Abstract: An installation for hot dip coating a metal strip is provided. The installation includes a device for moving the metal strip along a path, a pot for containing a melt bath and a wiping system including at least two nozzles placed on either side of the path downstream the pot. The wiping system has a box with a lower confinement part confining an atmosphere around the metal strip upstream of said nozzles and an upper confinement part confining the atmosphere around the metal strip downstream of the nozzles, first moving means for vertically moving the lower confinement part with respect to the pot and second moving means for vertically moving the upper confinement part with respect to both the pot and the lower confinement part. The nozzles are vertically movable relative to the pot.

Abstract: A solder dross recovery module has gears and a waste collection chamber positioned within a solder pot. The gears are configured to draw in solder dross from a surface of molten solder stored in the solder pot. The gears apply pressure to the solder dross so as to separate solder from the solder dross. The recovered solder is returned to the molten solder in the solder pot. A resulting waste material is collected in the waste collection chamber.

Abstract: An apparatus for hot dip coating metal strip is disclosed having a dip bath vessel (4), a snout (6) which opens into the dip bath vessel for introducing a metal strip (1) which is heated in a continuous furnace into the dip bath, and a deflecting roller (7) which is arranged in the dip bath vessel for deflecting the metal strip (1) which enters into the dip bath in a direction which points out of the dip bath. The snout (6) is provided with a shaft-shaped snout extension piece (6.1) for increasing the snout dipping depth, the internal width of the snout extension piece (6.1) tapering toward its outlet opening (6.15) at least over a part length of said snout extension piece (6.1). As a result, an increase or maximization of the eddy flow in the molten metal at or close to the metal strip (1) and therefore improved homogenization of the molten metal in the region of the strip is achieved, as a result of which slag-induced surface defects on the surface of the coated metal strip (1) can be avoided.

Abstract: Apparatus is disclosed for controlling the depth of a layer of a layer of adhesive on a peripheral surface of a rotary member (e.g., a wheel) for the application of the adhesive to an object. The apparatus comprises a heated reservoir containing a supply of hot melt adhesive maintained within a desired temperature range, where the rotary member is partially immersed in the adhesive and is rotated by a motor such that the as the rotary member is rotated up out of the peripheral surface of the rotary member has the layer of adhesive thereon. A computer controls system controls the motor such that the speed of the rotary member may be increased or decreased so as to vary the depth of the adhesive on the peripheral surface of the rotary member.

Abstract: Methods for coating an implantable medical device, such as a stent, are provided.

Abstract: An electroless deposition system includes a deposition solution, and saturating the deposition solution with an oxygen concentration in a range from about two thousand parts per million to about twenty thousand parts per million.

Abstract: A system and method for coating an implantable medical device, such as a stent, are provided.

Abstract: A substrate processing apparatus of the present invention comprises a cooling mechanism for cooling a processing solution and a filter for removing impurities contained in the processing solution, at some midpoint in a circulation path of the processing solution. With this constitution, the substrate processing apparatus can precipitate the impurities dissolved in the processing solution and remove the precipitated impurities. It therefore becomes possible to maintain the performance of the processing solution and reuse the processing solution. Further, the frequency of changing the processing solution to a new solution decreases, and this causes an increase in availability of the substrate processing apparatus and a decrease in consumption and drainage of the processing solution.

Abstract: An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble metals include palladium and platinum. Examples of semi-noble metals include cobalt, nickel, and tungsten. The catalytic layer may be deposited by electroless deposition, electroplating, or chemical vapor deposition. In one embodiment, the catalytic layer may be deposited in the feature to act as a barrier layer to a subsequently deposited conductive material. In another embodiment, the catalytic layer may be deposited over a barrier layer. In yet another embodiment, the catalytic layer may be deposited over a seed layer deposited over the barrier layer to act as a “patch” of any discontinuities in the seed layer. Once the catalytic layer has been deposited, a conductive material, such as copper, may be deposited over the catalytic layer.

Abstract: It is desired to remove matter on a fluid surface of a tank. The tank defines a circular tank orifice comprising a tank orifice rim, the tank orifice rim containing a fluid surface of a fluid, the fluid overflowing the tank orifice rim to form a fluid overflow, the fluid surface defining a fluid surface center. The matter is removed by discharging from near the tank orifice rim a plurality (n) of jets of the fluid towards the fluid surface center. Any matter on the fluid surface is thereby urged toward the tank orifice rim and eventually removed from the fluid surface by the fluid overflow. In one application, the tank comprises a dip tank and the fluid comprises photoreceptor coating solution or components thereof such as solvents, additives, or both.

