Abstract: A method of producing microelectronic components includes forming a functional layer system; applying a laminar carrier to the functional layer system; attaching a workpiece to a workpiece carrier; utilizing incident radiation of a laser beam is focused in a boundary region between a growth substrate and the functional layer system, and a bond between the growth substrate and the functional layer system in the boundary region is weakened or destroyed; separating a functional layer stack from the growth substrate, wherein a vacuum gripper having a sealing zone that circumferentially encloses an inner region is applied to the reverse side of the growth substrate, a negative pressure is generated in the inner region such that separation of the functional layer stack from the growth substrate is initiated in the inner region; and the growth substrate held on the vacuum gripper is removed from the functional layer stack.

Abstract: A method for separating a window includes providing a display device including a display panel, a window disposed on the display panel and including a color layer. An adhesive layer is disposed between the display panel and the window. Heat is applied to the display device. The method includes inserting a disassembling stick between the display panel and the window to separate an edge of the display panel from the window. The method includes cooling the display device. The method includes separating the display panel and the window from each other.

Abstract: A micro semiconductor device and a micro semiconductor display are provided. The micro semiconductor device includes an epitaxial structure, a first electrode, a second electrode and a supporting layer. The epitaxial structure has a bottom surface and a top surface, wherein the bottom surface is defined as a central region and a peripheral region. A first electrode and a second electrode are disposed on the central region of the bottom surface of the epitaxial structure, or the first electrode is disposed on the central region of the bottom surface of the epitaxial structure and the second electrode is disposed on the top surface of the epitaxial structure. The supporting layer is disposed on the peripheral region of the bottom surface of the epitaxial structure.

Abstract: A camera assembly of a gimbal structure is provided. The camera assembly includes a housing and a camera module disposed inside the housing. The camera assembly also includes a cable disposed inside the housing. The cable includes a first connection end, a second connection end, and a transition segment disposed between and connecting the first connection end and the second connection end. The first connection end is configured to connect with the camera module, the second connection end is configured to connect with an external device located outside of the housing. The transition segment includes a first transition segment disposed bending around a first rotation axis of the gimbal structure. The camera assembly is configured to rotate around the first rotation axis of the gimbal structure.

Abstract: A film peeling apparatus that peels a film attached to a substrate includes a chamber, a transfer unit, and first peeling rollers. The transfer unit is disposed in the chamber to transfer the substrate. The first peeling rollers are disposed in the chamber, each of the first peeling rollers includes a first electrostatic chuck to adsorb a first film attached to the substrate. The first peeling rollers roll the adsorbed first film to peel the first film from the substrate.

Abstract: A device for peeling off silicon wafers, including: a supporting member that is configured to support a board-shaped member to which plural silicon wafers are bonded via an adhesive; a heating unit for heating the board-shaped member; a shifting mechanism that is configured to shift, in a horizontal direction, the supporting member relatively with respect to the heating unit; a peeling-off mechanism that is configured to peel off the silicon wafers one by one; and a container for allowing the silicon wafers, the board-shaped member and the supporting member to soak in a liquid.

Abstract: A method and apparatus for replacement of damages display shield (typically glass) covering a display screen on a device, typically a mobile phone. Mobile phones have an electronic display protected by a glass shield. Between the glass and the display is often a plastic polarizing or other intermediary sheet. Removal of a damage glass can be accomplished by cutting thru the polarizer with a moving wire or blade. This separates the glass from the sensitive display and allows replacement of the glass without damaging the more expensive display.

Abstract: Systems and methods of separating bonded wafers are disclosed. In one embodiment, a system for separating bonded wafers includes a support for the bonded wafers and means for applying a sheer force to the bonded wafers. The system also includes means for applying a vacuum to the bonded wafers.

Abstract: A peeling apparatus for peeling a device substrate from a stacked workpiece obtained by attaching the device substrate through a thermoplastic adhesive to a support substrate. The peeling apparatus includes a first surface plate having a first holding surface for holding the entire surface of the support substrate under suction and a first heating member for heating the first holding surface, a second surface plate having a second holding surface for holding the entire surface of the device substrate under suction and a second heating member for heating the second holding surface, and a moving unit for relatively moving the first surface plate and the second surface plate so that the first holding surface and the second holding surface are relatively moved away from each other in a direction perpendicular to the first holding surface and the second holding surface.

