Abstract: A plurality of heat dissipation substrates stacked on each other, intermediate sheets disposed under a lowermost heat dissipation substrate, on an uppermost heat dissipation substrate, and between heat dissipation substrates adjacent to each other, a drying agent disposed over or under the plurality of heat dissipation substrates, and a bag that seals the plurality of heat dissipation substrates, the plurality of intermediate sheets, and the drying agent.

Abstract: The present invention relates to a molded air-cavity package. In addition, the present invention is related to a device comprising the same. The present invention is particularly related to molded air-cavity packages for radio-frequency ‘RF’ applications including but not limited to RF power amplifiers. Instead of using hard-stop features that are arranged around the entire perimeter of the package in a continuous manner, the present invention proposes to use spaced apart pillars formed by first and second cover supporting elements. By using only a limited amount of pillars, e.g. three or four, the position of the cover relative to the body can be defined in a more predictable manner. This particularly holds if the pillars are arranged in the outer corners of the package.

Abstract: This specification describes semiconductor wafer carriers, methods for manufacturing the semiconductor wafer carriers, and methods for using the semiconductor wafer carriers. The semiconductor wafer carriers can include features for avoiding double-slotting, for preventing glove marks on semiconductor wafers, and for providing additional sitting and storage options for the wafer carrier. In some examples, a semiconductor wafer carrier includes multiple notched left-side rods that are parallel in a vertical direction and multiple notched right-side rods that are parallel in the vertical direction. The semiconductor wafer carrier includes one or more bottom rods. The left-side rods, the right-side rods, and the one or more bottom rods are joined to define semiconductor wafer slots.

Abstract: Wafer support shelves (10, 10) are each provided with wafer support projections (A, B1, B2) on which parts of the outer margins of a semiconductor wafer (W) are to be placed. In each case, one of the support projections (A, B1, B2) is provided on the far side of the center position of the semiconductor wafer (W), and two of the support projections are provided on the near side of the center of the semiconductor wafer. By means of this structure, in a state in which a lid body (3) is not attached to a wafer extraction/insertion opening (2), the flexure amount of the semiconductor wafers placed on the support projections of multiple locations in the wafer support shelves can be reduced with a minimal number of projections, so that a hindrance is not created to an operation such as extraction by a robot arm.

Abstract: The present invention comprises a workpiece container for storing at least one workpiece having a bottom surface and a peripheral edge. In one embodiment, a workpiece support structure is located within the container enclosure, which forms multiple vertically stacked storage shelves within the enclosure. Each storage shelf includes, in one embodiment, a first tine and a second tine for supporting the workpiece in a substantially horizontal orientation. The bottom surface and peripheral edge of a workpiece seated on a storage shelf extends beyond the outer edge of both the first tine and the second tine. An end effector according to the present invention may engage these extended portions or “grip zones” of the workpiece.

Abstract: A substrate container includes an enclosure and an access structure formed in the enclosure and providing fluid access through the enclosure to an interior of the substrate container. The access structure includes an opening and an inner surface. A grommet is situated against the inner surface of the access structure.

Abstract: A method for batch brazing in a diffusion furnace includes inserting a plurality of fusible parts into a plurality of slots of at least one quartz boat, transporting the at least one quartz boat, including the fusible parts, into an interior of a reaction chamber of the diffusion furnace, sealing the interior of the reaction chamber, adjusting an atmosphere of the interior of the reaction chamber according to a recipe, moving a preheated furnace heating element from a location spaced apart from the reaction chamber to a location in substantial proximity with the reaction chamber to increase a temperature of the atmosphere of the interior of the reaction chamber above a predefined brazing temperature for a predefined brazing time period according to the recipe.

Abstract: A wafer-retaining unit has a plurality of vertically superimposed single-wafer retaining sections, each having a wafer-retaining frame abutting against only a lower end edge portion of the outer periphery of a semiconductor wafer, a wafer-securing frame disposed vertically movably relative to the wafer-retaining frame to abut against only an upper end edge portion of the outer periphery of the semiconductor wafer, and wafer lift members that lift the semiconductor wafer to a position where it is upwardly separate from the wafer-retaining frame and keeps the semiconductor wafer in this position. Consequently, a plurality of semiconductor wafers can be accommodated efficiently and safely without increasing the space between each pair of mutually adjacent semiconductor wafers. At the same time, the semiconductor wafers can be loaded and unloaded satisfactorily.

