Using Bond Inhibiting Separating Material Patents (Class 228/118)
  • Patent number: 11641712
    Abstract: A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer; a surface electrode on a surface of the electronic component body; and a covering ceramic layer covering a peripheral section of the surface electrode. The peripheral section of the surface electrode that is covered by the covering ceramic layer has a thin portion located on a central side of the surface electrode and which is thinner than a central section of the surface electrode, and a width of the thin portion is 20% or more of a width of the peripheral section of the surface electrode that is covered by the covering ceramic layer.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: May 2, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Yuki Takemori
  • Patent number: 11499467
    Abstract: An exhaust sensor includes a sensing element with a ceramic sensing element substrate and a sensing element terminal which is electrically conductive and which is supported by the ceramic sensing element substrate such that the sensing element is configured to sense constituents of exhaust gases when exposed thereto. The exhaust sensor also includes a mating terminal which is electrically conductive and which is in electrical communication with the sensing element terminal. The mating terminal has a base material and a clad material bonded to the base material such that the clad material contacts the sensing element terminal and such that the clad material is located between the sensing element terminal and the base material, thereby providing the electrical communication. The clad material is an alloy which is less than or equal to 20% iron, greater than or equal to 40% nickel, and greater than or equal to 13% chromium.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: November 15, 2022
    Assignee: DELPHI TECHNOLOGIES IP LIMITED
    Inventor: Charles S. Nelson
  • Patent number: 11338395
    Abstract: A welding position is provided which can prevent surface pressure drop in a seal bead in a pair of metal gaskets is determined. Joint surfaces of a pair of metal gaskets are joined to each other by welding. The pair of metal gaskets include a seal bead that encloses opening and a plurality of structures that bulge from the joint surfaces. A pressure-sensitive medium is sandwiched between the seal bead and a member to be engaged so that the pair of joined metal gaskets and the member to be engaged are stacked on one another, and the pair of joined metal gaskets are tightly engaged with the member to be engaged. The tight engagement is released, and a surface-pressure-drop location in the seal bead is detected based on a mark which remains on the pressure-sensitive medium after the release of the tight engagement.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: May 24, 2022
    Inventors: Takeshi Masaka, Kento Nagamatsu, Kazuaki Setoguchi
  • Patent number: 10955199
    Abstract: A cooling device for providing cooling capability of adjacent structures comprises a hollow chamber, an inlet and a chamber outlet, wherein the inlet, the chamber and the chamber outlet are configured such that fluid flow may enter via the inlet, pass through the chamber, and exit via the chamber outlet. The chamber is divided into a distribution chamber and a cooling chamber by a partitioning member, wherein the inlet is fluidly connected to the distribution chamber and the chamber outlet is fluidly connected to the cooling chamber. The partitioning member comprises at least a first and a second constriction passage, wherein the first constriction passage has a first predefined cross sectional flow area and the second constriction passage has a second predefined cross sectional flow area.
    Type: Grant
    Filed: May 30, 2016
    Date of Patent: March 23, 2021
    Assignee: SAAB AB
    Inventors: Martin Blennius, Hans Falk
  • Patent number: 10753205
    Abstract: A turbine shaft includes: a turbine impeller having a protruding portion provided on a back surface of a main body portion thereof and a welded surface provided on the back surface of the main body portion in a radially outer side of the protruding portion; and a shaft having an end hole provided on the one end surface thereof, the end hole in which the protruding portion is inserted, a welding surface provided in a radially outer side of the end hole and welded to the welded surface, a second seal groove provided in another end side with respect to the welding surface, and an enlarged diameter portion formed between the welding surface and the second seal groove, a diameter of the enlarged diameter portion expanding radially outward from the welding surface side toward the second seal groove side.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: August 25, 2020
    Assignee: IHI Corporation
    Inventors: Ryota Sakisaka, Takahiro Kobayashi, Shinichi Kaneda, Kenji Bunno
  • Patent number: 10695874
    Abstract: Provided is a stainless steel material for a diffusion bonding jig in which deformation of bonding members is suppressed while maintaining diffusion bonding properties of the bonding members, and in which releasability (detachability of a bonding member from a release member) after diffusion bonding treatment is excellent. An embodiment of the present invention provides a stainless steel material for a diffusion bonding jig having excellent deformation suppressibility and releasability, the material being a stainless steel material including 1.5 mass % or more of Si, and a ratio (Fr/Fp) of the high-temperature strength (Fr) of the stainless steel material at 1000° C. to the high-temperature strength (Fp) of a bonding member at 1000° C. being 0.9 or more, the bonding member to be bonded by diffusion bonding. The stainless steel material preferably includes C: 0.1 mass % or less, Si: 1.5 to 5.0 mass %, Mn: 2.5 mass % or less, P: 0.06 mass % or less, S: 0.02 mass % or less, Ni: 8.0 to 15.0 mass %, Cr: 13.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: June 30, 2020
    Assignee: NISSHIN STEEL CO., LTD.
