Abstract: A plasma ashing system includes a plasma generator configured to generate a plasma from a gas source. The system further includes a plasma reaction chamber configured to house a substrate comprising a Parylene coating, wherein the plasma reaction chamber is configured to expose surfaces of the Parylene coating on the substrate to the plasma, wherein the plasma is configured to remove portions of the Parylene coating on the substrate.

Abstract: Porous membranes are provided according to the invention having desirable coefficient of thermal expansion and large surface area, for example at least about 4,000 mm2. These porous membranes may be made according to an exemplary process employing lithographic patterning of a photoresist followed by development of the photoresist and etching. In one aspect, the etch barrier layer is chosen from a material that does not react with or incorporate metal or other contaminants into the membrane layer.

Abstract: A method for calibrating elementary patterns in variable-shaped-beam electron-beam lithography, includes the following steps: producing, by variable-shaped-beam electron-beam lithography, a calibration pattern comprising geometric figures each having a nominal critical dimension, the figures being divided into elementary patterns of smaller dimensions than each the nominal critical dimension; measuring the actual critical dimension of each the geometric figure; and applying a regression method on the basis of the actual critical dimensions thus determined to construct a mathematical model expressing either a variation in dimensions of the elementary patterns, or an error in the exposure dose of the elementary patterns producing an equivalent effect to the variation in dimensions, as a function of the dimensions of the elementary patterns. Application to the preparation of data with a view to transferring a pattern to a substrate by variable-shaped-beam electron-beam lithography.

Abstract: A wire grid polarizer and method of making a wire grid polarizer can protect delicate wires of the wire grid polarizer from damage. The wire grid polarizer can include a protective-layer located on an array of wires. The array of wires can further be protected by a chemical coating on an inside surface of the air-filled channels, closed ends of the air-filled channels, damaged wires of the array of wires in a line parallel to an edge of the wire grid polarizer, or combinations thereof. The method can include (i) providing the wire grid polarizer, (ii) applying the protective-layer, by physical vapor deposition or chemical vapor deposition but excluding atomic layer deposition, onto the array of wires, (iii) cutting the wire grid polarizer wafer into multiple wire grid polarizer parts, then (iv) protecting the array of wires.

Abstract: A gas bearing seal using porous materials for distribution of gas flow can provide site isolation during wet processing. In some embodiments, a flow cell comprises a porous media gas bearing surrounding a periphery of the flow cell, isolating the liquid inside the flow cell from the ambient air outside the flow cell. In some embodiments, a protective chuck comprises a porous media gas bearing disposed in a middle of the protective chuck, isolating the liquid outside the protective chuck with the gaseous ambient generated by the porous media gas bearing.

Abstract: Embodiments provided herein describe methods and systems for processing substrates. A substrate processing tool includes a housing having a sidewall and a lid. The housing defines a processing chamber. A substrate support is configured to support a substrate within the processing chamber. A plasma generation source is coupled to the housing and in fluid communication with the processing chamber through the lid of the housing. The plasma generation source is configured to provide a plasma activated species into the processing chamber. A mask is positioned within the processing chamber to at least partially shield the substrate from the plasma activated species. The mask includes a plurality of openings configured such that when the mask is in first and second positions, the plasma activated species passes through a respective first and second of the plurality of openings and causes first and second regions on the substrate to be processed.

Abstract: A mold for nanoimprint lithography assisted by a determined wavelength is disclosed. According to some aspects, a layer made from a first material including, on a first face, a layer made from a second rigid material in which n structured zones with micrometric or nanometric patterns (n?1) are made, and, on the face opposite said first face, a layer made from a third rigid material in which n recesses are formed, opposite the n structured zones. The n recesses are filled with a fourth material to form n portions. The transmittance at the determined wavelength of the layer of third material is lower than the transmittance of any one of the n portions; and the transmittance of the layers of first, second, and third materials at the determined wavelength ?det is such that the transmission of a light with determined wavelength ?det through said layers is lower than the transmission of the light through any one of the n portions and the layers of first and second materials.

