Abstract: An assembly includes a first member, a second member adjacent to the first member, and an aluminum material. At least one of the first member and the second member defines at least one trench. The aluminum material is disposed within the trench and bonds the first member to the second member along adjacent faces. In one form, a spacing between the first member and the second member along the adjacent faces is less than 5 ?m.

Abstract: The present invention relates to a run-in coating for a turbomachine, in particular for an aero engine, to be attached to a seal between a rotor and a stator, wherein the run-in coating comprises a metallic scaffold having interstices which are filled with an inorganic-nonmetallic filler material, and wherein the metallic scaffold is formed from an arrangement of metal fibers (9). The invention also relates to a corresponding turbomachine.

Abstract: A capacitor includes a capacitor element having internal electrodes and dielectric layers, the internal electrodes and the dielectric layers being alternately laminated; a first electrode layer formed on an edge surface of the capacitor element and connected to an internal electrode of the internal electrodes; and a second electrode layer formed into a mesh shape or a dot shape on the first electrode layer.

Abstract: Thermal-transfer assembly includes a first transfer module having a plurality of first projections. The first projections are spaced apart from one another to form corresponding gaps therebetween. The thermal-transfer assembly also includes a second transfer module having a plurality of second projections. The second projections are spaced apart from one another to form corresponding gaps therebetween. The first and second transfer modules interface with each other in a mated arrangement. The first and second projections project in opposite directions along a Z-axis and intimately engage one another to transfer thermal energy therebetween. The thermal-transfer assembly also includes an assembly clip coupled to and configured to engage each of the first and second transfer modules. The assembly clip prevents the first and second transfer modules from separating along the Z-axis and/or biases the first and second transfer modules away from each other along the Z-axis.

Abstract: A component, especially contrived and designed for being used in a turbomachine, includes a high-temperature coating being arranged above a base of the component. The base has at least one structural element for connecting it to the high-temperature coating, with the cross-section of the at least one structural element having at least three different widths, i.e. a base width at the lower end of the at least one structural element, a center width above it, and a tip width above that, where on average the center width is greater than or equal to the base width, but less than four times the base width, in particular less than or equal to three times the base width.

Abstract: A process of assembly by direct bonding of a first and second element, each having a surface including copper portions separated by a dielectric material, the process includes: polishing the surfaces such that the surfaces to be assembled allow assembly by bonding; forming a diffusion barrier selectively in copper portions of the first and second elements, wherein the surface of the diffusion barrier of the first and second elements is level with the surface, to within less than 5 nanometers; and bringing the two surfaces into contact, such that the copper portions of one surface cover at least partly the copper portions of the other surface, and such that direct bonding is obtained between the surfaces.

Abstract: A method is disclosed for mechanically bonding a metal component to a ceramic material, comprising providing a metal component comprising an anchor material attached to at least a first portion of one surface of the metal component; providing a ceramic material having a first surface and a second surface, wherein the ceramic material defines at least one conduit extending from the first surface to the second surface, wherein the at least one conduit has a first open end defined by the first surface, a second open end defined by the second surface, a continuous sidewall and a cross sectional area; positioning the ceramic material such that at least a portion of the at least one conduit is in overlying registration with at least a portion of the anchor material; and applying a bonding agent into at least a portion of the at least one conduit.

Abstract: The present invention relates to a method for manufacturing at least one portion of a seal ensuring gas-tightness between at least one first and one second glass panel in a glazing system, the method including the following steps: depositing a first adhesive layer on a first peripheral area of the first panel and a second adhesive layer on a second peripheral area of the second panel; welding a first metal seal element to the first adhesive layer; welding a second metal seal element or said first metal seal element to the second adhesive layer. According to the invention, the first and second adhesive layers are deposited using a high-speed oxy-fuel flame-spraying method.

Abstract: Disclosed are sintered silver bonded electronic package subcomponents and methods for making the same. Embodiments of the sintered silver bonded EPSs include topography modification of one or more metal surfaces of semiconductor devices bonded together by the sintered silver joint. The sintered silver bonded EPSs include a first semiconductor device having a first metal surface, the first metal surface having a modified topography that has been chemically etched, grit blasted, uniaxial ground and/or grid sliced connected to a second semiconductor device which may also include a first metal surface with a modified topography, a silver plating layer on the first metal surface of the first semiconductor device and a silver plating layer on the first metal surface of the second semiconductor device and a sintered silver joint between the silver plating layers of the first and second semiconductor devices which bonds the first semiconductor device to the second semiconductor device.