    Inventors: Yoshiaki Hori, Kazunari Imakawa
  • Patent number: 10639751
    Abstract: The present disclosure relates to an assembly for formation of a fan blade. The assembly comprises a suction panel; a pressure panel; and a membrane having a leading edge and a trailing edge. The membrane is sandwiched between the suction panel and pressure panel. The membrane comprises a gas entry slot extending in a radial direction, the gas entry slot having a radially outer receiving portion for receiving a pipe, and a radially inner portion. The radially inner portion of the gas entry slot has a substantially uniform width in a direction between the leading and trailing edge of the membrane.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: May 5, 2020
    Assignee: ROLLS-ROYCE plc
    Inventor: John H. Mason
  • Patent number: 10603740
    Abstract: A turbocharger wheel (4) and shaft (1) assembly exhibits a frustoconical geometry of welding zone contact surfaces extending to the outer circumference of the shaft (1). This frustoconical geometry not only allows continuous centering of the parts (1, 4) during joining, it also eliminates the problem of stress propagation along a plane. The location of the electron beam is shifted so that only the radially outer segment of the frustoconical contact surface is joined by welding, leaving a radially inner unmelted and unfused zone for maintaining firm contact of the oblique surfaces.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: March 31, 2020
    Assignee: BorgWarner Inc.
    Inventors: Silvio Koch, Stefan Eisinger
  • Patent number: 10525669
    Abstract: A method for producing a composite material, particularly a steel composite material, may involve providing a first workpiece and a second workpiece, producing a bonded connection between said first and said second workpiece in order to form a provisional composite, and rolling said provisional composite in order to form the composite material. During the rolling, the bonded connection may be at least partially released, in the form of a predetermined breaking point. The rolling may be performed as hot rolling. Further, the method may involve substantially hermetically sealing the provisional composite by way of a sealant. The first and second work pieces, moreover, may be peripherally connected by way of the bonded connection along an edge area of a contact surface formed by the first and second work pieces.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: January 7, 2020
    Assignees: THYSSENKRUPP STEEL EUROPE AG, THYSSENKRUPP AG
    Inventors: Jens-Ulrik Becker, Rainer Klenn, Stefan Myslowicki, Roland Wunderlich
  • Patent number: 10330549
    Abstract: A pressure measurement cell, comprising: a ceramic measurement membrane and a ceramic counterpart. The measurement membrane is joined to the counterpart in a pressure-tight manner forming a pressure chamber between the measurement membrane and the counterpart by means of an active brazing solder. The pressure measurement cell furthermore has a solder stop layer on a surface of the measurement membrane and/or the counterpart, wherein the solder stop layer has a metal oxide or a reduced form of the metal oxide. The metal oxide has at least one oxidation stage, which, assuming an activity coefficient of Rakt=1 at an inverse temperature of 8·10?4/K, has an oxygen coexistence decomposition pressure of not less than 1?23 MPa (10?23· bar) and not more than 1?12 MPa (10?12· bar) and which, assuming an activity coefficient of Rakt=1, at an inverse temperature of 9·10?4/K has an oxygen coexistence decomposition pressure of not less than 1?27 MPa (10?27 bar) and not more than 1?15 MPa (10?15 bar).
    Type: Grant
    Filed: April 22, 2014
    Date of Patent: June 25, 2019
    Assignee: ENDRESS+HAUSER SE+CO.KG
    Inventors: Nils Ponath, Andreas Rossberg
  • Patent number: 10309251
    Abstract: A rotor assembly includes a first rotor, a second rotor mounted on the first rotor and co-rotatable there with, and a thermal shield interlocked with the second rotor for co-rotation there with.
    Type: Grant
    Filed: March 10, 2014
    Date of Patent: June 4, 2019
    Assignee: UNITED TECHNOLOGIES CORPORATION
    Inventors: Jonathan Perry Sandoval, Julian Partyka
  • Patent number: 10226927
    Abstract: An embodiment method for manufacturing a droplet-discharging head substrate may include a first step to perform a surface activation process on joint surfaces of first and second plates with an atom beam, ion beam or plasma; a second step to align and stack the first and second plates in such a manner that nozzle holes formed in the first plate communicate with through-holes formed in the second plate; and a third step to bond the joint surfaces of the stacked first and second plates by atomic bonding without covalent bonding caused by ion movement. The third step bonds the joint surfaces by bringing a load member into contact with the droplet-discharging surface of the first plate at a position away from the nozzle holes to apply pressure under an atmospheric pressure and by bringing the joint surfaces close to each other with an electrostatic attractive force.
    Type: Grant
    Filed: January 21, 2014
    Date of Patent: March 12, 2019
    Assignee: KONICA MINOLTA, INC.
