Abstract: In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.

Abstract: A micro channel structure includes a substrate, a supporting layer, a valve layer, a second insulation layer, a vibration layer and a bonding-pad layer. A flow channel is formed on the substrate. A conductive part and a movable part are formed on the supporting layer and the valve layer, respectively. A first chamber is formed at the interior of a base part and communicates to the hollow aperture. A supporting part is formed on the second insulation layer. A second chamber is formed at the interior of the supporting layer and communicates to the first chamber through the hollow aperture. A suspension part is formed on the vibration layer. By providing driving power sources having different phases to the bonding-pad layer, the suspension part moves upwardly and downwardly, and a relative displacement is generated between the movable part and the conductive part, to achieve fluid transportation.

Abstract: A nozzle for printing three-dimensional parts with an additive manufacturing system, the nozzle comprising a nozzle body having an inlet end and a tip end offset longitudinally from the inlet end, a tip pipe for extruding a flowable material, an inner ring extending circumferentially around the tip pipe at the outlet end, an outer ring extending circumferentially around the inner ring, at least one annular recessed groove located circumferentially between the inner ring and the outer ring.

Abstract: A device and method for printing 3D articles including electronic and functional elements including 3D printer and a plasma jet printer based on a dielectric barrier atmospheric pressure plasma jet system in which both printing and in-situ treatment and post-deposition treatment can be carried out to tailor the materials characteristics. Plasma jet printer comprising of electrodes in the nozzle/print head for applying electric field and generating atmospheric plasma that could be used for non-gravity based highly directional printing in any direction. Integration of dielectric barrier plasma printer and plasma treatment jets with the 3D printer increases the capability of embedding high performance electronics in a 3D printed structure aiding in additive manufacturing of functional devices. Ability to use a range of materials for print head assembly including micro machined silicon increases the resolution of the plasma jet printer to sub-micron level.

Abstract: A differentially coated device for conducting a plurality of nano-volume specified reactions, the device comprising a platen having at least one exterior surface modified to a specified physicochemical property, a plurality of nano-volume channels, each nanovolume channel having at least one interior surface in communication with the at least one exterior surface. Methods for preparing and using such devices are also provided, as well as a method of registering a location of a dispenser array in relation to a microfluidic array. Quantities related to a vector displacement from the alignment position to a fixed position on the one of the dispenser array and the microfluidic array is determined. The quantities thus determined are used to guide positioning of the dispenser array relative to the microfluidic array.

Abstract: In a liquid ejection head and a method of manufacturing the ejection head, an ejection port board is provided with an expanded portion that communicates with a supply port and has an open end that is larger than an opening of the supply port.

Abstract: A liquid ejecting head with a supply port and an outlet port includes a pressurization chamber communicating with one of the suplly port and the outlet port, a first flow path communicating with the pressurization chamber and extending in a first axial direction, a second flow path communicating with the other of the supply port and the outlet port and extending in a second axial direction orthogonal to the first axial direction, and a nozzle that is provided to branch from the second flow path and that discharges the liquid along the first axial direction. When viewed in a third axial direction orthogonal to the first axial direction and the second axial direction, an inner wall at a location at which the second flow path and the first flow path intersect includes an inclined surface inclined with respect to the first axial direction and the second axial direction.

Abstract: A microfluidic device provided in a body accommodating a fluid containment chamber. A fluidic access channel and a drop emission channel are formed in the body and are in fluidic connection with the fluid containment chamber to form a fluidic path towards the body outside through a nozzle having an outlet section. An actuator is operatively coupled to the fluid containment chamber and is configured to cause ejection of fluid drops through the drop emission channel in an operating condition of the microfluidic device. The drop emission channel comprises a portion of reduced section having a smaller area than the outlet section of the nozzle.

Abstract: The present disclosure relates to a manufacturing method of inorganic thin film transistors (TFTs), including: forming a p-type semiconductor layer and a n-type semiconductor layer on a hard substrate in sequence, forming a slot on the p-type semiconductor layer, wherein the slot passes through the n-type semiconductor layer, forming a source and a drain on the n-type semiconductor layer, wherein the source and the drain are respectively configured on two sides of the slot, performing a flip-transferring process to transfer the p-type semiconductor layer, the n-type semiconductor layer, the source, and the drain on a flexible substrate, forming a gate insulation layer and a gate on the p-type semiconductor layer in sequence, forming a flat layer on the gate insulation layer, wherein the flat layer covers the gate. The inorganic TFT is designed to obtain a narrow channel inorganic TFT device, to reduce process requirements, and to reduce costs.

