Abstract: A compression apparatus includes an outer shell; a first plate and second plate, where the first plate and the second plate are located within the outer shell and a face of the first plate opposes a face of the second plate The compression apparatus also includes a compression mechanism which retractably moves the face of the second plate into contact with the face of the first plate. The face of the first plate or the face of the second plate includes a substrate layer, and a coating layer over the substrate layer, where the coating layer includes a plasma-enhanced chemical vapor deposition material.

Abstract: An ultra-fast moving conductor for use with a circuit breaker is provided. The moving conductor includes a hollow outer stem and a removable core. Multiple removable cores are produced for use with the moving conductor for different purposes. The outer stem is produced from annealed copper that must be brazed before the circuit breaker is placed into operation, and a first removable core produced from copper is inserted into the outer stem to provide structural reinforcement to the outer stem during brazing. After brazing is complete, the copper core is removed from the outer stem, and a significantly lighter work hardened aluminum core is inserted into the outer stem. The lightweight aluminum core enables the moving conductor to open the circuit breaker much faster than the copper core would, and the copper core prevents contamination of the brazing furnace that would result from using the aluminum core during brazing.

Abstract: A polymer melt candle filter having a support which comprises a hollow cylindrical body defined by a first end, a second end, and a cylinder wall having a first end portion and a second end portion. The first end portion includes a screw thread on its outside surface and optionally a hex fitting on its inside surface for receiving a hex wrench. The second end portion includes a plurality of holes in the cylinder wall. The area of the openings of the holes on the outside surface of the cylinder wall may be larger than the area of the openings of the corresponding holes on the inside surface of the cylinder wall. The shape of the openings of the holes on the outside surface may be non-circular.

Abstract: A device for producing a reinforcement, wherein the device has positioning mechanisms for the automated positioning of a longitudinal wire and a cross wire of the reinforcement to be produced. The device is characterized in that the device has a binding unit, wherein the device is designed to automatically connect the positioned wires by way of a binding element at a binding point by means of the binding unit.

Abstract: The invention relates to monolithic sorbents which are clad with tubes made of metal. The metal cladding can be applied directly to the monolithic sorbents by cold forming. This enables very mechanically stable cladding of the monolithic sorbents with minimal dead space.

Abstract: A method of forming a canister by means of a mechanical bonding of respective layers of a first metal material (tantalum) and a second metal material (niobium) to form a sheet stock, thereby forming the sheet stock into a canister form, wherein the first metal material comprises tantalum and the second metal material comprises at least one of niobium, molybdenum, or steel. The completed canister comprises a first metal material comprising tantalum, and a second metal material mechanically bonded to the first metal material by subjecting the first and second metal materials to at least 1,000,000 psi, to thereby form a canister having an inner diameter of 13-19 millimeters (mm), the second metal material comprising at least one of niobium, molybdenum, or steel.

Abstract: A component connection includes a first component, which is made of a material attractable by a magnet, and a second component which lies directly or indirectly adjacent to the first component and which has a hole. A magnetic element is provided which covers the hole and attracts the first component such that both components are clamped together.

Abstract: Representative implementations of techniques and devices provide seals for sealing the joints of bonded microelectronic devices as well as bonded and sealed microelectronic assemblies. Seals are disposed at joined surfaces of stacked dies and wafers to seal the joined surfaces. The seals may be disposed at an exterior periphery of the bonded microelectronic devices or disposed within the periphery using the various techniques.

Abstract: A motor including a rotor, and a stator having a plurality of coils wound around slots, wherein at least any one of the coils includes a single aluminum wire, a single copper wire joined to the aluminum wire, a stranded wire (lead wire) joined to the copper wire, a cold-pressure-welded joint portion (joint portion) joined between the aluminum wire and the copper wire by cold pressure welding, and a non-pressure welded joint portion (joint portion) provided between the copper wire and the stranded wire (lead wire). A burr covered by an insulation member (insulation tube) is provided in the cold-pressure-welded joint portion (joint portion). A thickness of the insulation member (insulation tube) is larger than a height of the burr.