    Inventor: Hiroaki Kozai
  • Patent number: 10220986
    Abstract: Container includes a base, a cover, and a pull tab. The base has a bottom, a side wall extending upwardly from the bottom, and a rim at an upper edge portion of the side wall. The cover has a closed condition and an open condition and an outer edge portion interengageable with the rim of the base when the cover is in the closed condition. The pull tab extends outwardly from at least one of the base or the cover. The pull tab having a deformable formation to be deformed when the cover is moved from the closed condition to the open condition, the pull tab remaining attached to the at least one of the base or the cover when moved from the closed condition to the open condition. Additional embodiments relate to a tamper evident feature for a container, and a method for containing product in a container.
    Type: Grant
    Filed: March 6, 2009
    Date of Patent: March 5, 2019
    Assignee: PACTIV CORPORATION
    Inventors: Frank A. Petlak, Scott W. Follansbee, H. Bernard Kirkland, Craig E. Cappel
  • Patent number: 10117642
    Abstract: A scan head for an ultrasound imaging device has a body that encloses a number of ultrasound transducers and controlling electronics. The electronics are sealed in the body of the scan head. The scan head has a fan that is configured to remove heat caused by the operation of the electronics. The motor is magnetically controlled and has controlling electronics that are sealed in the body of the scan head. In one embodiment, an airflow channel surrounds the electronics in the scan head and the fan is configured to move air through the airflow channel. In another embodiment, the electronics are thermally coupled to a heat exchanger heat via a conductive substrate and the fan is configured to move air over the heat exchanger.
    Type: Grant
    Filed: February 24, 2015
    Date of Patent: November 6, 2018
    Assignee: FUJIFILM SonoSite, Inc.
    Inventors: Clinton T. Siedenburg, John R. Stice
  • Patent number: 10077493
    Abstract: Methods of applying aluminum coating layers over copper wires are disclosed. A first method may include applying aluminum powder to the surface of a rod, passing the rod through a first set of compression rolls thereby forcing the aluminum powder into a compacted preform around the rod, and heating the rod covered by the preform at 550° C. to 620° C. Further, the heated preform coated rod is passed through a second set of compression rolls thereby obtaining an aluminum coated copper rod. A second method includes disposing a copper rod inside an aluminum tube having an inner layer formed of brazing aluminum alloy, reducing the diameter of the tube's inner surface to match the copper rod, and heating the composite tube-rod such that the inner layer of the brazing alloy fuses to the rod. Another method includes passing the copper rod through a spray of metallic aluminum.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: September 18, 2018
    Assignee: AFL Telecommunications LLC
    Inventors: David Payne, Joe Cignarale, Dan Nettles, Apollo Arce, Scotty Osment
  • Patent number: 10001012
    Abstract: A turbine wheel (1) of an exhaust-gas turbocharger (2), formed from a titanium aluminide material, having a wheel back (7) which is of closed configuration as viewed from an axial direction (A) and which has an outer contour (17), a hub (3) which extends from the wheel back (7) and which tapers along the axial direction (A), and a multiplicity of turbine blades (4) which extend from the wheel back (7) and from the hub (3) and which blades extend outward in a radial direction (R), as far as a connection region outer diameter (DAB) at least in a connection region (5). The wheel back (7) has, in an outer region (11) adjoining the connection region (5), a wheel back outer diameter (DRR) which is greater than or equal to the connection region outer diameter (DAB).
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: June 19, 2018
    Assignee: BorgWarner Inc.
    Inventors: Frank Scherrer, Menno Roder, Gerald Schall, Juergen Strelbitski, Michael Loewenberg, Stefan Eisinger, Adnan Adilovic, Achim Klein
  • Patent number: 9969055
    Abstract: A method and device for setting a predetermined radial gap width for rotor blades arranged in a housing of a turbomachine is provided. The method includes removing a housing part and at least partially exposing the rotor blades which are to be machined, arranging a grinding device in the region of a rotor blade which is to be machined such that the tip of the rotor blade is machined using a grinding disk of the grinding device, screening off the machining region by arranging a screening device which is formed so as to counter a release of grinding dust from the screen off machining region, providing a suction extraction such that it extracts grinding dust from the screened-off machining region and grinding the tip of the rotor blade in situ producing the radial gap width.
    Type: Grant
    Filed: November 7, 2013
    Date of Patent: May 15, 2018
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Rolf Groppe, Michael Keller, Uwe Kirchhübel, Rolf-Dieter Woitscheck
  • Patent number: 9859032
    Abstract: An electric wire capable of reducing an AC resistance equal to or less than the copper wire. In the electric wire in a single layered structure having a first layer of a substance having lower conductivity than copper, a radius of the wire is less than a skin depth, and an alternating current resistance value of the wire at a frequency used in the wire is greater than or equal to a sum of a direct current resistance value of the wire and a direct current resistance value of a copper wire having a same shape and a same outer diameter as the wire, and less than or equal to an alternating current resistance of the copper wire.
    Type: Grant
    Filed: March 17, 2014
    Date of Patent: January 2, 2018
    Assignee: FUJIKURA LTD.
