Abstract: An electro-optic fiber including a conductive fiber, a layer of electro-optic medium on the conductive fiber, and a conductor on the layer of electro-optic medium. A method of making the electro-optic fiber including the steps of coating a conductive fiber with an electro-optic medium and applying a conductor to the electro-optic medium. The resulting fibers can be woven to create a color-changing material, such as a fabric.

Abstract: An apparatus for detecting an endpoint of a grinding process includes a connecting device, a timer and a controller. The connecting device is connected to a sensor that periodically senses an interface of a reconstructed wafer comprising a plurality of dies of at least two types to generate a thickness signal comprising thicknesses from a surface of an insulating layer of the reconstructed wafer to the interface of the reconstructed wafer. The timer is configured to generate a clock signal having a plurality of pulses with a time interval. The controller is coupled to the sensor and the timer, and configured to filter the thickness signal according to the clock signal to output a thickness extremum among the thicknesses in the thickness signal within each time interval, wherein the thickness signal after the filtering is used to determine the endpoint of the grinding process being performed on the reconstructed wafer.

Abstract: A method for subjecting garment accessories to a surface electrolytic treatment provides various metallic colors to metallic garment accessories in a cost effective manner. The method can provide a first metallic color on one side of outer surface of the garment accessory and provide a second metallic color on the other side of the outer surface, by placing one or more metallic garment accessories in an electrolytic solution in a non-contact state with an anode and a cathode for passing electric current through the electrolytic solution, passing electric current through the electrolytic solution and generating a bipolar phenomenon on the garment accessory.

Abstract: A method for electro-chemical machining (ECM) is provided. Methods may include providing an ECM machine including a controller and a fixture configured for positioning an electrode for ECM, positioning the fixture in a selected dovetail slot of a plurality of dovetail slots in a turbine wheel, the turbine wheel being positioned in-situ in a turbomachine, the fixture positioning the electrode for ECM of a portion of the selected dovetail slot, applying an electrolyte solution between the selected dovetail slot and the electrode, and removing material from the portion of the selected dovetail slot by applying an electric potential to the electrode to create a potential gradient between the electrode and the portion of the selected dovetail slot. The machining may be repeated for each dovetail slot of the turbine wheel in-situ in the turbomachine.

Abstract: A modification process and modified article are disclosed. The modification process includes locating an area in an article, removing the area by machining to form a machined region, inserting a modification material into the machined region, securing the modification material to the article, machining the modification material flush with a geometry of the article, and applying a coating over at least a portion of the article. Another modification process includes locating an area under a suction side leading edge tip shroud fillet of an airfoil, removing the area by machining to form a hole, inserting a modification material having improved material properties as compared to an original base material into the hole, securing the modification material in place, machining the modification material and the airfoil to form a new fillet contour, and applying a coating over at least a portion of the airfoil. Also disclosed is the modified article.

Abstract: In accordance with some embodiments, an abrasive article is provided. The abrasive article includes a carrier. The abrasive article further includes a matrix layer on the carrier. The matrix layer includes a copper-titanium-tin alloy, wherein the copper-titanium-tin alloy includes from about 70 wt % to about 90 wt % of copper, from about 5 wt % to about 15 wt % of titanium, and from about 5 wt % to about 15 wt % of tin. The abrasive article also includes at least one abrasive particle partially embedded in the matrix layer. The abrasive particle includes carbon.

Abstract: This invention relates to compositions and methods for the at least partial dissolution, disruption and/or removal of deposit, such as scale and other deposit, from heat exchanger components. The heat exchanger components can include pressurized water reactor steam generators. In accordance with the invention, elemental metal is added locally to the surface of the deposit and/or anodic or cathodic current is applied locally to the deposit surface to destabilize or weaken the deposit. Subsequently, mechanical stress is applied to the weakened deposit to disrupt and remove the deposit from the surface of the heat exchanger component.

Abstract: A method of manufacturing an article (such as a dental restoration) comprising taking an article, comprising at least one product (such as a dental restoration), in an initial state, formed from a powdered material, layer-by-layer and electrochemically processing at least a select region of the at least one product (such as a dental restoration) so as to smoothen at least said select region.

Abstract: An apparatus and a method for selectively etching an encapsulant forming a package of resinous material around an electronic device includes an electronic device package mountable on the etch head; a conductive electrode in electrical contact with package leads of the electronic device package to apply a first voltage to the package leads of the electronic device; a first pump configured to pump a first quantity of the etchant solution from the source into the etch head where the etchant solution is electrically biased to a second voltage different from the first voltage. An etch cavity is formed on an exterior surface of the electronic device package. When the etchant solution has etched through an exterior surface of the electronic device package, the conductive bond wires of the electronic device is prevented from being etched by the applied first voltage.