Abstract: An apparatus including: (a) a vessel for a solution having a bottom end and an open top end, and defining a vertical axis perpendicular to the bottom end; (b) an insert device having a bottom surface and a top surface and nested within the vessel, wherein the insert device defines a passageway dimensioned for a substrate which is parallel to the vertical axis and extending through the insert device, and wherein the insert device also defines at least one bypass channel extending through the insert to allow solution within the vessel to flow to the top surface of the insert device; and (c) an overflow container positioned adjacent the vessel to catch solution runoff from the top surface of the insert device.

Abstract: A method for applying a viscous material to a lead frame element. A method of the invention includes positioning the lead frame facing downward and bringing the lead fingers into contact with a pool of adhesive material. The contact of the lead fingers to the adhesive material results in a portion of the lead fingers receiving a portion of the adhesive material from the pool of adhesive material. The gravitational forces on the adhesive material on the downward facing lead frame maintain the shape and boundary definition of the adhesive material.

Abstract: A method for applying a viscous material to a lead frame element. A method of the invention includes positioning the lead frame facing downward and bringing the lead fingers into contact with a pool of adhesive material. The contact of the lead fingers to the adhesive material results in a portion of the lead fingers receiving a portion of the adhesive material from the pool of adhesive material. The gravitational forces on the adhesive material on the downward facing lead frame maintain the shape and boundary definition of the adhesive material.

Abstract: The invention relates to a process for application of an organic coating on a moving metallurgical product 7 from a bath of a liquid organic material 3 contained in a vat 2 and liable to comprise air bubbles, the transfer of said liquid organic material 3 onto the product being accomplished in a coating zone, characterized in that, in order to eliminate said air bubbles, there is created in at least one zone of the bath, located upstream from said coating zone, an ascending current in the liquid material so as to convey the air bubbles from the bath to the vicinity of its surface and cause their bursting. The invention also relates to an apparatus for the implementation of this process.

Abstract: A dip soldering process includes a reservoir of molten solder and a solder ladle for immersion therein to refresh the supply of ladled solder. The ladled solder is displaced by a displacement plunger to thereby overflow the ladle and carry with it surface contamination. Continued immersion of the plunger during the soldering operation of the workpiece accomplishes continual flow across the soldered workpiece thereby removing any contaminants which rise to the surface or are introduced by the workpiece.

Abstract: A sliding bearing to be immersed in molten metal has low friction and long life. The bearing is provided with a solid particle trap portion for preventing solid particles in the molten metal from penetrating between sliding surfaces of the shaft and the bearing and removing the solid particles. Abrasive wear and an increase in friction, caused by biting of the solid particles into the sliding surfaces can be prevented. A continuous hot-dip plating apparatus employs the sliding bearing in the molten metal.

Abstract: A fabricated bubble operated pump for diluting dross in a steel treating bath.

Abstract: A dipping head dips planar arrays of electronic components, disposed in carriers, into sheets of termination paste that are conveyed to a dipping site by a conveyor having an upper planar surface. The sheets are produced atop the conveyor by a doctoring device. The conveyor can be a belt, preferably an endless belt of stainless steel. A wear plate provides vertical support for the belt at the dipping site in order to maintain the planarity of the sheet of termination paste. Preferably the wear plate is perforated with a vacuum source below to hold the belt snug against the plate. The doctoring device is located before (referenced to the direction of belt travel) the dipping site and can be a reservoir of paste riding atop the belt with the paste selectively metered out by raising or lowering of the blade against the belt. A scraper blade can be located after the dipping site to recover leftover paste and guide it into a device which pumps the paste through a filter and back to the reservoir.

Abstract: Take-in and take-out conveyors are provided on horizontal sides of a chucking mechanism, which is adapted to engage a workpiece and vertically move the same, and disposed flush with each other for supplying and discharging the workpiece to and from a position of the chucking mechanism. A dipping vessel is provided immediately under the chucking mechanism at a position lower than the level at which the workpiece is carried by the take-in and take-out conveyors. The take-in and take-out conveyors, which are adapted to carry the workpiece in the same direction and at the same speed, are slid/driven in approaching and separating directions between standby positions, which are opposite to each other across a vertical space of the chucking mechanism, and working positions which are located near each other immediately under the chucking mechanism. Thus, it is possible to perform dipping with high accuracy without sliding the chucking portion while protecting the workpiece against vibration and deviation.

