density, hardness, wear resistance and corrosion resistance. Briefly, an alloy composition described herein comprises 15-25 wt. % chromium, 15-20 wt. % molybdenum, 0-15 wt. % tungsten, 10-20 wt. % nickel, 2.5-3.5 wt. % boron, 2.5-4.5 wt. % silicon, 1-2 wt. % carbon and the balance cobalt, wherein a ratio of boron to silicon (B/Si) in the alloy composition ranges from 0.5 to 1.0.
    Type: Grant
    Filed: February 6, 2017
    Date of Patent: October 1, 2019
    Assignee: KENNAMETAL INC.
    Inventors: Matthew Yao, Abdelhakim Belhadjhamida, David A. Lee, Qingjun Zheng
  • Patent number: 10364500
    Abstract: Electrically-conductive silver metal can be provided in a thin film or pattern on a substrate from a silver complex having reducing silver ions and represented by: wherein L represents an ?-oxy carboxylate; P represents a primary alkylamine compound; a is 1 or 2; b is 1 or 2; and c is 1, 2, 3, or 4, provided that when a is 1, b is 1, and when a is 2, b is 2. The silver complex is mixed in a hydroxy-free, nitrile-containing aprotic solvent with a polymer that is either (i) a hydroxy-containing cellulosic polymer or (ii) a non-cellulosic acrylic polymer having a halo- or hydroxy-containing side chain. The reducible silver ions in the a thermally sensitive thin film or pattern can be thermally converted to electrically-conductive metallic silver under suitable heating conditions to provide a product article that can be used in various devices.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: July 30, 2019
    Assignee: EASTMAN KODAK COMPANY
    Inventors: Deepak Shukla, Kevin M. Donovan, Dianne Marie Meyer
  • Patent number: 10329683
    Abstract: Embodiments herein relate to methods, apparatus, and systems for electroplating metal into recessed features using a superconformal fill mechanism that provides relatively faster plating within a feature and relatively slower plating in the field region. Moreover, within the feature, plating occurs faster toward the bottom of the feature compared to the top of the feature. The result is that the feature is filled with metal from the bottom upwards, resulting in a high quality fill without the formation of seams or voids, defects that are likely where a conformal fill mechanism is used. The superconformal fill mechanism relies on the presence of a sacrificial oxidant molecule that is used to develop a differential current efficiency within the feature compared to the field region. Various plating conditions are balanced against one another to ensure that the feature fills from the bottom upwards. No organic plating additives are necessary, though plating additives can be used to improve the process.
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: June 25, 2019
    Assignee: Lam Research Corporation
    Inventors: Lee J. Brogan, Natalia V. Doubina, Matthew A. Rigsby, Jonathan David Reid
  • Patent number: 10249486
    Abstract: Proposed is a method for polishing a semiconductor substrate including an intermediate polishing step of polishing in such a way that the number of surface defects having heights of less than 3 nm is 45% or more of the total number of the surface defects on the surface of a semiconductor substrate, and a final polishing step of finish-polishing the semiconductor substrate after the intermediate polishing step.
    Type: Grant
    Filed: March 30, 2015
    Date of Patent: April 2, 2019
    Assignee: NITTA HAAS INCORPORATED
    Inventors: Masashi Teramoto, Tatsuya Nakauchi, Noriaki Sugita, Shinichi Haba, Akiko Miyamoto
  • Patent number: 10069131
    Abstract: The present invention is directed to an electrode for energy storage devices and a method for making the electrode for energy storage devices is disclosed, where a flexible binder in the electrode formulation is activated by certain additives and is uniformly deposited on to the active and conductive particles by high speed mixing. The particles deposited with activated binder particles are then pressed together to form free standing electrode film. High performance and cost effective products, such as free standing electrode films, laminated electrodes, ultracapacitors, lithium ion capacitors, batteries, fuel cells and hybrid cells which are the combination of the above devices, and the energy storage system or the system blocks, such as modules, can be manufactured using this process.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: September 4, 2018
    Inventor: Linda Zhong
  • Patent number: 9960051
    Abstract: The present invention relates to an activation composition for activation of silicon substrates, which is an aqueous solution comprising a source of palladium ions, a source of fluoride ions and at least two aromatic acids. The present invention further relates to a method for its use and optionally for subsequent metallization of such treated substrates. The method can be employed in semiconductor and solar cell manufacturing.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: May 1, 2018
    Assignee: Atotech Deutschland GmbH
    Inventors: Christof Suchentrunk, Christian Schwarz
  • Patent number: 9932676
    Abstract: The pretreatment solution for electroless plating of the present invention is composed of noble metal colloidal nanoparticles, a sugar alcohol, and water. The colloidal nanoparticles are gold, platinum, or palladium, have an average particle diameter of 5 to 80 nm, and are contained in the pretreatment solution in an amount of 0.01 to 10 g/L as metal mass. The sugar alcohol is at least one selected from the group consisting of tritol, tetritol, pentitol, hexitol, heptitol, octitol, inositol, quercitol, or pentaerythritol and is contained in the pretreatment solution in an amount of 0.01 to 200 g/L in total. The electroless plating method of the present invention uses the pretreatment solution and performs the electroless plating in an electroless plating bath.