    Inventors: Chihiro Kamidaki, Ning Guan, Yasunobu Hori
  • Patent number: 9765623
    Abstract: A Method for modifying a plurality of cooling holes of a turbine component includes disposing a recess-shaped modification in a recess of the component comprising a plurality of cooling hole outlets, wherein the recess-shaped modification is formed to substantially fill the recess and comprising a plurality of modified cooling holes passing there through. The method further includes aligning the plurality of modified cooling holes of the recess-shaped modification with the plurality of cooling hole outlets of the component, inserting at least one alignment pin into at least one of aligned pair of holes and hole outlets, bonding the recess-shaped modification disposed in the recess to the component, and removing the at least one alignment pin after bonding, wherein the plurality of modified cooling holes of the recess-shaped modification is fluidly connected with the plurality of cooling holes of the component.
    Type: Grant
    Filed: July 23, 2013
    Date of Patent: September 19, 2017
    Assignee: General Electric Company
    Inventors: Srikanth Chandrudu Kottilingam, Yan Cui, Brian Lee Tollison, David Edward Schick, Jonathan Matthew Lomas, Gareth William David Lewis
  • Patent number: 9250026
    Abstract: A heat exchanger comprises a base portion and a plurality of fins. The fins are disposed on the base portion in parallel along a processing direction. Each fin has a processing surface far away from the base portion. The processing surfaces sunken to form at least one groove, and the groove extends along a grooving direction which intersects with the processing direction. Furthermore, each fin has two upper valley sides at the groove, and the two upper valley sides connect the processing surface. The two upper valley sides and the processing surface form an obtuse angle. The structure of the heat exchanger can prevent processing waste filling in the passages between fins.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: February 2, 2016
    Assignee: INVENTEC CORPORATION
    Inventor: Chien-An Chen
  • Patent number: 9175476
    Abstract: A self supporting panel system used to fabricate ceilings, floors, walls, or roofs. The panel system is assembled from a plurality of panels, each having a core that is sandwiched between opposing plate members. In a preferred embodiment, the core of each panel includes a unifying material to enhance the load bearing capacity of the panel.
    Type: Grant
    Filed: February 18, 2014
    Date of Patent: November 3, 2015
    Assignee: PN II, INC.
    Inventors: Lawrence J. Wrass, James K. Peterson, Robert P. Broad
  • Patent number: 9123456
    Abstract: A high frequency cable includes: a central conductor made from aluminum or an aluminum alloy; a covering layer made from copper covering the central conductor, and having a fiber-like structure in a longitudinal direction; and an intermetallic compound layer formed between the central conductor and the covering layer and having greater volume resistivity than the covering layer, wherein a cross-sectional area of the covering layer is 15% or less of an entire cross-sectional area including the central conductor, the intermetallic compound layer and the covering layer.
    Type: Grant
    Filed: September 21, 2012
    Date of Patent: September 1, 2015
    Assignee: FUJIKURA LTD.
    Inventors: Takashi Shinmoto, Shotaro Yoshida, Shinji Katayama, Taikou Toda, Takamasa Kato, Masanori Daibo, Akio Kawakami
  • Patent number: 8963057
    Abstract: Apparatus and method are provided for an electric induction brazing process in an inert atmosphere using a substantially oxygen-free copper alloy filler or preform under an inert atmosphere within a brazing chamber minimally sized for containment of the brazed joint region and an induction coil. The inert atmosphere may be nitrogen gas supplied from a liquid nitrogen source. For brazing of an open-interior fitting around a hole in a tubular material a nesting area is provided around the hole for seating of the filler or preform and the fitting.
    Type: Grant
    Filed: October 26, 2008
    Date of Patent: February 24, 2015
    Assignee: Radyne Corporation
    Inventors: Brian R. Gramoll, Robert P. Frank
  • Patent number: 8740043
    Abstract: A method for producing a surface on a component, which has regions having different wettabilities with respect to a solder. The method includes forming a first metallic layer on the component and forming a second metallic layer on the first metallic layer, the second metallic layer preventing oxidation of the first metallic layer. The method furthermore includes removing the second metallic layer with the aid of a laser in a predefined surface region for exposing the first metallic layer, and oxidizing the exposed first metallic layer on the surface, which results in a wettability with respect to a solder in the predefined surface region that is less than in a surface region adjacent to the predefined surface region.
    Type: Grant
    Filed: October 5, 2009
    Date of Patent: June 3, 2014
    Assignee: Robert Bosch GmbH
    Inventor: Hans-Martin Irslinger
  • Patent number: 8579181
    Abstract: A method of forming an internal structure in a hollow component that includes the steps of forming an assembly having first, second, and third plates the first and second plates each with a substantially planar surface and a surface that includes at least one protrusion and is on the exterior facing surfaces of the assembly. The third plate is sandwiched between the first and second plates. The method also includes the steps of selectively bonding portions of the third plate to sections of the first and second plates substantially opposite the at least one protrusions of the first and second plates; and forming the assembly against a die such that the at least one protrusions of the first and second plates are transferred from the exterior facing surfaces to the interior facing surfaces of the first and second plates.