Abstract: A described packing insert for disc-shaped objects has a ring and a deformable contacting portion supported by the ring and extending from a circumference of the ring. The contacting portion has one or more solid portions extending from the circumference. The solid portions define a plurality of radially arranged members separated by a plurality of void regions, where the solid portions extend radially from a circumference of the ring.

Abstract: The present invention provides a glass support system, including methods and equipment for supporting a glass substrate on a column of air. The disclosed glass alignment equipment may be used to prevent or reduce defects or contamination on the surface of a glass substrate which may arise when the glass is aligned prior to etching. In particular, a support pin of the present invention may be used with an air circulation system to support or align glass over a column of air so as to reduce or prevent defects or contamination on the glass in dry etching processes used in the manufacturing of LCDs and other devices.

Abstract: A method for batch brazing jet stacks in a diffusion furnace. The method may include inserting fusible parts into slots of quartz boats and transporting the quartz boats into an interior of a reaction chamber of a diffusion furnace. An operator may seal the interior of the reaction chamber and an atmosphere of the interior of the reaction chamber may be adjusted according to a brazing recipe. A preheated furnace heating element may be moved toward the reaction chamber to increase a temperature and the fusible parts may be brazed according to the brazing recipe. The furnace heating element may then be moved away from the reaction chamber, the chamber unsealed, and the brazed parts removed.

Abstract: A structure for independently supporting a wafer and a mask in a processing chamber is provided. The structure includes a set of extensions for supporting the wafer and a set of extensions supporting the mask. The set of extensions for the wafer and the set of extensions for the mask enable independent movement of the wafer and the mask. In one embodiment, the extensions are affixed to an annular ring which is capable of moving in a vertical direction within the processing chamber. A processing chamber, a mask, and a method for combinatorially processing a substrate are also provided.

Abstract: A method and apparatus for batch brazing jet stacks in a diffusion furnace. The method may include inserting fusible parts into slots of quartz boats and transporting the quartz boats into an interior of a reaction chamber of a diffusion furnace. An operator may seal the interior of the reaction chamber and an atmosphere of the interior of the reaction chamber may be adjusted according to a brazing recipe. A preheated furnace heating element may be moved toward the reaction chamber to increase a temperature and the fusible parts may be brazed according to the brazing recipe. The furnace heating element may then be moved away from the reaction chamber, the chamber unsealed, and the brazed parts removed.

Abstract: A system and method of reducing the introduction of foreign material to wafers. A system includes an enclosure structured and arranged to carry wafers used in semiconductor device manufacturing, and an attractive material arranged as at least a portion of an interior surface of the enclosure.

Abstract: A semiconductor wafer storage case is disclosed that includes plural support members that are spaced at predetermined intervals with respect to each other and are each configured to come into contact with a peripheral edge region of a first face of a semiconductor wafer, and an elastic member that elastically supports the support members with respect to each other and is configured to elastically deform to come into contact with a second face of the semiconductor wafer and press the semiconductor wafer onto a corresponding support member.

Abstract: A pressure resistant case (22) is constructed in a rectangular parallelepiped box shape by assembling a bottom plate (61) and ceiling plate (62) and first side plate (63) and second side plate (64) and third side plate (65) and a fourth side plate (66) formed of thick aluminum plate and by welding on four sides by the TIG welding method. In the TIG welding of the ceiling plate (62) and the first side plate (63), the end surface on the side where a hollow section (72) of the ceiling plate (62) is formed, abuts against the main surface on the side where the locating section (71) of the first side plate (63) is formed. The edge near the hollow section (72) of the ceiling plate (62) is abutted against the locating section (71), and a fillet weld section (75) is formed by TIG welding on the corner section formed by the ceiling plate (62) and the locating section (71).

Abstract: A packaging system, hereinafter referred to as the Critical Packaging System, relates to critical issues that associate with sensitive articles such as IC wafers before, during and after shipment phases. The system employs a choice of two or more specialty designed containers, and any one selected design having choices of two or more methods by which to avoid, reduce and/or eliminate wafer damage from breakage, scratches and/or corrosion during shipment phases. For the purpose of maximizing product yield during packaging phases a special apparatus is used to insert wafers within containers without scratch damage. The following programs are used in packaging: (1) Quality Assurance/Certification, (2) Critical Factor Monitoring, and (3) a Recycle and Refurbish Program. These programs are specifically designed to achieve new levels of product yields, reduce product cost, and landfill impact.