Abstract: The invention relates to a weld cleaning fluid, and method of cleaning weld or discolouration especially on stainless steel. Stainless steel welds, such as those done by TIG welding, require cleaning to remove the resulting surface discolouration and also to passivate the steel. This is often done using an electro-cleaning apparatus with the assistance of electrolyte cleaning fluids. A new cleaning fluid has been developed that has a generally neutral pH, instead of the highly acidic nature of previously used fluids, which avoids environmental and safety issues. The cleaning fluid composition preferably has potassium or sodium orthophosphate salts as the main active ingredient, or similar such salts, and has a pH of around 7. It may also include a sequestering or chelating agent such as a sodium and/or potassium salt of EDTA, and colouring and fragrance.

Abstract: An electrochemical grinding tool and method capable of rounding sharp edges that may be prone to cracking, for example, edge regions of cooling slots within dovetail slots of turbine wheels. The electrochemical grinding tool includes a drilling assembly, a conductive bit, and a motor for rotating the conductive bit about an axis thereof. The conductive bit of the electrochemical grinding tool is inserted into a first slot, an electrolyte solution is applied between the conductive bit of the electrochemical grinding tool and a second slot that intersects the first slot, an electrical potential is applied to the conductive bit and the turbine wheel to create a potential gradient between the conductive bit and the edge of the second slot, and material is removed from the edge of the second slot by displacing the conductive bit about and along the edge.

Abstract: Provided are an electrode, an electrolysis cell, and an electrochemical analyzer that improve the long-term stability of analysis data. A working electrode, a counter electrode, and reference electrode are disposed in an electrolysis cell. The working electrode is obtained by forming a lead wire in a composite material having platinum or a platinum alloy as a base material, in which a metal oxide is dispersed, or in a laminated material obtained by laminating a valve metal and platinum such that the cross sectional crystal texture in the thickness direction of the platinum is formed in layers and the thickness of each layer of the platinum is 5 micrometers or less. The metal oxide is selected from among zirconium oxide, tantalum oxide, and niobium oxide, and the metal oxide content of the platinum or the platinum alloy is 0.005 to 1 wt % in terms of the zirconium, tantalum, or niobium metal.

Abstract: A superconducting thin film having excellent critical current characteristics is provided. A substrate for a superconducting thin film includes a substrate body (10A) having a main surface (10B) in which the root mean square slope R?q of a roughness curve is 0.4 or less.

Abstract: A metallic component (1) for high-pressure applications, which serves in particular for fuel injection systems of air-compressing, self-igniting internal combustion engines, comprises at least one transition region (2). The transition region (2) is re-worked here after a hardening operation. The re-working is performed by electrochemical removal and mechanical removal, in particular honing.

Abstract: A grinding/electrolysis combined multi-wire-slicing processing method for silicon wafers includes the following steps: first, with a metal slicing wire(10) provided on a multi-wire-slicing machine serving as cathode, a silicon rod or a silicon ingot(1)(anode) is processed by grinding/electrolysis combined multi-wire-slicing through application of a voltage; second, during said processing, the metal slicing wire(10) and the silicon rod or a silicon ingot(1) are connected with a low-voltage continuous or pulsed direct current power supply(9); third, an electrolytic liquid is sprayed into the cutting area to ensure cooling and anode erosion. The method reduces macroscopic cutting force and enables a grinding/electrolysis combined multi-wire-slicing processing method for large size ultra-thin silicon wafers.

Abstract: In some embodiments, the present invention provides novel methods of preparing porous silicon films and particles for lithium ion batteries. In some embodiments, such methods generally include: (1) etching a silicon material by exposure of the silicon material to a constant current density in a solution to produce a porous silicon film over a substrate; and (2) separating the porous silicon film from the substrate by gradually increasing the electric current density in sequential increments. In some embodiments, the methods of the present invention may also include a step of associating the porous silicon film with a binding material. In some embodiments, the methods of the present invention may also include a step of splitting the porous silicon film to form porous silicon particles. Additional embodiments of the present invention pertain to anode materials derived from the porous silicon films and porous silicon particles.