    Type: Grant
    Filed: March 9, 2010
    Date of Patent: November 12, 2013
    Assignee: Rolls-Royce PLC
    Inventors: Oliver Michael Strother, Keith Christopher Goldfinch
  • Patent number: 8210421
    Abstract: A process for the manufacture of plated strips comprising at least two layers of different metals or alloys. The process allows subsequent separation of different cropped layers resulting from shearing the plated strips. The process comprises preparing plates corresponding to each of the plating layers, superimposing and assembly of these plates to form a composite plate, hot and possibly cold rolling of this composite plate to obtain a plated strip, and shearing of cropping areas during or after rolling. In one embodiment, prior to superimposing the different plates, an anti-sticking agent is applied to the cropping areas of at least one of the surfaces of the plates which will be in contact with each other.
    Type: Grant
    Filed: June 1, 2004
    Date of Patent: July 3, 2012
    Assignee: Constellium France
    Inventors: Sandrine Dulac, Christian Barthelemy, Sylvain Henry, Armand Gabriel
  • Patent number: 7966707
    Abstract: A method for forming or remanufacturing a component to have an internal space. A refractory metal blocking element is formed, in situ, with at least a portion to be within the internal space. A material is added by at least one of welding, laser cladding, and diffusion brazing, the blocking element at least partially blocking entry of the material to the internal space. The blocking element is removed.
    Type: Grant
    Filed: May 6, 2005
    Date of Patent: June 28, 2011
    Assignee: United Technologies Corporation
    Inventors: Edward R. Szela, Norman Pietruska
  • Publication number: 20110051388
    Abstract: Some invention embodiments relate to a method for forming a fuse which electrically connects two metal surfaces (2) that are arranged on a printed circuit board (5) next to each other and spaced apart from each other. It is provided according to the invention that the two metal surfaces (2) are each partially covered with a protective coating (5), wherein a partial region forming a contact region (2a) remains uncovered, liquid soft solder material (1) which bridges the gap between the two metal surfaces (2) is applied onto the two uncovered partial regions (2a), and the protective coating (5) in a surrounding area of the solder material (1) is removed after the soft solder material (1) has solidified, in order to form receiving regions (2b) which are wetted by the solder material (1) when the latter fuses, with the result that the solder material (1) flows off from a printed circuit board region (3) between the two metal surfaces (2) and the electrical contact formed by the solder material (1) is interrupted.
    Type: Application
    Filed: September 1, 2010
    Publication date: March 3, 2011
    Inventors: Michael Luppold, Alexander Dauth
  • Patent number: 7837444
    Abstract: Within gas turbine engines 10 it is necessary to provide fixed vanes which comprise an aerofoil in the gas flow through the gas turbine engine 10. These vanes are subject to significant stressing. Therefore it is generally necessary to secure the vane at one end 103 through an appropriate bond such as brazing while at another end a friction damping response is achieved. By providing an anti-bonding layer it is possible to prevent a mechanical bond being formed at the friction damping end 105. Furthermore, a tight fit can be emphasized by residual bonding material remaining after an attempted bonding process upon the anti-bonding layer.
    Type: Grant
    Filed: November 16, 2006
    Date of Patent: November 23, 2010
    Assignee: Rolls-Royce PLC
    Inventor: Rodney D. Conrad
  • Patent number: 7735421
    Abstract: Reusable printing forms and thermal image setting on the printing forms is optimized in terms of performance. A method for manufacturing the printing form, in particular a rewritable printing form, having a thermally insulating layer, is distinguished by the fact that the thermally insulating layer is produced by the configuration of individual layers to form a layer sequence as a multilayer system. A printing form which is manufactured by the method according to the invention can have images set on it with a low power image setting device, as it is possible to effectively prevent heat from dissipating in an undesirably pronounced manner, for example into a metallic carrier.
    Type: Grant
    Filed: January 30, 2009
    Date of Patent: June 15, 2010
    Assignee: Heidelberger Druckmaschinen AG
    Inventor: Bernd Vosseler
  • Patent number: 7666521
    Abstract: A honeycomb body for an exhaust treatment unit has at least one honeycomb structure and a least one housing, which at least partially surrounds the at least one honeycomb structure. At least one region between the honeycomb structure and the housing is formed with a brazed joint and at least two separate measures delimit the brazed joint. Furthermore, a method for producing a corresponding honeycomb is also proposed.