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: April 3, 2018
    Assignee: ELECTROPLATING ENGINEERS OF JAPAN LIMITED
    Inventors: Masahiro Ito, Yuichi Adachi
  • Patent number: 9903019
    Abstract: An aqueous composition for forming a chemical conversion layer on a metal surface, wherein the composition contains at least one active component for the formation of the chemical conversion layer, as well as at least one thickener, and has a viscosity in the range between 10 mPa*s and 10000 mPa*s.
    Type: Grant
    Filed: October 28, 2013
    Date of Patent: February 27, 2018
    Assignees: Airbus Operations GmbH, EADS Deutschland GmbH
    Inventors: Sonja Nixon, Martin Beneke, Dominik Raps
  • Patent number: 9783553
    Abstract: A non-hydroxylic-solvent soluble silver complex comprises a reducible silver ion complexed with an ?-oxy carboxylate and an oxime compound. The non-hydroxylic-solvent soluble silver complex can be represented by the following formula (I): (Ag+)a(L)b(P)c?? (I) wherein L represents the ?-oxy carboxylate; P represents the oxime compound; a is 1 or 2; b is 1 or 2; and c is 1, 2, 3, or 4, provided that when a is 1, b is 1, and when a is 2, b is 2. Such complexes can be incorporated into photosensitive compositions in method to provide thin films or patterns in various articles to provide electrically-conductive silver metal.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: October 10, 2017
    Assignee: EASTMAN KODAK COMPANY
    Inventors: Deepak Shukla, Thomas Robert Welter
  • Patent number: 9765229
    Abstract: The present invention relates to an ink composition and a writing instrument. The ink composition comprises 10 to 70 wt % of a metallic pigment, 10 to 30 wt % of a resin, 0 to 20 wt % of a colorant, 0 to 20 wt % of an auxiliary agent and a solvent as the remainder; the solvent is a main solvent or a mixture of the main solvent and an auxiliary solvent; the resin includes a film-forming resin and a thickening resin; the present invention uses a low-level monohydric alcohol solvent as the main solvent, a polyvinyl acetal resin as the film-forming resin, and further includes the auxiliary agent, the metallic pigment or the colorants, so the ink composition with such good characteristics as being environmental friendly, drying quickly, being written smoothly and having strong compatibility to general writing surfaces is produced.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: September 19, 2017
    Assignee: SHANGHAI NNW NEW MATERIALS TECHNOLOGY CO., LTD.
    Inventors: Wei Qian, Ling Cheng, Yong Sang
  • Patent number: 9731513
    Abstract: A method for forming an ink jet image on a substrate includes ink jetting an ink jettable and UV-curable composition onto the substrate in an imagewise fashion to form an ink jetted image on the substrate. The ink jettable and UV-curable composition includes: a reactive polymer comprising: (a1) or (a2) recurring units comprising pendant metal complexing water-solubilizing groups, (b) at least 5 mol % of recurring units having a pendant group capable of crosslinking via [2+2] photocycloaddition, and optionally (c) at least 1 mol % of recurring units comprising a pendant amide, hydroxyl, or lactam group, or a pendant precursor moiety for the pendant amide, hydroxyl, or lactam group. The ink jetted image is cured to form a UV-cured ink jet image on the substrate. The ink jettable and UV-curable composition can also include metal nanoparticles or reducible metal ions that can serve as catalytic sites for electroless plating.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: August 15, 2017
    Assignee: EASTMAN KODAK COMPANY
    Inventors: Thomas B. Brust, Anne Troxell Wyand
  • Patent number: 9532448
    Abstract: A power electronics module including an insulated patterned metal substrate, a semiconductor bonded to the substrate, and an agglomeration of solid metal particles mechanically bound to each other and the substrate and arranged to form electrical interconnects between the semiconductor and a bus bar, a control board, a sensor, or a combination thereof.