Abstract: Bare aluminum baffles are adapted for resist stripping chambers and include an outer aluminum oxide layer, which can be a native aluminum oxide layer or a layer formed by chemically treating a new or used bare aluminum baffle to form a thin outer aluminum oxide layer.

Abstract: A process for grinding workpieces is obtained which includes attaching honing stones to a tool, each of the honing stones including grinding particles and an electroconductive connection for fixing the grinding particles to each other; grinding the workpieces with the honing stones by applying a honing liquid having substantially no electroconductive property to a region between the workpiece and the honing stones, the workpieces being successively ground during a series of processing periods, while interposing non-processing periods between the processing periods, each of the workpieces being ground in one of the processing periods; and performing an electrolytic dressing with respect to the honing stones by using an electrode provided to face the honing stones with a space therebetween, a voltage being applied between the honing stones and an electrode in the presence of an electroconductive liquid in the space between the honing stones and the electrode, the electrolytic dressing being carried out during t

Abstract: In a method for producing bores, a tool connected as a cathode and a workpiece connected as an anode are connected to a voltage source. The workpiece and the tool are connected to one another in an electrically conductive manner via an electrolyte, and an electrical potential difference between the workpiece and the tool is formed at least at times for removing material from the workpiece. Furthermore, the workpiece and the tool are subjected to a relative movement in relation to one another for producing the bore. The potential difference between the workpiece and the tool is formed by a corresponding voltage level in such a way that a gas-vapor envelope which surrounds the tool is formed.

Abstract: The invention is an electrolytic microfinishing process which utilizes a conductive tool as a cathode and a conductive workpiece as an anode both connected to a power supply. Electrolytic fluid is pumped between the tool and workpiece, creating a decomposition of the workpiece surface allowing the surface of the workpiece to be removed or wiped away by the interaction of the flowing electrolyte and rotation of the tool without generating any heat at a rate significantly faster than any other known machining process. The tool has no contact with the workpiece and accordingly, requires very low clamping loads to hold the workpiece in the spindle during the finishing operation. Due to the low clamping loads, the distortion of the workpiece is completely eliminated. Modulating the power supply during the work cycle allows the use of a single tool for both roughing and finishing as a continuous cycle to significantly provide surface finishes previously unobtainable.

Abstract: Various embodiments relate to interconnects for solid oxide fuel cells (“SOFCs”) comprising ferritic stainless steel and having at least one via that when subjected to an oxidizing atmosphere at an elevated temperature develops a scale comprising a manganese-chromate spinel on at least a portion of a surface thereof, and at least one gas flow channel that when subjected to an oxidizing atmosphere at an elevated temperature develops an aluminum-rich oxide scale on at least a portion of a surface thereof. Other embodiments relate to interconnects comprising a ferritic stainless steel and having a fuel side comprising metallic material that resists oxidation during operation of the SOFCs, and optionally include a nickel-base superalloy on the oxidant side thereof. Still other embodiments relate to ferritic stainless steels adapted for use as interconnects comprising ?0.1 weight percent aluminum and/or silicon, and >1 up to 2 weight percent manganese. Methods of making interconnects are also disclosed.

Abstract: Abrasive particles having a particle diameter of not more than 100 nm are manufactured from raw material. The manufactured abrasive particles are separately dispersed, and are coated with a polymer. Coated abrasive particles having a particle diameter of not more than 100 nm are selected and are mixed with a liquid component of a slurry to manufacture the slurry. A pH adjuster and a viscosity agent are added to the slurry. A glass substrate is polished using the manufactured slurry. Since the abrasive particles having a particle diameter of more than 100 nm or an agglomerate of the cohering abrasive particles does not contact the glass and does not cause big scratches on the glass, the generation of the scratches of 70 nm or more on the glass during polishing are suppressed.

Abstract: An apparatus and method for hybrid machining a workpiece is disclosed. The workpiece is powered as an anode, a cutter is powered as a cathode and a cutting fluid or coolant is circulated therebetween. The cutter is made of a conductive material and a non-conductive abrasive material. The hybrid machine performs a roughing pass machining operation in which material is removed from the workpiece at a relatively high rate using a high-speed electro-erosion (HSEE) process. Then, the hybrid machine performs a finish pass machining operation in which material is removed from the workpiece using precision electro-grinding (PEG) process at a different differential electrical potential and/or flushing rate than the roughing pass machining operation to provide a smooth finish without thermal effects on the workpiece.