Abstract: A debonder apparatus for debonding two via an adhesive layer temporary bonded wafers includes a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly, and an X-axis drive control. The top chuck assembly includes a heater and a wafer holder. The X-axis drive control drives horizontally the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. A wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer is placed upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly and is carried by the X-axis carriage drive to the process zone under the top chuck assembly and the unbonded surface of the carrier wafer is placed in contact with the top chuck assembly.

Abstract: A melt adhesive containing 20 to 90 wt % of at least one polyamide having a molecular weight (Mw) from 10,000 to 250,000 g/mol; 1 to 25 wt % of at least one organic or inorganic salt; 0 to 60 wt % of further additives, wherein the adhesive has a softening point from 100° C. to 220° C. Additionally described is a process for reversible adhesive bonding of substrates, wherein the adhesive bond is released under tension after application of an electrical voltage.

Abstract: An embodiment method for separating semiconductor devices from a wafer comprises using a carrier which acts an adjustable adhesive force upon the semiconductor devices and removing the semiconductor devices from the carrier by applying a mechanical or acoustical impulse to the carrier.

Abstract: A method for disconnecting a first mechanical part from a second magnetic mechanical part, the first mechanical part being adhered to the second magnetic mechanical part by an adhesive film along a connecting area. In the method, a magnetic field is generated at least within the connecting area so as to generate, by induction, eddy currents in the second magnetic mechanical part, to soften the adhesive film and enable disconnection of the first and second mechanical parts.

Abstract: A method and apparatus for replacement of damages display shield (typically glass) covering a display screen on a device, typically a mobile phone. Mobile phones have an electronic display protected by a glass shield. Between the glass and the display is often a plastic polarizing or other intermediary sheet. Removal of a damage glass can be accomplished by cutting thru the polarizer with a moving wire or blade. This separates the glass from the sensitive display and allows replacement of the glass without damaging the more expensive display.

Abstract: A superposed wafer is separated to a processing target wafer and a supporting wafer while being heated. Then, an adhesive on a joint surface of the processing target wafer is removed by supplying an organic solvent onto the joint surface of the processing target wafer. Then, an oxide film formed on the predetermined pattern on the joint surface of the processing target wafer is removed by supplying acetic acid to the joint surface of the processing target wafer. Then, the joint surface of the processing target wafer is inspected. Then, based on an inspection result, the adhesive on the joint surface of the processing target wafer is removed and the oxide film formed on the predetermined pattern on the joint surface of the processing target wafer is removed.

Abstract: In an embodiment of the disclosure, there is provided a method and system for recycling a cured composite laminate material into a delaminated recyclate that maintains a fiber volume fraction and a lamina level fiber alignment substantially the same as the cured composite laminate material. The method provides a cured composite laminate material having a fiber volume fraction and a lamina level fiber alignment. The cured composite laminate material undergoes solvent soak preconditioning, liquid solvent removal, pre-heating, and rapid heating with phase change delamination of the cured composite laminate material to obtain the delaminated recyclate that maintains a fiber volume fraction and a lamina level fiber alignment substantially the same as the cured composite laminate material.

Abstract: A delamination apparatus includes a stage mounted with a lower supporting member, a donor film laminated to the lower supporting member, and an acceptor substrate sealed between the lower supporting member and the donor film, a first gripper positioned at an end side of the stage, the first gripper being configured to grip an end of the donor film and to move with the end of the donor film away from the acceptor substrate, and a first filling roll positioned over the donor film, the first filling roll being configured to blow ions toward the donor film while rotating toward the first gripper.

Abstract: Improved semiconductor wafer debonding system, method, and apparatus, including a stress-free means for multi-axis debonding utilizing a specialized tool or fixture having at least one ultrasonic transducer.