Abstract: The present embodiments provide a gradient coil assembly. The gradient coil assembly includes an aluminum wire body, and a copper wire end connected by cold pressure welding to two ends of the aluminum wire body. Using the gradient coil according to a particular embodiment, it is possible to reduce gradient coil weight as well as reduce the thickness of an outer vacuum chamber used for a magnet, thereby reducing the cost of the magnet and gradient coil, and making it less difficult to install and maintain the magnet and gradient coil. There is no problem of oxidation associated with the cold pressure welding of the aluminum wire body to the copper wire ends, so quality defects arising from such oxidation are avoided.

Abstract: The invention relates to a method for the forming of a workpiece, in particular a blank, composed of sheet steel, in which method the following steps are performed in succession: providing a workpiece composed of multiple steel layers which have been non-detachably connected to one another by roll-bonding and of which at least two steel layers have a different strength and/or elongation at fracture, heating the workpiece, and subjecting the workpiece to hot forming. To ensure a high strength and at the same time the easiest possible formability, the invention proposes that at least one section of the hot-formed workpiece is hardened, and that the workpiece is subsequently subjected to cold forming in the region in which the hardening has been performed. The invention also relates to a corresponding workpiece.

Abstract: An appliance cabinet may be made having at least a first metallic tub, and a mounting bracket by which a component of the appliance may be mounted to the cabinet. The bracket and the first metallic tub may be juxtaposed. The bracket may be attached to the first metallic tub by moving one of a portion of the first metallic tub or the bracket at a speed great enough to induce plastic flow of the portion of the first metallic tub about a portion of the bracket.

Abstract: A reelable mechanically lined pipe (MLP) (30) having at least a liner (32) and an outer pipe (34), the outer pipe having an outer diameter, DH, with the MLP formed from a plurality of pipe joints having conjoining girth welds (36), wherein the ends of each pipe joint terminate with clad overlay welds (40) having a length in the range Lmin=100 mm and Lmax=4DH, and wherein the liner thickness, t, is equal to or less than a value calculated by formula I as defined.

Abstract: The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, and an intermediate thin film metal layer.

Abstract: A method for manufacturing a high frequency cable that includes covering a central conductor made from aluminum or an aluminum alloy with a covering layer made from copper; and wire drawing of the central conductor covered by the covering layer using dies at multiple steps, each of the dies having a cross-section reduction rate of 20% to 29% with an entire reduction angle of 16 degrees, to form a fiber-like structure in a longitudinal direction in the covering layer, and to form an intermetallic compound layer having greater volume resistivity than the covering layer between the central conductor and the covering layer.

Abstract: A bond wire feed system has a wire tensioning unit with a chamber that has a wire inlet aperture and a wire outlet aperture. The wire inlet and outlet apertures have centers that are aligned with a central axis of the chamber. A clamp is positioned to receive a bond wire provided from the wire outlet aperture. The clamp has at least two jaws movable relative to each other and arranged to grip the wire to align a central axis of the wire with the central axis of the chamber. The jaws are also movable along the central axis of the wire in order to pull the wire through the wire tensioning unit.

Abstract: A method for preparing an implant having a porous metal component. A loose powder mixture including a biocompatible metal powder and a spacing agent is prepared and compressed onto a metal base. After being compressed, the spacing agent is removed, thereby forming a compact including a porous metal structure pressed on the metal base. The compact is sintered, forming a subassembly, which is aligned with a metal substrate portion of an implant. A metallurgical bonding process, such as diffusion bonding, is performed at the interface of the subassembly and the metal substrate to form an implant having a porous metal component.

Abstract: A method of welding two workpieces together is described. A conductor in electrical communication with a pulse circuit is provided. A portion of the second workpiece is located adjacent the conductor. The two workpieces are also located together. A portion, or all, of one workpiece is welded to the other by applying a pulse current to one of the workpieces. A method of forming a workpiece is disclosed using a pulse current to move the workpiece into a desired shape.

Abstract: Example multi-layer printed circuit boards (‘PCBs’) are described as well as methods of making and using such PCBs that include layers of laminate; at least one via hole traversing the layers of laminate, and a via conductor contained within the via hole, the via conductor comprising a used portion and an unused portion, the via conductor comprising copper coated with a metal having a conductivity lower than the conductivity of copper.