Abstract: Methods and apparatuses for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate. An apparatus in accordance with one embodiment includes a support member configured to releasably carry a microelectronic substrate and first and second electrodes spaced apart from each other and from the microelectronic substrate. A polishing medium is positioned between the electrodes and the support member and has a polishing surface positioned to contact the microelectronic substrate. At least a portion of the first and second electrodes can be recessed from the polishing surface. A liquid, such as an electrolytic liquid, can be provided in the recess, for example, through flow passages in the electrodes and/or the polishing medium. A variable electrical signal is passed from at least one of the electrodes, through the electrolyte and to the microelectronic substrate to remove material from the substrate.

Abstract: A method of removing coating from a substrate may include contacting a portion of coating on a surface of a substrate to an acid.

Abstract: A water electrolysis apparatus includes a plurality of unit cells. A membrane electrode assembly of the unit cell includes an anode side power feeding element and a cathode side power feeding element stacked on an anode catalyst layer and a cathode catalyst layer on both surfaces of a solid polymer electrolyte membrane. A surface of the anode side power feeding element is subjected to a grinding process, and then, subjected to an etching process to form a smooth surface.

Abstract: A polishing pad includes at least one conductive polishing element supported by a compressible under layer having conductive patterning therein, the conductive patterning adapted to permit coupling of a potential to the conductive polishing element; a guide plate above the compressible under layer, the guide plate having a hole through which the polishing element passes and further having a cathodic element connected thereto; and a slurry distribution layer adhered to the guide plate opposite the compressible under layer. The polishing pad may further include a proton exchange membrane placed over the cathodic element. A semiconductor wafer having a metal film thereon may be polished using the polishing pad by placing the wafer in contact with the polishing element, applying anodic current to the polishing element and cathodic current to the cathodic element, and polishing with an anodic solution. For copper films, a sulfuric acid-copper sulfate solution may be used.

Abstract: The present invention provides a method of electrochemical polishing of a workpiece using a polishing pad having a cellular polymeric layer overlying a conductive substrate, the cellular polymeric layer having a thickness less than 1.5 mm; wherein the cellular polymeric layer comprises a plurality of pores that extend through the thickness of the cellular polymeric layer from a polishing surface of the cellular polymeric layer to the conductive substrate; and wherein the plurality of pores exhibit a diameter that is smaller at the polishing surface than at the conductive substrate.

Abstract: A composition for use in polishing a wafer is disclosed. The composition includes an aqueous solution of initial components substantially free of loose abrasive particles and having a pH in the range of about 2 to 7, the aqueous solution including at least one polyelectrolyte and a surfactant. In certain embodiments, the wafer polishing composition can be adjusted to control cut rate and selectivity for modifying semiconductor wafers using a fixed abrasive Chemical Mechanical Polishing (CMP) process. Also disclosed is a CMP method and a process for polishing a wafer using the polishing composition.

Abstract: There is here disclosed a nozzle type ELID grinding apparatus comprising a conductive grindstone 12 having a contact surface with a workpiece 1; and an ion supply nozzle 16 that supplies an electrolytic medium 2 containing hydroxyl ions (OH?) onto a surface of the conductive grindstone, the workpiece being ground while the surface of the grindstone is dressed by electrolysis or chemical reaction. Furthermore, the apparatus comprises a grindstone power source 14 for setting the conductive grindstone to be a positive potential (+).

Abstract: The present invention relates to compositions for chemical-mechanical polishing comprising A 0.01% to 40% by weight based on the total amount of the composition of abrasive particles of at least one porous metal-organic framework material, wherein the framework material comprises at least one at least bidentate organic compound which is coordinately bound to at least one metal ion; B 40% to 99.8% by weight based on the total amount of the composition of a liquid carrier; and C 0.01% to 20% by weight based on the total amount of the composition of a polishing additive component. The invention further relates to the use of said composition as well as methods for chemical-mechanical polishing of a surface with the aid of said compositions.

Abstract: An apparatus and method for hybrid machining a workpiece is disclosed. The apparatus includes a mandrel for supporting the workpiece adjacent a cutter mounted on an arbor. A workpiece is powered as an anode and the cutter is powered as a cathode, and a cutting fluid or coolant is circulated therebetween. The cutter is made of a conductive material and a non-conductive abrasive material to maximize the amount of material removed from the workpiece. The coolant includes one or more additives to enhance the electrical discharge between the cutter and the workpiece. The cutter is moved relative to the workpiece to remove material from the workpiece at a predetermined depth of cut using an enhanced high-speed electro-erosion (HSEE) process in which both HSEE and abrasive machining processes are used. The workpiece may then be finish machined to a final shape of the titanium article, such as a dovetail of a turbine blade.

