Abstract: Provided are a film for manufacturing semiconductor component, a film for electronic component manufacture, a method for manufacturing a semiconductor component using such a film for manufacturing semiconductor component, and a method for manufacturing an electronic component using such a film for electronic component manufacture. The film for component manufacture includes a base layer and an adhesive layer provided on one surface side of the base layer, and the Ra (?m) of the surface of one side of the base layer on which the adhesive layer is not provided is 0.1 to 2.0, and the Rz (?m) is 1.0 to 15. The method using the film for component manufacture includes a segmenting step, a pickup step, and an evaluation step prior to the pickup step.

Abstract: A sensor device having a first counter electrode extending under an intermediate carrier, and having a first distance between the intermediate carrier and the first counter electrode being modifiable by the pressure on the movable region, and the first counter electrode encompassing, under the intermediate carrier, at least one electrically separated region that is disposed below a spacing element and includes at least a lateral extent of the spacing element.

Abstract: A method of manufacturing an aluminum electrolytic capacitor includes impregnating an aluminum electrolytic capacitor with a first electrolyte to form a first impregnated capacitor, aging the first impregnated capacitor using a first aging process to form a first aged capacitor, impregnating the first aged capacitor with a second electrolyte to form a second impregnated capacitor, the second electrolyte being different from the first electrolyte, aging the second impregnated capacitor using a final aging process to form a final aged capacitor, and impregnating the final aged capacitor with a third electrolyte.

Abstract: A method of depositing material to manufacture an electrostatic chuck is provided. The method first deposits at least one layer of a first dielectric material on a handle using spin coating and/or direct spraying method. A functional electric layer is next deposited on the at least one layer of the first dielectric material. Finally, the electrostatic chuck if formed by depositing at least one layer of a second dielectric material on the functional electric layer and the first dielectric material using spin coating and/or direct spraying method.

Abstract: A sole assembly for an article of footwear includes a midsole that is formed from at least a bladder and foam midsole component. The midsole has a ground facing surface and a sidewall, and the bladder meets the foam midsole at a component boundary on the sidewall. An etching extends into both the foam midsole and the bladder. The etched channel has a depth into the sidewall of between about 2 ?m and about 1000 ?m and continuously extends across the component boundary.

Abstract: A method for manufacturing a microfluidic device includes providing a first substrate having a first surface and a second surface located opposite the first surface. An etching mask is produced on the first surface, the etching mask having an opening. A recess is produced by etching in the first surface in a region of the opening. An electrically conductive material is deposited on the etching mask and/or a layer covering the etching mask, and on a region of a bottom of the recess below the opening.

Abstract: A magnetic assembly includes a magnetic core including at least one winding leg and at least one winding. The at least one winding inductively coupled to the magnetic core and wound around the at least one winding leg. The at least one winding includes a foil conductive material and a tape. The tape includes a thermally conductive adhesive layer and an electrically insulating layer.

Abstract: Embodiments of the disclosed subject matter provide a device including a micronozzle array having separate redundant groups of depositors that each include a delivery aperture disposed between two exhaust apertures. The device may include a first row of depositors of a first redundant group, each of which may be connected in parallel to first common delivery lines and first common exhaust lines. The device may include a second row of depositors of a second redundant group, each of which is connected in parallel to second common delivery and second common exhaust lines. The first row of depositors and the second row of depositors may operate independently from one another. The device may be disposed within a deposition chamber and in proximity of a substrate.

Abstract: A pump includes a vibrating plate, a flow path forming member, a pump chamber, and a film valve. The vibrating plate is provided with a piezoelectric element, vibrates due to distortion of the piezoelectric element, and has a gap on an outer periphery. The flow path forming member is disposed so as to face the vibrating plate, and has a hole in a portion facing the vibrating plate. The pump chamber is surrounded by the vibrating plate and the flow path forming member, and has a central space communicating with the hole and an outer edge space communicating with the gap. The film valve is disposed in the pump chamber. The film valve is in contact with the vibrating plate and the flow path forming member when a pressure in the central space is lower than a pressure in the outer edge space.