Abstract: A separation apparatus for separating a superposed substrate into a processing target substrate and a supporting substrate, includes: one holding part holding the processing target substrate via a tape; another holding part holding the supporting substrate; and a moving mechanism moving the another holding part in a vertical direction while holding an outer peripheral portion thereof to continuously separate the supporting substrate held by the another holding part from the processing target substrate held by the one holding part starting from an outer peripheral portion toward a central portion of the supporting substrate, wherein the moving mechanism includes: a first moving part holding the another holding part and moving only the outer peripheral portion of the another holding part in the vertical direction; and a second moving part moving the first moving part and the another holding part in the vertical direction.

Abstract: A method of separating a wafer from a carrier includes placing a wafer assembly on a platform. The wafer assembly includes the wafer, the carrier, and a layer of wax between the wafer and the carrier. A wafer frame is mounted on the wafer of the wafer assembly. The layer of wax is softened. The wafer and the wafer frame mounted thereon are separated, by a first robot arm, from the carrier.

Abstract: Implementations and techniques for removing and segregating components from printed circuit boards are generally disclosed.

Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

Abstract: A separating apparatus, including a base and a wire, is provided. The base is adapted for carrying an electronic device. The electronic device includes a first substrate, a second substrate, and an adhesive layer. The adhesive layer adheres the first substrate and the second substrate to each other. The wire is configured on the base. A wire diameter of the wire is equal to or greater than a thickness of the adhesive layer.

Abstract: A device for detaching a cover adhesively attached to a base is provided. The device includes a support plate for supporting the base, and a suction plate applying an overall and uniform attracting action to the cover by means of a vacuum. The device further includes a driving unit to pull the suction plate away from the base. The device further includes a heating element to heat and soften adhesive, thereby weakening the adhesive bond between the base and the cover and allowing the release of the cover from the base.

Abstract: An object of the invention is to provide a pressure-sensitive adhesive optical film-peeling method capable of easily detaching the pressure-sensitive adhesive optical film from a glass substrate with no damage to the glass substrate or no adhesive deposit on the glass substrate, and to provide a pressure-sensitive adhesive optical film suitable for use in such a peeling method. The invention is directed to a method for peeling a pressure-sensitive adhesive optical film from an optical film-carrying glass substrate including a glass substrate and the pressure-sensitive adhesive optical film bonded thereto, which includes: exposing the optical film-carrying glass substrate to an environment at a temperature of 40 to 98° C. and a relative humidity of 60 to 99% for three minutes or more; and then peeling the pressure-sensitive adhesive optical film from the glass substrate under the environment.

Abstract: A system and method for refurbishing or recycling a layered article such as a golf ball is disclosed that includes removing a cover from the article. The system can include a golf ball guide, a golf ball scorer-driver that can score the outer shell of the golf ball while simultaneously advancing it along the golf ball guide, a cover peeler having an orifice with an inner diameter that is less than an outer diameter of the golf ball cover, and a press that can drive the golf ball core through the cover peeler orifice. The method includes inducing at least one weakened region in the outer shell of the golf ball, rupturing the weakened region to create at least one opening in the golf ball outer shell, and forcing a core portion of the golf ball through the opening in the golf ball outer shell.

Abstract: Systems and methods of separating bonded wafers are disclosed. In one embodiment, a system for separating bonded wafers includes a support for the bonded wafers and means for applying a sheer force to the bonded wafers. The system also includes means for applying a vacuum to the bonded wafers.

Abstract: A separation apparatus for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive, into the processing target substrate and the supporting substrate includes: a first holding unit that includes a heating mechanism heating the processing target substrate and holds the processing target substrate; a second holding unit that includes a heating mechanism heating the supporting substrate and holds the supporting substrate; a moving mechanism that relatively moves at least the first holding unit or the second holding unit in a horizontal direction; and a porous part that is annularly provided along an outer peripheral portion of the first holding unit and formed with a plurality of pores, and supplies an inert gas to the outer peripheral portion of the first holding unit holding the processing target substrate.

