Abstract: The present disclosure provides an optical sensing unit, a touch panel, a method for manufacturing the optical sensing unit, a method for manufacturing the touch panel, and a display device. The optical sensing unit includes a Photo thin film transistor (TFT), a storage capacitor for storing a leakage current generated by the Photo TFT, and a Readout TFT for reading out an electric signal stored in the storage capacitor. The method for manufacturing the optical sensing unit includes a step of forming a gate electrode of the Readout TFT capable of shielding an active layer of the Readout TFT and preventing the active layer from being exposed to an ambient light beam.

Abstract: A method and system for integrated circuit fabrication is disclosed. In an example, the method includes determining a first process parameter of a wafer and a second process parameter of the wafer, the first process parameter and the second process parameter corresponding to different wafer characteristics; determining a variation of a device parameter of the wafer based on the first process parameter and the second process parameter; constructing a model for the device parameter as a function of the first process parameter and the second process parameter based on the determined variation of the device parameter of the wafer; and performing a fabrication process based on the model.

Abstract: Methods and devices include a patterning device positioned along a processing path. The patterning device forms one or more holes through workpieces at a contact location of the workpieces. A transport device is positioned along the processing path. The transport device removes the workpieces from the processing path and stacks the workpieces by simultaneously moving at least two of the workpieces together in workpiece sets. The transport device comprising a vacuum device that contacts the contact location of the top workpiece within each of the workpiece sets. The vacuum device applies vacuum through the holes of the top workpiece to the bottom workpiece within each of the workpiece sets to maintain the workpieces together in the workpiece sets when performing the removing and the stacking.

Abstract: A laminate for making signs, the laminate comprising a readily-abraded layer and an abrasion-resistant layer. A method of making signs is also disclosed. The method includes providing a laminate comprising a first layer that is readily etched by abrasives and a second layer disposed beneath the first layer and substantially resistant to abrasive etching. A mask is applied to the top of the laminate; and abrasives are used to selectively remove a portion of the first layer, so as to form a relief image with a controlled and uniform relief depth.

Abstract: A method for manufacturing a light reflecting metal wall including a step (a) forming a cavity structure on a metal plate on which back surface a substrate is laminated, the cavity structure including on its side wall a light reflecting wall, the step (a) including the steps of (b) forming a first mask on a surface of the metal plate, the first mask having a mask opening portion corresponding to an opening portion of the cavity structure, and (c) forming the light reflecting wall on a side wall of the metal plate by carrying out wet etching with respect to the metal plate with the first mask, in the step (c), in the middle of the wet etching, the first mask being bent by press working along the light reflecting wall formed by the wet etching. As a result, the light reflecting metal wall is stably formed by securing both (i) an area of an LED chip mounting surface and (ii) a thickness of the light reflecting metal wall even if a packaged light-emitting element has a narrow lateral width of its short side.

Abstract: A method for manufacturing a display device includes a first step of preparing a first substrate which has a first area to be etched and a second area located at a periphery of the first area and which has a display element on its surface, a second step of etching and removing the first area of the first substrate, a third step of forming a second substrate on a surface of the first substrate that is opposite to the surface on which the display element is located, and a fourth step of removing the second area of the first substrate.

Abstract: A method of fixing a stator core in a cylindrical housing includes the following steps. The first step is a step of blanking a plurality of stator core sheets from an electromagnetic steel sheet by using a die. The die has a circular outside contour for blanking the stator core sheets from the electromagnetic steel sheet and each of the blanked stator core sheets has an outside contour. The second step is a step of forming the stator core by laminating the blanked stator core sheets one on another. The third step is a step of setting a non-fixing position of the stator core to the housing in such an angular position where difference in diametral dimension of the outside contour between the die and the stator core is relatively large.

Abstract: In order to achieve low cost of manufacture of a display device by reducing the use of primary material used in a manufacturing process of a display device and saving labor taken for a vacuum process, according to the invention, liquid droplets containing conductive particles are ejected on a film being processed by using a first liquid droplet ejecting apparatus having a liquid droplet ejecting head provided with a plurality of liquid droplet ejecting orifices, thereby a conductive film is formed. After that, a resist pattern is locally formed on the conductive film by using a second liquid droplet ejecting apparatus having a liquid droplet ejecting head provided with a plurality of liquid droplet ejecting orifices. The conductive film is etched with the resist pattern as a mask to form a wiring.