    Type: Grant
    Filed: March 3, 2016
    Date of Patent: December 27, 2016
    Assignee: Ford Global Technologies, LLC
    Inventor: Brian Joseph Robert
  • Patent number: 9521790
    Abstract: A panel includes a display window and a supporting body integrated with the display window. The display window is made of sapphire and the supporting body is made of ceramic materials. The supporting body is integrally formed with the supporting body by sintering process. A method for manufacturing the panel is also provided.
    Type: Grant
    Filed: November 22, 2013
    Date of Patent: December 13, 2016
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Shao-Han Chang
  • Patent number: 9403995
    Abstract: The present invention provides blue colored aqueous dispersion of silver nanoparticles and process for preparation thereof. The present invention also provides compositions comprising blue colored dispersion of silver nanoparticles. The blue colored aqueous dispersion comprising silver nanoparticles wherein dispersion is characterized by —having plasmonic peaks in the range 330-335 nm and 650-720 nm combined with missing plasmonic peaks in the range 390 to 410 nm and 410-500 nm in UV-Vis spectrum, —the dispersion having silver nanoparticles of anisotropic shape with majority of particles (>65%) having equivalent diameter in range of 0.5 to 6 nm, —Molar extinction coefficient greater than 10.1 preferably in the range of 10.1 to 15.7 mM?1 cm?1 at wavelength of maximum absorption in the range of 650-720 nm, —Dispersion stability of at least 15 months, —Minimum Bactericidal Concentration (MBC) lower than 0.10 ppm preferably in the range of 0.055-0.099 ppm.
    Type: Grant
    Filed: November 2, 2011
    Date of Patent: August 2, 2016
    Assignees: Indian Institute of Technology, Resil Chemicals Private Limited
    Inventors: Ashwini K. Agrawal, Manjeet Jassal, Sangita Paul, Ganesh Srinivasan, Gayatri Hela Pamidipati
  • Patent number: 9217093
    Abstract: An ink includes a palladium salt, an organic amine that forms a palladium complex from the palladium salt, and, at least one solvent, the solvent has a boiling point at about the decomposition temperature of the palladium complex.
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: December 22, 2015
    Assignee: XEROX CORPORATION
    Inventors: Yiliang Wu, Biby Esther Abraham
  • Publication number: 20150126031
    Abstract: A process for depositing a metal includes disposing an activating catalyst on a substrate; contacting the activating catalyst with a metal cation from a vapor deposition composition; contacting the substrate with a reducing anion from the vapor deposition composition; performing an oxidation-reduction reaction between the metal cation and the reducing anion in a presence of the activating catalyst; and forming a metal from the metal cation to deposit the metal on the substrate.
    Type: Application
    Filed: January 14, 2015
    Publication date: May 7, 2015
    Inventor: Owen HILDRETH
  • Patent number: 8974752
    Abstract: Methods of treating of stannous oxide particles having at least a partial surface crust of stannic oxide by contacting the particles with a reducing agent for a period of time sufficient to produce stannous oxide are provided. The stannous oxide particles produced are readily soluble in organic sulfonic acids.
    Type: Grant
    Filed: September 30, 2012
    Date of Patent: March 10, 2015
    Assignee: Dow Global Technologies LLC
    Inventor: Matthew L. Grandbois
  • Publication number: 20150033980
    Abstract: One aspect of the present invention includes a method of fabricating an electronic device. According to one embodiment, the method comprises providing a substrate having dielectric oxide surface areas adjacent to electrically conductive surface areas, chemically bonding an anchor compound with the dielectric oxide surface areas so as to form an anchor layer, initiating the growth of a metal using the electrically conductive surface areas and growing the metal so that the anchor layer also bonds with the metal. The anchor compound has at least one functional group capable of forming a chemical bond with the oxide surface and has at least one functional group capable of forming a chemical bond with the metal. Another aspect of the present invention is an electronic device. A third aspect of the present invention is a solution comprising the anchor compound.
