Abstract: A method for forming an atomically smooth surface on a copper electrode through electropolishing and the atomically smooth surface are provided. An exemplary method for forming an atomically smooth surface by electropolishing includes placing a copper foil in an electrolyte solution including ethylene glycol and phosphoric acid. The copper foil is coupled to a current source. Current is applied to the copper foil to electropolish the copper foil. The electropolishing is stopped when the electropolishing is completed.

Abstract: An aluminum alloy article having improved surface contrast and an associated method are provided. The method includes grinding a surface of the article, diamond polishing the surface of the article, and removing ?-aluminum matrix material from the surface by fine polishing the surface with a suspension containing colloidal silica and a caustic substance, wherein the caustic substance has a higher pH value than the pH value of colloidal silica.

Abstract: A method for electropolishing a medical device includes moving a plunger mechanism towards a side of the medical device to establish electrical contact between the medical device and an anode, the plunger mechanism moving transversely to a longitudinal axis of the medical device. Electropolishing the medical device following positioning the plunger mechanism and medical device and then removing the medical device and the anode from the electrolytic bath and unloading the medical device from the anode following electropolishing.

Abstract: In the BB transfer, or so called electrochemical delamination process, a transfer film is firstly spray-coated on a stack formed by two graphene sandwiching a metal (Cu or Cr) foil as a protection layer. Then, direct current (dc) voltage is applied to the first stack as a cathode and an anode (from be a platinum wire, a carbon rod, or others) in an electrolyte aqueous solution. With application of the electrolysis potential, hydrogen bubbles appear at the graphene/metal foil interfaces, while oxygen bubble appear at the anode due to the reduction of water. These H2 bubbles provide a gentle but persistent force to detach the graphene film from the copper foil at its edges, and the process is aided by the permeation of the electrolyte solution into the interlayers as the edges delaminate.

Abstract: An electropolishing fixture with a plunger mechanism. The plunger mechanism can establish contact between a device and an anode mandrel during an electropolishing process while the device is immersed in an electrolytic bath.

Abstract: A method of electropolishing a medical implant is provided. During the electropolishing, an anodotic film forms around surfaces of the implant. Two or more ultrasonic transducers are oriented around the implant and are activated to disrupt the anodotic film. The ultrasonic transducers are activated only during a portion of the electropolishing process to allow the anodotic film to at least partially reform.

Abstract: The invention provides a stripping gold component which could remove gold from substrate, comprising: a stripping gold chemical compound; and a assistant conductive compound wherein said stripping gold chemical compound bonds with gold to form covalent bond to strip gold from said substrate, said assistant conductive chemical compound helps the electric conduction and decreases the voltage, said substrate would not be damaged after stripping gold from said substrate, and the stripping gold component is cyanide free.

Abstract: Bare aluminum baffles are adapted for resist stripping chambers and include an outer aluminum oxide layer, which can be a native aluminum oxide layer or a layer formed by chemically treating a new or used bare aluminum baffle to form a thin outer aluminum oxide layer.

Abstract: A plating apparatus for use in forming a plated film in trenches, via holes, or resist openings that are defined in a surface of a semiconductor wafer, and forming bumps to be electrically connected to electrodes of a package, on a surface of a semiconductor wafer. The plating apparatus has a plating tank for holding a plating solution, a holder for holding a workpiece and bringing a surface to be plated of the workpiece into contact with the plating solution in the plating tank, and a ring-shaped nozzle pipe disposed in the plating tank and having a plurality of plating solution injection nozzles for injecting the plating solution to the surface to be plated of the workpiece held by the holder to supply the plating solution into the plating tank.

Abstract: An aluminum article includes a substrate comprising a surface having a plurality of nano-pores defined therein; and a transparent vacuum deposition layer deposited on the surface and filling the nano-pores.

Abstract: A system and method is described for electropolising tubular metallic prostheses. In one aspect, the system provides a continuously changing set of points of contact between anode and prosthesis. In another aspect, the cathode is given a conical shape to correct for current concentrations that would otherwise exist and unevenly affect the amount of electropolishing over the length of the prosthesis.