Abstract: A plated silicon-based electronic cigarette atomizing chip includes the following components: a silicon substrate, wherein the silicon substrate is provided with an array of micro-pillars or an array of micro-holes, an inlet end, and an outlet end, the outer walls of the micro-pillars are plated side walls, the inner walls of the micro-holes are plated inner walls, and the array of micro-pillars defines a plurality of micro-channels or electronic cigarette liquid channels penetrating the micro-holes are provided on the silicon substrate; a glass cover, wherein the air holes passing through the glass cover are provided; and the glass cover is fixedly connected to the silicon substrate by a bonding process.

Abstract: A liquid ejection head has on one surface of a substrate a liquid flow path having an ejection orifice and a liquid generating energy generating element while the element is protected against liquid by an insulating layer formed on the surface. The liquid ejection head further has a liquid inflow path and a liquid outflow path each running through the substrate and the insulating layer to circulate liquid. The liquid inflow path and the liquid outflow path each have a first opening on the surface of the substrate and a second opening on the surface of the insulating layer and for each of the liquid inflow and outflow paths, the end on the ejection orifice side of the second opening is located closer to the ejection orifice than the end on the ejection orifice side of the first opening.

Abstract: A liquid ejection head including: a substrate; an energy generating element, which is provided on the substrate and is utilized to eject liquid; a first film provided on the energy generating element; a flow path forming member, which has an ejection orifice from which the liquid is ejected and forms a flow path of the liquid between the substrate and the flow path forming member; and an electrode, which generates a flow of the liquid, wherein the electrode includes the first film.

Abstract: A thin film stack can include a metal substrate having a thickness of from 200 angstroms to 5000 angstroms and a passivation barrier disposed on the metal substrate at a thickness of from 600 angstroms to 1650 angstroms. The passivation barrier can include a dielectric layer and an atomic layer deposition (ALD) layer disposed on the dielectric layer. The dielectric layer can have a thickness of from 550 to 950 angstroms. The ALD layer can have a thickness from 50 to 700 angstroms.

Abstract: A liquid ejection head manufacturing method comprising a step of forming a laminate, a step of connecting and a step of forming a protection film. The laminate includes electrodes and flow paths of liquid. The step of connecting is connecting terminals of a wiring substrate to terminals of the electrodes. The protection film is formed using atomic layer deposition, on a surface of the laminate defining the flow paths after connecting the terminals.

Abstract: The present disclosure relates to a device for analyzing a fluid sample. In one aspect, the device includes a fluidic substrate that comprises a micro-fluidic component embedded in the fluidic substrate configured to propagate a fluid sample via capillary force through the device and a means for providing a fluid sample connected to the micro-fluidic component. The device also includes a lid attached to the fluidic substrate at least partly covering the fluidic substrate and at least partly closing the micro-fluidic component. The fluidic substrate may be a silicon fluidic substrate and the lid may be a CMOS chip. In another aspect, embodiments of the present disclosure relate to a method for fabricating such a device, and the method may include providing a fluidic substrate, providing a lid, and attaching, through a CMOS compatible bonding process, the fluidic substrate to the lid to close the fluidic substrate at least partly.

Abstract: A manufacturing method of micro channel structure is disclosed and includes steps of: providing a substrate; depositing and etching to form a first insulation layer; depositing and etching to form a supporting layer; depositing and etching to form a valve layer; depositing and etching to form a second insulation layer; depositing and etching to form a vibration layer, a lower electrode layer and a piezoelectric actuating layer; providing a photoresist layer and depositing and etching to form a plurality of bonding pads; depositing and etching to from a mask layer; etching to form a first chamber; and etching to form a second chamber.

Abstract: A method of manufacturing a semiconductor device includes forming an auxiliary mask including a plurality of mask openings on a main surface of a crystalline semiconductor substrate. A porous structure is formed in the semiconductor substrate. The porous structure includes a porous layer at a distance to the main surface and porous columns that extend from the porous layer into direction of the main surface and that are laterally separated from each other by a non-porous portion. A non-porous device layer is formed on the non-porous portion and on the porous columns.