    Type: Application
    Filed: October 16, 2014
    Publication date: February 5, 2015
    Inventor: Artur KOLICS
  • Patent number: 8894760
    Abstract: A Group 3a ink, comprising, as initial components: a polyamine solvent; a Group 3a material/organic complex; and, a reducing agent; wherein the molar concentration of the reducing agent exceeds the molar concentration of the Group 3a material/organic complex; wherein the Group 3a ink is a stable dispersion and wherein the Group 3a ink is hydrazine and hydrazinium free. Also provided are methods of preparing the Group 3a ink and of using the Group 3a ink to deposit a Group 3a material on a substrate for use in a variety of semiconductor applications, such as metallization of silicon devices in VLSI technology, the growth of semiconducting III-V alloys, thin film transistors (TFTs), light emitting diodes (LEDs); and infrared detectors.
    Type: Grant
    Filed: November 20, 2009
    Date of Patent: November 25, 2014
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Kevin Calzia, David W. Mosley
  • Publication number: 20140287165
    Abstract: The present disclosure is related to a cladding composition. The cladding composition may include cladding powder particles and flux particles. The flux particles may have an average particle size of less than about 40 ?m, and more than about 50% of the flux particles may adhere to the surfaces of the cladding powder particles.
    Type: Application
    Filed: March 21, 2013
    Publication date: September 25, 2014
    Applicant: Caterpillar Inc.
    Inventors: Daniel Thomas Cavanaugh, Daniel Joseph Sordelet, Justin Curtis Embrey
  • Publication number: 20140242288
    Abstract: Provided are a reducing electroless silver plating solution and a reducing electroless silver plating method using the silver plating solution, the reducing electroless silver plating solution being capable of preventing decomposition of silver in the plating solution thereby to maintain stability of the solution and also being capable of preventing excessive roughening of an underlying metal or the like thereby to form a plating film having good film characteristics and a good appearance. The reducing electroless silver plating solution according to the present invention comprises a water-soluble silver salt and a reducing agent, wherein cyanide ions in a concentration of 0.006×10?3 mol/L to 12.5×10?3 mol/L are contained.
    Type: Application
    Filed: October 9, 2012
    Publication date: August 28, 2014
    Applicant: C. UYEMURA & CO., LTD
    Inventors: Daisuke Hashimoto, Kota Kitajima, Akira Okada
  • Publication number: 20140230688
    Abstract: A current collector is covered with sodium metal through: (1) applying a sodium dispersion containing sodium metal and at least one substance selected from the group consisting of an imide salt and a binder, on a current collector in an inert gas environment (with an oxygen concentration of not more than 0.01% and a dew point of not more than ?10° C.), followed by heating and drying; (2) pressure bonding a piece of solid sodium metal having a surface which exhibits a metallic luster onto a current collector in the aforementioned inert gas environment; (3) vapor-depositing sodium metal on a current collector in a reduced pressure environment; or (4) immersing a current collector having a surface fired at a temperature ranging from 150 to 300° C. in molten sodium metal after removing a coating film which is generated on a surface and formed from impurities, in the aforementioned inert gas environment.
    Type: Application
    Filed: September 27, 2012
    Publication date: August 21, 2014
    Applicant: NIPPON SODA CO., LTD
    Inventors: Hideaki Ito, Hitoshi Kobayashi, Toshiaki Yamashita, Shinichi Maruyama
  • Publication number: 20140205859
    Abstract: An electroless silver plating ink useful in a one step process for coating an article substrate with a bright metallic silver plate, wherein the silvering ink comprises a silver diammine ion, [Ag(NH.sub.3).sub.2].sup.+, in dimethyl sulfoxide.
    Type: Application
    Filed: January 22, 2013
    Publication date: July 24, 2014
    Inventor: Andre Reiss
  • Publication number: 20140193571
    Abstract: The present disclosure is directed to a process for producing a low gloss metallic color coating composition having a target gloss value. The low gloss metallic color coating composition can be produced from a high gloss metallic color coating composition with the addition of a matting agent. The disclosure is also directed to a coating system using the process. This disclosure is also directed to a method for matching color, flake appearance, and gloss of a coating. The processes, methods and systems of this disclosure are particularly useful for producing a low gloss metallic color coating composition having a target gloss value when the high gloss metallic color coating composition comprises both metallic effect pigments and color pigments.