Abstract: The invention provides a method for patterning a polymer surface. A polymer layer is formed on a substrate. A conductive grid with a mesh pattern is placed on the polymer layer. The mesh pattern is transferred to the polymer layer by a plasma treatment. The conductive grid is then removed.

Abstract: A protective chuck is disposed on a substrate with a gas layer between the bottom surface of the protective chuck and the substrate surface. The gas layer protects a surface region against a fluid layer covering the substrate surface. In some embodiments, the pressure fluctuation at the gas layers is monitored, and through the dynamic feedback, the gas flow rate can be adjusted to achieve a desired operation regime. The dynamic control of operation regime setting can also be applied to high productivity combinatorial systems having an array of protective chucks.

Abstract: A protective chuck is disposed on a substrate with a gas bearing layer between the bottom surface of the protective chuck and the substrate surface. The gas bearing layer protects a surface region against a fluid layer covering the substrate surface. The protection of the gas bearing is a non-contact protection, reducing or eliminating potential damage to the substrate surface due to friction. The gas bearing can enable combinatorial processing of a substrate, providing multiple isolated processing regions on a single substrate with different material and processing conditions.

Abstract: A protective chuck is magnetically levitated on a substrate with a gas layer between the bottom surface of the protective chuck and the substrate surface. The gas layer protects a surface region of the substrate against a fluid layer covering the remaining of the substrate surface without contacting the substrate, reducing or eliminating potential damage to the substrate surface. The magnetically levitated protective chuck can enable combinatorial processing of a substrate, providing multiple isolated processing regions on a single substrate with different material and processing conditions.

Abstract: A method of using a fluidic device includes providing a fluidic chip having a plurality of surface energy traps; depositing at least one fluid droplet on the fluidic chip, the fluid droplet including magnetic particles suspended therein; and moving at least a portion of the at least one fluid droplet across a surface of the fluidic chip by altering a magnetic interaction applied to the magnetic particles such that the at least one fluid droplet interacts with at least one of the plurality of surface energy traps.

Abstract: Methods for creating nano-shaped patterns are described. This approach may be used to directly pattern substrates and/or create imprint lithography molds that may be subsequently used to directly replicate nano-shaped patterns into other substrates in a high throughput process.

Abstract: The invention relates to a method for the local etching of the surface of a substrate, characterized in that it comprises: a) making a gas-pervious polymer pad that comprises three-dimensional patterns on one surface thereof; b) contacting the surface including the pad patterns with the substrate; c) submitting the pad/substrate assembly to a plasma so that the species present in the plasma are accelerated and diffused through the pad until they reach the substrate.

Abstract: A micro-lens array and a method for fabricating a micro-lens includes forming a first lens formation material layer on and/or over a micro-lens formation area of a semiconductor substrate, and then forming a portion of the lens formation material layer as a first micro-lens using a first mask. A second lens formation material layer is formed adjacent to the first micro-lens on and/or over the micro-lens formation area. The second lens formation material layer is also formed as a second micro-lens using a second mask which is a different type from that of the first mask.

Abstract: Apparatus and methods for shielding a feature projecting from a first area on a substrate to a plasma while simultaneously removing extraneous material from a different area on the substrate with the plasma. The apparatus includes at least one concavity positioned and dimensioned to receive the feature such that the feature is shielded from the plasma. The apparatus further includes a window through which the plasma removes the extraneous material. The method generally includes removing the extraneous material while shielding the feature against plasma exposure.

Abstract: According to one embodiment, a method of manufacturing a magnetic recording medium includes forming protruded magnetic patterns on a substrate, depositing a nonmagnetic material in recesses between the magnetic patterns and on the magnetic patterns, and etching back the nonmagnetic material using an oxygen-containing etching gas while reforming a surface of the nonmagnetic material.

Abstract: A role of a bottom face of a silicon wafer is identified in a manufacturing process of the silicon wafer. And preferable characteristic feature is also identified. In order to obtain the above characteristic feature, a process method to be implemented into the method of manufacturing a normal silicon wafer is provided. For example, the method comprises: a pre-cleaning process for cleaning the silicon wafer having top and bottom faces processed to a mirror finish; and a rapid thermal process or an epitaxial growth process, wherein the pre-cleaning process comprises a hydrofluoric acid (HF) process and a subsequent pure water (DIW) process.