Abstract: A method for elaborating an assembly comprising at least one composite structure part, one metal interface part and one metal structure part, said method includes a first step for assembling the part to the part in order to form a sub-assembly and a second assembling step for welding the interface part of said sub-assembly to part. As the composite structure and metal interface parts are pre-equipped with mating connecting means of the male/female type and with means for locking said connection, said method includes, during the first assembling step, a phase for pre-assembling the parts by interlocking male/female mating connecting means and a phase for locking said interlock by deforming by pressing at least one portion of the locking means pre-equipping the metal interface.

Abstract: To permanently apply lead terminals to corresponding electrodes of electronic or electro-optic components, a. providing a frame including a tensioned wire, b. providing a holding jig including at least one seat in which the components can be removably and temporarily retained, c. applying the components to the seats with the respective electrodes aligned along a respective longitudinal direction, d. applying the holding jig to the frame and orienting the same so that the longitudinal direction corresponds to the direction of the tensioned wire, the tensioned wire being thereby brought substantially in contact with (all) the electrode(s) aligned to each other on a corresponding row of components, e. electrically and mechanically bonding the tensioned wire to the corresponding electrodes, and f. cutting the wire to separate the components from each other thereby forming a respective lead terminal for each electrode.

Abstract: In an exemplary method a piezoelectric wafer is prepared on which multiple piezoelectric frames are formed. Each frame has a piezoelectric vibrating piece including excitation electrodes, and a frame portion surrounds the vibrating piece. A lid wafer is prepared on which multiple respective lids are formed, each sized substantially similarly to the respective frames. A base wafer is prepared on which multiple of bases are formed, each sized substantially similarly to the respective frames. Each base has through-holes. Stripes of a first bonding film are formed on both major surfaces of the piezoelectric wafer around the periphery of each frame. Stripes of a second bonding film are formed on the inner major surface of the lid wafer, corresponding to respective stripes of the first bonding film. Stripes of a third bonding film are formed on the inner major surface of the base wafer, corresponding to respective stripes of the first bonding film.

Abstract: Disclosed herein is a manufacturing method for a ceramic heater. The manufacturing method includes the step of manufacturing a sintered ceramic substrate using a ceramic material and forming a conductive through hole in the ceramic substrate, the step of screen printing low temperature firing paste on the ceramic substrate, thus forming a heating wire, the step of screen printing Ag paste on the through hole, thus forming an electrode, the step of joining, using heat and pressure, a green sheet to a surface of the ceramic substrate on which the heating wire is formed, the step of firing the joined ceramic substrate and green sheet at low temperature, thus manufacturing a substrate body, and the step of brazing the lead wire to the electrode of the substrate body using filler metal while the lead wire is exposed to atmosphere.

Abstract: To permanently apply lead terminals to corresponding electrodes of electronic or electro-optic components, the following steps are carried out: a. providing a frame including at least one tensioned wire, b. providing a holding jig including at least one seat in which a respective one of the components can be removably and temporarily retained, c. applying the components to the seats with the respective electrodes aligned along a respective longitudinal direction; in this way a row of aligned components is obtained, each component having a corresponding electrode aligned to the subsequent one in the row, d. applying the holding jig to the frame and orienting the same so that the longitudinal direction corresponds to the direction of the tensioned wire, the tensioned wire being thereby brought substantially in contact with (all) the electrode(s) aligned to each other on a corresponding row of components, e.

Abstract: The present invention's composite-to-metal attachment methodology—bolt-free and adhesive-free—features the implementation of an intermediary structure containing metallic fibrous material. The intermediary structure couples a first adherend (which contains nonmetallic fibrous material) with a second adherend (which contains metallic nonfibrous material). The intermediary structure's fibrous attribute is availed of for effecting its co-cure attachment to the first adherend. The intermediary structure's metallic attribute is availed of for effecting its weld attachment to the second adherend. According to typical inventive practice, respective panels of the first adherend and the intermediary structure are arranged and connected so as to describe a stepped configuration at the interface between the first adherend and the intermediary structure. The first adherend and a first portion of the intermediary structure are co-impregnated with a uniform resinous system and are co-cured.