Abstract: A method includes: a first step of disposing the superposed substrate at a position where the superposed substrate is not in contact with a first holding unit and a second holding unit in a space between the first holding unit and the second holding unit, and supplying an inert gas into the space; a second step of thereafter relatively moving the first holding unit and the second holding unit in the vertical direction, and holding the processing target substrate by the first holding unit and holding the supporting substrate by the second holding unit; and a third step of thereafter relatively moving the first holding unit and the second holding unit in the horizontal direction while heating the processing target substrate held by the first holding unit and the supporting substrate held by the second holding unit, to separate the processing target substrate and the supporting substrate from each other.

Abstract: In the field of release and pickup of ultrathin semiconductor dies, there is provided an active carrier (1) for carrying a wafer (20) and a method for using such a carrier (1). The wafer (20) comprises a particular die arrangement (P). The active carrier (1) comprises a base plate (2) and a number of energizers (7) constructed on or in this base plate (2). The energizers (7) are laid out in an arrangement corresponding to the die arrangement (P). The energizers (7) can locally energize an adhesive layer (3) in proximity to a selected die (14) from the die arrangement (P). By this local energizing of the adhesive layer (P), the selected die is loosened from the adhesive layer (3). Furthermore the active carrier (1) comprises a plurality of externally addressable contacts (12) and conduction pathways (9). The conduction pathways (9) connect the contacts (12) to the energizers (7) thereby allowing individual control over said energizers (7) by addressing said contacts (12).

Abstract: A device for peeling off silicon wafers, including: a supporting member that is configured to support a board-shaped member to which plural silicon wafers are bonded via an adhesive; a heating unit for heating the board-shaped member; a shifting mechanism that is configured to shift, in a horizontal direction, the supporting member relatively with respect to the heating unit; a peeling-off mechanism that is configured to peel off the silicon wafers one by one; and a container for allowing the silicon wafers, the board-shaped member and the supporting member to soak in a liquid.

Abstract: A peeling device for peeling off a substrate to be processed and a support substrate from an overlapped substrate, the overlapped substrate being formed by bonding the substrate to be processed and the support substrate by an adhesive, which includes: a first holding unit configured to heat the substrate to be processed and configured to hold the substrate to be processed; a second holding unit configured to heat the support substrate and configured to hold the support substrate; a moving mechanism configured to horizontally move at least one of the first holding unit and the second holding unit relative to each other; and an inert gas supply mechanism configured to supply an inert gas onto a bonding surface of the substrate to be processed or a bonding surface of the support substrate.

Abstract: A system and method for refurbishing or recycling a layered article such as a golf ball is disclosed that includes removing a cover from the article. The system can include a golf ball guide, a golf ball scorer-driver that can score the outer shell of the golf ball while simultaneously advancing it along the golf ball guide, a cover peeler having an orifice with an inner diameter that is less than an outer diameter of the golf ball cover, and a press that can drive the golf ball core through the cover peeler orifice. The method includes inducing at least one weakened region in the outer shell of the golf ball, rupturing the weakened region to create at least one opening in the golf ball outer shell, and forcing a core portion of the golf ball through the opening in the golf ball outer shell.

Abstract: A method of separating a wafer from a carrier includes placing a wafer assembly on a platform. The wafer assembly includes the wafer, the carrier, and a layer of wax between the wafer and the carrier. A wafer frame is mounted on the wafer of the wafer assembly. The layer of wax is softened. The wafer and the wafer frame mounted thereon are separated, by a first robot arm, from the carrier.

Abstract: Device and method for stripping a wafer from a carrier that is connected to the wafer by an interconnect layer. The device includes a receiving means for accommodating the carrier-wafer combination consisting of the carrier and the wafer, a connection release means for breaking the connection provided by the interconnect layer between the carrier and the wafer, and stripping means for stripping the wafer from the carrier, or for stripping the carrier from the wafer. The connection release means operates in a temperature range from 0° to 350° C., especially from 10° to 200° C., preferably from 20° to 80° C., and more preferably at ambient temperature. The method includes the steps of accommodating the carrier-wafer combination on a receiving means, breaking the connection provided by the interconnect layer by a connection release means, and stripping the wafer from the carrier, or stripping the carrier from the wafer by stripping means.