Abstract: A method and apparatus for evaluating a conditioned electrochemical mechanical polishing pad are provided. A polishing pad is conditioned using a first set of process conditions. A sheet wafer and a residue wafer are polished on the polishing pad. The removal rates of one or more materials from the sheet wafer and the residue wafer are measured. A normalized removal rate is calculated. The polishing pad is further conditioned if the normalized removal rate is not within a minimum value and a maximum value. In one embodiment, the normalized removal rate comprises a ratio of the removal rate of the residue wafer to the removal rate of the sheet wafer.

Abstract: The invention relates to a method for the electrochemical removal of a metal coating from a component. According to said method, the component is immersed in an electrolyte solution and a current is passed through the component and a secondary electrode that is in contact with the electrolyte. The current is pulsed with a routine that has a duty cycle >10 to <90%, two current densities between 5 mA/cm2 to 1000 mA/cm2 and a frequency of 5 Hz to 1000 Hz.

Abstract: Pad-assisted electropolishing of the substrate is conducted by performing anodic dissolution of metal at a first portion of the substrate and simultaneously mechanically buffing a second portion of the substrate with a buffing pad. Anodic dissolution includes forming a thin liquid layer of electropolishing liquid between the anodic substrate and a cathodic electropolishing head. The location of electrical contacts between the substrate and power supply allow peripheral edge regions of the substrate to be mechanically buffed with the pad. Preferably, a substrate is further planararized using an isotropic material-removal technique. An apparatus includes an electropolishing head that is movable to a position proximate to a first portion of a substrate to form a thin gap, and a buffing pad that mechanically buffs a second portion of the substrate using minimal pressure.

Abstract: A surface treatment method for housings, comprising: providing a substrate made of damascus steel; and chemically etching the substrate using inorganic acid solution or inorganic salts solution to give the substrate a patterned appearance.

Abstract: Methods and compositions for electro-chemical-mechanical polishing (e-CMP) of silicon chip interconnect materials, such as copper, are provided. The methods include the use of compositions according to the invention in combination with pads having various configurations.

Abstract: Methods and apparatuses for selectively removing conductive materials from a microelectronic substrate. A method in accordance with an embodiment of the invention includes positioning the microelectronic substrate proximate to and spaced apart from an electrode pair that includes a first electrode and a second electrode spaced apart from the first electrode. An electrolytic liquid can be directed through a first flow passage to an interface region between the microelectronic substrate and the electrode pair. A varying electrical signal can be passed through the electrode pair and the electrolytic liquid to remove conductive material from the microelectronic substrate. The electrolytic liquid can be removed through a second flow passage proximate to the first flow passage and the electrode pair.

Abstract: Disclosed herein is a highly-durable electrode tool for electrochemical machining, which can prevent the corrosion and abrasion of a conductive pattern at the time of electrochemical machining for forming dynamic pressure-generating grooves of a fluid dynamic bearing, and a method of manufacturing the same. The electrode tool for electrochemical machining includes: an electrode substrate on which a conductive pattern is formed to have protrusions corresponding to the fine grooves and to which negative current is applied; a nonconductive insulating layer, covering an entire top surface of the electrode substrate excluding the conductive pattern; and a conductive layer, which is formed on the conductive pattern to protect the conductive pattern, and a top surface of which is the same height as a top surface of the nonconductive insulating layer.

Abstract: Methods and apparatuses for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate. An apparatus in accordance with one embodiment includes a support member configured to releasably carry a microelectronic substrate and first and second electrodes spaced apart from each other and from the microelectronic substrate. A polishing medium is positioned between the electrodes and the support member and has a polishing surface positioned to contact the microelectronic substrate. At least a portion of the first and second electrodes can be recessed from the polishing surface. A liquid, such as an electrolytic liquid, can be provided in the recess, for example, through flow passages in the electrodes and/or the polishing medium. A variable electrical signal is passed from at least one of the electrodes, through the electrolyte and to the microelectronic substrate to remove material from the substrate.