Abstract: A micropump device is formed in a monolithic semiconductor body integrating a plurality of actuator elements arranged side-by-side. Each actuator element has a first chamber extending at a distance from a first face of the monolithic body; a membrane arranged between the first face and the first chamber; a piezoelectric element extending on the first face over the membrane; a second chamber, arranged between the first chamber and a second face of the monolithic body; a fluidic inlet path fluidically connecting the second chamber with the outside of the monolithic body; and a fluid outlet opening extending in a transverse direction in the monolithic body from the second face as far as the second chamber, through the first chamber. The monolithic formation of the actuator elements and the possibility of driving the actuator elements at different voltages enable precise adjustment of flows, from very low values to high values.

Abstract: Embodiments of articles including a low-contrast anti-reflection coating are disclosed. The coated surface of such articles exhibits a reduced difference in reflectance between a pristine state and when a surface defect is present. In one or more embodiments, the coated surface of such articles exhibits a first average reflectance in the range from about 0.6% to about 6.0% in a pristine condition and a second average reflectance of about 8% or less after removal of a surface thickness of the anti-reflection coating. In other embodiments, the coated substrate exhibits a second average reflectance of about 10% or less, when the coated surface comprises a contaminant. In some embodiments, the coated substrate exhibits a first color coordinate (a*1, b*1) in a pristine condition and a second color coordinate (a*2, b*2) after the presence of a surface defect such that ?a*b* is about 6 or less.

Abstract: Apparatus that can detect chassis tamper events are disclosed. One apparatus includes a chassis including a secure area housing a secure element within the chassis and a security switch coupled between the chassis and the secure area. The security switch includes a switch and a processor in which the switch is configured to mechanically trigger to a tamper state from a non-tamper state in response to a chassis tamper event occurring between the chassis and the secure area and to be electrically reset to the non-tamper state from the tamper state in response to receiving a reset signal from the processor. Methods and computer program products that can perform chassis tamper event and switch reset functions for the apparatus are also disclosed.

Abstract: In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.

Abstract: A capacitor has an anode with one or more active layers that each includes fused particles positioned on a current collector. The current collector includes tunnels that extend from a first face of the current collector to a second face of the current collector.

Abstract: Some examples include a fusing system for an additive manufacturing machine including a carriage movable across a build zone along the x-axis, a thermic source mounted to the carriage, and a roller mounted to the carriage adjacent to the thermic source. A longitudinal section of an exterior surface of the roller is exposed to indirect heat from the thermic source. The roller is controlled to rotate during and outside of a spreading operation of the build material. The carriage is to maintain the roller within a radiative heat transfer area of the thermic source.

Abstract: Methods, systems, and apparatus for multi-scale stereolithography. The apparatus includes a light source for providing a laser beam having a first shape and a first size. The apparatus includes a dynamic aperture having multiple apertures that are of the same or different sizes or shapes. The dynamic aperture is configured to receive the laser beam and modify at least one of the shape or the size of the laser beam. The apparatus includes a platform for holding an object to be printed. The apparatus includes a processor connected to at least one of the light source, the dynamic aperture or the platform. The processor is configured to move the platform to direct the laser beam or direct the laser beam to cure resin onto the object to be printed using a first aperture of the multiple apertures to form the object.

Abstract: Embodiments are provided herein for a substrate having one or more embedded traces and a method for fabricating one or more embedded traces. The method includes: forming a bump on a first major surface of a substrate, the bump having a height measured from the first major surface to a top surface of the bump; forming a trace comprising: a lower trace portion that directly contacts the first major surface, a sidewall trace portion that directly contacts at least one sidewall of the bump, and an upper trace portion that directly contacts the top surface of the bump; depositing a blanket dielectric layer over the trace; and etching away a top portion of the blanket dielectric layer to expose a top surface of the upper trace portion.

Abstract: A local deformation which is generated on bonded substrates can be reduced. A bonding apparatus includes a first holding unit configured to attract and hold a first substrate from above; a second holding unit configured to attract and hold a second substrate from below; a striker configured to bring the first substrate into contact with the second substrate by pressing a central portion of the first substrate from above; a moving unit configured to move the second holding unit between a non-facing position where the second holding unit does not face the first holding unit and a facing position where the second holding unit faces the first holding unit; and a temperature control unit disposed to face the second holding unit placed at the non-facing position and configured to locally adjust a temperature of the second substrate attracted to and held by the second holding unit.