Abstract: A method for manufacturing a liquid discharge head includes a transferring step of transferring a dry film supported by a supporting member to a substrate having a hole, and a peeling step of peeling the supporting member off the dry film on the substrate. In the peeling step, the dry film is in contact with a wall surface defining the hole in the substrate.

Abstract: A liquid ejection head is capable of performing high-speed ejection operation as well as reducing a depth dimension. For this purpose, in a configuration in which flexible circuits electrically connect element substrates to electrical substrates, the electrical substrates are arrayed in two lines along a plane different from a plane on which the element substrates are arrayed and the flexible circuits electrically connect the element substrates to the electrical substrates while being bent.

Abstract: A flexible display and manufacturing method thereof are disclosed. In one aspect, the flexible display includes a flexible substrate including a bending area, an insulating layer disposed on the flexible substrate, and at least one groove in the insulating layer within the bending area. The flexible display also includes a stress relaxation layer disposed on the at least one groove and a plurality of wires formed over the insulating layer and the stress relaxation layer.

Abstract: A fluid ejection apparatus may include a drop generator to eject fluid droplets in a vertical direction and a fluid channel containing the drop generator. The fluid channel may include a vertical inlet through which fluid is to enter the fluid channel and a vertical outlet through which fluid not ejected by the drop generator is to be circulated out of the fluid channel.

Abstract: Structures and formation methods of a semiconductor device structure are provided. A semiconductor device structure includes a first dielectric layer and a second dielectric layer over a semiconductor substrate. A cavity penetrates through the first dielectric layer and the second dielectric layer. The semiconductor device structure also includes a first movable membrane between the first dielectric layer and the second dielectric layer. The first movable membrane is partially exposed through the cavity. The first movable membrane includes first corrugated portions arranged along an edge of the cavity.

Abstract: There is provided a method of producing an electromechanical transducer that includes a plurality of electromechanical transducer elements on a substrate. The method includes forming a plurality of individual electrodes corresponding to the plurality of electromechanical transducer elements on the substrate, forming an insulation film to cover the plurality of individual electrodes on the substrate, forming a conductive film on the insulation film, forming a plurality of openings to expose the plurality of individual electrodes in each of the insulation film and the conductive film, and forming a plurality of electromechanical transducer films on the plurality of individual electrodes exposed in the plurality of openings.

Abstract: An inkjet print head includes an ejection module having a printing element substrate that ejects ink to a print medium and a flexible wiring substrate electrically connected to the printing element substrate; and a member for supporting the ejection module by joining, wherein the flexible wiring substrate has a capacitor, a periphery of the capacitor being covered with a sealing agent, and the capacitor is provided in a recess formed on the member.

Abstract: A liquid discharge head includes a recording element board including multiple discharge orifices configured to discharge liquid, multiple pressure chambers that communicate with the multiple discharge orifices via discharge channels, and have therein recording elements configured to generate energy used to discharge liquid, a liquid supply channel configured to supply liquid to the multiple pressure chambers, and a liquid recovery channel configured to recover liquid from, the multiple pressure chambers. The multiple pressure chambers communicate with the liquid supply channel and the liquid recovery channel so that liquid flows through the multiple pressure chambers. The direction of flow of liquid in the multiple pressure chambers is the same direction.

Abstract: A manufacturing method for a bonded-substrate article includes a first bonding where a first bonding region of a first substrate and a third bonding region of a second substrate are bonded at a first temperature, and a second bonding, following the first bonding, where a second bonding region of the first substrate and a fourth bonding region of the second substrate are bonded at a second temperature. The first temperature is lower than the second temperature.

Abstract: An Inorganic Lift-Off-Profile-Process (referred to herein as “ILOPP”) is described wherein a portion of a surface inorganic oxide is etched from a substrate oxide surface and under a photoresist edge that supports a sacrificial metal layer. This oxide etched profile under the sacrificial photoresist/metal edge improves Lift-Off of the sacrificial metal layer and delivers smoother, improved metal edge definition in addition to an improved planer surface (flatness) as compared to known LOP technologies.