Abstract: A composite steel plate includes at least two steel sheets rolled to form a plate. One of the sheets has a composition that varies in a depthwise direction, between nanocrystalline and micron grained. The plate is made by treating a steel sheet to produce a composition in the sheet that varies in a depthwise direction of the sheet between nanocrystalline and micron grained, stacking the treated sheet with at least one other steel sheet, and rolling the stacked sheets to form the plate.

Abstract: Sputtering targets are described that comprise: a) a target surface component comprising a target material; b) a core backing component having a coupling surface, a back surface and at least one open area, wherein the coupling surface is coupled to at least part of the target surface component; and wherein at least part of the target surface component fits into at least one open area of the core backing component. In some embodiments, the target surface component, the core backing component or a combination thereof have at least one surface area feature coupled to or located in the back surface of the core backing component, the target surface component or a combination thereof, wherein the surface area feature increases the cooling effectiveness of the target surface component.

Abstract: A device and method for fabrication includes providing a first substrate assembly including a first substrate and a first metal layer formed on the first substrate and a second substrate assembly including a second substrate and a second metal layer formed on the second substrate. The first metal layer is joined to the second metal layer using a cold welding process wherein one of the first substrate and the second substrate includes a semiconductor channel layer for forming a transistor device.

Abstract: Example multi-layer printed circuit boards (‘PCBs’) are described as well as methods of making and using such PCBs that include layers of laminate; at least one via hole traversing the layers of laminate, and a via conductor contained within the via hole, the via conductor comprising a used portion and an unused portion, the via conductor comprising copper coated with a metal having a conductivity lower than the conductivity of copper.

Abstract: A method of room-temperature bonding a plurality of substrates via an intermediate member, includes: forming the intermediate member on a surface to be bonded of the substrate by physically sputtering a plurality of targets; and activating the surface to be bonded by an ion beam. Preferably, the target composed of a plurality of types of materials is physically sputtered. Since the materials of the intermediate member are sputtered from the plurality of targets arranged in various directions from the surface to be bonded of the substrate, the intermediate member can be uniformly formed on the surface to be bonded. Further, since the intermediate member is composed of the plurality of types of materials, the room-temperature bonding of substrates difficult to bond together when an intermediate member is composed of a single type of material can be performed without heating and excessively pressing the substrates during bonding.

Abstract: An endless hot rolling material shear-joining method capable of threading hot rolling materials in a finish rolling process without strip breakage by controlling joining conditions for the hot rolling materials in an endless hot rolling process for high carbon steel, and an endless hot rolling plant therefor are disclosed. The shear-joining method for endless hot rolling materials of high carbon steel includes shear-joining high carbon steel metal bars comprising, in terms of weight %, 0.30% to 1.20% C, inevitable impurities, and balance Fe, or comprising 0.15% to 1.5% C containing at least one of Cr, Ni, Mo, V, Ti, W, B, Nb, and Sb, inevitable impurities, and balance Fe, such that a joined surface of the joined metal bars is formed to be inclined in a thickness direction of the metal bars, in a hot rolling plant by a joiner adapted to join the metal bars after overlapping tail part of a leading one of the metal bar and top part of a trailing metal bar.

Abstract: A clad material 1A for insulating substrates is provided with a Ni layer 4 made of Ni or a Ni alloy, a Ti layer 6 made of Ti or a Ti alloy and arranged on one side of the Ni layer, and a first Al layer 7 made of Al or an Al alloy and arranged on one side of the Ti layer 6 that is opposite to a side of the Ti layer 6 on which the Ni layer 4 is arranged. The Ni layer 4 and the Ti layer 6 are joined by clad rolling. A Ni—Ti series superelastic alloy layer 5 formed by alloying at least Ni of constituent elements of the Ni layer 4 and at least Ti of constituent elements of the Ti layer 6 is interposed between the Ni layer 4 and the Ti layer 6. The Ti layer 6 and the first Al layer 7 are joined by clad rolling in an adjoining manner.

Abstract: An electrical conductor includes a base substrate of at least one of copper, copper alloy, nickel or nickel alloy and a layered structure applied to the base substrate. The layered structure includes a foil and a graphene layer deposited on the foil. The layered structure is applied to the base substrate after the graphene layer is deposited on the foil. A method of manufacturing the electrical conductor includes providing a base substrate, providing a foil, depositing a graphene layer on the foil to define a layered structure, and depositing the layered structure on the base substrate.