Abstract: A method for microassembly of heterogeneous materials comprises contacting a stamp with an ink disposed on a donor substrate to form an inked stamp, where the ink is reversibly bound to the stamp. The inked stamp is stamped onto a receiving substrate or onto an object on the receiving substrate, and the stamp is removed, thereby transferring the ink to the receiving substrate. The ink and the receiving substrate or the ink and the object are thermally joined, thereby forming a microassembly of heterogeneous materials. The ink may comprise a first material and the receiving substrate or the object may comprise a second material different from the first material.

Abstract: A DNA sequencing device and related methods, wherein the device includes a substrate, a nanochannel formed in the substrate, a first electrode positioned on a first side of the nanochannel, and a second electrode. The second electrode is positioned on a second side of the nanochannel opposite the first electrode, and is spaced apart from the first electrode to form an electrode gap that is exposed in the nanochannel. At least a portion of first electrode is movable relative to the second electrode to decrease a size of the electrode gap.

Abstract: To provide a wafer laminate which permits easy bonding between a support and a wafer, permits easy delamination of a wafer from a support, enables enhanced productivity of a thin wafer, and is suited to production of a thin wafer, and for a method of producing the wafer laminate. The wafer laminate includes a support, an adhesive layer formed on the support, and a wafer laminated in such a manner that its front surface having a circuit surface faces the adhesive layer. The adhesive layer includes a light-shielding resin layer A and a non-silicone thermoplastic resin-coating resin layer B in this order from the support side. The resin layer A is composed of a resin that contains a repeating unit having a condensed ring, and the resin layer B has a storage elastic modulus E? at 25° C. of 1 to 500 MPa and a tensile break strength of 5 to 50 MPa.

Abstract: To provide cover glass for mobile terminals exhibiting high strength in a thin plate thickness state to enable reductions in thickness of apparatuses when inserted in the apparatuses, cover glass (1) for a mobile terminal of the invention is cover glass (1) that is obtained by forming a resist pattern on main surfaces of a plate-shaped glass substrate, then etching the glass substrate with an etchant using the resist pattern as a mask, and thereby cutting the glass substrate into a desired shape and that protects a display screen of the mobile terminal, where an edge face of the cover glass (1) is formed of a molten glass surface, and as surface roughness of the edge face, arithmetic mean roughness Ra is 10 nm or less.

Abstract: A stress-engineered frangible structure includes multiple discrete glass members interconnected by inter-structure bonds to form a complex structural shape. Each glass member includes strengthened (i.e., by way of stress-engineering) glass material portions that are configured to transmit propagating fracture forces throughout the glass member. Each inter-structure bond includes a bonding member (e.g., glass-frit or adhesive) connected to weaker (e.g., untreated, unstrengthened, etched, or thinner) glass member region(s) disposed on one or both interconnected glass members that function to reliably transfer propagating fracture forces from one glass member to other glass member. An optional trigger mechanism generates an initial fracture force in a first (most-upstream) glass member, and the resulting propagating fracture forces are transferred by way of inter-structure bonds to all downstream glass members.

Abstract: To prevent constriction machining from reducing usage efficiency of a glass rod, provided is a glass rod machining method including softening of softening a portion of the glass rod by heating the portion of the glass rod, and constricting of forming a constricted shape in the glass rod by moving one end of the glass rod relative to the other end of the glass rod at a constriction speed satisfying a condition that a constriction load acting as a tensile force on the glass rod does not extend beyond a predetermined range. In this method, the constricting includes, when constriction speed increases, making an adjustment to decrease a heating temperature of the glass rod. This method may include determining of determining the heating temperature of the glass rod during the constricting by referencing a heating temperature table in which heating temperatures corresponding to the constriction speed are stored in advance.

Abstract: Methods of fabricating a glass laminate is provided. According to one embodiment, a glass laminate comprised of a microwave absorbing layer and a microwave transparent layer is formed. The microwave absorbing layer is characterized by a microwave loss tangent ?H that is at least a half order of magnitude larger than a loss tangent ?L of the microwave transparent layer. An area of the glass laminate is exposed to microwave radiation. The exposed area comprises a cross-laminate hot zone having a cross-laminate hot zone temperature profile. Substantially all microwave absorbing layer portions of the hot zone temperature profile and substantially all microwave transparent layer portions of the hot zone temperature profile reside above the glass transition temperature TG of the various layers of the glass laminate prior to impingement by the microwave radiation.