Abstract: A method and apparatus for retaining electrolyte on a rotating platen using directional air flow is provided. In one embodiment, an apparatus for processing a substrate is provided. The apparatus includes a platen assembly having a surface for supporting a processing pad and disposed on a stationary base so that the platen assembly may rotate relative to the base; and an air knife coupled to the base and extended over a portion of the surface, the air knife operable to deliver a stream of air toward the pad to divert at least a portion of a fluid disposed on the pad toward a center of the pad.

Abstract: An electro-chemical processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.

Abstract: An insulated vibration-stirring apparatus comprising a vibration generating means containing a vibration motor and a vibrating member attached to that motor, and a vibrating rod attached by an installation piece to allow vibration linked with the vibration generating means, and vibrating vanes installed on this vibrating rod. An electrical insulation area made from hard rubber is installed on a section nearer to the installation section to the installation piece than the section where the vibrating vanes are mounted on the vibrating rod. An electrical line is connected to the lower section of the vibrating rod on the electrical insulation area side where the vibrating vanes are installed. This electrical line conducts power to the vibrating vanes by way of the lower section of the vibrating rod.

Abstract: An integrated tool is provided including at least one workpiece processing station having a paddle assembly. In accordance with another independent aspect of the present invention, the workpiece processing station is adapted for adjusting the level of the processing fluid relative to a workpiece, wherein the portion of the workpiece to be processed and possibly the paddle is selectively immersed within the processing fluid. In accordance with a further independent aspect of the present invention, a paddle is provided for use proximate to a workpiece in a workpiece processing station. The paddle includes a one or more sets of delivery ports and one or more sets of fluid recovery ports. In at least one embodiment, the paddle provides for agitation of a processing fluid proximate to the surface of the workpiece. In at least another embodiment, the paddle provides for the delivery and/or recovery of one or more fluids to the portion of the workpiece to be processed.

Abstract: The present invention provides an apparatus for electrochemical mechanical processing of a surface of a workpiece by utilizing a process solution. The apparatus of the present invention includes an electrode touching the process solution, a belt workpiece surface influencing device extended between a supply spool and a receiving spool. During the process, the surface of the workpiece is placed in proximity of the workpiece surface influencing device and the process solution is flowed through the process section and onto the surface while a potential difference is applied between the electrode and the surface of the workpiece.

Abstract: An electrode for rejuvenating a cooling passage within an airfoil, the electrode including a tip, an end, a conductive core extending between the tip and the end, and an insulating coating disposed on the conductive core. The insulating coating exposes a number of conductive strips of the conductive core extending between the tip and the end. The insulating coating forms a number of insulating portions and further exposes a number of spacer portions of the conductive core longitudinally positioned between the insulating portions. The insulating portions substantially span a distance between the tip and the end and are positioned between the conductive strips.

Abstract: This invention relates to an improved apparatus and method for electrolytic descaling of steel strips. The apparatus comprises electrodes integrated with nozzles having jet openings for dispensing electrolyte onto the surface of the steel strips. By jetting the electrolyte to the steel strip in the air and applying a voltage to the electrode, the scale on the surface of the steel strip is removed. This jetting of electrolyte reduces the size requirement of the electrolyte tank storing the electrolyte because the required quantity of electrolyte decreases. The present invention does not require immersion of the electrodes in the electrolyte and thus avoids the problem of short-circuiting that occurs with submerged electrodes. This results in a significant improvement in electric power efficiency.

Abstract: Generally, a method and apparatus for electro-chemical polishing a metal layer disposed on a substrate is provided. In one embodiment, the electro-chemical polishing apparatus generally includes a substrate support having a plurality of contact members, a cathode and at least one nozzle. The nozzle is adapted to centrally dispose a polishing fluid on the substrate supported by the substrate support. The cathode is adapted to couple the polishing fluid to a negative terminal of a power source. A positive terminal of the power source is electrically coupled through the contact members to the conductive layer of the substrate. The nozzle creates a turbulent flow in the portion of the polishing fluid boundary layer proximate the center of the substrate which enhances the polishing rate at the center of the substrate.

Abstract: An electroetching process of the present invention uses a multiphase environment for planarizing a wafer with conductive surface having a non-uniform topography. The multiphase environment includes a high resistance phase and an etching solution phase. The conductive surface to be planarized is placed in the high resistance phase and adjacent a phase interface between the high resistance phase and the etching solution phase. A wiper is used to mechanically move the thin high resistance phase covering the conductive surface so that the raised regions of the non-planar conductive surface is briefly exposed to etching solution phase. The mechanical action of the wiper does not disturb the high resistivity phase filling the rescessed regions of the surface. As the raised surface locations are exposed, the etching solution phase contacts and electroetch the exposed regions of the raised regions until the surface planarized.