Abstract: Apparatus for soldering, leveling and cooling printed circuit panels including a preheater, a fluxer, and soldering, leveling and cooling stations. The cooperation of the soldering, leveling and cooling stations provides for efficient processing of printed circuit panels. The soldering station, which includes a solder immersion chamber through which the panels are conveyed, provides an oil coating on the solder to minimize formation of dross. Automatic replenishment of oil through use of suitable flux on the panels to be soldered provide continuous cleaning of the soldering system to permit extended operation. A cooling table transports the soldered panels on a cushion of air to prevent marring.

Abstract: In a dip soldering apparatus, a first scraper blade scrapes the surface of the solder bath before a pot is raised through the surface of the bath, and a second blade then scrapes the surface of solder in the pot when the pot has been lifted through the surface. The blades are swept around in a circle to facilitate operation of the device. A rotary station for feeding components to the soldering apparatus comprises a rotatable table carrying a plurality of pneumatically operated stations to index them sequentially through operating positions. The air supply lines, for pneumatic control and operation of each station, are discrete to the respective operating positions and so it is not necessary to provide a system of supply lines which rotate with the stations. An end of a supply line is sealed to a conduit in the table by a PTFE sealing member which has an inwardly directed, tapered lip. As air pressure in the line is increased (to operate the station) the lip is urged against the underside of the table.

Abstract: An apparatus and method for fabricating integral three-dimensional objects from successive layers of photoformable compositions by exposing the layers of the composition through a detachable flexible transparent film, one side of the film being in contact with the composition and the other side of the film with a rigid transparent plate, which guides and supports the film.

Abstract: A large thin web having a coherent crystal morphology throughout its extent is made on a continuous basis by drawing a meniscus of the web material from a hot melt thereof onto a heated support surface which moves relative to the melt so that the liquid is distributed as a thin liquid film over that support surface. The moving support surface advances the film progressively past a chiller which establishes a chill zone at the surface of the film which cools the film material at an isothermal front or boundary therein to a temperature below the melting point of the material so that the material solidifies. Also, a crystal seeding bar is located at the chill zone which is brought into contact with the film just ahead of the front so that when the film solidifies in the chill zone it assumes the crystal morphology of the seeding bar.

Abstract: An organic film forming apparatus includes a trough storing water therein and a work drive device for moving a work with respect to the trough. The surface of the water is partitioned by a rod into a first developing region on which a monomolecular film is developed and a second developing region on which no monomolecular film is developed. The work is moved by the device through the developed monomolecular film so as to adhere the film on the surface of the work. The device has a holding mechanism which has a holding portion engaged with the work, and which holds the work so that when the work passes through the developed monomolecular film, the holding portion is away from the film or passes through the film after almost the entire work passes through the film.

Abstract: A method is described which details the preparation of large area close packed monolayers of colloidal particles from random distributions of colloidal particles by compressing the random network.

Abstract: The crucible is of the type in which substrates to be epitaxially coated are disposed in a slide comprising a substrate carrier (7), whose displacement permits of bringing the substrates (9) successively into contact with different baths of epitaxy. It comprises a compartment (2), in which tightening slides (11) and solution-containing slides (12) are alternately stacked, each of the latter slides having a cavity receiving a solution (14) and merging at the lower part of the said slide (12). The tightening slides (11) close the lower part of the cavities (45). The slide comprising a substrate carrier (7) can be translated between a rear position in which it is disengaged from the stack and a front position in which, after having driven out the lower slide of the stack, it is situated under this stack.

Abstract: For protecting the surface of a soldering bath a covering means is used which comprises two phases (3,4), which are placed one on top of the other, are not soluble in each other and are liquid at the soldering temperature. The bottom phase (3) is produced by spreading over the top phase (4), which consists of a liquid synthetic polyalphaolefin, a powder of a chemically active component of sebacic acid and/or suberic acid which is solid at room temperature and liquid at the soldering temperature.