Abstract: A method of forming a decorated midsole element for articles of footwear includes obtaining a decorated film having one or more graphic elements applied to a first surface of the film and placing the decorated film in a mold. A midsole element is obtained and placed in the mold, and pressure is applied to the mold to form a midsole element having a decorated surface. The decorated film may include a layer of polyether-block co-polyamide polymer and the midsole element may be formed of ethylvinylacetate. A midsole assembly and an article of footwear having decorated midsole top layers are also described.

Abstract: A method of manufacturing an orthodontic appliance includes plating a first pattern of a material on a substrate to define a layer. Repeating plating of the first material one or more times forms an additional pattern. A layered structure is built up and forms a portion of the orthodontic appliance. A pattern of a second material different from a first material may be plated on the substrate or on a pattern of the first material. The material may be a sacrificial material that may be later removed. The orthodontic appliance may be an archwire or a self-ligating orthodontic bracket having one or more layered structures formed by plating patterns of the material. Plating may include plating patterns of materials so as to form a movable member in place relative to a bracket body.

Abstract: A method for fabricating a part includes sectionalizing a computer-generated representation of a part into strata having an order, forming layers corresponding to the strata from sheet material, stacking at least two of the layers in the order, and joining the layers together. The method is suitable for producing a phase-change material container for a thermal energy harvesting device, for example.

Abstract: The invention relates to a device for forming at least one thin film made of a powder material (14). The device includes a storage area, a deposition area (7), and a cylinder (1) having a circular base for depositing and compacting the powder material (14), the latter having been previously moved from a storage area to a deposition area (7). The device further includes a cylinder (1) having a smooth cylindrical surface, said cylinder being rotatably movable (F1) about the axis of revolution (A) thereof, as well as translatably movable in at least one direction (F5) parallel to a main plane in the deposition area (7), between the storage and deposition (7) areas; a scraper (3) that is movable in a direction perpendicular to the main plane of the deposition (7) area, as well as translatably movable in the same direction (F5) as the cylinder (1), between the storage and deposition (7) areas, the scraper (3) being adapted to move the powder material from one area to another (7).

Abstract: The invention relates to a microfluidic system for controlling a concentration profile of molecules capable of stimulating a target, for example formed by an assembly of living cells, this system comprising: —a microfluidic device (1) comprising at least one microfluidic channel (4) equipped with at least one inlet orifice (21) and with at least one outlet orifice (22) for at least one fluid; —at least one means for supplying the microfluidic channel (4) with at least one fluid comprising molecules capable of stimulating the target; —at least one chamber (8) or another microfluidic channel comprising a base (6) intended to receive the target; and —at least one microporous membrane (5) separating the chamber (8) or the other microfluidic channel from the microfluidic channel (4), said microporous membrane (5) being positioned away from the base (6) so that when the supply means provides the microfludic channel (4) with said at least one fluid flowing in laminar flow in contact with the microporous membrane (5)

Abstract: A thermally tempered glass substrate for transient electronic systems (i.e., including electronic devices that visually disappear when triggered to do so) including two or more fused-together glass structures having different coefficient of thermal expansion (CTE) values disposed in an intermixed arrangement manner that generates and stores potential energy in the form of residual, self-equilibrating internal stresses. In alternative embodiments the substrate includes laminated glass sheets, or glass elements (e.g., beads or cylinders) disposed in a glass layer. A trigger device causes an initial fracture in the thermally tempered glass substrate, whereby the fracture energy nearly instantaneously travels throughout the thermally tempered glass substrate, causing the thermally tempered glass substrate to shatter into multiple small (e.g., micron-sized) pieces that are difficult to detect. Patterned fracture features are optionally provided to control the final fractured particle size.

Abstract: A method for producing a holder of at least one substrate from a first and a second plate, each including first and second parallel flat faces, the method including: a) delimitation on the first face of the second plate of plural surfaces by a non-bondable area in which a direct bonding with a face of the first plate is prevented; b) bringing the first face of the second plate into contact with the first face of the first plate; c) direct bonding between the first faces except in the non-bondable area; and d) removal of the portions of the second plate located vertically below surfaces inside the non-bondable area.