Abstract: A method is provided for forming a metallurgical bond. A first metal workpiece and one or more second metal workpieces are brought into proximity to one another such that a first portion of the first workpiece is in general overlying relationship with a second portion of the one or more second workpieces. A suitable material is provided between said first portion and said second portion, said material being in the form of particles or foil. At least a first part of said first workpiece comprising said first portion is forced toward said a part of the one or more second workpiece comprising said second portion by means of any one of a suitable high pressure joining process and a high speed joining process, such as to cause the said first metal workpiece and said one or more second metal workpieces to become joined or welded to one another to form a metallurgical bond therebetween.

Abstract: The present invention relates to a method for manufacturing a printed circuit board, which includes: preparing a base substrate with an electrode pad; providing a conductive material having a predetermined height; disposing the conductive material on the electrode pad; and forming a conductive post on the electrode pad by bonding the electrode pad and the conductive material, and can achieve a fine pitch and easily implement a conductive post with a high aspect ratio.

Abstract: In a connecting material of the present invention, a Zn series alloy layer is formed on an outermost surface of an Al series alloy layer. In particular, in the connecting material, an Al content of the Al series alloy layer is 99 to 100 wt.% or a Zn content of the Zn series alloy layer is 90 to 100 wt.%. By using this connecting material, the formation of an Al oxide film on the surface of the connecting material at the time of the connection can be suppressed, and preferable wetness that cannot be obtained with the Zn—Al alloy can be obtained. Further, a high connection reliability can be achieved when an Al series alloy layer is left after the connection, since the soft Al thereof functions as a stress buffer material.

Abstract: A stator for an electric motor includes a stator coil including a wire pair with respective ends that are joined with a ring. The ring is positioned around the wire pair and joined to the wire pair by a metal joining process.

Abstract: A method is provided for forming a metallurgical bond. A first metal workpiece (10) and one or more second metal workpieces (15) are brought into proximity to one another such that a first portion (12) of the first workpiece (10) is in general overlying relationship with a second portion (17) of the one or more second workpieces (15). A suitable material (99) is provided between said first portion (12) and said second portion (17), said material (99) being in the form of particles or foil. At least a first part of said first workpiece (10) comprising said first portion (12) is forced toward said a part of the one or more second workpiece (15) comprising said second portion (17) by means of any one of a suitable high pressure joining process (95) and a high speed joining process, such as to cause the said first metal workpiece (10) and said one or more second metal workpieces (15) to become joined or welded to one another to form a metallurgical bond therebetween.

Abstract: A cold weld is formed in a multilayer-material. A first pin is coupled to a first block. A second pin is coupled to a second block. The multilayer material is disposed between the first pin and the second pin. The first pin opposes the second pin. The multilayer material is held in the XY plane and floats in the Z axis.

Abstract: An impact beam assembly includes a beam of high-strength steel, and a pair of end brackets constructed of a dissimilar material than the high-strength steel. The brackets are locally deformed onto the beam to thereby surround a portion of the beam. Once deformed, the brackets define a flat section suitable for welding to a vehicle door panel, as well as a section for retaining the beam. The beam can include a surface feature suitable for retaining the beam to the end brackets. A method of reinforcing a vehicle door assembly includes positioning the beam with respect to the end brackets such that the brackets surround a portion of the beam, and then activating a magnetic pulse coil (MPC) to deform an overlapping portion of the brackets onto the beam. The brackets are then attached to a surface of the door assembly to reinforce the door assembly.

Abstract: A conduction path includes a first conduction path forming plate (11) made of a first metal and having a through hole (13), and a second conduction path forming plate (15) made of a second metal and having a press-fit portion (17) press-fitted into the through hole. A wall surface of the through hole and a side surface of the press-fit portion forms an inclined bonding surface (18) inclined relative to a normal line of an overlap surface of the first conduction path forming plate and the second conduction path forming plate, and a bonding portion (25) formed by metal flow is formed in a region located in a periphery of the inclined bonding surface.