Abstract: A simple method is provided for protecting slider mounted read/write transducers from electrostatic discharge damage during the manufacture of disk drives. The method involves placing a ball of conducting thermoplastic resin, such as a gold or silver epoxy, between the terminal pads of the transducer and using the ball to shunt the pads to read-head shields and the slider substrate and thence to ground. The epoxy ball is easily applied and easily removed and can be used at different stages in the manufacturing process.

Abstract: A method of manufacturing a ceramic/metal composite structure includes the steps of: performing a multi-stage pre-oxidizing process on the copper sheet; placing the copper sheet on a ceramic substrate; and heating the copper sheet and the ceramic substrate to a joining temperature to join the copper sheet and the ceramic substrate together to enhance interface strength between the copper sheet and the ceramic substrate according to the multi-stage pre-oxidizing process. The multi-stage pre-oxidizing process includes a first stage of pre-oxidizing process and a second stage of pre-oxidizing process, and the first and second stages of pre-oxidizing processes are performed in atmospheres with different oxygen partial pressures and at different temperatures.

Abstract: The present invention provides a bonding method in which a bonded portion having a sufficient bonding strength can be obtained at a relatively low temperature, for example, in die bonding a semiconductor chip. A metal paste 20 was applied to a semiconductor chip 10, the metal paste 20 consisting of metal powder of one or more kinds selected from gold powder, silver powder, platinum powder, and palladium powder having a purity not lower than 99.9 wt % and an average particle diameter of 0.005 ?m to 1.0 ?m and an organic solvent. After being applied, the metal paste 20 was dried in a vacuum in a dryer. The chip was heated at 230° C. for 30 minutes to sinter the metal paste, by which a metal powder sintered compact 21 was formed. Next, a nickel plate 30 was placed on the semiconductor chip 10, and bonded to the semiconductor chip 10 by heating and pressurization.

Abstract: A composite body which can withstand high thermal stresses is formed by high-temperature soldering at least a part of a high-temperature-resistant, metallic or nonmetallic component and at least a part of a high-temperature-resistant, nonmetallic component. Prior to soldering, a metallic barrier layer, which is impervious to the solder melt, of one or more elements selected from the group consisting of V, Nb, Ta, Cr, Mo, W, Ti, Zr, Hf and alloys thereof, is deposited on that surface of each nonmetallic component which is to be soldered. Solder material, barrier layer and soldering conditions are adapted to one another in such a manner that during the soldering operation the metallic barrier layer remains at least partially in the solid state, so that after the soldering operation it is still present in a thickness of at least 10 ?m at least over the majority of the soldering surface.

Abstract: This invention provides methods and systems for brazing. One aspect of the invention provides a method of brazing cutter teeth. The method includes providing a bit body, pressing at least one cutter against the bit body with a spring device, placing the bit body and the at least one cutter in an inert gas filled chamber with about 10% H2, and heating the chamber to a temperature above the melting point of the filler metal thereby melting the filler metal. A quantity of filler metal is held between each of the at least one cutters and the bit body.

Abstract: A method of packaging a semiconductor component with a printed wiring board is disclosed. The method includes determining a first distance, applying a thin film onto a surface of the semiconductor component such that the thin film is spaced apart from a support of the semiconductor, applying a solder pad onto the printed wiring board, placing the semiconductor component with the thin film onto the printed wiring board, and positioning the thin film adjacent the solder pad.

Abstract: A semiconductor device is provided in which a semiconductor chip is bonded to a substrate with a sufficiently increased bonding strength and cracking is assuredly prevented which may otherwise occur due to heat shock, heat cycle and the like. The semiconductor device includes a semiconductor chip and a substrate having a bonding area to which the semiconductor chip is bonded via a metal layer. The metal layer includes an Au—Sn—Ni alloy layer and a solder layer provided on the Au—Sn—Ni alloy layer. Undulations are formed in an interface between the Au—Sn—Ni alloy layer and the solder layer.

Abstract: A metal/composite joint. An illustrative embodiment of the metal/composite joint includes a metallic component, a composite component provided in engagement with the metallic component, an engagement region defining contact between the metallic component and the composite component and a plurality of attachment projections joining the metallic component and the composite component. The attachment projections may be non-uniformly distributed along the engagement region. A method of joining a metallic component and a composite component is also disclosed.