Abstract: A high purity ceramic article having a typical pore size of at least about 15 ?m and an active impurity concentration of less than about 400 ppm can be prepared by molding ceramic powder, sintering to vaporize any active impurity components, washing to dissolve any remaining active impurity components with an acid solution, and oxidizing to remove any residual active impurity components.

Abstract: Ball grid array packages for semiconductor die include a thermally conductive container and a substrate that substantially enclose a semiconductor die. The die is positioned with respect to the container by thermally conductive supports formed in the container or attached to the container. The die contacts the supports so that the die and the container form a cavity that is at least partially filled with a thermally conductive material such as a conductive epoxy to promote thermal conduction between the die and the container. The die electrically connects to the substrate with bond wires that extend through an aperture in the substrate and attach to bond pads provided on the substrate. The aperture is typically filled with a protective layer of resin, epoxy, or other material that also encapsulates the bond wires.

Abstract: The attaching-and-detaching operation of a lid unit, and the operation of taking in and out semiconductor wafers stored in a container body are facilitated. Thin-plate supporting units for supporting semiconductor wafers are provided in the container body of a thin-plate supporting container, and wafer holding units for pressing and supporting the semiconductor wafers, supported by the thin-plate supporting units, from a lid unit side are provided inside a lid unit. The area of a lower surface of a V-shaped groove of the wafer holding unit is increased. The V-shaped groove easily fits the peripheral portion of the semiconductor wafer when attaching the lid unit to the container body. The lower surface of a V-shaped groove of the thin-plate supporting portion is roughened to enhance slipping property with respect to the semiconductor wafer. The angle of inclination of a ridge is determined to be 2 to 5 degrees with respect to the horizontal direction.

Abstract: A carrier for transporting silicon semiconductor wafers during semiconductor wafer processing operations including an enclosure, a door and a flange structured to interface with a machine so that the carrier can be lifted by the machine. A lift saddle connects the flange to the container so that the load on the flange is transferred to a part of the enclosure other than the top of the enclosure to prevent distortion of the enclosure to maintaining seal integrity between the enclosure and the door.

Abstract: A substrate container having an enclosure with an access opening for inserting and removing substrates into an interior of the enclosure and a door chassis that is configured to selectively enclose the opening, the door chassis comprising a first wall having a peripheral wall extending therefrom. The substrate container includes a latch mechanism that is operably coupled with the chassis, the latch mechanism configured to operably secure the chassis to the opening. The door of the substrate container includes a textured particle capture region wherein particles generated by the latch mechanism and elsewhere are captured by the particle capture region.

Abstract: The present disclosure describes apparatus and methods for processing microfeature workpieces, e.g., by depositing material on a microelectronic semiconductor using atomic layer deposition. Some of these apparatus include microfeature workpiece holders that include gas distributors. One exemplary implementation provides a microfeature workpiece holder adapted to hold a plurality of microfeature workpieces. This workpiece holder includes a plurality of workpiece supports and a gas distributor. The workpiece supports are adapted to support a plurality of microfeature workpieces in a spaced-apart relationship to define a process space adjacent a surface of each microfeature workpiece. The gas distributor includes an inlet and a plurality of outlets, with each of the outlets positioned to direct a flow of process gas into one of the process spaces.

Abstract: A plastic insert (20) is configured to provide support of thin wafers (49) in wafer carriers (45) configured to provide peripheral wafer support. The invention includes the insert, the insert in combination with a wafer carrier, and the, methods of supporting the thin wafers as provided by the insert and the wafer carrier. The insert (20), in preferred embodiments, utilize tabs (80, 82) that fit into the side wall recesses (53) and have an interference fit in said recesses to secure the insert in place.

Abstract: The present invention provides a wafer holder, a wafer support member, a wafer boat and a heat treatment furnace, which are capable of sufficiently suppressing slip dislocations, without lowering productivity and at low cost, in the high temperature heat treatment of silicon wafers, and said wafer holder is characterized in that: the wafer holder is composed of a wafer support plate and three or more wafer support members mounted on said wafer support plate, each of the wafer support members having a wafer support portion or more; at least one of said wafer support members is a tilting wafer support member which has a plurality of upward-convex wafer support portions on the upper surface and is tiltable with respect to said wafer support plate; and the wafer is supported by at least four wafer support portions.

Abstract: A substrate container and a bottom plate are connected with a mechanism for adjusting the distance between the container and bottom plate, by, e.g., a threaded connection between two members of the connector mechanism. Also provided are a duck-billed valve for venting the container and a dampener for minimizing damage due to shocks.

