Abstract: The present invention relates to a copper foil current collector having superior adhesion to an active material of a Li secondary battery. The electrolytic copper foil of the present invention having a first surface and a second surface comprises: a first protective layer at the first surface; a second protective layer at the second surface; and a copper film between the first and second protective layers, wherein an oxygen-containing part at the second surface has a thickness (OT) of not less than 1.5 nm. According to the present invention, an electrolytic copper foil current collector for a Li secondary battery, which has low electric resistance and high adhesion to an active material, can be provided.

Abstract: A reduction electrode of an embodiment includes a metal base material and a plurality of metal nanowires provided on the metal base material. The plurality of metal nanowires include metal nanowires whose average height of contour curve of surface is 20 nm or less for 50% or more in a number ratio. The plurality of metal nanowires are formed by reducing a plurality of metal oxides each having a nanowire shape formed on the metal base material by an electrochemical reduction method. A reduction process of the metal oxides includes a first process of passing a current under a constant current condition where an absolute value is 5 mA/cm2 or more through the plurality of metal oxides, and a second process of passing a current under a constant potential condition through the plurality of metal oxides.

Abstract: Provided are a steel-shape measurement device and a steel-shape correction device. The steel-shape measurement device measures a distance to a detection spot group on a to-be-scanned surface of a steel product with a laser rangefinder 5A that measures the distance through scanning of a steel product S with a laser beam emitted from one laser light source 11 and redirected with a galvanometer mirror 13, and measures a shape of the steel product from obtained measured-distance data. The steel-shape measurement device includes an object having a 45°-0° diffuse reflectance of equal to or lower than 10% as a laser-beam absorber 8 at least one portion within an irradiation range irradiated with a regular-reflected laser beam from a to-be-scanned surface of the steel product.

Abstract: Textured cover assemblies for electronic devices are disclosed. The textured cover assemblies may provide a combination of optical and tactile properties to the electronic devices. In some cases, a textured cover assembly may be provided over decorative coating.

Abstract: A method is provided for the nanostructuring and oxidation of a surface, which has an anodizable metal and/or an anodizable metal alloy, both being coated with an oxide layer, by way of a laser or particle radiation in an inert or reactive atmosphere and subsequent anodization. As a result, oxide nanostructures are formed on the entire surface, in titanium or titanium alloys in the form of nanotubes.

Abstract: Electrochemical device or photo-electrochemical device comprising an electrolyte containing a bistriflimide anion, hereafter named as TFSI—, at least two electrodes, each of these electrodes being in contact with a current collector comprising a metal support characterized in that at least one electrode has a current collector the metal support of which comprises an electro-active surface which is functionalized with linear or branched fluorinated carbon chains, such as perfluoroalkyl chains, in the form of a molecular layer which improves the corrosion resistance of said functionalized surface compared to a non-functionalized surface, wherein not impairing the passage of electrons between said electrode and its current collector, the functionalized surface being at the interface between said electrode and its current collector.

Abstract: A top-gated graphene field effect transistor can be fabricated by forming a layer of graphene on a substrate, and applying an electrochemical deposition process to deposit a layer of dielectric polymer on the graphene layer. An electric potential between the graphene layer and a reference electrode is cycled between a lower potential and a higher potential. A top gate is formed above the polymer.

Abstract: A metal surface treated to have a distinct cosmetic appearance such as an integral layer that is glossy may be used in electronic devices. The surface treatment may include polishing a metal surface, texturing the polished metal surface, polishing the textured surface, followed by anodizing the surface, and then polishing the anodized surface. The metal surface may also be dyed to impart a rich color to the surface.

Abstract: A nuclear fuel cladding is provided. The nuclear fuel cladding includes a base cladding; and at least one nanomaterial layer deposited on a surface of the base cladding, the nanomaterial layer having an average grain size of between 5 to 400 nanometers. A method of manufacturing nuclear fuel cladding is also provided. The method includes depositing nanoparticles on a base cladding to form at least one nanomaterial layer, the nanoparticles having an average grain size of between 5 to 400 nanometers.