Abstract: The disclosure relates to methods of marking valuable items, mainly precious stones and in particular, cut diamonds, and can be used for their identification. To implement the marking procedure, the identification surface of the product is first polished. A marking image, optically visible in reflected light is formed on the polished surface by modifying the identification area of said surface by means of a guided ion beam with a given ion energy. In the modification process, the composition of the surface layer is modified with the possibility of changing the optical properties of modified sites in relation to the optical properties of untreated sites of the identification surface.

Abstract: A method of correcting for pattern run out in a desired pattern in directional deposition or etching comprising the steps of providing a test substrate; providing a stencil of known thickness on the test substrate; providing a stencil pattern extending through the stencil to the test substrate.

Abstract: Micro- and nanofilters have a wide range of applications in many fields, including medical diagnostics, drug delivery, medical implants, and hemodialysis. Some issues that limit commercial application of current nanofilters in medicine are low pore density, non-uniform pore size, and the use of materials that are not biocompatible. A method is described to fabricate high porosity polymer and diamond micro- and nanofilters producing smooth, uniform and straight pores of high aspect ratio. Pore size, density, and shape can be predetermined with a high degree of precision by masks and controlled etch. The method combines energetic neutral atom beam lithography and a mask. This technology allows etching polymeric materials in a clean, well-controlled, and charge-free environment, making it very suitable for fabricating nanofilters and other components for biomedical applications.

Abstract: A method of removing an organic, preferably polymeric, light-emitting material (4) from defined areas of a substrate (1) comprises the steps of arranging a shadow mask (5) to overlie the organic material other than in the defined areas, and applying a beam of ions (7) to the defined areas through the mask. The method is useful in forming organic light-emitting diode arrays.

Abstract: A paper pad having a three dimensional image is disclosed wherein the faces or sides of the pad comprise a plurality of paper sheet edges formed into three dimensional surfaces extending from the common planar surface of the side or indenting into said surface. According to one embodiment, the three dimensional surfaces are created through computer numeric controlled (CNC) carving of a compressed side of the paper pad to create an aesthetically pleasing, complex three dimensional design. According to another embodiment, a shaped die is applied to a compressed side of a paper pad under selected conditions of time, temperature, pressure and humidity to deboss a portion of the paper material and produce a three dimensional design in the surface of the compressed side.

Abstract: A panel includes a light permeable material that is partially coated with superimposed layers and includes a metallized layer. A print pattern typically has a radiation-reflective surface facing one side of the panel and a radiation-absorbing surface facing the other side of the panel, for example to form a vision control panel, for example a one-way vision, see-through graphic panel.

Abstract: Impurities can be eluted simultaneously from a plurality of local areas of a surface layer of a semiconductor substrate. A supporting unit supports the substrate, and a sample plate is disposed on the surface of the substrate. The sample plate has a plurality of holes that expose the local areas of the surface of the substrate. Eluant is provided onto the local areas of the surface layer of the substrate through the holes in the sample plate. The impurities are thus dissolved by the eluant to produce a sample. A nozzle transfers the sample from the local areas of the surface of the substrate to a plurality of sample cups. Therefore, samples from the surface layer of the substrate may be produced in a short amount of time.

Abstract: A substrate processing apparatus that roughens the surface of a substrate through a dry etching method by covering the surface of the substrate to be processed with a plate provided with a number of opening portions. The plate is provided with the opening portions in such a manner that an open area ratio of the opening portions on the peripheral side is smaller than an open area ratio of the opening portions in the central portion when the plate is viewed in a plane. It is thus possible to form textures on the surface of the substrate efficiently and homogenously, which in turn makes it possible to manufacture highly efficient solar cells or the like at a low cost.