Abstract: Provision is made of a method for producing a piezoelectric multilayer component (1), in which piezoelectric green sheets, at least one ply (21) containing an auxiliary material having a first and a second component and layers (20) containing electrode material are arranged one above another alternately and sintered, wherein, during the sintering, the first and second components of the auxiliary material chemically react, and the at least one ply (21) containing the auxiliary material is degraded.

Abstract: A multi-channel fluid coupling for a printhead includes: a body having a first channel and a second channel, the second channel being relatively longer than the first channel; a first inlet port and a first outlet port at opposite ends of the first channel; and a second inlet port and a second outlet port at opposite ends of the second channel. The first and second channels are configured for proportionally modulating a flow resistance of fluids flowing therethrough.

Abstract: A method for manufacturing a liquid jetting apparatus includes: a wire formation step of forming a wire so that a part of the wire covers a piezoelectric film; and an electrode formation step of forming a second electrode, after the wire formation step, on a surface of the piezoelectric film on a side far from a vibration film so as to be in electrical conduction with the wire. The liquid jetting apparatus includes: a flow passage formation portion; and a piezoelectric actuator having the vibration film provided on the flow passage formation portion, the piezoelectric film arranged on the vibration film, a first electrode arranged on a surface of the piezoelectric film on a side near to the vibration film, the second electrode arranged on the surface of the piezoelectric film on the side far from the vibration film, and the wire connected to the second electrode.

Abstract: A flexible display and manufacturing method thereof are disclosed. In one aspect, the flexible display includes a flexible substrate including a bending area, an insulating layer disposed on the flexible substrate, and at least one groove in the insulating layer within the bending area. The flexible display also includes a stress relaxation layer disposed on the at least one groove and a plurality of wires formed over the insulating layer and the stress relaxation layer.

Abstract: A liquid ejection head includes a substrate, a piezoelectric element above the substrate, an orifice forming member above the substrate on the piezoelectric-element-provided-side, in which the orifice forming member has an ejection orifice for ejecting liquid and defines a pressure chamber between the orifice forming member and the substrate, and the pressure chamber communicates with the ejection orifice and includes the piezoelectric element therein, a first thin film provided between the substrate and piezoelectric element and defining a space between the first film and the substrate, and a second thin film on the piezoelectric element on the side opposite to the first film side and differing from the first film in rigidity. A communicating port is formed in the substrate in a region facing the space, communicates with the space through an opening having a smaller area than the area of the region, and is closed at an end.

Abstract: A liquid ejection head includes a substrate; and an ejection orifice-forming member formed on the substrate and including an ejection orifice configured to eject liquid and a liquid channel communicating with the ejection orifice. The ejection orifice-forming member includes an ejection orifice-forming member layer A, an intermediate water-repellent layer, and an ejection orifice-forming member layer B in this order from a substrate-side of the member. The ejection orifice-forming member also includes a protrusion protruding into the ejection orifice, and the ejection orifice-forming member includes a water-repellent projection portion that is at least a portion of the intermediate water-repellent layer and that projects farther into the ejection orifice than the ejection orifice-forming member layer A and the ejection orifice-forming member layer B.

Abstract: A liquid discharge head includes: a recording element board including a discharge orifice configured to discharge liquid, a recording element configured to generate energy to discharge liquid, a pressure chamber having the recording element within, a liquid supply channel configured to supply liquid to the pressure chamber, and a liquid recovery channel configured to recover liquid from the pressure chamber; and a support member configured to support the recording element board, the support member including a supply chamber configured to supply liquid to the liquid supply channel, and a recovery chamber configured to recover liquid from the liquid recovery channel. An inner volume of the recovery chamber is smaller than an inner volume of the supply chamber.

Abstract: By appropriately defining a flow path capacity from an opening of an ink supply path to a nozzle in a pressure chamber, a progress of thickening ink toward the pressure chamber is suppressed. In other words, by setting the individual flow path capacity to be large, specifically, to 4400 pl or higher, desirably 6210 pl or higher, it is possible to suppress the progress of the thickening of the ink even in a small-sized liquid ejecting head of which the shortest formation pitch between each of the nozzles is 1/300 inches. More specifically, a nozzle communication opening is provided between the pressure chamber and the nozzle, and a total capacity of the nozzle communication opening and the pressure chamber is configured to be 4400 pl or higher, desirably 6210 pl or higher.