    Type: Grant
    Filed: May 12, 2008
    Date of Patent: February 23, 2010
    Assignee: EMITEC Gesellschaft fuer Emissionstechnologie mbH
    Inventors: Ludwig Wieres, Alexander Scholz
  • Patent number: 7653978
    Abstract: A method for providing a stop-off material on a workpiece is provided, as is an associated assembly. A maskant is provided on the workpiece such that a first portion of the workpiece is exposed and a second portion of the workpiece is covered by the maskant. The stop-off is then disposed, with the maskant on the workpiece preventing the stop-off from being applied to the second portion of the workpiece. The maskant is removed from the workpiece leaving the stop-off disposed on a select portion of the workpiece. The removal of the maskant can leave the workpiece substantially free of debris. Thereafter, the workpiece can be further processed, e.g., by diffusion bonding, with the stop-off preventing diffusion bonding of part of the workpiece.
    Type: Grant
    Filed: July 2, 2004
    Date of Patent: February 2, 2010
    Assignee: The Boeing Company
    Inventors: Don R. Arnold, Jeff L. Guentzel, Larry D. Hefti, Franna S. Pitt, Gregory L. Ramsey
  • Publication number: 20090140028
    Abstract: A soldering system for melting a solder to form a joint between a first workpiece and a second workpiece is described. The system may comprise an energy generating system, a soldering tip, and a dispenser adapted to dispense controlled amounts of the solder. The soldering tip includes a non-wetting solder contact layer in operative communication with the energy generating system. The energy generating system may include induction, electrical, or heat generating systems in communication with the soldering tip. The non-wetting solder contact layer comprises a material that is not wettable by the molten solder. The system permits control of an amount of the solder in the joint.
    Type: Application
    Filed: November 30, 2007
    Publication date: June 4, 2009
    Applicant: NORDSON CORPORATION
    Inventors: Michael S. Forti, Kevin W. Gaugler, John A. Vivari, JR., Keith Wheeler
  • Patent number: 7431197
    Abstract: A method of fabricating a hollow mechanical part includes a step of depositing an anti-diffusion substance in a predefined pattern on at least one face of primary parts to be assembled together. The depositing step is performed by applying a layer of anti-diffusion substance including a powder over a surface of the face of the primary parts; and by localized sintering of the anti-diffusion substance in the predefined pattern by the heating that results from localized application of a laser beam along a track.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: October 7, 2008
    Assignee: SNECMA
    Inventors: Jean-Michel Franchet, Gilles Klein, Patrick Gesmier
  • Patent number: 7325307
    Abstract: A hollow blade is shaped by superplastic inflation of a blank made up of welded-together sheets. A die comprising two hollow shapes clamping the outline of the blank is placed inside an autoclave-forming enclosure in order to subject the blank to superplastic inflation, and the two hollow shapes are united by U-shaped clamps made of a material having a coefficient of thermal expansion that is smaller than that of the material constituting said shapes.
    Type: Grant
    Filed: June 9, 2005
    Date of Patent: February 5, 2008
    Assignee: SNECMA Moteurs
    Inventors: Jean-Michel Patrick Maurice Franchet, Patrick Gesmier, Benoit Antoine Yves Marty
  • Patent number: 7255260
    Abstract: A method for manufacturing an assembly including a stack of at least two primary parts, the primary parts being joined together around their periphery with the exception of a place forming a passage so as to define between the two of them a cavity, and the primary parts having, facing the cavity, at least one face that is covered, in a pattern, with a stop-off product containing a binder that can be thermally degraded, and a sealed reservoir having an open end, the end being joined in a sealed manner to the passage in the stack so as to allow communication between the internal space of the reservoir and the cavity, the reservoir being placed under a partial vacuum, this being produced so as to be non-deformable at the temperature and at the pressure at which the diffusion bonding of the said stack takes place.
    Type: Grant
    Filed: March 19, 2004
    Date of Patent: August 14, 2007
    Assignee: Snecma Moteurs
    Inventors: Jean-Michel Franchet, Patrick Gesmier
  • Publication number: 20040118679
    Abstract: A sputtering target is provided, including a target material and a backing plate that are bonded with a strong adhesion at a reduced cost. The method for bonding the target material and the backing plate does not use a special soldering material, and is therefore cheaper and more reliable. The target includes an inorganic target material and a backing plate that are bonded with a soldering material between them. At least one of the target material and the backing plate is coated with a coupling agent of a semi-metal oxide or a metal oxide.
    Type: Application
    Filed: July 23, 2003
    Publication date: June 24, 2004
    Inventors: Shigeru Taniguchi, Katsunori Iwasaki
  • Patent number: 6673466
    Abstract: A housing for a honeycomb body includes a jacket tube with an inner wall surface. The jacket tube has a passivation layer in at least one section of the inner wall surface in order to deliberately modify a connection to the honeycomb body by joining. A method for the production of a catalyst carrier body with a honeycomb body and a housing according to the invention are also indicated. A catalyst carrier body produced in this way reduces thermal stresses between the honeycomb body and the jacket tube and, in particular, ensures a reliable brazing process during production, even in a vacuum.