Abstract: The present disclosure generally relates to a sealed metal laminate structure comprising: a metal layer having a first surface and an opposite second surface; a first enamel layer laminated on the first surface of the metal layer, except at an exposed metal protrusion at a perimeter edge of the sealed metal laminate structure; a second enamel layer laminated on the second surface of the metal layer, except at the exposed metal protrusion at the perimeter edge of the sealed laminate structure; and a phosphate sealer deposited on the exposed metal protrusion of the sealed metal laminate structure. The present disclosure also relates to a metal laminate structure without a phosphate sealer. In addition, systems and methods for treating workpieces, including metal laminate structures, are discussed.

Abstract: Method of ablating the surface of a substrate including providing a dry substrate and an electrolyte source, ablating the surface of the dry substrate to at least partially remove a native oxide layer, and immersing the ablated dry substrate in the electrolyte source, in which the dry substrate is ablated prior to being introduced into the electrolyte source. Also provided is a method of ablating the surface of a substrate that includes providing a dry substrate and an electrolyte, depositing a portion of the electrolyte on the substrate at a thickness of less than 10 microns and ablating the surface of the substrate with the electrolyte applied thereon. System for use in the ablation of the surface of a substrate are also provided.

Abstract: Disclosed are pre-wetting apparatus designs and methods. These apparatus designs and methods are used to pre-wet a wafer prior to plating a metal on the surface of the wafer. Disclosed compositions of the pre-wetting fluid prevent corrosion of a seed layer on the wafer and also improve the filling rates of features on the wafer.

Abstract: A supply of metal parts are electroplated by progressively transferring the parts with a computer controlled robot into a series of open top tanks containing solutions. The tanks have submerged metal fixtures which temporarily support the parts, and each fixture in the electroplating tank is individually connected to a direct current power source through a corresponding timer switch controlled by the computer so that each part is plated for a precise time period independently of the time the part remains in the plating solution. Each fixture is coated with an insulation material and has a base with metal contact with a removable fixture member having limited metal line contact with the supporting part. A plurality of electroplating lines each include the above components, and common tanks in the lines receive an electroplating solution recirculated through a common filter and service tank where the solution is heated and controlled.

Abstract: A method of depositing nickel on a surface of an object, the method including the steps of providing a source of direct current having a positive and a negative terminal; connecting the object to the negative terminal; connecting an anode to the positive terminal; and submerging the object and anode in a solution comprising nickel. The anode is positioned at a distance equal to or less than 2 mm from the surface of the object and when the source of direct current is switched on, nickel in the solution comprising nickel is deposited on the surface of the object.

Abstract: A method is disclosed for marking a tool. The method includes the steps of providing a tool, cleaning the tool, providing a printed layer on the tool, and providing at least one electroplated layer on the tool. The step of cleaning the tool includes the step of providing an air blast over the tool. The step of providing the air blast includes the step of providing an air compressor for producing the air blast. The step of providing the air compressor includes the step of providing an electrostatic dust gun that produces ions in addition to the air blast so that the ions neutralizes static charges on the tool as the air blast sweeps the tool.

Abstract: A plating method for an RF device is disclosed. The method includes (a) pre-treating the RF device made from a substrate material; (b) forming a copper plating layer by applying copper plating to the RF device; and (c) forming a thin-film layer over the copper plating layer, the thin-film layer made of a precious metal, where a thickness of the precious-metal thin-film layer is thinner than a skin depth at a working frequency band. The disclosed method makes it possible to provide a plating treatment with a low cost while providing a superior appearance quality.

Abstract: We describe herein biocompatible single crystal Cu-based shape memory alloys (SMAs). In particular, we show biocompatibility based on MEM elution cell cytotoxicity, ISO intramuscular implant, and hemo-compatibility tests producing negative cytotoxic results. This biocompatibility may be attributed to the formation of a durable oxide surface layer analogous to the titanium oxide layer that inhibits body fluid reaction to titanium nickel alloys, and/or the non-existence of crystal domain boundaries may inhibit corrosive chemical attack. Methods for controlling the formation of the protective aluminum oxide layer are also described, as are devices including such biocompatible single crystal copper-based SMAs.