Abstract: There is provided a liquid jet head capable of preventing a damage of an actuator plate without degrading the quality of characters and images to be recorded on a recording medium. The liquid jet head includes a nozzle plate, an actuator plate provided with an exposed area exposed from the nozzle plate, a nozzle guard provided with an opening section, and a bonding layer disposed at least between the actuator plate including the exposed area and the nozzle guard and bonding the actuator plate and the nozzle guard to each other. The nozzle guard includes a non-contact section continuing throughout an area from a place opposed to the exposed area to an inner circumferential edge of the opening section, and opposed to the actuator plate across the bonding layer, and an alignment section disposed on the opposite side to the non-contact section across the opening section, and carrying out the alignment between the nozzle plate and the nozzle guard.

Abstract: A three-dimensional (“3D”) structure for handling fluids, a fluid handling device containing the 3D structure, and a method of making the 3D structure. The method includes providing a composite photoresist material that includes: (a) a first photoresist layer derived from a photoresist resin having a first chemical property selected from the group consisting of epoxide equivalent weight, aromatic content, and crosslink density and (b) at least a second photoresist layer derived from a photoresist resin having a second chemical property selected from the group consisting of epoxide equivalent weight, aromatic content, and crosslink density different from the first chemical property. The composite photoresist material is devoid of an adhesion promotion layer between layers of the composite photoresist material and the composite photoresist material has varying mechanical and/or physical properties through a thickness of the 3D structure.

Abstract: A liquid ejection head includes a liquid ejection board and a liquid ejection head component disposed on the liquid ejection board. The liquid ejection board includes a substrate, an energy generating device on the substrate, a channel defining member defining a liquid channel and having a liquid ejection opening in communication with the liquid channel, a liquid supply passage in communication with the liquid channel, a liquid supply opening in communication with the liquid supply passage and having a smaller opening cross-sectional area taken in a direction perpendicular to a flow direction of a liquid than the liquid supply passage, and an opening in communication with the liquid channel. The liquid channel allows a liquid to be in contact with the energy generating device. The liquid ejection opening allows a liquid to be ejected therethrough. The liquid ejection head component closes at least a portion of the opening.

Abstract: A liquid discharge head includes an actuator substrate, a holding substrate, a common-liquid-chamber substrate, and a vibration absorber. The actuator substrate includes a plurality of individual liquid chambers and a plurality of pressure generating elements. The individual liquid chambers are communicated with a plurality of nozzles to discharge liquid. The pressure generating elements are arrayed to pressurize liquid in the individual liquid chambers. The holding substrate includes a recessed portion to accommodate the pressure generating elements. The common-liquid-chamber substrate includes a common liquid chamber to supply the liquid to the individual liquid chambers. The common-liquid-chamber substrate is bonded to the holding substrate. The vibration absorber is disposed at at least a part of a bonded portion of the common-liquid-chamber substrate and the holding substrate, to absorb vibration.

Abstract: A liquid ejecting head includes a pressure chamber formation substrate having a pressure chamber formed therein, a flow path formation substrate that is connected to the pressure chamber formation substrate, and that has a flow path in communication with the pressure chamber formed in a state penetrating through the flow path formation substrate in a thickness direction thereof, and a nozzle plate that is connected to the flow path formation substrate on an opposite side to the pressure chamber formation substrate, and that has a nozzle in communication with the flow path opened therein. The flow path formation substrate is configured from a single substrate, and an opening area on a pressure chamber side of the flow path is formed wider than an opening area on a nozzle side of the flow path.

Abstract: A composite of metal and resin and a manufacturing method require a metal piece and a resin piece, and the surface of the metal piece is etched to include a number of micropores. Each micropore includes a first inclined hole and a second inclined hole, the first inclined hole and the second inclined hole diverging from each other below the surface of the metal piece. The first inclined hole and the second inclined hole extend downwards from a common starting hole which is symmetric around an axis perpendicular to the surface of the metal piece. The resin is embedded in the micropores to combine with the metal piece, where the bonding strength of the composite of metal and resin is increased.