Abstract: Nano-structured interconnect formation and a reworkable bonding process using solder films. Large area fabrication of nano-structured interconnects is demonstrated at a very fine pitch. This technology can be used for pushing the limits of current flip chip bonding in terms of pitch, number of I/Os, superior combination of electrical and mechanical properties as well as reworkability. Sol-gel and electroless processes were developed to demonstrate film bonding interfaces between metallic pads and nano interconnects. Solution-derived nano-solder technology is an attractive low-cost method for several applications such as MEMS hermetic packaging, compliant interconnect bonding and bump-less nano-interconnects.

Abstract: A method is disclosed for mechanically bonding a metal component to a ceramic material, comprising providing a metal component comprising an anchor material attached to at least a first portion of one surface of the metal component; providing a ceramic material having a first surface and a second surface, wherein the ceramic material defines at least one conduit extending from the first surface to the second surface, wherein the at least one conduit has a first open end defined by the first surface, a second open end defined by the second surface, a continuous sidewall and a cross sectional area; positioning the ceramic material such that at least a portion of the at least one conduit is in overlying registration with at least a portion of the anchor material; and applying a bonding agent into at least a portion of the at least one conduit.

Abstract: A method of joining or repairing metal surface structures. Joinder and/or repair of metal or metal-polymer laminate panels may be carried out using so-called “cold metal transfer” gas metal arc welding techniques. Moreover, suitable zinc-copper-aluminum alloys may improve weldability, durability and strength. The reduced thermal input permits effective weld formation at the metal sheet layers without giving rise to temperature gradient sufficient to significantly damage the interior elements.

Abstract: A method for creating a soldered joint to contacts of a piezoelectric actuator and polarizing the piezoceramic layers of the piezoelectric actuator has the steps of Polarization and soldering of the joint which are performed simultaneously such that the duration of the process is reduced.

Abstract: A process for soldering an electronic component onto a support which includes at least one heat drain for the component. The method uses a solder paste which incorporates a stripping flux activated at a first temperature, and a solder alloy melted at a second temperature. The process includes preheating the support on the face opposite the component through the heat drain up to the first temperature, placing the component on the support with the solder paste, heating the component by applying a hot gas at a sufficiently high temperature to bring the solder alloy to the melting temperature.

Abstract: A simple method is provided for protecting slider mounted read/write transducers from electrostatic discharge damage during the manufacture of disk drives. The method involves placing a ball of conducting thermoplastic resin, such as a gold or silver epoxy, between the terminal pads of the transducer and using the ball to shunt the pads to read-head shields and the slider substrate and thence to ground. The epoxy ball is easily applied and easily removed and can be used at different stages in the manufacturing process.

Abstract: A cutting tip for a drilling tool includes a cemented carbide cutting base 11, a diamond element 12 supported by the cutting base 11, and a bonding layer formed between the cutting base 11 and the diamond element 12 in order to bond them. The bonding layer 13 includes diffusion layers S1 and S2 in which one or two or more metals selected from a group consisting of Fe, Ni, Co, Ti, Zr, W, V, Nb, Ta, Cr, Mo, and Hf diffuses into at least one of the cemented carbide or the diamond.

Abstract: The present invention relates to a WLP fabrication method capable of welding a lid wafer with a device wafer by using laser illumination. The WLP fabrication method can rapidly weld bonding metal strips of device and lid wafers with each other in order to couple the lid wafer with the device wafer while sealing an internal cavity from the outside without giving any thermal effect to a drive unit in the device wafer.

Abstract: The electrodes are formed by surface coating and cold compression on metal strips. They are then assembled, by hot pressing, with an electrolytic membrane. The metal strips are then removed, preferably by mechanical detachment. Current collectors are then formed on each of the electrodes by PVD type techniques that are conventional in microelectronics. The resulting thin micro-battery with high surface capacity can then be integrated in an integrated circuit, in particular by bonding by means of indium connecting balls.

Abstract: The invention relates to a process for the metallization with a silicon alloy melting at a temperature T1 of certain zones of the surface of a part made of an oxide ceramic unable to be wetted by the said alloy, the said process comprising, in succession, a step of depositing carbon on the said zones of the said part that are to be metallized, a step of depositing the silicon alloy in solid form on at least one portion of the said part, so that the said alloy has at least one point of contact with the said zones to be metallized, followed by a heating step at a temperature greater than or equal to T1, the said alloy gathering in the molten state on the said zones to be metallized. This process applies also to the brazing of parts, at least one of which is a part made of an oxide ceramic unable to be wetted by the said alloy. Application of the said processes to the fields of electronics, electrical engineering, thermal engineering and chemical engineering.