Abstract: A method of manufacturing a composite conductive component comprising the steps of providing at least two blanks of metallic material, said blanks consisting of dissimilar metallic materials; placing said blanks in edge to edge or in partially overlapping relationship with one another, solid state joining said blanks to each other, by rolling or welding, so as to form a composite body, rolling said composite body along the joint over the entire width of the composite body to reduce the thickness thereof, and cutting the rolled composite body across the joint to produce at least two composite conductive components, each comprising the metallic materials of said at least two blanks and having a joint between said at least two different metallic materials. A composite conductive component comprises at least a first portion of a first metallic material and at least a second portion of a second metallic material, said first and second metallic materials being dissimilar from each other is produced by the method.

Abstract: A method a scale having an inductively scannable graduation, the scale including a sequence of graduation elements disposed in a measuring direction and a layer stack including a succession of metal layers. The succession of metal layers includes a ferromagnetic metal carrier layer and a graduation layer that forms the sequence of graduation elements. The carrier layer is disposed between the graduation layer and a metal substrate, and the metal substrate is dimensioned to definitively determine mechanical properties of the layer stack.

Abstract: Compression cold welding methods, joint structures, and hermetically sealed containment devices are provided. The method includes providing a first substrate having at least one first joint structure which comprises a first joining surface, which surface comprises a first metal; providing a second substrate having at least one second joint structure which comprises a second joining surface, which surface comprises a second metal; and compressing together the at least one first joint structure and the at least one second joint structure to locally deform and shear the joining surfaces at one or more interfaces in an amount effective to form a metal-to-metal bond between the first metal and second metal of the joining surfaces. Overlaps at the joining surfaces are effective to displace surface contaminants and facilitate intimate contact between the joining surfaces without heat input. Hermetically sealed devices can contain drug formulations, biosensors, or MEMS devices.

Abstract: A press apparatus includes a mounting table and a pressing member. A workpiece formed of a plurality of laminated core sheets is placed on the mounting table, and the pressing member is used for pressing the workpiece on the mounting table from above. The mounting table is supported by a base member so as to be loosely movable in a horizontal plane. When the pressing member is lowered, a positioning member determines the position of the workpiece such that the core sheets of the workpiece are aligned along a single vertical axis.

Abstract: Compression cold welding methods, joint structures, and hermetically sealed containment devices are provided. The method includes providing a first substrate having at least one first joint structure which comprises a first joining surface, which surface comprises a first metal; providing a second substrate having at least one second joint structure which comprises a second joining surface, which surface comprises a second metal; and compressing together the at least one first joint structure and the at least one second joint structure to locally deform and shear the joining surfaces at one or more interfaces in an amount effective to form a metal-to-metal bond between the first metal and second metal of the joining surfaces. Overlaps at the joining surfaces are effective to displace surface contaminants and facilitate intimate contact between the joining surfaces without heat input. Hermetically sealed devices can contain drug formulations, biosensors, or MEMS devices.

Abstract: A cold weld is formed in a multilayer-material. A first pin is coupled to a first block. A second pin is coupled to a second block. The multilayer material is disposed between the first pin and the second pin. The first pin opposes the second pin. The multilayer material is held in the XY plane and floats in the Z axis.

Abstract: When connecting with a conventional Zn/Al/Zn cladding material, thickness of a connecting part needs to be less than double an existing high-lead solder (about 100 ?m) in order to make heat resistance in the connecting part at least equivalent to a level of the existing solder. Moreover, thickness of an Al layer needs to make as thick as possible in order to fully exhibit stress relaxation performance of the Al layer. Provided is a semiconductor device including a semiconductor element, a frame, and a connecting part which connects the semiconductor element and the frame to each other, in which an interface between the connecting part and the semiconductor element and an interface between the connecting part and the frame respectively have the area of Al oxide film which is more than 0% and less than 5% of entire area of the respective interfaces.

Abstract: A method of manufacturing an orthopaedic implant device having a porous outer surface is described. In one embodiment, the implant device includes a porous layer, an intermediate layer, and a solid substrate. The porous layer is preferably bonded to the intermediate layer by cold isostatic pressing. The intermediate layer is preferably bonded by vacuum welding to the solid substrate such that the porous layer forms at least a portion of the outer surface of the orthopaedic implant device. Preferably, a diffusion bond is created between the bonded intermediate layer and the solid substrate by hot isostatic pressing. In another embodiment, a porous layer is created on an outer surface of a solid layer by selective melting. Preferably, the solid layer is bonded to the solid substrate such that the porous layer forms at least a portion of the outer surface of the orthopaedic implant device.