    Type: Application
    Filed: July 23, 2012
    Publication date: July 10, 2014
    Inventors: Ayumu Yokoyama, Rajesh Gopalan Saliya, Anthony Moy
  • Patent number: 8748007
    Abstract: Disclosed are coating compositions, such as primer compositions, suitable for providing corrosion protection to metal substrates, as well as related coated articles and methods.
    Type: Grant
    Filed: April 24, 2008
    Date of Patent: June 10, 2014
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Matthew S. Scott, Richard F. Syput, Steven R. Zawacky
  • Patent number: 8734686
    Abstract: Disclosed is a metal pattern composition including a conductive metal or a conductive metal precursor compound, and a carboxylic acid-amine base ion pair salt.
    Type: Grant
    Filed: September 10, 2010
    Date of Patent: May 27, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-Hun Byun, Jae-Ho Lee, Young-Hwan Kim
  • Publication number: 20140109793
    Abstract: A method of supplying a Zn—Al alloy to a molten zinc pot which accommodates a molten zinc bath in a hot dip galvanizing line, includes: supplying the Zn—Al alloy from a supply portion provided at a lower portion of an insertion guide having a pipe shape, in which the supply portion is immersed between an inner wall of the molten zinc pot on a downstream side in a travelling direction of a steel sheet and a front support roll installed in the molten zinc bath at a depth within ±400 mm from a lower end of the front support roll, and an inside of the insertion guide is pressurized by inert gas to prevent the molten zinc bath from advancing to the inside of the insertion guide.
    Type: Application
    Filed: March 4, 2013
    Publication date: April 24, 2014
    Applicant: Nippon Steel & Sumitomo Metal Corporation
    Inventors: Yu Yamauchi, Mikio Kawamura, Masaaki Omodaka, Hideki Nishimura
  • Patent number: 8697233
    Abstract: A metal-coated material comprising a metal-coated lipid bilayer vesicle and a preparation method thereof are provided. A metal-coated material comprising a metal-coated lipid bilayer vesicle having a network of siloxane bonding (Si—O—Si) on its surface. a method for preparing the metal-coated lipid bilayer vesicle comprising the following steps: (1) rendering the functional group(s) having the ability of carrying the metal catalyst to the surface of lipid bilayer vesicle having a network of siloxane bonding (Si—O—Si bonding) on its surface, at or after the formation, by self-organization, of the lipid bilayer vesicle; (2) immobilizing the metal catalyst on the surface of the lipid bilayer vesicle; (3) optionally, reducing the metal catalyst; and (4) performing electroless plating.
    Type: Grant
    Filed: October 31, 2006
    Date of Patent: April 15, 2014
    Assignees: Nara Institute of Science and Technology, JX Nippon Mining & Metals Corporation
    Inventors: Jun-ichi Kikuchi, Yoshihiro Sasaki, Mineo Hashizume, Toru Imori
  • Patent number: 8696944
    Abstract: Disclosed is a metal pattern composition including a conductive metal or a conductive metal precursor compound, and a carboxylic acid-amine base ion pair salt.
    Type: Grant
    Filed: September 10, 2010
    Date of Patent: April 15, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-Hun Byun, Jae-Ho Lee, Young-Hwan Kim
  • Patent number: 8673401
    Abstract: A method for depositing gallium using a gallium ink, comprising, as initial components: a gallium component comprising gallium; a stabilizing component; an additive; and, a liquid carrier; is provided comprising applying the gallium ink on the substrate; heating the applied gallium ink to eliminate the additive and the liquid carrier, depositing gallium on the substrate; and, optionally, annealing the deposited gallium.
    Type: Grant
    Filed: January 7, 2013
    Date of Patent: March 18, 2014
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: David Mosley, David Thorsen
  • Publication number: 20140070399
    Abstract: Electrochemically deposited indium composites are disclosed. The indium composites include indium metal or an alloy of indium with one or more ceramic materials. The indium composites have high bulk thermal conductivities. Articles containing the indium composites also are disclosed.