Abstract: In an embodiment of the disclosure, there is provided a method and system for recycling a cured composite laminate material into a delaminated recyclate that maintains a fiber volume fraction and a lamina level fiber alignment substantially the same as the cured composite laminate material. The method provides a cured composite laminate material having a fiber volume fraction and a lamina level fiber alignment. The cured composite laminate material undergoes solvent soak preconditioning, liquid solvent removal, pre-heating, and rapid heating with phase change delamination of the cured composite laminate material to obtain the delaminated recyclate that maintains a fiber volume fraction and a lamina level fiber alignment substantially the same as the cured composite laminate material.

Abstract: Improved semiconductor wafer debonding system, method, and apparatus, including a stress-free means for multi-axis debonding utilizing a specialized tool or fixture having at least one ultrasonic transducer.

Abstract: Described methods and apparatus provide a controlled perturbation to an adhesive bond between a device wafer and a carrier wafer. The controlled perturbation, which can be mechanical, chemical, thermal, or radiative, facilitates the separation of the two wafers without damaging the device wafer. The controlled perturbation initiates a crack either within the adhesive joining the two wafers, at an interface within the adhesive layer (such as between a release layer and the adhesive), or at a wafer/adhesive interface. The crack can then be propagated using any of the foregoing methods, or combinations thereof, used to initiate the crack.

Abstract: A flexible substrate bonding and debonding apparatus is disclosed. In one embodiment, the apparatus includes i) a chamber, ii) a lower chuck disposed in a lower portion of the chamber and having a lower heating unit and a cooling conduit built therein, iii) an upper chuck disposed above the lower chuck and having an upper heating unit built therein, iv) a pressurizing unit disposed above the upper chuck and v) a separating unit corresponding to either side of bonding surfaces of a support substrate and a flexible substrate which are disposed between the lower chuck and the upper chuck. The flexible substrate bonding and debonding apparatus can pressurize the flexible substrate and the support substrate simultaneously using a heat-treatment process. Therefore, the flexible substrate can be more reliably bonded and debonded even at low temperature.

Abstract: A method and apparatus enables linered label applicators to use labels on thin liners. Linered labels comprise a composite of an elongate sheet of thin or light-weight temporary liner having a precut label adhered to a low adhesion surface. The cut-out labels on the liner are fed into the linered label applicator. The use of support mechanisms other then vacuum application on rollers enables the use of thinner liner sheets on labels. A die head for cutting or perforating labels comprising adhesive on label stock comprising a die head having at least 80% of its outer surface comprising flat areas between cutting edges, multiple cutting edges on the outer surface, and an internal volume in the die head, the internal volume for carrying coolant liquid into and out of the volume so as to cool the outer surface of the die head when the coolant temperature is at least 10° C. cooler than the outer surface of the die head.

Abstract: Implementations and techniques for removing and segregating components from printed circuit boards are generally disclosed.

Abstract: There is disclosed a method of separating laminated sheets comprising first and second sheets which are bonded by an adhesive interlayer, the method comprising heating the interlayer to soften it and causing the first and second sheets to be forced apart when the interlayer is softened.

Abstract: A method for removing a protective coating material from a portion of an optical fiber including a glass optical fiber having an outer surface surrounded by said protective coating material, said method comprising the steps of: (i) providing a fiber collection and support device having: (a) a coarse conical fiber collector having an input port and (b) a fine fiber centering collector including a fiber tube having an output port, said input port is larger then said output port; (ii) providing the fiber threaded through the course conical collector into the fiber collection tube of the fine fiber centering collector; (iii) contacting the fiber, as it exits from the output port of the fiber collection tube of the fiber collection and support device, with a stream of hot gas; and (iv) directing a stream of a hot gas onto the protective coating material that is to be removed.