Abstract: A bath composition for the electropolishing of a metal surface made of nonalloyed titanium is disclosed. The bath composition may comprise sulfuric acid of 2 to 40% by volume, hydrofluoric acid of 10 to 18% by volume and acetic acid of 42 to 62% by volume.

Abstract: This invention, in one aspect, relates to processes for electropolishing aluminum, in particular, aluminum alloy metal surfaces, by immersing the metal surface in a polishing solution and making the aluminum alloy material anodic. The polishing solution can comprise a phosphoric acid solution and a hypophosphite-containing compound. The polishing solution can also comprise a polyol, a polyol ether and an organic acid.

Abstract: Generally, a method and apparatus for electrochemical polishing a metal layer disposed on a substrate is provided. In one embodiment, the electrochemical polishing apparatus generally includes a substrate support having a plurality of contact members, a cathode and at least one nozzle. The nozzle is adapted to centrally dispose a polishing fluid on the substrate supported by the substrate support. The cathode is adapted to couple the polishing fluid to a negative terminal of a power source. A positive terminal of the power source is electrically coupled through the contact members to the conductive layer of the substrate. The nozzle creates a turbulent flow in the portion of the polishing fluid boundary layer proximate the center of the substrate which enhances the polishing rate at the center of the substrate.

Abstract: This invention relates to an improved apparatus and method for electrolytic descaling of steel strips. The apparatus comprises electrodes integrated with nozzles having jet openings for dispensing electrolyte onto the surface of the steel strips. By jetting the electrolyte to the steel strip in the air and applying a voltage to the electrode, the scale on the surface of the steel strip is removed. This jetting of electrolyte reduces the size requirement of the electrolyte tank storing the electrolyte because the required quantity of electrolyte decreases. The present invention does not require immersion of the electrodes in the electrolyte and thus avoids the problem of short-circuiting that occurs with submerged electrodes. This results in a significant improvement in electric power efficiency.

Abstract: The present invention relates to a method of electropolishing aided by ultrasonic means having the capability of rapidly discharging dregs. More specifically, the invention relates to a method of electrochemical polishing process aided by an auxiliary ultrasonic cleaning device which emits ultrasonic vibrating energy to effectively discharge dregs, shorten the polishing cycle time for each workpiece, and improve the surface roughness of the workpiece. The present invention further provides an electropolishing apparatus that can be easily retrofitted to almost every existing machine tool as an auxiliary unit. Alternately, the ultrasonic apparatus can be installed separately as an independent ultrasonic generating unit.

Abstract: A method and an apparatus for manufacturing a wire, particularly a sawtooth wire for all-steel sawtooth wire card clothings, wherein the surface of a wire-shaped intermediate product, such as a wire already provided with sawteeth, is smoothened in an electropolishing process in an electrolyte bath containing an electrolyte. A relative movement is produced between the electrolyte and the intermediate product during the electropolishing process. The apparatus includes a device for producing a relative movement between the electrolyte and the intermediate product contained in the electrolyte bath.

Abstract: A method of removing a metal skin from a through-hole surface of a copper-Invar-copper (CIC) laminate without causing differential etchback of the laminate. The metal skin includes debris deposited on the through-hole surface as the through hole is being formed by laser or mechanical drilling of a substrate that includes the laminate as an inner plane. Removing the metal skin combines electrochemical polishing (ECP) with ultrasonics. ECP dissolves the metal skin in an acid solution, while ultrasonics agitates and circulates the acid solution to sweep the metal skin out of the through hole. ECP is activated when a pulse power supply is turned on and generates a periodic voltage pulse from a pulse power supply whose positive terminal is coupled to the laminate and whose negative terminal is coupled to a conductive cathode. After the metal skin is removed, the laminate is differentially etched such that the copper is etched at a faster rate than the Invar.