Abstract: The present invention is directed to an electrodepositable coating composition comprising a bismuth salt and a stabilizing agent, and wherein the molar ratio of elemental bismuth to the stabilizing agent is not less than 1:0.25.

Abstract: A resin board that consists of at least one of a mixture of a plurality of types of resins having different degrees of susceptibility to erosion by an ozone solution, and a resin having, in a molecule, a plurality of types of components having different degrees of susceptibility to erosion by the ozone solution is treated with ozone water to form a reformed layer, and a catalyst metal is adsorbed by the reformed layer so as to form a resin-metal composite layer, on which a plating process is performed. In the resin board, a component or components that is/are likely to be eroded on by the ozone solution dissolves into the ozone solution, and pores or clearances on the order of nanometers are formed between the component(s) and a component or components that is/are less likely to be eroded by the ozone solution. With the plating deposited in the pores or clearances, the adhesion strength is improved due to an anchoring effect.

Abstract: A method and apparatus for selectively controlling deposition rate of conductive material during an electroplating process. Dopants are predominantly incorporated into a conductive seed layer on field regions of a substrate prior to filling openings in the field regions by electroplating. A substrate is positioned in one or more processing chambers, and barrier and conductive seed layers formed. A dopant precursor is provided to the chamber and ionized, with or without voltage bias. The dopant predominantly incorporates into the conductive seed layer on the field regions. Electrical conductivity of the conductive seed layer on the field regions is reduced relative to that of the conductive seed layer in the openings, resulting in low initial deposition rate of metal on the field regions during electroplating, and little or no void formation in the metal deposited in the openings.

Abstract: An apparatus including a bicycle wheel rim. At least a portion of the bicycle wheel rim can include a braking material. The braking material can have a roughness of about 1 micron to about 80 microns.

Abstract: A method of anodizing a coil comprised of wire having a copper core and a layer of a metal formed on the core is disclosed. The metal has electrically insulating characteristics when anodized. Two variations of the method are provided. In the first variation the metal-clad wire is partially anodized prior to being wound on a spool to form a coil. Once the partially anodized wire is wound onto a spool the coiled wire is anodized to complete anodization. The anodized coiled wire may be rinsed to remove residual electrolytic material. In the second variation the metal-clad wire is wound on a spool to form a coil. The coiled wire is then anodized. The method of the disclosed invention reduces or entirely eliminates the presence of micro cracks in the oxide layer. The resulting coil may be used in motors, electromagnets, generators, alternators and subsystems for the same.

Abstract: A method of forming a colored appearance suitable for forming a colored appearance for a conductive casing of a connector is provided. The conductive casing has a body and at least one lead. The lead extends from the body. The method of forming a colored appearance includes the following steps. A surface of the conductive casing is roughened. A conductive metal layer is formed on the roughened surface of the conductive casing. A shielding layer is formed on a part of the conductive metal layer located on the lead. A colorful conductive layer is formed on the conductive casing. The shielding layer and a part of the colorful conductive layer located on the shielding layer are removed to expose the part of the conductive metal layer on the lead. Therefore, the conductive casing has a colored appearance.

Abstract: A process for fabricating oleophobic surface coatings to be deposited on a metal surface, such as the front-face or aperture plate of piezoelectric print heads and transfix rolls. The surface coatings are applied to the surface by electrochemical polymerization.

Abstract: Semiconductors are electrochemically etched in solutions containing sources of bifluoride and nickel ions. The electrochemical etching may form pores in the surface of the semiconductor in the nanometer range. The etched semiconductor is then nickel plated.