Abstract: A method includes identifying a liquid within a vessel using an object located in the liquid that is not attached to the vessel. The object is, for example, a metal plate inscribed with an identifier, such as the name and strength of a medical solution. The plate rests against the bottom of the vessel, and the liquid is identified by reading the name through the liquid. A method of forming a label includes inscribing a metal object configured for placement within a vessel with the name and strength of a liquid medical solution, for example, laser etching a stainless steel plate. A label includes a metal plate configured for placement within a vessel and having a name and a strength of a liquid medical solution inscribed thereon. The plate includes, for example, stainless steel, and does not include an adhesive or have a fastener interface to receive a mechanical fastener.

Abstract: An optical element comprising at least a plurality of pixels formed on a substrate and partition walls arranged respectively between adjacent pixels is manufactured by a method comprising steps of forming partition walls of a resin composition on a substrate, performing a dry etching process by irradiating the substrate carrying the partition walls formed thereon with plasma in an atmosphere containing gas selected from oxygen, argon and helium, performing a plasma treatment process by irradiating the substrate subjected to the dry etching process with plasma in an atmosphere containing at least fluorine atoms, and forming pixels by applying ink to the areas surrounded partition walls by means of an ink-jet system.

Abstract: Disclosed are a semiconductor wafer (10) having a front side laser scribe (22) and the methods for manufacturing the same. The methods of the invention include the formation of a scribe foundation (12) on the front side of the semiconductor wafer (10) designed to accept laser scribing (22), and laser scribing the scribe foundation (12). Disclosed embodiments include a semiconductor wafer (10) having a scribe foundation (12) of layered dielectric (30) and metal (34) on the front side. According to disclosed embodiments of the invention, the formation of a scribe foundation (12) is performed in combination with the formation of a top level metal layer (34) on the semiconductor wafer (10) methods for manufacturing.

Abstract: A backlight etching process, and more particularly the etching of a solid, semi-translucent base material, to form an exact image within the material. The base material is preferably translucent and most preferably an acrylic-based product, such as DuPont Corian®. Specific portions of the etched image can be digitally altered to enhance the quality of the image. Lines may be added to better delineate between areas of the image, or specific areas may be masked and altered. The etched image can also be colorized by cutting exact forms or silhouettes of colored film using digital techniques and adhering the silhouette to the smooth, back side of the etched image. A backing sheet may then be applied over the colored silhouette, to strengthen the product and protect the silhouette, to the etched image product.

Abstract: A non-conventional lithographic process for modifying, improving and fabricating structural anisotropy, organization and order, and anisotropy of the mechanical, electrical, optical, optoelectronics, charge-carrying and energy-carrying properties in thin films constituted by organic materials with double conjugated bonds. The method consists in molding, performed directly on the conjugated thin film by virtue of intimate contact with the surface of a mold. The parts of the film in direct contact with the mold undergo a transformation that is local in character and whose dimensions depend on the dimensions of the structures provided on the mold. Molding can be performed both in static conditions and in dynamic conditions.

Abstract: A method for replicating a high resolution three-dimensional imprint pattern on a compliant media is disclosed. The compliant media carries an imprint stamp that includes three-dimensional features that can be used as an imprint stamp in a roll-to-roll transfer printing process. The compliant media can be made to any size and can be connected with a belt or a cylinder. The compliant media can be optically transparent and the belt or cylinder can also be optically transparent so that a light source positioned inside or outside the belt or the cylinder can irradiate another media that is urged into contact with the compliant media.

Abstract: Disclosed are a semiconductor wafer (10) having a front side laser scribe (22) and the methods for manufacturing the same. The methods of the invention include the formation of a scribe foundation (12) on the front side of the semiconductor wafer (10) designed to accept laser scribing (22), and laser scribing the scribe foundation (12). Disclosed embodiments include a semiconductor wafer (10) having a scribe foundation (12) of layered dielectric (30) and metal (34) on the front side. According to disclosed embodiments of the invention, the formation of a scribe foundation (12) is performed in combination with the formation of a top level metal layer (34) on the semiconductor wafer (10) methods for manufacturing.

Abstract: A micro-casted silicon carbide nano-imprinting stamp and method of making a micro-casted silicon carbide nano-imprinting stamp are disclosed. A micro-casting technique is used to form a foundation layer and a plurality of nano-sized features connected with the foundation layer. The foundation layer and the nano-sized features are unitary whole that is made entirely from a material comprising silicon carbide (SiC) which is harder than silicon (Si) alone. As a result, the micro-casted silicon carbide nano-imprinting stamp has a longer service lifetime because it can endure several imprinting cycles without wearing out or breaking. The longer service lifetime makes the micro-casted silicon carbide nano-imprinting stamp economically feasible to manufacture as the manufacturing cost can be recouped over the service lifetime.