Abstract: A dry etching apparatus including a plate 15 provided in parallel or nearly parallel with an RF electrode 9 to cover a substrate 1 placed on the RF electrode 9 directly or through a tray 24. The plate 15 is provided with planar or nearly planar obstacles 16 that inhibit a gas and plasma from passing through the plate 15 as well as opening portions 19. This makes it possible to achieve conditions under which etching residues attach to the surface of the substrate faster by trapping the etching residues in a space between the surface of the substrate 1 and the plate 15. Fine textures can be thus formed efficiently on the surface of the substrate (FIG. 4).

Abstract: A method for fabricating a semiconductor device and an equipment for fabricating the semiconductor device are described. According to the method and the equipment, a semiconductor substrate is irradiated with a particle beam through an opening formed in a thin film portion of a stencil mask having the thin film portion and a supporting portion supporting the thin film portion. The method and the equipment are controlled so that the supporting portion of the stencil mask can be irradiated with the fringe of the particle beam. As a result, the method and the equipment provide suppressing deterioration such as deformation or breakage of the stencil mask.

Abstract: Nanostructures on substrates include one or more nanofeatures having unscathed walls and width dimensions of forty-five nm or less. The nanofeatures may include at least one of a nanotrench, nanocapillary, nano-chemical pattern, and nanowire. The nanostructures may include a nano object with a pattern of nano elements. A nano system may include at least one nano system device, which may include at least one nanofeature. A method of forming nanofeatures on substrates includes placing a nano-templating element on the substrate. A masking material is deposited at an acute angle to form shadow gaps on shadowed regions of the substrate. The nano-templating element, the angle, and other factors may be selected to form shadow gaps having width dimensions less than 10 nm. The substrate may be chemically modified in the areas corresponding to the shadow gaps to create nanofeatures with unscathed walls having width dimensions of less than 10 nm.

Abstract: A method of forming a structure. The method including: forming a layer of a polymerizable composition including one or more polyhedral silsesquioxane oligomers each having one or more polymerizable groups, one or more polymerizable diluents, one or more photoacid generators and/or one or more photoinitiators; pressing a surface of a template having a relief pattern into the layer, the template, the layer filling voids in the relief pattern; polymerizing the layer to have thick and thin regions corresponding to the relief pattern; removing the template; removing the thin regions of the dielectric layer; and either curing the layer to create a porous dielectric layer followed by filling spaces between the thick regions of the porous dielectric layer with an electrically conductive material or filling spaces between the thick regions of the dielectric layer with an electrically conductive material followed by curing the dielectric layer to create a porous dielectric layer.

Abstract: An optical device, a method of manufacturing the optical device, a replica substrate for manufacturing the optical device, and a method of producing the replica substrate are disclosed. The optical device includes a base, and a plurality of structures arranged at a fine pitch equal to or shorter than a wavelength of visible light on a surface of the base. Each of the structures is composed of protuberance. The structures have a depth distribution.

Abstract: The present invention provides a method of forming a circuit pattern on an integrally bonded member, the method not requiring a correction step of a laminate film or a resist film which has been necessary at the time of wet treatment of the integrally bonded member. After a circuit pattern forming metal plate 13 is bonded on a part of a ceramic substrate 12 so as to expose an outer peripheral edge portion of the ceramic substrate 12 in an integrally bonded member 10, the integrally bonded member 10 is set on a treating apparatus 30 while being covered with a masking member 20 having a window portion 22 from which the circuit pattern forming metal plate 13 of the integrally bonded member 10 is exposed.

Abstract: A drive unit is described for switching circuit breakers on and off, in particular disconnecting switches and/or grounding switches of medium-voltage switchgear. The drive unit includes a reversible d.c. motor and a switching device containing two separately drivable and interlocked reversing switches, one assigned to each direction of rotation of the d.c. motor, their contacts performing the current reversal on the windings of the d.c. motor as required to reverse the direction of rotation. The drive unit further includes power contactors whose contacts have the required switching capacity for load switching. The all-or-nothing relays and safety switches are implemented by uniform low-power relays representing the direction of rotation, each having at least two electrically isolated relay contacts connected in parallel and also having an equalizing capacitor connected in parallel to each. Such drive units are used in connection with switchgear for power transmission and distribution.