Abstract: An electrode is formed using a sanding mechanism to condition the surface of the electrode for electrochemical purposes. Hazardous particles emitted during sanding are captured using jetted liquid, and may be recycled for later use. The sanded surface provides increased electrode lifespan and lead oxide adherence.

Abstract: Technologies are presented for growing graphene by chemical vapor deposition (CVD) on a high purity copper surface. The surface may be prepared by deposition of a high purity copper layer on a lower purity copper substrate using deposition processes such as sputtering, evaporation, electroplating, or CVD. The deposition of the high purity copper layer may be followed by a thermal treatment to facilitate grain growth. Use of the high purity copper layer in combination with the lower purity copper substrate may provide thermal expansion matching, compatibility with copper etch removal, or reduction of contamination, producing fewer graphene defects compared to direct deposition on a lower purity substrate at substantially less expense than deposition approaches using a high purity copper foil substrate.

Abstract: A surface preparation solution comprises an ionic liquid solvent and a water and oxygen scavenging species. Methods for making the solution, and methods for using the solution to prepare and activate a substrate surface for bulk electrodeposition are also disclosed.

Abstract: A metal article comprises an alloy substrate having a surface and a non-diffused metal monolayer disposed thereon. The surface has a first surface work function value ?s. The non-diffused monolayer deposited on the surface has a second surface work function value ?s that is less negative than the first surface work function value. A method for depositing the monolayer via underpotential deposition (UPD) is also disclosed.

Abstract: A method includes (a) contacting at least a portion of a substrate material with a solution comprising a source of copper, wherein the solution is essentially free of a source of a group IIIB metal and a source of a group IVB metal; and (b) after step (a), contacting at least a portion of the substrate with an electrodepositable coating composition comprising (i) a film-forming resin and (ii) a source of yttrium.

Abstract: Provided in one embodiment is a method comprising: disposing atoms of at least one non-metal element over a surface of a cladding material of a nuclear fuel element; and forming at least one product comprising the at least one non-metal element in, over, or both, a surface layer of the cladding material; wherein the at least one non-metal element has an electronegativity that is smaller than or equal to that of oxygen. Also provided is a nuclear fuel element comprising a modified surface layer adapted to mitigate formation of Chalk River Unidentified Deposits (CRUD) on the cladding material.

Abstract: Systems and methods for plating and/or etching of hard-to-plate metals are provided. The systems and methods are designed to overcome the deleterious effect of superficial coating or oxide layers that interfere with the plating or etching of certain metal substrates. The systems and methods involve in situ removal of coating materials from the surfaces of the metal substrates while the substrates are either submerged in plating or etching solutions, or are positioned in a proximate enclosure just prior to submersion in the plating or etching solutions. Further, the substrates can be in contact with a suitable patterning mask to obtain patterned oxide-free regions for plating or etching. This in situ removal of coating layers may be achieved by pulse heating or photoablation of the substrate and the inhibiting coating layers. Electrical energy or laser light energy may be used for this purpose. Additionally or alternatively, the coating materials may be removed by mechanical means.

Abstract: The surface of cutters for dentistry is rendered passive to electroplating by immersion in a concentrated aqueous solution of nitric acid for a certain period of time. This is followed by painting a length including the surface marked out by the slots, the surface inside the slots and the surface at the tip, using an electrically insulating paint resistant to acids. Each cutter is then ground using a grinding wheel with rotating disk having an abrasive edge shaped like the continuous profile of the painted surface. Grinding removes the paint together with a micrometric layer of metal from the surface except for that inside the slots. The shank is ground and painted for a length adjacent to the slots.

Abstract: A method for shrinking a linewidth on a substrate includes the steps of applying a stretching force on the substrate, defining a line on a top surface of the substrate and releasing the applied stretching force. The applied force is executed by mechanical stretching or thermal expansion and has a direction parallel to the line.

Abstract: Selectively accelerated or selectively inhibited metal deposition is performed to form metal structures of an electronic device. A desired pattern of an accelerator or of an inhibitor is applied to the substrate; for example, by stamping the substrate with a patterned stamp or spraying a solution using an inkjet printer. In other embodiments, a global layer of accelerator or inhibitor is applied to a substrate and selectively modified in a desired pattern. Thereafter, selective metal deposition is performed.