Abstract: There is provided a method for forming a smooth resin layer on a substrate having a concavo-convex portion in manufacturing a liquid ejection head by a casting method. To achieve this, after forming an opening pattern on the resin layer formed on the substrate, a mold is brought into contact with the resin layer at a predetermined pressure so as to smooth a surface of the resin layer.

Abstract: A method for manufacturing a device for ejecting a fluid, including producing a nozzle plate including: forming a first nozzle cavity, having a first diameter, in a first semiconductor body; forming a hydrophilic layer at least in part in the first nozzle cavity; forming a structural layer on the hydrophilic layer; etching the structural layer to form a second nozzle cavity aligned to the first nozzle cavity in a fluid-ejection direction and having a second diameter larger than the first diameter; proceeding with etching of the structural layer for removing portions thereof in the first nozzle cavity, to reach the hydrophilic layer and arranged in fluid communication the first and second nozzle cavities; and coupling the nozzle plate with a chamber for containing the fluid.

Abstract: A thermal inkjet printhead may include a passivation layer, a bond pad formed over the passivation layer and insulating strips of a dielectric material formed over the passivation layer on opposite sides of the bond pad.

Abstract: A microelectronic device containing a piezoelectric thin film element is formed by oxidizing a top surface of a piezoelectric layer with an oxygen plasma, and subsequently forming an etch mask containing photoresist on the oxidized top surface. The etch mask is conditioned with an oven bake followed by a UV bake. The piezoelectric layer is etched using a three step process: a first step includes a wet etch of an aqueous solution of about 5% NH4F, about 1.2% HF, and about 18% HCl, maintaining a ratio of the HCl to the HF of about 15.0, which removes a majority of the piezoelectric layer. A second step includes an agitated rinse. A third step includes a short etch in the aqueous solution of NH4F, HF, and HCl.

Abstract: A method for manufacturing a semiconductor chip includes forming at least a portion of a front-side groove by anisotropic dry etching from a front surface of a substrate along a cutting region; forming a modified region in the substrate along the cutting region by irradiating the inside of the substrate with a laser along the cutting region; and dividing the substrate along the cutting region by applying stress to the substrate.

Abstract: A manufacturing method of a liquid ejection head, which includes a step of preparing a substrate including a first layer, a step of forming a flow path mold for forming the flow path and a member located outside the mold with a gap between the mold and the member from the first layer, a step of providing a second layer so that the second layer fills the gap and covers the mold and the member located outside the mold with the gap between them, a step of forming an ejection orifice forming member for forming an ejection orifice from the second layer, a step of removing the member located outside the mold with the gap between them, and a step of forming a wall member located outside the ejection orifice forming member with at least a partial gap between the ejection orifice forming member and the wall member.

Abstract: A method of manufacturing a light emitting device includes: providing on a mounting substrate a soluble member which is soluble in a solvent and which has a lower surface, an upper surface opposite to the lower surface in a height direction, and an outer side surface provided between the lower surface and the upper surface, the lower surface contacting the mounting substrate; providing a light blocking member made of resin to cover the outer side surface of the soluble member so that an inner side wall of the light blocking member contacts the outer side surface of the soluble member; removing the soluble member using the solvent to provide a recess surrounded by the inner side wall of the light blocking member; and mounting a light emitting element in the recess.

Abstract: A fluid ejection chip and associated methods of forming are disclosed. According to an exemplary embodiment, the fluid ejection chip comprises a substrate, a flow feature layer, and a nozzle layer. The flow feature layer is disposed over the substrate and has an exposed hydrophilic surface layer with an ink contact angle of about 80 degrees. The nozzle layer is disposed over the flow feature layer and has a thickness of about 4 microns to about 8 microns and an exposed hydrophobic surface layer having an ink contact angle of about 115 degrees.

Abstract: A fluid dispenser is disclosed herein. An example of such a fluid dispenser includes a member configured to define a plurality of orifices through which a fluid is ejected and a manifold including a plurality of fluid passageways each of which is configured to have a different angle relative to the member. This example of a fluid dispenser additionally includes a plurality of slots each of which is coupled to a different one of the fluid passageways of the manifold to conduct the fluid from the fluid passageways towards the orifices. Additional features and modifications of this fluid dispenser are disclosed herein, as are other examples of fluid dispensers.