Abstract: The present invention is a substrate for forming a patterned thin film by causing a specific fluid to adhere. More particularly, this substrate comprises a pattern formation region that is patterned in a specific shape in order to form a film. This pattern formation region is constituted such that an affinity region having an affinity to the fluid is disposed according to specific rules within a non-affinity region not having an affinity to the fluid. The fluid can be uniformly made to adhere to the required region, without spreading out too much or splitting up, allowing a uniform thin film to be formed.

Abstract: An apparatus for plasma treating workpieces in vacuum comprises a stack of plasma chambers (20). Handling of workpieces to and from the plasma chambers of the stack is performed in parallelism by one handling device and through lateral handling openings of the plasma chambers. The handling device is rotatable around an axis parallel to the handling openings of the plasma chambers and comprises transport means simultaneously movable radially with respect to the axis of rotation towards and from the handling openings.

Abstract: A cutting-free method for making a hologram sticker includes the steps of adding a releasing layer on a base; plating a metal layer on the releasing layer; printing an epoxy layer with a holographic pattern on the metal layer; chemically etching the metal layer not covered by the epoxy layer together to remove the excess metal layer; washing the residual layers; drying the washed and etched layers; applying an adhesive layer on top of the washed epoxy layer and applying a releasing layer on top of the adhesive layer.

Abstract: A method of manufacturing an array of nanostuctures, such as quantum dots, having a controlled diameter and a substrate with an ordered array of nanostructures having a controlled diameter. In a preferred embodiment of the invention, nanoscale features are produced on a substrate by using a porous crystalline protein as a template for preparing an etch/deposition mask having a regular array of nanoscale pores of a diameter different from the protein template. The mask may be used to etch a regular array of nanoscale wells and/or deposit nanoclusters of adatoms on the surface of an underlying substrate. A further embodiment of the invention is a substrate including an ordered array of nanoscale features having a controlled size.

Abstract: A process for forming an inorganic material layer pattern on a substrate. The process includes the steps of transferring an inorganic powder dispersed paste layer supported on a support film to the surface of the substrate to form the inorganic powder dispersed paste layer on the substrate; forming a resist film on the inorganic powder dispersed paste layer transferred to the surface of the substrate; exposing the resist film to light through a mask to form a latent image of a resist pattern; developing the exposed resist film to form the resist pattern; etching exposed portions of the inorganic powder dispersed paste layer to form an inorganic powder dispersed paste layer pattern corresponding to the resist pattern; and baking the pattern to form an inorganic material layer pattern.

Abstract: A method for forming a recognition mark on the back surface of a substrate for a KGD that can be easily produced while manufacturing cost is low and permits repeated use of a substrate is provided. In the method, wiring patterns are formed on a surface of one side of an insulating substrate. The method includes step of forming a conductive pattern as a recognition mark on one surface where the wiring patterns are formed, and step of forming a through hole from a surface where the wiring pattern is not formed toward the conductive pattern. In the substrate, bumps connected with the KGD are formed on the surface on which the wiring patterns are not formed. Also, the conductive pattern may have a shape as the recognition mark or the through hole may have the shape as the recognition mark.

Abstract: A process for forming an inorganic material layer pattern on a substrate. The process includes the steps of transferring an inorganic powder dispersed paste layer supported on a support film to the surface of the substrate to form the inorganic powder dispersed paste layer on the substrate; forming a resist film on the inorganic powder dispersed paste layer transferred to the surface of the substrate; exposing the resist film to light through a mask to form a latent image of a resist pattern; developing the exposed resist film to form the resist pattern; etching exposed portions of the inorganic powder dispersed paste layer to form an inorganic powder dispersed paste layer pattern corresponding to the resist pattern; and baking the pattern to form an inorganic material layer pattern.

Abstract: In devices such as flat panel displays, an aluminum oxide layer is provided between an aluminum layer and an ITO layer when such materials would otherwise be in contact to protect the ITO from optical and electrical defects sustained, for instance, during anodic bonding and other fabrication steps. This aluminum oxide barrier layer is preferably formed either by: (1) partially or completely anodizing an aluminum layer formed over the ITO layer, or (2) an in situ process forming aluminum oxide either over the ITO layer or over an aluminum layer formed on the ITO layer. After either of these processes, an aluminum layer is then formed over the aluminum oxide layer.

Abstract: A process for forming an inorganic material layer pattern on a substrate. The process includes the steps of transferring an inorganic powder dispersed paste layer supported on a support film to the surface of the substrate to form the inorganic powder dispersed paste layer on the substrate; forming a resist film on the inorganic powder dispersed paste layer transferred to the surface of the substrate; exposing the resist film to light through a mask to form a latent image of a resist pattern; developing the exposed resist film to form the resist pattern; etching exposed portions of the inorganic powder dispersed paste layer to form an inorganic powder dispersed paste layer pattern corresponding to the resist pattern; and baking the pattern to form an inorganic material layer pattern.