    Type: Grant
    Filed: October 15, 2002
    Date of Patent: January 6, 2004
    Assignee: EMITEC Gesellschaft fuer Emissionstechnologies mbH
    Inventors: Rolf Brück, Ludwig Wieres, Ferdi Kurth, Karl-Josef Schmitz, Hans-Günter Faust, Jan Hodgson
  • Patent number: 6626351
    Abstract: By utilizing a roll bonding process and appropriately forming steps, a load bearing structure is created which is capable of handling and appropriately transferring loads. One preferred method includes the combination of roll bonding and hydroforming to efficiently create structural components. While various product configurations are possible, one version includes a waffle-type structure produced by appropriate roll bonding of material sheets. This waffle-type structure can also undergo additional forming steps to create several structural components capable of handling and carrying loads in a very efficient and effective manner. More significantly, this process enables the use of structural aluminum for load bearing components which are efficiently and cost effective when manufactured.
    Type: Grant
    Filed: May 4, 2001
    Date of Patent: September 30, 2003
    Assignee: Tower Automotive Technology Products, Inc.
    Inventors: Lawrence M. Dziadosz, Clarence W. Fulton
  • Patent number: 6626350
    Abstract: A method is available for repairing metallic components such as gas turbines, which have mechanically weight-carrying grooves, where the longitudinal edges of the grooves which exist on the component surface are largely in a plane and their actual contour deviates, at least locally, due to removal and/or displacement the component material from the desired contour. The method begins with abrasive blasting of the groove surfaces, followed by closing of the open groove ends by build-up welding, and subsequent filling of the grooves with soldering powder. The soldering powder is heated to liquefaction, then cooled and solidified in a vacuum, and the desired contour of the groove is then machined.
    Type: Grant
    Filed: June 25, 2001
    Date of Patent: September 30, 2003
    Assignee: MTU Aero Engines GmbH
    Inventor: Reinhold Meier
  • Publication number: 20010054225
    Abstract: A head gimbal assembly, which is a component of a hard disk drive, has a bending portion that has elasticity and is bent at a predetermined angle under an unloaded condition, and a slider is bonded to a holding portion thereof by mounting the head gimbal assembly on a bonding jig in a state in which the bending portion is stretched. When the head gimbal assembly is separated from the bonding jig after bonding, the bending portion is not restored freely, so that the head gimbal assembly is caught by the bonding jig during the separating process and a locked state is sometimes established.
    Type: Application
    Filed: June 12, 2001
    Publication date: December 27, 2001
    Applicant: International Business Machines Corporation
    Inventors: Yasuhiro Mita, Kohichiroh Naka, Takuya Satoh, Tatsumi Tsuchiya, Tatsushi Yoshida
  • Publication number: 20010047587
    Abstract: Terminals of a plurality of types of components to be mounted on a circuit board are provided beforehand with a joining material corresponding to the type of component. A basic joining material is applied to the circuit board all at one time. The basic joining material is commonly usable for joining all of the types of components to the circuit board. An individual joining material is applied to certain locations on the circuit board, to which locations components of a particular type are to be mounted. The individual joining material matches properties of the joining material provided beforehand to the components of the particular type. The second step may be performed before the first step to yield the same results.
    Type: Application
    Filed: November 29, 2000
    Publication date: December 6, 2001
    Applicant: Fujitsu Limited
    Inventor: Yoshitsugu Kotaki
  • Patent number: 6286750
    Abstract: A HIP-bonded body of a beryllium member and copper alloy member. Before subjecting the members to HIP processing, a diffusion inhibiting layer is deposited on the outer surface of the copper alloy member. A bond promoting layer of aluminum or aluminum alloy is then formed on the diffusion inhibiting layer. During the HIP bonding step, an insert composed of an aluminum-magnesium alloy is juxtaposed between the outer aluminum layer of the pre-treated copper alloy member and the beryllium member.
    Type: Grant
    Filed: March 22, 2000
    Date of Patent: September 11, 2001
    Assignee: NGK Insulators, Ltd.
    Inventor: Takaharu Iwadachi
  • Patent number: 6264091
    Abstract: A method of diffusion bonding at least two metal workpieces (12, 14, 16) comprises assembling the workpieces (12, 14, 16) into a stack (10) relative to each other so that the surfaces (18, 20, 22, 24) are in mating contact. The edges of the workpieces (12, 14, 16) are sealed together, except for an aperture (42) where a pipe (44) is to be inserted. A pipe (44) is joined to the stack (10) such that the axis (50) of the pipe (44) is arranged at an angle of at least 45° to the axis (48) of the aperture (42) to provide a sealed assembly. The interior of the sealed assembly is evacuated via the pipe (44) and the pipe (44) is sealed. Sufficient heat and pressure is applied across the thickness of the workpieces (10, 12, 14) to diffusion bond the workpieces together to form an integral structure. The angling of the pipe (44) relative to the aperture (42) reduces the possibility of the pipe (44) being sucked back and bursting during diffusion bonding.