Abstract: A method for assembling an electrical circuit apparatus that includes; a substrate having a top side, a ground layer, at least one thermal aperture, and at least one solder aperture; a heat sink; and an adhesive layer for mechanically coupling the heat sink to the ground layer of the substrate, the adhesive layer having at least one aperture wherein aligning the at least one substrate solder aperture with the at least one adhesive layer aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.

Abstract: A method of connecting a metal (1) with a ceramic material (2) comprises the steps of providing a through-hole (3) in the ceramic material and positioning the metal (1) to be connected to the ceramic material (2) proximate to the ceramic material (2) with the through-hole (3). Subsequently, the metal (1) is melted (7) proximate to the through-hole (3). A pressure difference prevails between the side of the ceramic (2) remote from the metal and the side of the metal (1) remote from the ceramic material (2). A larger pressure prevails at the side of the metal (1) remote from the ceramic material (2). The pressure difference causes the melt (7) to be pressed into the through-hole (3) in the ceramic material (2). The through-hole (3) has such a shape that, after solidification, the solidified material (14) and the through-hole (3) have a complementary locking form.

Abstract: A metal plate (126) has a plurality of openings (127) extending through it, and is cleaned using a wet hydrogen process (157). Glass windows (106) are then placed in the openings, and are each fused to the metal plate by heat (231) in a manner so that each window projects outwardly on each side of the plate. Both sides of each window are then simultaneously ground and polished (232). Exposed surfaces of the metal plate are electroplated with nickel and gold (236). One or more coatings (41, 46, 47) are applied to one or both sides of each window. Several sections are then cut from the assembly, each of which can serve as a lid (17) for an optical apparatus (10).

Abstract: Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.

Abstract: A material and method for adhering at least two materials that includes the step of interposing at least one intermediate layer between the two materials and associated adhesion material. The materials to be adhered exhibit at least one characteristic dissimilarity and the intermediate material interposed contains at least one shape memory alloy, the shape memory alloy capable of exhibiting -superelasticity.

Abstract: The present invention comprises a method of manufacturing a brazed body. The method comprises forming a multi-layer assembly comprising: a first material capable of forming a first oxide and having a melting temperature higher than 660° C.; a first reducing metal adjacent the first material, the reducing metal capable of reducing at least a portion of the first oxide on the first material a braze adjacent to the reducing metal; and a second material adjacent the braze, the second material comprising a material having a melting temperature higher than 660° C. The method then comprises creating a vacuum around the assembly, and heating the assembly to melt the reducing metal and the braze. The assembly is then subject to cooling to thereby form the brazed body.

Abstract: The invention relates to a composite sheet material for brazing, the composite sheet material having a structure comprising an aluminium or aluminium alloy substrate on at least one side coupled to a layer comprising a polyolefin/acrylic acid copolymer as a carrier filled with brazing flux material, and optionally also with a metal powder, in an amount sufficient to achieve brazing. The invention further relates to a method of manufacturing composite sheet material for brazing, which method comprises the steps (a) mixing the polyolefin/acrylic acid copolymer with the brazing flux material and/or metal powder, and (b) applying to at least one surface of the metal substrate a mixture of said copolymer filled with the brazing flux material and/or metal powder, in an amount sufficient to achieve subsequent brazing.

Abstract: A method of joining a ceramic matrix composite rocket nozzle to a metal manifold is provided, wherein a silicon nitride insert is disposed inside the ceramic matrix composite rocket nozzle and the metal manifold to provide a joint therebetween. The silicon nitride insert is preferably co-processed with the ceramic matrix composite rocket nozzle such that the ceramic matrix provides a bond between the rocket nozzle and the insert. The metal manifold is then secured to the silicon nitride insert, preferably using brazing, to form a joint assembly.

Abstract: A preferred sputter target assembly (10, 10′) comprises a target (12, 12′), a backing plate (14, 14′) bonded to the target (12, 12′) along an interface (22, 22′) and dielectric particles (20, 20′) between the target (12, 12′) and the backing plate (14, 14′). A preferred method for manufacturing the sputter target assembly (10, 10′) comprises the steps of providing the target (12, 12′) and the backing plate (14, 14′); distributing the dielectric particles (20, 20′) between mating surfaces (24, 26) of the target (12, 12′) and the backing plate (14, 14′), most preferably along a sputtering track pattern on one of the mating surfaces; and bonding the target (12, 12′) to the backing plate (14, 14′) along the mating surfaces (24, 26).