Abstract: A stamp device for printing a pattern on a surface of a substrate having a two-sided rigid carrier layer providing on its first side a patterned layer made of a first material and being combined on its second side with a soft layer made of a softer material than that of the first material.

Abstract: A method for fabricating semiconductor components includes the steps of providing semiconductor dice on a substrate and forming a polymer layer on the substrate. In addition, the method includes the steps of providing a stencil having patterns thereon, and pressing the stencil into the polymer layer to form complimentary patterns in the polymer layer. The method also includes the steps of forming conductors in the polymer layer by forming a conductive layer on the complimentary patterns, and planarizing the conductive layer and the polymer layer to a same surface. A system for performing the method includes the substrate, the stencil and an energy source for curing the polymer layer. The system also includes an optical or mechanical alignment apparatus for aligning the stencil to the substrate.

Abstract: A mask frame assembly includes a frame having an opening and a mask having at least two unit mask elements. Both ends of each unit mask element are fixed to the frame in a state of tension. The unit mask elements include a unit masking pattern, and overlap each other on a predetermined width to form a single mask pattern block. Each unit mask element has a recessed wall in an overlapping portion thereof so as to maintain the thickness of the mask constant at an overlap between the unit mask elements. Accordingly, the mask frame assembly reduces distortion in an evaporation pattern due to an increase in the size of a mask pattern, facilitates the adjustment of a total pitch of evaporation patterns, and prevents evaporation from occurring at undesired positions.

Abstract: A slider prevent the phenomenon of sticking and reduce entrapping of foreign particles between sliding surfaces. A method for making micro-protrusions or micro-cavities on a surface of a substrate comprises placing the substrate in a process chamber, supporting a mask member having a micro shielding surface independent of and in front of the substrate, and irradiating fast atomic beams onto the surface of the substrate through the mask member.

Abstract: A dry etching apparatus that performs etching on a substrate 1 placed on a tray 13 inside a chamber 18 by covering the substrate 1 with a plate 14 provided with opening portions 15, in which a distance D between the surface opposing the substrate 1 and the substrate 1 in the peripheral portion of the plate 14 is set shorter than the distance D between the surface opposing the substrate 1 and the substrate 1 in the central portion of the plate 14. Textures can be thus formed homogeneously on the surface of the substrate.

Abstract: A maskant plate is described which allows for protection of textured, diffusion-hardened surfaces on prosthetic devices while not interfering with common post-oxidation mass finishing procedures which are often used to form the finished product after surface oxidation.

Abstract: Methods for finishing or refurbishing surfaces on protective covers encapsulating microelectronic dies. In one embodiment, a method for fishing a surface of a protective package on a microelectronic device includes abrading the surface of the package by engaging an abrasive media with the surface of the package, terminating the abrasion when a surface blemish has been at least partially removed from the package, and cleaning residual materials from the package after terminating the abrasion of the package surface. The abrasive media can include a fixed-abrasive member, a fixed-abrasive member and a solution, a non-abrasive member and a chemical solution having abrasive particles, or an abrasive blasting media.

Abstract: On an optical device, a metal mask is formed in the shape of a dot array, and then reactive ion etching is performed. The etching is continued while the diameter of the metal mask gradually becomes smaller until the area of the metal reduces to a predetermined area.

Abstract: An implantable prosthesis, for example a stent, is provided having one or more micropatterned microdepots formed in the stent. Depots are formed in the prosthesis via chemical etching and laser fabrication methods, including combinations thereof. They are formed at preselected locations on the body of the prosthesis and have a preselected depth, size, and shape. The depots can have various shapes including a cylindrical, a conical or an inverted-conical shape. Substances such as therapeutic substances, polymeric materials, polymeric materials containing therapeutic substances, radioactive isotopes, and radiopaque materials can be deposited into the depots.