Abstract: Provided is a method for preparing an epoxy substrate having a nanopattern, including: (a) forming a titanium oxide film by anodizing a titanium substrate; (b) obtaining a titanium substrate having a concave shape formed on the surface by removing the titanium oxide film from the titanium substrate on which the titanium oxide film has been formed; (c) coating an epoxy resin onto the titanium substrate on which the concave shape has been formed; and (d) obtaining an epoxy substrate having a nanopattern of convex surfaces by removing the titanium substrate.

Abstract: A surface treatment for metal surfaces can be used to create one or more desired effects, such as functional, tactile, or cosmetic effects. In one embodiment, the treatment involves selectively masking a portion of the surface using a photolithographic process. The mask can protect the masked portion of the surface during subsequent treatment processes such as texturizing and anodization. The mask can result in the creation of a surface having contrasting effects. A pattern can be formed by the contrasting effects in the shape of a distinct graphic, such as a logo or text.

Abstract: Disclosed herein is a method for manufacturing a printed circuit board. According to a preferred embodiment of the present invention, there is provided a method for manufacturing a printed circuit board, including: preparing a base substrate; forming a carrier layer on the base substrate; forming a through via hole penetrating the carrier layer and the base substrate; forming a plating layer on the carrier layer and an inner wall of the through via hole; filling the through via hole with a conductive paste; removing a portion of the plating layer formed on the carrier layer; removing the carrier layer; and forming a circuit layer on the base substrate.

Abstract: The present invention provides an apparatus for plating pretreatment of a cylinder block that includes an electrode performing a plating pretreatment of the cylinder inner wall surface. A gap flow channel communicates with an in-electrode flow channel at a position closest to a seal jig, the gap flow channel being adapted to introduce a treatment liquid to the cylinder inner wall surface, the in-electrode flow channel being adapted to receive the treatment liquid having passed through a communicating hole. The present invention is provided a method for pretreating before plating a cylinder block including disposing an electrode to face the cylinder inner wall surface so as to form a gap flow channel, and introducing a treatment liquid to the gap flow channel thereby flowing through the treatment liquid toward a seal jig and then into an in-electrode flow channel through a communicating hole.

Abstract: A chargeable and dischargeable secondary battery for use in electronic devices, industrial machines, electric-powered vehicles, is provided, along with an anodic electrode and a copper foil for anode current collector. It is an anode for secondary battery that utilizes non-aqueous electrolyte, which comprises a silicon-type active material film formed on one side or both sides of a current collector made of copper foil or copper alloy foil, wherein 1 g/m2 to 14 g/m2 of silicon-type active material film is formed on said current collector, and the lightness Y value in a XYZ colorimetric system (CIE 1931 standard colorimetric system) for the surface of said anode, onto which said silicon-type active material film is formed, is 15 to 50, and the surface roughness (ten point average roughness) Rz specified by the Japanese Industrial Standards (JIS B0601-1994 ten point average roughness) is 1.0 ?m or more and 4.5 ?m or less.

Abstract: A method for making a stamper which has an uneven surface pattern, in which unit structures are arranged in x and y directions at respective periods that are both shorter than the shortest wavelength of an incoming light ray, on the surface of a substrate and satisfies the following Inequality (1): ? ? ? x , y ? min < 1 ni + ni · sin ? ? ? ? ? i max ( 1 ) where ?min is the shortest wavelength of the incoming light ray, ?imax is the largest angle of incidence of the incoming light ray, ni is the refractive index of an incidence medium, ?x is the period of the uneven surface pattern in the x direction, and ?y is the period of the pattern in the y direction. As a result, diffraction of short-wave light components can be reduced in a broad wavelength range.