Abstract: A process for the preparation of an electrode, which comprises: (1) transferring a conductive paste layer supported on a base film to a substrate to form the conductive paste layer on the substrate; (2) forming a resist film on the conductive paste layer transferred to the substrate; (3) exposing the resist film through a mask to form a resist pattern latent image; (4) developing the exposed resist film to form a resist pattern; (5) etching exposed portions of the conductive paste layer to form a conductive paste layer pattern corresponding to the resist pattern; and (6) thermosetting the pattern to form a conductive layer pattern.

Abstract: An in-mold decorating and laser etching method prints a plurality of layers on a flat thin sheet plastic substrate, including combinations of opaque and colored, including translucent and smoked, forms the substrate into a contoured three dimensional workpiece, injection molds the workpiece to an injection molded part, and laser etches a designated graphic in the opaque layer on the part.

Abstract: A method of making an illuminate, multicolored panel, comprising the steps of fixing together an opaque layer to a clear layer to form a panel, etching a well into the opaque layer of the panel, and depositing tinted translucent material into the well.

Abstract: Field emission display and method for fabricating the same, the field emission display including a cathode array having a cathode electrode formed on a substrate, insulating layers and carbon nanotube films for use as emitter electrodes formed alternately on the cathode electrode, and a gate electrode formed on the insulating layer, thereby permitting fabrication of a large sized cathode plate at a low cost because the film is formed by screen printing and exposure, which can reduce the cumbersome steps in fabrication of the related art Spindt emitter tip, and both a low voltage and a high voltage FEDs because the carbon nanotube film used as the emitter has a low work function, with an easy and stable electron emission capability.

Abstract: For increasing the rate with which a workpiece is treated in a plasma enhanced chemical vapor deposition method and thereby lowering for coating treatment exposure of the coating to ion impact, there is maintained a non-vanishing dust particle density along the surface to be treated with a predetermined density distribution along this surface. The density distribution may be controlled by appropriately applying a field of force substantially in parallelism to the surface to be treated and acting on the dust particles entrapped in the plasma discharge.

Abstract: A method of balancing a display panel substrate for a backlit illuminated display includes providing a transparent display panel substrate having a front surface, a back surface, and side surfaces, the substrate being coated with a diffuse reflective layer and overcoated with an opaque layer on the back surface and side surfaces, and having recesses in the back surface to receive lamps to provide illumination to the display; coating the substrate on the front surface with a diffuse translucent layer of defined thickness; illuminating the substrate by lamps positioned within the recesses in the back surface of the substrate; forming an image indicative of the brightness at each point of the front surface of the illuminated substrate and determining from the image the additional thickness of diffuse translucent layer to be added to each point on the front surface of the substrate to produce a uniform brightness of a desired intensity at each point of the front surface when that layer is added and the substrate

Abstract: A porcelain coated sign comprises a steel plate reverse etched to form raised indicia, including Braille, against an etched background area. The plate is coated with a porcelain slurry and fired to form a porcelainized surface. The raised indicia may be tipped with one or more additional pigmented porcelain enamels to provide contrasting colors if desired.

Abstract: The present invention concerns a novel method for balancing an illuminated display panel to achieve a predetermined level of illumination uniformity from indicia formed on the panel. One embodiment of the present invention includes the steps of first fabricating an unbalanced display panel having light translucent and absorptive layers deposited on a panel substrate with indicia formed in the light absorptive layers. The unbalanced panel is illuminated and the amount of light from the indicia formed in the panel are measured to identify illumination deficient indicia. A carbon dioxide laser beam is then focused onto the illumination deficient indicia so as to etch portions of the light translucent layer underlying these indicia and increase the amount of illumination from these indicia. In an alternative embodiment, an illuminated display panel is partially fabricated by applying a light translucent layer to a display panel substrate.

Abstract: A method of manufacturing a hot-stamped decal includes step A: preparing a metalized polyester film including a metalized layer disposed on a top surface thereof, a clear polyester sheet disposed to an under side of the metalized layer, an adhesive layer disposed to an under side of the clear polyester sheet and a release sheet disposed to an under side of the adhesive layer, step B: applying a printing process on the metalized layer to form a mark thereon composed of a printed ink layer, step C: preparing an alkaline corrosive solution, step D: flushing the top surface of the metalized layer with the alkaline solution composed of water and NaOH to the top surface of the metalized layer to corrode the metalized layer not covered by the printing ink layer, step E: flushing the top surface of the metalized layer with water and step F: drying the hot-stamped decal.