Abstract: A swelling element packer is made with internal rings that are either split or scrolled. After the swelling element is built on a temporary mandrel a longitudinal seam of a variety of designs is cut through the element. This allows the rapid deployment of the element on the tubular that will be a part of a string and will serve as the final mandrel. The assembly is then magnetic pulse welded or crimped so as to urge the open ends of the rings to move toward each other and become secured to each other and further opening the possibility of attaching parts on the ring itself to the underlying tubular by displacing or otherwise removing the swelling material that was between the ring and the final mandrel when the magnetic pulse process began. The rings can be embedded wholly within the element or can extend beyond the opposed ends or combinations of the two.

Abstract: [Problem] A metal laminated substrate for an oxide superconducting wire is provided at a low cost. The metal laminated substrate has high strength, and stable high biaxial orientation in the longitudinal direction. [Means for Resolution] A metal laminated substrate for an oxide superconducting wire is manufactured such that a non-magnetic metal plate T1 having a thickness of not more than 0.2 mm and a metal foil T2 made of Cu alloy which is formed by cold rolling at a draft of not less than 90% and has a thickness of not more than 50 ?m is laminated to each other by room-temperature surface active bonding, after lamination, crystal of the metal foil is oriented by heat treatment at a temperature of not less than 150° C. and not more than 1000° C. and, thereafter, an epitaxial growth film T3 made of Ni or an Ni alloy having a thickness of not more than 10 ?m is laminated to the metal foil.

Abstract: A laser, aimed at a flyer plate tab, causes optical energy to be directed at the tab, specifically, at a top surface thereof. Energy impacting the tab accelerates the tab out of an initial bent position, straightening it into an impact with a target sheet. The impact occurs in excess of 100 m/s, resulting in a metallurgical bond between the tab and the target sheet. The laser preferably strikes the top surface in a normal direction, based upon an initial angularity of the tab relative to the target. The laser emission, preferably in the range of 1 to 100 Joules delivered in a microsecond, may be augmented by an ablative layer on the top surface or a transparent covering on the top surface that reacts against the expanding gas from ablative activity on the top surface. The weld is formed without physical contact between the welding device and the tab.

Abstract: A cold weld is formed in a multilayer material. A first pin is coupled to a first block. A second pin is coupled to a second block. The multilayer material is disposed between the first pin and the second pin. The first pin opposes the second pin. The multilayer material is held in the XY plane and floats in the Z axis.

Abstract: A method for solid state bonding of a plurality of metallic layers and devices made by that method are disclosed. First and second metallic layers are solid state bonded utilizing a protective coating on the non-bonded surfaces that engage the pressure applying appliance to prevent the surfaces from adhering to the pressure applying appliance and to protect the surfaces from imprinting during the bonding process. The invention can be used to fabricate micro-channel devices with smooth outer surfaces and eliminate mold release compounds utilized in conventional bonding procedures.

Abstract: A tool for assembling a part made of a ferromagnetic material with a part made of a paramagnetic material. The tool includes a first tool part including a first abutment and a first electromagnetic coil. The tool also includes a second part including a second abutment, wherein the second part is mechanically assembled with the first part such that the first and second abutments are selectively attracted or repelled with respect to each other. The first electromagnetic coil is used for generating an electromagnetic flux that enables the paramagnetic part to be pushed towards the second abutment and/or the ferromagnetic part to be attracted thereto when the first and/or second part is placed between the first and second abutments.

Abstract: A press apparatus includes a mounting table and a pressing member. A workpiece formed of a plurality of laminated core sheets is placed on the mounting table, and the pressing member is used for pressing the workpiece on the mounting table from above. The mounting table is supported by a base member so as to be loosely movable in a horizontal plane. When the pressing member is lowered, a positioning member determines the position of the workpiece such that the core sheets of the workpiece are aligned along a single vertical axis.