    Type: Application
    Filed: November 18, 2013
    Publication date: March 13, 2014
    Inventors: Nathaniel E. BRESE, Edit SZOCS, Felix J. SCHWAGER, Michael P. TOBEN, Martin W. BAYES
  • Publication number: 20140026782
    Abstract: The present invention relates to a silver ink composition comprising: silver complexes obtained by reacting one or more silver compounds selected from chemical formula 1 with one or more ammonium carbamate-based compounds or ammonium carbonate-based compounds selected from chemical formula 2 to chemical formula 4; and oxime-based compounds.
    Type: Application
    Filed: April 20, 2012
    Publication date: January 30, 2014
    Applicant: INKTEC CO., LTD.
    Inventors: Kwang-Choon Chung, Hyun Nam Cho, Ji Hoon Yoo, Dae Sang Han
  • Patent number: 8623764
    Abstract: Compositions and methods for forming metal films on semiconductor substrates are disclosed. One of the disclosed methods comprises: heating the semiconductor substrate to obtain a heated semiconductor substrate; exposing the heated semiconductor substrate to a composition containing at least one metal precursor comprising at least one ligand, an excess amount of neutral labile ligands, a supercritical solvent, and optionally at least one source of B, C, N, Si, P, and mixtures thereof; exposing the composition to a reducing agent and/or thermal energy at or near the heated semiconductor substrate; disassociating the at least one ligand from the metal precursor; and forming the metal film while minimizing formation of metal oxides.
    Type: Grant
    Filed: July 21, 2010
    Date of Patent: January 7, 2014
    Assignee: Lam Research Corporation
    Inventor: Mark Ian Wagner
  • Patent number: 8617301
    Abstract: Compositions and methods for depositing elemental metal M(0) films on semiconductor substrates are disclosed. One of the disclosed methods comprises: heating the semiconductor substrate to obtain a heated semiconductor substrate; exposing the heated semiconductor substrate to a composition containing a metal precursor, an excess amount of neutral labile ligands, and a supercritical solvent; exposing the metal precursor to a reducing agent and/or thermal energy at or near the heated semiconductor substrate; reducing the metal precursor to the elemental metal M(0) by using the reducing agent and/or the thermal energy; and depositing the elemental metal M(0) film while minimizing formation of metal oxides.
    Type: Grant
    Filed: January 30, 2007
    Date of Patent: December 31, 2013
    Assignee: Lam Research Corporation
    Inventor: Mark Ian Wagner
  • Publication number: 20130309404
    Abstract: An autocatalytic tin plating bath containing Sn2+ ions, Ti3+ ions as reducing agent, an organic complexing agent and phenanthroline or a derivative thereof as stabilizing agent is disclosed. The plating bath is suitable for manufacture of printed circuit boards, IC substrates and metallization of semiconductor wafers.
    Type: Application
    Filed: January 11, 2012
    Publication date: November 21, 2013
    Applicant: Atotech Deutschland GmbH
    Inventors: Arnd Kilian, Jens Wegricht, Isabel-Roda Hirsekorn
  • Patent number: 8574665
    Abstract: A palladium precursor composition contains a palladium salt and an organoamine. The composition permits the use of solution processing methods to form palladium layers.
    Type: Grant
    Filed: June 6, 2011
    Date of Patent: November 5, 2013
    Assignee: Xerox Corporation
    Inventors: Yiliang Wu, Ping Liu
  • Patent number: 8568824
    Abstract: A non-catalytic palladium precursor composition is disclosed, including a palladium salt and an organoamine, wherein the composition is substantially free of water. The composition permits the use of solution processing methods to form a palladium layer on a wide variety of substrates, including in a pattern to form circuitry or pathways for electronic devices.
    Type: Grant
    Filed: November 7, 2011
    Date of Patent: October 29, 2013
    Assignee: Xerox Corporation
    Inventors: Yiliang Wu, Ping Liu
  • Patent number: 8563088
    Abstract: A method for preparing a Group 1a-1b-3a-6a material using a selenium/Group 1b ink comprising, as initial components: a selenium component comprising selenium, an organic chalcogenide component having a formula selected from RZ—Z?R? and R2—SH, a Group 1b component and a liquid carrier; wherein Z and Z? are each independently selected from sulfur, selenium and tellurium; wherein R is selected from H, C1-20 alkyl group, a C6-20 aryl group, a C1-20 alkylhydroxy group, an arylether group and an alkylether group; wherein R? and R2 are selected from a C1-20 alkyl group, a C6-20 aryl group, a C1-20 alkylhydroxy group, an arylether group and an alkylether group; and wherein the selenium/Group 1b ink is a stable dispersion.