Abstract: A method for manufacturing a photocathode includes positioning the photocathode on a support such that an etch surface of the photocathode faces away from the support. The method includes inserting an end of the support containing the photocathode into a cap. The cap comprises a passage operable to direct an etch compound to the etch surface of the photocathode. The method also includes aligning the etch surface of the photocathode with the passage of the cap using the support. The method also includes inserting a plunger through a passage in the support to contact a surface of the photocathode opposite the etch surface of the photocathode. The method further includes securing the photocathode against the cap using the plunger to confine the etch compound to the etch surface of the photocathode.

Abstract: An internal coating on an internal passage wall exposed at a passage opening through an article external surface is protected from removal during repair of the article, including removal of at least a portion of an external coating, by a masking assembly disposed about the passage opening. The masking assembly comprises a masking member and a substantially flexible seal, substantially inert to a coating removal medium for the external coating. The masking member is shaped for disposition about the passage opening across a gap between the external surface and the masking member. The substantially flexible seal is disposed across the gap substantially to seal the gap.

Abstract: Disclosed is a method for fabricating a stencil mask for use in electron beam lithography which improves resolution by effectively reducing beam blur resulting from coulomb repulsion effects in the electron beam. The disclosed method includes fabricating a first mask and a second mask that are then aligned and joined to form the final stencil mask. The structure of the second mask limits the number and controls the initial pattern of the electrons that pass through the stencil mask to limit beam blur, narrow the incident energy distribution, and improve the resolution of the final image.

Abstract: A frequency control apparatus including a shielding board that is provided with a window for exposing some or all of a plurality of electrodes disposed on a piezoelectric substrate, and a shutter for opening and closing the window. An aperture pattern board is provided between the shielding board and a piezoelectric resonator. On the aperture pattern board, combinations of apertures are provided which correspond to the A electrodes exposed through the window on the shielding board at one time. After measuring the frequencies for respective elements and measuring the variations from the target frequency, the suitable pattern of apertures is selected from the aperture pattern board according to the amount of variations, and then the frequency control is carried out only on the elements selected through the apertures.

Abstract: Disclosed is a novel method for fabricating a stencil mask comprising the formation of an absorber pattern, including an alignment key or target, on the topside of an SOI wafer having a transparent buried insulating layer. The formation of the absorber pattern is followed by the formation of an alignment window from the backside of the SOI wafer using the insulating layer as a lens. The alignment window allows the alignment between the absorber pattern and the frame pattern to be verified, using light passing through the window lens and illuminating the alignment key, before initiating the frame etch, thereby improving the quality and/or throughput of the stencil mask manufacturing process.

Abstract: There is disclosed a method of the plasma cleaning of a chip-mounted board, in which the destruction of a chip due to the charge build-up in a land during the plasma cleaning is prevented. There is provided a mask member for covering a board placed on a plasma-generating electrode. This mask member has openings through which the chip, mounted on the land on the board, and electrodes on the board are exposed, respectively, and an exposed portion of the land, extending outwardly of the chip, and a conducting portion on the board are covered with the mask member. A high-frequency voltage is applied to the plasma-generating electrode, thereby producing plasm within a vacuum chamber, so that ions Ar+ impinge on pads on the chip to clean and charge up these pads. The land is covered with the mask member, and therefore will not be charged up with the ions Ar+ and electrons e−.

Abstract: A microfilter utilizing the principles of tangential flow to prevent clogging, and sloped channel sides to overcome surface tension effects is provided which has feed inlet and exit connected by a feed flow channel; a barrier channel parallel to the feed flow channel, and a filtrate collection channel parallel to the barrier channel so that liquid can flow from the feed flow channel through the barrier channel which is too small to accommodate the particles, into the filtrate collection channel, and from then through a filtrate flow channel to a filtrate exit. Several picoliters of cell-free plasma are recovered from one drop of blood for analysis.

Abstract: The slider according to the invention can prevent the phenomenon of sticking and reduce entrapping of foreign particles between the sliding surfaces. The method for making micro-protrusions or micro-cavities on a surface of a substrate comprises the steps of: placing the substrate in a process chamber; supporting a mask member, having a micro shielding surface, independent of and in front of the substrate; and irradiating fast atomic beams onto the surface of the substrate through the mask member.