Abstract: Laser ablation can be used to form a trench within at least a blanket layer of a stressor layer that is atop a base substrate. A non-ablated portion of the stressor layer has an edge that defines the edge of the material layer region to be spalled. Laser ablation can also be used to form a trench within a blanket material stack including at least a plating seed layer. A stressor layer is formed on the non-ablated portions of the material stack and one portion of the stressor layer has an edge that defines the edge of the material layer region to be spalled. Laser ablation can be further used to form a trench that extends through a blanket stressor layer and into the base substrate itself. The trench has an edge that defines the edge of the material layer region to be spalled.

Abstract: A method of layerwise solid freeform fabrication is disclosed. The method comprises, for each of at least a few of the layers, dispensing and hardening at least a first modeling material and a second modeling material to form a core region and one or more envelope regions at least partially surrounding the core region. In some embodiments, the ratio between the elastic moduli of adjacent regions, when hardened, is from about 1 to about 20.

Abstract: In one embodiment, a method of singulating semiconductor die from a semiconductor wafer includes forming a material on a surface of a semiconductor wafer and reducing a thickness of portions of the material. Preferably, the thickness of the material is reduced near where singulation openings are to be formed in the semiconductor wafer.

Abstract: A method of fabricating a semiconductor device includes providing an assembly substrate including a split plane defining a handle region and a transfer region, a film layer coupled to the transfer region, and one or more active devices coupled to the film layer. The method also includes providing a device substrate including one or more bonding regions and joining the assembly substrate to the device substrate. The method further includes splitting the assembly substrate to remove the handle region.

Abstract: Laser ablation can be used to form a trench within at least a blanket layer of a stressor layer that is atop a base substrate. A non-ablated portion of the stressor layer has an edge that defines the edge of the material layer region to be spalled. Laser ablation can also be used to form a trench within a blanket material stack including at least a plating seed layer. A stressor layer is formed on the non-ablated portions of the material stack and one portion of the stressor layer has an edge that defines the edge of the material layer region to be spalled. Laser ablation can be further used to form a trench that extends through a blanket stressor layer and into the base substrate itself. The trench has an edge that defines the edge of the material layer region to be spalled.

Abstract: Disclosed is a method for carrying out edge etching and strengthening of an OGS (One-Glass-Solution) touch panel with one-time film lamination. After a prepared large glass sheet has been subjected to a first strengthening treatment, a plurality of touch control circuits and peripheral frames of black, white, or other colors associated with the touch control circuits are laid on a surface of the large glass sheet. Afterwards, an upper lamination film and a lower lamination film are respectively laminated on surfaces of the large glass sheet with a plurality of preservation zones and cutting zones defined therein and are subjected to film cutting to form cut lines. The cutting zones of the upper lamination film and the lower lamination film are peeled off along the cut lines. Then, the large glass sheet is cut into a plurality of small glass cells along the cut lines of the cutting zones. Side edges of the small glass cells are then subjected to etching and strengthening.

Abstract: A particle manipulation system uses a MEMS-based, microfabricated particle manipulation device, which has an inlet channel, output channels, and a movable member formed on a substrate. The movable member moves parallel to the fabrication plane, as does fluid flowing in the inlet channel. The movable member separates a target particle from the rest of the particles, diverting it into an output channel. However, at least one output channel is not parallel to the fabrication plane. The device may be used to separate a target particle from non-target material in a sample stream. The target particle may be, for example, a stern cell, zygote, a cancer cell, a component of blood, bacteria or DNA sample, for example. The particle manipulation system may also include a microfluidic structure which focuses the target particles in a particular portion of the inlet channel.

Abstract: Diffusion bonding a stack of aluminum thin films is particularly challenging due to a stable aluminum oxide coating that rapidly forms on the aluminum thin films when they are exposed to atmosphere and the relatively low meting temperature of aluminum. By plating the individual aluminum thin films with a metal that does not rapidly form a stable oxide coating, the individual aluminum thin films may be readily diffusion bonded together using heat and pressure. The resulting diffusion bonded structure can be an alloy of choice through the use of a carefully selected base and plating metals. The aluminum thin films may also be etched with distinct patterns that form a microfluidic fluid flow path through the stack of aluminum thin films when diffusion bonded together.