Abstract: A structure for racking substrates includes first to fourth main legs isolated from one another at intervals wider than widths of both long sides and both short sides of a substrate, first to fourth protrusions respectively protruded from the first to fourth main legs in a direction of the long sides or the short sides of the substrate, a first side support bar coupled to the first and second protrusions and supporting an edge of one long side or one short side of the substrate, a second side support bar coupled to the third and fourth protrusions and supporting an edge of the other long side or the other short side of the substrate, at least one auxiliary leg disposed between the first and second main legs, or the second and third main legs, or the third and fourth main legs, or the fourth and first main legs, and at least two central support bars coupled to the auxiliary leg, extended parallel to the long sides or the short sides of the substrate, and supporting a central portion of the substrate.

Abstract: A container for disks has an improved latching mechanism. The container comprises a cassette with sidewalls with slots for holding disks in an axial arrangement, two opposite end walls each have a U-shaped recess extending downwardly from the open top, a top cover with a rectangular top portion and two end portions extend downwardly to cover the U-shaped recess. The top cover latches to the cassette by way of a latching mechanism which includes a living hinge, an extension portion, and a hook portion all on each end portion. The hook portion cooperates and engages with a cooperative catch member on the cassette. The extension member is under tension to secure the top cover in place. In an alternate embodiment, recesses on the extension portion connect to nubs on the cassettes or on the bottom cover to secure the top cover in place.

Abstract: A semiconductor fabricating apparatus having a structure, which facilitates a loading and unloading operation of wafers while having a low effect by a high temperature during a heat treatment. The semiconductor fabricating apparatus includes a plurality of ring-shaped holder having brims and recessed portions, the brims for mounting the to-be-processed wafers thereon, thereby performing the required heat treatment. A tweezer plate of a wafer loading-transferring device is inserted onto the recessed portion or taken out therefrom, and the inserted tweezer plate is ascended or descended, so that the wafer can be inserted on the brims or taken out therefrom.

Abstract: Provided is a semiconductor manufacturing system capable of loading a plurality of semiconductor wafers into a vertical reaction tube, and performing a thermal process. The semiconductor manufacturing system includes a first wafer loading boat, a second wafer loading boat, a plate cap, a door plate and a lifting system. The first wafer loading boat is mounted in the reaction tube and includes a plurality of holder supporters that support a wafer holder in a shape of a board, the wafer holder being loaded vertically at a predetermined interval and on which the semiconductor wafer is rested on. The second wafer loading boat is inside or outside the first wafer loading boat and has a wafer supporter that supports the semiconductor wafer. The lifting system moves either the first wafer loading boat or the second wafer loading boat vertically and separates the semiconductor wafer, which is loaded on the wafer holder, from the wafer holder at a predetermined height.

Abstract: A first construction of a tray for electronic parts according to the present invention is provided with an engaging cut-out corner portion which is formed by cutting a corner portion of a table-like flat portion which is arranged diagonally with respect to a-cut-out corner portion. A second construction of a tray for electronic parts according to the present invention is provided with a pawl engaging protruding portion which is formed on a step-like peripheral edge portion above a cut-out portion. In a third construction of a tray for electronic parts according to the present invention, when two trays are stacked up so that the top faces thereof face each other, an engaging first-shaped protrusion which is formed around a predetermined pocket of one tray engages an engaging second-shaped protrusion which is formed around a predetermined pocket of the other tray.

Abstract: A semiconductor wafer susceptor for batch substrate processing. The susceptor includes a central region in a primary plane and a plurality of flat annular extensions extending below the central region in a secondary plane. The primary and secondary planes are parallel to each other. An edge of the substrate overhangs the central region allowing no contact of the susceptor with the substrate edge.

Abstract: A package includes: a substrate having a ridged peripheral portion and a center portion defined by and lower in level than the ridged peripheral portion. A semiconductor chip is mounted on the center portion. A plurality of lead is electrically coupled to the semiconductor chip and penetrates the substrate outwardly from the center portion. The package also includes a cap deeming a cavity space which accommodates the semiconductor chip. The cap has a cap bonding face bonded with a substrate bonding face of the ridged peripheral portion. The cap bonding face and the substrate bonding face are higher in level than the center portion.