Abstract: Pad-assisted electropolishing of the substrate is conducted by performing anodic dissolution of metal at a first portion of the substrate and simultaneously mechanically buffing a second portion of the substrate with a buffing pad. Anodic dissolution includes forming a thin liquid layer of electropolishing liquid between the anodic substrate and a cathodic electropolishing head. The location of electrical contacts between the substrate and power supply allow peripheral edge regions of the substrate to be mechanically buffed with the pad. Preferably, a substrate is further planararized using an isotropic material-removal technique. An apparatus includes an electropolishing head that is movable to a position proximate to a first portion of a substrate to form a thin gap, and a buffing pad that mechanically buffs a second portion of the substrate using minimal pressure.

Abstract: An Electro Chemical Grinding (ECG) quill includes a tool manufactured of a porous tool material having a multitude of pores. An ECG electrolyte is communicated through a hollow tool shank for communication through the porous tool material to manufacture a slot.

Abstract: A method and apparatus for removing conductive material from a microelectronic substrate. In one embodiment, the method can include engaging a microelectronic substrate with a polishing surface of a polishing pad, electrically coupling a conductive material of the microelectronic substrate to a source of electrical potential, and oxidizing at least a portion of the conductive material by passing an electrical current through the conductive material from the source of electrical potential. For example, the method can include positioning first and second electrodes apart from a face surface of the microelectronic substrate and disposing an electrolytic fluid between the face surface and the electrodes with the electrodes in fluid communication with the electrolytic fluid. The method can further include removing the portion of conductive material from the microelectronic substrate by moving at least one of the microelectronic and the polishing pad relative to the other.

Abstract: Method of forming a multilayer structure by electroetching or electroplating on a substrate. A seed layer is arranged on the substrate and a master electrode is applied thereto. The master electrode has a pattern layer forming multiple electrochemical cells with the substrate. A voltage is applied for etching the seed layer or applying a plating material to the seed layer. A dielectric material (9) is arranged between the structures (8) thus formed. The dielectric layer is planarized for uncovering the structure below and another structure layer is formed on top of the first. Alternatively, the dielectric layer is applied with a thickness two layers and the structure below is accessed by selective etching of the dielectric layer for selectively uncovering the top surface of the structure below. Multiple structure layer may also be formed in one step.

Abstract: The present invention replaces all or a portion of substrate processing by chemical-mechanical polishing with electrolytic processing using deionized water, ultrapure water or the like. An electrolytic processing apparatus comprises: a chemical-mechanical polishing section for chemically-mechanically polishing a surface of a substrate; an electrolytic processing section having a processing electrode and a feeding electrode, and also having an ion exchanger provided at least either between the substrate and the processing electrode or between the substrate and the feeding electrode, for electrolytically processing a surface of a workpiece under existence of a solution by applying a voltage between the processing electrode and the feeding electrode; and a top ring capable of freely moving between the chemical-mechanical polishing section and the processing electrode section.

Abstract: Systems and methods for electrochemically processing a substrate. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact element is a rotating member. In one embodiment, the contact element comprises a noble metal.

Abstract: An electrode assembly includes a distribution plate having a plurality of grooves that communicate with openings in an overlying polishing pad layer. The grooves include end openings that allow for draining of process solution, both during processing and subsequent cleaning/rinsing of the pad. Drainage occurs continually during processing, cleaning and rinsing, and so is constricted through the end openings relative to the grooves, to prevent wastage. The end openings are sufficiently large, however, to substantially completely drain fluids from the grooves between steps without delaying robotic motions.

Abstract: The present invention discloses an apparatus having a platen; a polishing pad disposed over the platen; a slurry dispenser disposed over the polishing pad; a cathode connected electrically to the polishing pad; a wafer carrier disposed over the polishing pad; an anode connected electrically to the wafer carrier; and a power supply connected to the anode and the cathode. The present invention further discloses a method to remove a surface layer from a wafer using a polishing pad, a slurry, and an electrical current.

Abstract: An electrolytic polishing method of a substrate having a barrier film and an interconnect metal layer on a surface to be processed under the presence of an electrolytic solution, including a barrier film electrolytic polishing process which removes the barrier film by applying a voltage between a cathode and an anode, with the surface to be processed serving as the cathode, and causing relative motion between the surface to be processed and a polishing pad which faces and makes contact with the surface to be processed.

Abstract: An apparatus and method for manufacturing and refurbishing a conductive polishing pad assembly for performing an electrochemical process on a substrate is disclosed. The conductive polishing pad assembly is formed using a contact surface as a foundation that is coated with a metallic coating to create a conductive contact surface. In one embodiment, the metallic coating is a high purity tin/zinc alloy that is sprayed on the contact surface. The contact surface contains abrasive particles while the metallic coating provides at least conductive qualities to the contact surface.