Abstract: A pattern forming method includes forming a coating film containing a hydrophilic first homopolymer having a first bonding group and a hydrophobic second homopolymer having a second bonding group capable of bonding with the first bonding group, forming a bond between the first and second bonding group to produce a block copolymer of the first and second homopolymers, and heating the coating film to microphase-separating the copolymer into a hydrophilic domain and a hydrophobic domain. The hydrophilic and hydrophobic domains are arranged alternately. The bond is broken, then selectively dissolving-removing either domain by a solvent to provide a polymer pattern of a remainder domain.

Abstract: A method to produce a fabric applique includes the steps of providing a piece of steel, removing oxide layers from the steel, and forming a pattern on the steel. The steel is etched and coded. A die cutting laminate including the coded steel is prepared and compressed to cut fabric.

Abstract: Methods to fabricate reaction cartridges for biological sample preparation and analysis are disclosed. A cartridge may have a reaction chamber and openings to allow fluids to enter the chamber. The cartridge may also have handles to facilitate its use. Such cartridges may be used for polymerase chain reaction.

Abstract: The present invention discloses a section of tubing including a fluoropolmer tubular body which has an interior surface defining a fluid passage through the tubular body. At least a first portion of the interior surface has a first hydrophobicity which is less than that of the remainder of the tubular body. At least a first portion of the interior surface can have a molar ratio of fluorine to oxygen of no greater than 30 to 1. Products can include the tubular bodies of the present invention attachable to fluid processing instruments such as immunodiagnostic instruments. The present invention also discloses methods for manufacturing the disclosed tubular bodies.

Abstract: This disclosure concerns bonding a thin film of diamond to a second thick diamond substrate in a way that does not cause the exposed (un-bonded) diamond surface to become contaminated by the bonding process or when the bonded diamond is held at high temperature for many hours in vacuum.

Abstract: An implantable medical device formed from one or more layers of thin film polymer is assembled by providing by adhesively securely one or more polymer coupons on individual rigid backings. After each coupon is shaped or components mounted to the coupon, the coupons are bonded together. The adhesive is dissolved to remove the device from the backing or backings to which it is attached.

Abstract: The present invention provides templating methods for replicating patterned metal films from a template substrate such as for use in plasmonic devices and metamaterials. Advantageously, the template substrate is reusable and can provide plural copies of the structure of the template substrate. Because high-quality substrates that are inherently smooth and flat are available, patterned metal films in accordance with the present invention can advantageously provide surfaces that replicate the surface characteristics of the template substrate both in the patterned regions and in the unpatterned regions.

Abstract: A method for making a graphene/carbon nanotube composite structure includes providing a metal substrate including a first surface and a second surface opposite to the first surface, growing a graphene film on the first surface of the metal substrate by a CVD method, providing at least one carbon nanotube film structure on the graphene film, and combining the at least one carbon nanotube film structure with the graphene film, and combining the polymer layer with the at least one carbon nanotube film structure and the graphene film, and forming a plurality of stripped electrodes by etching the metal substrate from the second surface.

Abstract: A circuit substrate, including a porous glass film with the volume percentage ratio of the glass being above 45%, a resin adhesion layer located on either side of the glass film respectively, and a metal foil located in the outside of resin adhesion layer. The glass film, the resin adhesion layer and the metal foil join together through suppressing, and the resin of the resin adhesion layer is filled in the gaps of the glass film. The circuit substrate employs a porous glass film as a carrier material, so that the resin adhesion layer and the surface of the glass film surface have a good binding force, and the CTE of the circuit substrate in the direction of X and Y is reduced compared to instances before, and has good formability, which is simple and convenient in process operation. In addition, also provided is a manufacturing method for a circuit substrate.

Abstract: A radar reflection-damping glazing includes a first substrate and a second substrate arranged above the first substrate in terms of surface area. A first radar-reflecting structure is arranged on the outside surface or on the inside surface of the first substrate. A second radar-reflecting structure is arranged on the inside surface or on the outside surface of the second substrate. The first radar-reflecting structure is an electrically conducting coating, into which linear decoated regions are introduced.