    Type: Grant
    Filed: October 12, 2012
    Date of Patent: October 22, 2013
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Kevin Calzia, David Mosley, David L. Thorsen, Charles R. Szmanda
  • Publication number: 20130108512
    Abstract: Methods of treating of stannous oxide particles having at least a partial surface crust of stannic oxide by contacting the particles with a reducing agent for a period of time sufficient to produce stannous oxide are provided. The stannous oxide particles produced are readily soluble in organic sulfonic acids.
    Type: Application
    Filed: September 30, 2012
    Publication date: May 2, 2013
    Applicant: DOW GLOBAL TECHNOLOGIES LLC
    Inventor: Dow Global Technologies LLC
  • Publication number: 20130084466
    Abstract: Disclosed are methods for treating metal substrates that include contacting the metal with pretreatment compositions comprising: (a) a group IIIB metal, a group IVB metal and/or a group VB metal; and (b) a rheology modifier composition.
    Type: Application
    Filed: September 30, 2011
    Publication date: April 4, 2013
    Applicant: PPG Industries Ohio, Inc.
    Inventors: Nathan J. Silvernail, Thor G. Lingenfelter
  • Patent number: 8383849
    Abstract: Classes of liquid aminosilanes have been found which allow for the production of silicon carbo-nitride films of the general formula SixCyNz. These aminosilanes, in contrast, to some of the precursors employed heretofore, are liquid at room temperature and pressure allowing for convenient handling. In addition, the invention relates to a process for producing such films. The classes of compounds are generally represented by the formulas: and mixtures thereof, wherein R and R1 in the formulas represent aliphatic groups typically having from 2 to about 10 carbon atoms, e.g., alkyl, cycloalkyl with R and R1 in formula A also being combinable into a cyclic group, and R2 representing a single bond, (CH2)n, a ring, or SiH2.
    Type: Grant
    Filed: March 18, 2011
    Date of Patent: February 26, 2013
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Manchao Xiao, Arthur Kenneth Hochberg
  • Patent number: 8372485
    Abstract: A gallium ink is provided, comprising, as initial components: a gallium component comprising gallium; a stabilizing component; an additive; and, a liquid carrier; wherein the gallium ink is a stable dispersion. Also provided are methods of preparing the gallium ink and for using the gallium ink in the preparation of semiconductor films (e.g., in the deposition of a CIGS layer for use in photovoltaic devices).
    Type: Grant
    Filed: February 18, 2011
    Date of Patent: February 12, 2013
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: David Mosley, David Thorsen
  • Publication number: 20130022761
    Abstract: The present invention relates to a silver complex obtained by reacting at least one silver compound represented by the formula 2 below with at least one ammonium carbamate compound or ammonium carbonate compound represented by the formula 3, 4 or 5 below:
    Type: Application
    Filed: May 11, 2012
    Publication date: January 24, 2013
    Applicant: Inktec Co., Ltd.
    Inventors: Kwang-Choon Chung, Hyun-Nam Cho, Myoung-Seon Gong, Yi-Sup Han, Jeong-Bin Park, Dong-Hun Nam, Seong-Yong Uhm, Young-Kwan Seo
  • Patent number: 8354046
    Abstract: Highly ordered Ge films are prepared directly on single crystal Si substrates by applying an aqueous coating solution having Ge-bound polymer onto the substrate and then heating in a hydrogen-containing atmosphere. A coating solution was prepared by mixing water, a germanium compound, ethylenediaminetetraacetic acid, and polyethyleneimine to form a first aqueous solution and then subjecting the first aqueous solution to ultrafiltration.
    Type: Grant
    Filed: September 11, 2009
    Date of Patent: January 15, 2013
    Assignee: Los Alamos National Security, LLC
    Inventors: Quanxi Jia, Anthony K. Burrell, Eve Bauer, Filip Ronning, Thomas Mark McCleskey, Guifu Zou