Abstract: The present invention provides a removal roller (12) for detaching a film (2) from a disc-shaped workpiece (3), in particular from a mould wafer (3), comprising a film handling portion (13) for non-positively taking up or for expelling a portion (14) of the film (2). The present invention also provides a device (1) for detaching a film (2) from a disc-shaped workpiece (3), in particular from a mould wafer (3), comprising: a mounting means (4) for non-positively mounting the disc-shaped workpiece (3); a removal roller (12) of this type; a displacement means (17) for moving the removal roller (12) horizontally and/or vertically to a surface (10) of the mounting means (4); and a rotation means (24) for rotating the removal roller (12) about a centre axis (25) of the removal roller (12). Furthermore, the present invention also provides a method for detaching a film (2) from a disc-shaped workpiece (3), in particular from a mould wafer (3), by means of a device (1) of this type.

Abstract: A disclosed image removing device includes a roller peeling member onto which a recording material with the image forming substance having thermoplastic properties is superposed; a heating unit configured to heat the image forming substance; a pressurizing unit configured to apply pressure to the roller peeling member and the recording material superposed thereon to cause the image forming substance heated by the heating unit to adhere to the roller peeling member; a separating unit configured to separate the recording material from the roller peeling member after the image forming substance has adhered to the roller peeling member; and a removing unit configured to remove, from the roller peeling member, the image forming substance that has been transferred from the recording material to the roller peeling member. The removing unit is driven in such a manner that the removing unit and the roller peeling member pressurize/contact/slide against each other.

Abstract: A separating method of a bonded body, the bonded body including two base members and a bonding film through which the base members are boded together, enabling to easily and efficiently separating the bonded body into the two original base members is provided. Further, the bonding film contains a silicone material composed of silicone compounds. The separating method includes: preparing the bonded body with the bonding film; and applying energy for separation to the bonding film so that cleavage is generated within the bonding film due to breakage of a part of molecular bonds of the silicone compounds, to thereby separate the bonded body into the first and second base members.

Abstract: A disassembly method for membrane electrode assembly for fuel cell, and a disassembly method for fuel cell are provided, disassembly methods which are advantageous for the recovery of catalysts that are included in catalytic layers by making structural destruction of the catalytic layers progress by means of expanding a volumetrically-expandable material inside the catalytic layers. In such a state that a catalytic layer includes a volumetrically-expandable material that is capable of expanding volumetrically, the volumetrically-expandable material, which is included in the catalytic layer, is expanded by means of expansion treatment. Next, expansion of the volumetrically-expandable material, which has undergone volumetric expansion in the catalytic layer, is cancelled.

Abstract: An improved apparatus for temporary wafer bonding includes a temporary bonder cluster and a debonder cluster. The temporary bonder cluster includes temporary bonder modules that perform electronic wafer bonding processes including adhesive layer bonding, combination of an adhesive layer with a release layer bonding and a combination of a UV-light curable adhesive layer with a laser absorbing release layer bonding. The debonder cluster includes a thermal slide debonder, a mechanical debonder and a radiation debonder.

Abstract: An apparatus and a method for the removal of pellicles from masks which can be used for photolithographic purposes. The pellicles are removed from masks in a universal manner without them being further contaminated or damaged. In an apparatus, at least one grip is present for the manipulation of masks provided with pellicles which has at least two fixing elements which engage at the edge of a mask with exerted pressure force. There are moreover present in this connection at least one detector for the contactless determination of the position of mounts formed at the radially outer edge of pellicles, and a heating device for the heating of an adhesive with which pellicles are fastened to a mask with material continuity, and a removal apparatus of the pellicles from a mask having a mask fixing unit and a pellicle removal unit.

Abstract: A method for reusing a recording medium forms an image on the recording medium by use of an image forming material, and removes the image forming material from the recording medium through thermal transfer by use of a peeling member. The recording medium is paper produced by applying a treatment liquid at a size pressing after paper making and then drying the treatment liquid. The treatment liquid includes a water-soluble or water-dispersible polymer having an alkyl group with carbon atoms at its side chain as an image-repellant substance. The image forming material includes a thermoplastic resin, and the adhesive strength between the peeling member and the image forming material is higher than the adhesive strength between the recording medium and the image forming material.