Abstract: A wafer box with a handle device is provided. A wafer box includes a wafer box main body for carrying at least one wafer, a handle device having a holding portion being evenly and securely held by an operator with digits so as to transport the wafer box conveniently, and a connecting component for connecting the wafer box main body to the handle device. The connecting component further includes an engaging portion for being engaged with the wafer box main body, a positioning portion for positioning the connecting component on the wafer box main body, and an urging portion for urging against the wafer box main body.

Abstract: A shipper for memory disks comprises a cassette having an open top and an open bottom, a top cover to cover the open top, and a bottom cover to cover the bottom. The body portion has opposing side walls and opposing end walls. The two side walls each have with a vertical upper portions and an inwardly converging bottom portion. Said sidewalls have inwardly facing elongate teeth or spacers defining slots to hold the substrates in a vertically positioned and spaced array. Each tooth is continuous from the open top to the open bottom and each tooth has a upper vertical portion at the vertical upper portion of the side wall and a converging lower portion at the bottom portion of the side walls. The converging lower portion of each tooth follows the convergence of the bottom portions of the sidewalls.

Abstract: An assembly to facilitate the transport of semiconductor wafers comprises rigid first and second end plates, and a plurality of interconnected flexible pockets provided between these first and second end plates. Each of the pockets is configured to store a semiconductor wafer therein. A method of facilitating the transport of semiconductor wafers comprises inserting semiconductor wafers into pockets of a wafer transport assembly, the assembly having rigid first and second end plates, and a plurality of interconnected flexible pockets attached therebetween. The method further comprises collapsing the pockets down onto the semiconductor wafers by moving the first end plate toward the second end plate. A method of fabricating an assembly to facilitate the transport of semiconductor wafers comprises providing a plurality of interconnected flexible pockets between rigid first and second end plates, each of these pockets being configured to store a semiconductor wafer therein.

Abstract: The purpose of the present invention is to provide a wafer carrying system with a manual-opened cover. The wafer carrying system of the present invention includes a wafer cassette having an opening, a cover disposed on the wafer cassette for covering the opening of the wafer cassette, an opener disposed on the cover for opening the cover, a base for mounting the opener thereon, a separating device connected with the base and the opener, thereby the cover being movable from a shut position to a separated position, a first pivoting device connected to the separating device for pivoting the cover to a first specific position, and a second pivoting device connected to the first pivoting device for pivoting the cover to a second specific position.

Abstract: A wafer container having a latching mechanism utilized to lock the door of the wafer container in an airtight status. The latching mechanism comprises a cam rotated to move a link and a locking plate pivoted to one end of the link, and a guide block adapted to guide the locking plate sliding into an insertion hole in the container body of the wafer container by using a straight guide means and a curved guide means of the guide block and then to turn the locking plate about pivot rods at the link, causing the locking plate to withstand against part of the container body and to hold down the door toward the inside of the container body and to lock the door in an airtight status.

Abstract: A wafer holding apparatus composed of a plurality of rods joined at opposite ends by endplates. Each rod at each end is secured to the endplates by a mechanical dovetail joint. The dovetail joint secures the rods to the endplates without the need for sealing or coating agents. Also, auxiliary mechanical components such as nuts and bolts to secure the joint components need not be employed to secure the joint. Each rod has multiple grooves or slits for placing multiple semiconductor wafers that are to be processed in processing chambers. The wafer holding apparatus is oxidation resistant, chemical resistant and thermal shock resistant.

Abstract: A substrate processing apparatus includes a first holder made of silicon carbide or silicon and a second holder made of quartz. Each of the first and the second holder is of a ring shape and the second ring shaped holder is mounted on the first holder. The second holder is used to mount a substrate thereon while the substrate is being processed.

Abstract: A wafer carrier for carrying a plurality of axially aligned thin circular wafers. The wafer carrier has a framework portion formed from a pair of end members connected by a plurality of side support members. A pair of opposing sidewall assemblies is positioned between the pair of end members, and is attached to at least one side support member. Each sidewall assembly has a plurality of shelves defining a plurality of slots for receiving a wafer. The sidewall assemblies are formed from a plurality of stacked together individual shelf members. Each shelf member has a body portion with an upper surface and a lower surface. The lower surface has a plurality of pegs which are positioned to be received by a plurality of apertures formed in the upper surface of an immediately adjacent individual shelf member.

Abstract: A wafer cassette for storing and transporting wafers that is equipped with sensors such as piezoelectric sensors or capacitance sensors on the surface of the dividers for sensing the presence or absence of wafers positioned on top of the dividers is described. The sensors are capable of detecting any defective placement of wafers such as a cross-slot placement or a double placement such that the condition can be corrected by a machine operator and a wafer cassette can be stopped before it is loaded into an internal buffer of a process machine.