Abstract: Systems and methods for achieving cavitation at high static pressures which may be used in acoustic applications and research such as in liquid metal resonators. Novel preparation and electroplating methods are disclosed to improve boundary layer conditions. A chemical cleaning loop for containment and treatment for oxide removal and to develop a dynamic system for chemically treating liquid metal disposed in a liquid metal loop is also described. A liquid metal handling loop for containment and treatment is provided to maintain cleanliness of bulk liquid metal.

Abstract: A method of treating a metallic surface of an article including the steps of providing an article having a metallic surface; texturizing the surface using a laser to create a controlled pattern across the surface; and anodizing the surface. The controlled pattern may include a series of pits etched in a predetermined repeating pattern across the surface, such as an array of dots or a grid. The controlled pattern may also include a series of pits etched in a predetermined pseudo-random pattern across the surface.

Abstract: The invention relates to a prepreg, obtained by impregnating a base material with an epoxy resin composition containing an epoxy resin (A), a curing agent (B), an accelerator (C), a phenoxy resin (D), and an inorganic filler (E) and semi-hardening the impregnated material, wherein the inorganic filler (E) has an average particle diameter of 3 ?m or less. When a circuit with a narrow wire distance is formed on a surface of a insulator substrate composed of such a prepreg by using a method of forming the circuit by plating process, an amount of the plating remaining on the insulator substrate surface at the circuit contour periphery can be reduced. As a result, it leads to stabilization of inter-circuit insulation resistance and increase in a yield during production of printed wiring boards.

Abstract: Disclosed herein is a method for coating a metallic interconnect of a solid oxide fuel cell. The method for coating a metallic interconnect of a solid oxide fuel cell includes generating a cobalt compound solution using lithium cobalt oxide (LiCoO2) that is an anodic material of a lithium ion battery; immersing the metal interconnect in a plating solution in which the generated cobalt compound solution is contained; and forming cobalt (Co) on the immersed metal interconnect by performing electroplating.

Abstract: A method of conditioning a liquid crystal polymer (LCP) substrate for enhanced surface adhesion accomplished by exposing an LCP substrate to oxygen plasma. The plasma will chemically alter and modify the LCP substrate surface to promote increased adhesion of metal and subsequent LCP layers during lamination. Lamination is accomplished while dwelling under the melt temperature of the LCP substrate itself. A further method is disclosed of detecting impurities modified or deposited onto the LCP surface during plasma treatment.

Abstract: Anodized electroplated aluminum structures and methods for making the same are disclosed. Cosmetic structures according to embodiments of the invention are provided by electroplating a non-cosmetic structure with aluminum and then anodizing the electroplated aluminum. This produces cosmetic structures that may possess desired structural and cosmetic properties and that may be suitable for use as housing or support members of electronic devices.

Abstract: A method for manufacturing a magnetic write head having a write pole and a trailing wrap around magnetic shield, and having a non-magnetic step layer and a non-magnetic bump to provide additional spacing between the write pole and the trailing wrap around shield at a location removed from the air bearing surface. A magnetic write pole material is deposited on a substrate and a non-magnetic step layer is deposited over the write pole. A reactive ion milling can he used to pattern the non-magnetic step layer to have a front edge that is located a desired distance from an air hearing surface. A patterning and ion milling process is then performed to define a write pole, and then a layer of alumina is deposited and ion milled to from a tapered, non-magnetic bump at the front the non-magnetic step layer.

Abstract: Frost-free surfaces and methods for manufacturing such surfaces are described. The frost-free surfaces reduce ice build-up, prevent vapor condensation and reduce adhesion force between ice and a solid substrate. The surfaces can be on parts used in devices where superhydrophobic properties may be obtained post or during device manufacturing. The superhydrophobic properties are the result of aluminum oxide clusters made on such surfaces.

Abstract: The method of surface treatment, as applied onto a metal base material, of the present invention includes a reduction treatment step of reduction-treating the oxide film formed on the metal base material and an oxidation treatment step of oxidation-treating the oxide film having been subjected to the reduction treatment.