Abstract: Metallic articles, for instance, ferrous strips are metallized, for instance, zinc coated by passing the heated article through a coating chamber and applying thereto a continuous stream of the molten coating metal so as to uniformly and evenly metallize said article. Thereafter, excess molten coating metal is removed from the coated article by hot gas blasting and the hot gas blasted article leaving the coating chamber is immediately cooled. Wiping means may be provided before applying the molten coating metal so as to deflect any molten coating metal dropping from the metallic article passing therethrough, while rollers may be arranged between the coating metal applying means and the hot gas blasting means. Said rollers serve to remove the major part of excess coating metal from the coated metallic article and to stabilize movement of the metallic article passing through the coating chamber.

Abstract: The occurrence of defects on wire coated with an aluminum-zinc alloy coating applied by hot dipping in a molten coating bath is substantially decreased by preventing the deposition of zinc powder particles upon the surface of the molten aluminum-zinc coating prior to solidification of the coating. The deposition of metallic zinc powder particles upon the molten aluminum-zinc coating may be alleviated in several different manners, including preventing the formation of the zinc powder, preventing the accumulation of the zinc powder upon the surface of the molten aluminum-zinc bath, decomposing the zinc powder before it accumulates and exhausting or removing the zinc powder from the vicinity of the molten metal coated wire as it leaves the molten bath. Several novel apparatus arrangements for accomplishing the above are disclosed.

Abstract: An apparatus for applying an epoxy glue, solder paste or a similar material to the surface of a planar circuit chip, such as a silicon integrated circuit chip. Positioned just above the liquid epoxy in the bath is a fine mesh, stainless steel screen clamped at its periphery and having supported thereover a leveling paddle with a micrometer adjustment rotatable relative to the bath itself for smoothing the material over the screen surface. After this smoothing or leveling operation, the chip, usually held by a vacuum chuck, is pressed against the screen into the epoxy with the screen functioning as a resilient means enabling the chip to be withdrawn therefrom with uniform deposition of material applied to the undersurface thereof. The apparatus may also have a spongy material such as polyurethane or a sponge neoprene rubber under the screen to enhance chip removal.

Abstract: An apparatus used in surface treatment and a method of surface treatment using said apparatus are provided in the present invention.

Abstract: In a bottle cleaning operation, bottles to be cleaned are introduced into a machine housing divided into a first housing and a separate second housing intercommunicating with one another through a bottle transfer section. Bottles are introduced into carrier compartments mounted on a first endless circulating chain in the first housing. After undergoing certain cleaning procedures in the first housing, the bottles are transferred into the second housing with the bottles passing in a free-falling manner from the first circulating chain. Within the second housing the cleaning operation is continued with the bottles held in carrier compartments on a second endless circulating chain. After being treated within the second housing, the bottles free-fall from the second circulating chain and return into the first housing for completing the cleaning operation before the bottles are discharged from the first housing.

Abstract: The occurrence of defects on wire coated with an aluminum-zinc alloy coating applied by hot dipping in a molten coating bath is substantially decreased by preventing the deposition of zinc powder particles upon the surface of the molten aluminum-zinc coating prior to solidification of the coating. The deposition of metallic zinc powder particles upon the molten aluminum-zinc coating may be alleviated in several different manners, including preventing the formation of the zinc powder, preventing the accumulation of the zinc powder upon the surface of the molten aluminum-zinc bath, decomposing the zinc powder before it accumulates and exhausting or removing the zinc powder from the vicinity of the molten metal coated wire as it leaves the molten bath. Several novel apparatus arrangements for accomplishing the above are disclosed.

Abstract: A method and an apparatus for continuously hot-dip galvanizing a steel strip, which comprises:Using a hot-dip galvanizing tank divided into a reaction chamber and a plating chamber having a bottom wall downwardly inclining toward the bottom wall of said reaction chamber, by a vertical partition provided, at the lowermost end thereof, with a gap and, at the upper end portion thereof, with an aperture of which the opening can be adjusted, said reaction chamber and said plating chamber communicating with each other through said gap and said aperture; causing a hot-dip galvanizing bath containing aluminum in a prescribed amount, contained in said hot-dip galvanizing tank, to circulate by convection, under the effect of stirring by a stirring means provided in said reaction chamber, through said gap and said aperture, between said reaction chamber and said plating chamber; continuously introducing a steel strip into said hot-dip galvanizing bath in said plating chamber while continuing said stirring, to subject sa

Abstract: Apparatus is disclosed herein for extending the length of a trailing wave of a double sided laminar wave of solder by the use of a dam in an oil intermix wave soldering system to create a dead zone while still being able to remove oil from the surface of the dead zone area on a continuous basis to prevent contaminants from interfering with soldering operations.