    Type: Grant
    Filed: September 23, 1998
    Date of Patent: July 24, 2001
    Assignee: Rolls-Royce plc
    Inventor: Richard G Milburn
  • Patent number: 6247635
    Abstract: A connector for use with a circuit substrate having a plurality of elongated conductors. A solder ball is fused to the end of the conductors for connection of the connector to a circuit substrate. Method for attaching the solder ball to the end of the conductors using a solder paste with or without a preformed solder ball. The conductors are fitted into passages of an interface member. A tail end of each conductor terminates in a well in a surface of the interface member that facilitates the attachment of solder ball to the end of the conductors. The passages in the interface member hold the conductor tail ends in place while providing a clearance around the conductor to accommodate the effects of thermal expansion and contraction.
    Type: Grant
    Filed: May 4, 2000
    Date of Patent: June 19, 2001
    Assignee: Berg Technology, Inc.
    Inventor: Stanley W. Olson
  • Patent number: 6220497
    Abstract: In method for soldering metal microstructured plates, stacks of plates and solder layers are prepared by placing the solder layers between each adjacent plate. The thickness of the solder layers range from 3 to 25 &mgr;m. The stack is then soldered by heating it in a vacuum or an inert atmosphere.
    Type: Grant
    Filed: January 19, 1999
    Date of Patent: April 24, 2001
    Assignee: Xcellsis GmbH
    Inventors: Uwe Benz, Lothar Haug, Wolfgang Kleinekathoefer, Peter Waitkat
  • Patent number: 6168068
    Abstract: Disclosed is a method of preventing a gold plate connector of a printed circuit board (PCB) from being contaminated during a soldering process. The disclosed method prevents the gold plate connector coupled with the printed circuit board from being contaminated during wave soldering of the printed circuit board after spreading flux over the printed circuit board on which electronic components are mounted, and the method includes the steps of: forming a strip mask in a form of a membrane by solidifying a masking solution after spreading the masking solution capable of being solidified over the gold plate connector of the printed circuit board, performing the spreading of the masking solution before the spreading of the flux; and removing the strip mask from the gold plate connector after performing the wave soldering. As a result, it is not necessary to perform a washing operation of the gold plate connector. The washing operation can be troublesome, time-consuming, and inconvenient.
    Type: Grant
    Filed: September 3, 1998
    Date of Patent: January 2, 2001
    Assignee: Samsung Electronic Co, Ltd.
    Inventors: Gun-Yong Lee, Masaharu Tsukue, Choul-Su Kim
  • Patent number: 6129256
    Abstract: The invention provides a reflow furnace for an electronic assembly. The electronic assembly comprises a printed circuit board and a device on the printed circuit board. The printed circuit board has solder at a first area near the device and a metallic surface at second area distant from the device. The furnace comprises a frame, a support, a heater, and a shield. The support is secured to the frame and is capable of holding the printed circuit board. The heater is secured to the frame and is capable of heating the printed circuit board while being held by the support. The shield is secured to the frame and is positioned to prevent solder from migrating from the first area to the metallic surface at the second area while the printed circuit board is being heated.
    Type: Grant
    Filed: September 21, 1999
    Date of Patent: October 10, 2000
    Assignee: Intel Corporation
    Inventors: Jeffrey R. Watson, Kiet M. Van, Steven B. Roach
  • Patent number: 6106644
    Abstract: A method of applying a pattern of stop-off material to a sheet is described, the pattern being stored in a computer memory; the method comprises:(a) placing the sheet (22) on a table (12) that is traversable by a printing head (14) capable of applying jets of fluid from a reservoir onto the underlying sheet,(b) supplying a suspension of stop-off material to the fluid jet reservoir and(c) traversing the printer head (14) with respect to the sheet and(d) so controlling the head that it applies jets of stop-off material to the sheet to form a pattern of stop-off material in accordance with the pattern stored in the said memory.The method finds particular use in applying stop-off material in combined diffusion bonding/superplastic forming fabrication techniques.
    Type: Grant
    Filed: December 17, 1997
    Date of Patent: August 22, 2000
    Assignee: British Aerospace Public Limited Company
    Inventors: Allister McCool, Nigel D Haworth
  • Patent number: 6095397
    Abstract: Solder deposit carrier for the selective soldering of terminal areas of a substrate, comprising on an electrically conductive, non-wettable or wetting-inhibiting coating (12) a transfer mask (13) of an electrically isolating, non-solderable material which exposes the coating in the area of mask openings (14), in which the mask openings (14) serve to accommodate solder deposits (16) electroplated to the coating (12), and the coating (12) comprises two superimposed metal layers (15, 17) of different materials, such that the layer (17) facing towards the mask openings (14) is non-wettable or has a wetting-inhibiting effect, and the layer (15) arranged facing away from the mask openings (14) acts as a current-carrying layer during the electroplating.
    Type: Grant
    Filed: June 29, 1998
    Date of Patent: August 1, 2000
    Assignee: Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
    Inventors: Jurgen Wolf, Gerhard Chmiel