Abstract: A processing chamber for depositing and/or removing material onto/from a semiconductor wafer when the wafer is subjected to an electrolyte and in an electric field, and in which a rotating anode is used to agitate and distribute the electrolyte. A hollow sleeve is utilized to form a containment chamber for holding the electrolyte. A wafer residing on a support is moved vertically upward to engage the sleeve to form an enclosing floor for the containment chamber. One electrode is disposed within the containment chamber while the opposite electrode is comprised of several electrodes distributed around the circumference of the wafer. The electrodes are also protected from the electrolyte when the support is raised and engaged to the sleeve. In one embodiment, the support and the sleeve are stationary during processing, while a rotating anode is used to agitate and distribute the electrolyte.

Abstract: An electrode structure is constituted by a first electrode, and at least one second electrode providing a pair of opposite portions with a prescribed spacing therebetween at which the first electrode is disposed. The electrode structure is suitably used for electrolytic etching and is effective in providing an accurate etching pattern without damaging the surface of an etching object.

Abstract: The present invention teaches a method of producing a textured surface upon an arbitrarily configured titanium or titanium alloy object for the purpose of improving bonding between the object and other materials such as polymer matrix composites and/or human bone for the direct in-growth of orthopaedic implants. The titanium or titanium alloy object is placed in an electrolytic cell having an ultrasonically agitated solution of sodium chloride therein whereby a pattern of uniform "pock mark" like pores or cavities are produced upon the object's surface. The process is very cost effective compared to other methods of producing rough surfaces on titanium and titanium, alloy components. The surface textures produced by the present invention are etched directly into the parent metal at discrete sites separated by areas unaffected by the etching process. Bonding materials to such surface textures on titanium or titanium alloy can thus support a shear load even if adhesion of the bonding material is poor.

Abstract: For a condensed matter system containing a guest interstitial species such as hydrogen or its isotopes dissolved in the condensed matter host lattice, the invention provides tuning of the molecular orbital degeneracy of the host lattice to enhance the anharmonicity of the dissolved guest sublattice to achieve a large anharmonic displacement amplitude and a correspondingly small distance of closest approach of the guest nuclei. The tuned electron molecular orbital topology of the host lattice creates an energy state giving rise to degenerate sublattice orbitals related to the second nearest neighbors of the guest bonding orbitals. Thus, it is the nuclei of the guest sublattice that are set in anharmonic motion as a result of the orbital topology. This promotion of second nearest neighbor bonding between sublattice nuclei leads to enhanced interaction between nuclei of the sublattice.

Abstract: A method of machining the surface of an electrically conductive workpiece by application of a voltage to an electrically conductive tool spaced apart from the workpiece and moving the tool to shape or pattern the workpiece wherein variable flow of fluid is provided in the space between the tool and the workpiece. The fluid contains suspended insoluble interactive particles that are electrically conductive or are ionically conductive, but electronically insulating. The suspended particles came intermittent electrical short circuiting between the tool and the workpiece to prevent catastrophic and uncontrolled sparking or arcing during machining.

Abstract: Nozzle body acting as an insoluble anode for the galvanic or chemical treent of rod-shaped or pipe-shaped objects continuously moved through the nozzle body and acting as cathode. The nozzle body is arranged in a hollow body serving as a pressure vessel, the electrolyte flowing through the hollow body. The hollow body has a plurality of radial bore holes acting as nozzles, these bore holes being arranged in a plurality of cross-sectional regions lying at a distance from one another and being inclined at angles (.alpha.) and (.beta.) relative to the longitudinal axis of the nozzle body and relative to the respective cross-sectional region. Diaphragms are associated with the nozzle body which is coated on all sides with a layer of metal from the platinum group. The diaphragms are arranged in the through-opening of the nozzle body, surround the body to be treated, and are situated in planes between the outlet openings of the bore holes.

Abstract: An electrolyte is circulated between the surface to be machined, raised to an anode potential, and a tool electrode (9') raised to a cathode potential. The electrolyte contains lithium nitrate as a unique active product with a concentration of between 20 g/l and 2350 g/l and preferably between 50 g/l and 250 g/l. The process can be applied to the machining of the surface of any metallic component and in particular to the machining of the internal surface of tubular components (5) such as penetrations in the vessel bottom or closure head of a nuclear reactor; in this case the electrochemical machining cell consists of a cylindrical tool electrode (9') placed inside the component to be machined.