Abstract: A plastic package base, an air cavity type plastic package, and their manufacturing methods, which are capable of realizing the advantages of a ceramic package in that it has a compact size, makes less noise, and is highly thermally resistant, are provided.

Abstract: A wafer boat and boat handle are designed for automatic interlocking engagement and release upon manipulation by a user. The boat includes a side rail with a lip for engagement within a slot formed in the handle, and a handle cam activating contact surface for contacting a gripping block member of the handle. The handle includes at least one boat holding block with a boat lip holding slot therewithin. The handle also includes at least one boat gripping block that is rotatably engaged with the holding block, and which includes a frontwardly projecting rail gripping flange. When the boat lip is brought into the holding block slot, the gripping block rotates and the flange is brought over the top of the rail. The boat rail is thereby held between the slot and the flange of the handle, such that the boat may be lifted and moved.

Abstract: The embodiment of this invention is an apparatus that provides for a cassette-to-cassette batch demounting process wherein the apparatus has two cassettes for holding and separating semiconductor substrates. A first cassette is placed on top of a second cassette, using the first cassette as the top cassette that holds the semiconductor substrate and the support substrate, and the second cassette at the bottom as a bottom cassette that receives the semiconductor substrate after demounting process. The semiconductor substrate is loaded with its support substrate into a slot in the top cassette. The top cassette will let only the semiconductor substrate to descend to the bottom cassette while blocking the support substrate from exiting the top cassette. The two cassettes are then soaked in a hot solvent that can dissolve or melt an adhesive that adheres the semiconductor substrate to the support substrate in order to weaken the cohesive force between the two substrates.

Abstract: An apparatus for transporting semiconductor wafers between processing steps that can also be used to support the wafers during various processing steps. The apparatus minimizes the obstruction of fluid flow in the process tank, reduces the amount of devices that will fail due to edge exclusion, and reduces processing times. In one embodiment, the apparatus is a wafer carrier comprising a wire frame having three load supporting members, the load supporting members having a plurality of wafer engaging elements adapted to support a plurality of wafers.

Abstract: An apparatus for growing thin films by exposing the substrate to alternately repeated surface reactions of vapor-phase reactants. The apparatus comprises a reaction chamber including a reaction space, infeed means connected to the reaction space for feeding into the reaction space the reactants, and outfeed means connected to the reaction space for discharging waste gases. At least one substrate is adapted into the reaction space and a second surface is also adapted into the reaction space in a disposition opposed to the surface of the substrate. The thin-film growth supporting surface of the substrate and the other surface disposed opposing the same are arranged in the reaction chamber so as to subtend an angle opening in the flow direction of the reactants in relation to the opposed surfaces. The distance between the opposed surfaces at the infeed end of reactants is smaller than at the gas outfeed end.

Abstract: A vertical ceramic wafer boat for supporting a silicon wafer having a predetermined radius “R”. The wafer boat comprises a base portion and a column rack, which extends generally vertically upwards from the base portion. The column rack includes a pair of vertical column rack supports extending generally vertically upwards from the base portion. The column rack also includes a plurality of wafer supports having a generally Y shaped cross section. The wafer supports extend substantially horizontally from the column rack supports to define a plurality of slots within the column rack sized to receive the wafer.

Abstract: A frame of a wafer boat is retrofitted with brace assemblies. The frame has left and right vertically extending, horizontally spaced supports. Each support has a plurality of slots above one another. A plurality of substantially horizontal wafers are horizontally insertable above one another with respective left edges of the wafers in respective ones of the slots of the left support and respective right edges of the wafers in respective ones of the slots of the right support. Each brace assembly includes a plurality of braces. Each brace has a respective upper surface in a respective position to support a lower surface of a respective wafer between and distant from the slots in which the left and right edges of the wafer are inserted.

Abstract: A silicon carbide rail for use as a support in an apparatus for holding semiconductor wafers is made by forming a first series of parallel slots or grooves into the front side of a graphite plate usually without piercing the back side of the plate, converting the slotted graphite plate into a slotted silicon carbide plate, and forming a second series of parallel slots into the back side of the slotted silicon carbide plate such that each slot on the back side connects with a corresponding slot on the front side. The width of each back side slot is less than that of the corresponding front side slot, thereby forming rail teeth having a ledge running along their to top surfaces.