Abstract: A method of manufacturing a joint between metal and a ceramic substrate for a high temperature sensor. First, a predetermined hole is formed in the ceramic substrate to serve as a joint portion. A bonding layer is preferably disposed on the ceramic substrate to form on the inner surface and the surrounding portion of the hole. Next, the hole is filled with a supporting metal. Then, a conductive layer is formed on the supporting metal and the bonding layer. A metal signal conductive frame is then formed on the conductive layer. Next, a welding spot is formed through the metal signal conductive frame, the conductive layer and the supporting metal at the joint portion by a welding process.

Abstract: A method of interconnecting a pair of metal oilfield tubulars having complementary tapered edges (3, 6) with a common contact surface when the tubulars are interconnected, is provided. The method comprises providing the tapered edge of at least one of the tubulars at the common contact surface thereof with a thin layer of a metal having a melting temperature lower than the melting temperature of the tubulars, interconnecting the tubulars whereby the thin layer of metal is in between the tubulars, applying heat to the thin layer of metal so as to melt the thin layer of metal, and cooling the tapered edges whereby a metallurgical bond is created between the tubulars.

Abstract: The invention proposes a paste for welding ceramic materials to metallic contact surfaces or metals, which contains a noble metal, an aluminum compound, a silicon compound, and a compound selected from the group of the barium compounds, calcium compounds, and magnesium compounds. Along with these, a binder, a solvent, a softener, a thixotropic agent, and a dispersing agent can also be added to the paste. A paste of this kind is used to produce a welded joint between ceramic materials and a metallic contact surface, the paste preferably being printed onto the ceramic material. The ceramic material is then sintered with the paste, and then the metallic contact surface or a metal is welded on.

Abstract: A composite material is produced by a method where an adhesive composition which comprises a particulate material that reduces thermal stress and a brazing material containing a noble metal element as a base, wherein the adhesive composition can bond two or more kinds of different members to form a composite member with sufficient bond strength to avoid causing damages, such as cracks that occur on the side of the member that is weak against thermal stress, and also by a method to produce a composite member comprised of two or more kinds of different members, in which either the adhesive composition is used or the bonding portion of the different members is filled with the particulate material that reduces thermal stress, and then a molten brazing material is poured there into, and cooled to bond the members.

Abstract: A heat sink made of aluminum having both high strength and heat dissipation performance together is manufactured. In a method of manufacturing a heat sink made of aluminum by brazing a plurality of fins 13 on a heat dissipating substrate 11, the fin 13 comprises an Al—Mg—Si series alloy containing from 0.3 to 0.7% by weight of Mg, from 0.3 to 0.7% by weight of Si and the balance of Al and inevitable impurities, and is put to cooling at a rate of 50° C./min or more in a range from 450-500° C. to 300° C. in the cooling process after heating for brazing and, subsequently, artificial aging is applied at 100 to 250° C.

Abstract: A large dimension hollow body such as a fuel tank is formed from cold deformable sheet metal by cutting a sheet metal blank of a conformation matching the hollow structure to be formed and which has a nonuniform cross section between its ends. The sheet metal blank is then formed into a three-dimensional shape closed at one end and subjected to hydrostatic forming, whereupon the other end is closed optionally after insertion of an object to be received in the tank such as a fuel pump. The welding of the edges of the blank together and the application of the caps can produce pressure-tight weld seams and can be effected by laser-beam welding or tungsten inert gas welding.

Abstract: A process for sealing a ceramic filter by infiltrating a metal into an end of the filter. The process includes the steps of contacting the end of a porous ceramic filter with a molten metal, whereby the metal enters into the ceramic matrix to substantially fill the void space. The ceramic filter is cooled to form a filter having a ceramic-metal composite portion. The present invention also provides a filter having an infiltrated metal seal. Methods for joining infiltrated ends are also provided.

Abstract: The present invention is directed to a means for the surface preparation of a metal or metal alloy substrate. In the process of the present invention, a stream of a mixture of flux particles and metal particles is hurled at the substrate at velocities effective for flux adhesion to the surface. The velocities of the particle stream is adjusted so that the flux particles adhere to the surface and the metal particles bounce off the surface. At higher temperatures and velocities, the metal particles are co-deposited with the flux.