Means To Bond By Applying Only Pressure (e.g., For Cold Welding, Etc.) Patents (Class 228/3.1)
  • Patent number: 11806815
    Abstract: A welder containing a weld part, a clamp and a number of tools that is for welding metal wires end-to-end to one another. The tools have a tool indicator that is either in complete or in non-complete condition, and can be processing tools used to finish the weld or testing tools allowing testing the weld once finished. Before starting the welding the first metal wire is held in the clamp. By that action all tool indicators are set to the non-complete condition. When a processing tool has been used, its processing tool indicator is set to complete. When the weld has passed the specification of a testing tool, the testing tool indicator is set to complete. When each processing and testing tool indicator is set to complete the clamp will open. In this case it is sure that the operator has done all necessary steps and checks on the weld.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: November 7, 2023
    Assignee: NV BEKAERT SA
    Inventors: Badgujar Bhushan, Santosh Hadawale
  • Patent number: 9950409
    Abstract: A clamping device has a clamp and a removable handle. A pair of clamping arms is on the clamp. A pivoting device includes a clamp bushing linked with each of the clamping arms of the pair of clamping arms to move the pair of arms between an opened and closed position. The removable handle couples with the clamp bushing. The removable handle includes a release mechanism to actuate the pivot mechanism to move the clamping arms between the open and clamped positions.
    Type: Grant
    Filed: February 8, 2016
    Date of Patent: April 24, 2018
    Assignee: Delaware Capital Formation, Inc.
    Inventors: Thomas M. Grobbel, Ken Hagan
  • Patent number: 9214446
    Abstract: The present invention is directed to provide a method of manufacturing an optical module in which optical devices are optically aligned with high precision regardless of elastic return of bonding bumps. The invention provides a method of manufacturing an optical module including the steps of forming bumps for bonding made of metal on a substrate, and bonding a second optical device on the bonding bumps by applying a load so that the bumps for bonding are deformed only by a predetermined amount from a position where a first optical device and the second optical device are optically coupled most efficiently and, after that, releasing the load.
    Type: Grant
    Filed: March 16, 2012
    Date of Patent: December 15, 2015
    Assignee: CITIZEN HOLDINGS CO., LTD.
    Inventor: Kaoru Yoda
  • Patent number: 8978961
    Abstract: The method is used to produce connecting elements (1). The connecting elements (1) are intended for coupling functional elements for applications in the field of oil drilling technology. The connecting element comprises two end pieces (2, 3) and at least one spacer (4) connecting the end pieces to each other. At least one spacer (4) is connected to at least one of the end pieces (2, 3) by pressure welding.
    Type: Grant
    Filed: July 18, 2009
    Date of Patent: March 17, 2015
    Assignee: Blohm + Voss Oil Tools GmbH
    Inventors: Jens Lutzhöft, Jörn Grotherr, Christian Hoffmann, Heiko Junge
  • Patent number: 8899084
    Abstract: A method of welding two workpieces together is described. A conductor in electrical communication with a pulse circuit is provided. A portion of the second workpiece is located adjacent the conductor. The two workpieces are also located together. A portion, or all, of one workpiece is welded to the other by applying a pulse current to one of the workpieces. A method of forming a workpiece is disclosed using a pulse current to move the workpiece into a desired shape.
    Type: Grant
    Filed: October 9, 2012
    Date of Patent: December 2, 2014
    Assignee: Dana Automotive Systems Group, LLC
    Inventors: Boris A. Yablochnikov, Eve S. Steigerwalt, Tom O'Neil, Jack A. Kummerow
  • Patent number: 8608048
    Abstract: A method of room-temperature bonding a plurality of substrates via an intermediate member, includes: forming the intermediate member on a surface to be bonded of the substrate by physically sputtering a plurality of targets; and activating the surface to be bonded by an ion beam. In this case, it is preferable that the target composed of a plurality of types of materials is physically sputtered. Since the materials of the intermediate member are sputtered from the plurality of targets arranged in various directions from the surface to be bonded of the substrate, the intermediate member can be uniformly formed on the surface to be bonded. Further, since the intermediate member is composed of the plurality of types of materials, the room-temperature bonding of substrates difficult to bond together when an intermediate member is composed of a single type of material can be performed without heating and excessively pressing the substrates during bonding.
    Type: Grant
    Filed: May 6, 2011
    Date of Patent: December 17, 2013
    Assignees: Mitsubishi Heavy Industries, Ltd., National Institute of Advanced Industrial Science and Technology
    Inventors: Takayuki Goto, Jun Utsumi, Kensuke Ide, Hideki Takagi, Masahiro Funayama
  • Patent number: 8376206
    Abstract: A cold weld is formed in a multilayer-material. A first pin is coupled to a first block. A second pin is coupled to a second block. The multilayer material is disposed between the first pin and the second pin. The first pin opposes the second pin. The multilayer material is held in the XY plane and floats in the Z axis.
    Type: Grant
    Filed: October 18, 2011
    Date of Patent: February 19, 2013
    Assignee: Medtronic, Inc.
    Inventors: Christian S. Nielsen, Timothy T. Bomstad, Anthony M. Chasensky
  • Publication number: 20120125978
    Abstract: A cold weld is formed in a multilayer-material. A first pin is coupled to a first block. A second pin is coupled to a second block. The multilayer material is disposed between the first pin and the second pin. The first pin opposes the second pin. The multilayer material is held in the XY plane and floats in the Z axis.
    Type: Application
    Filed: October 18, 2011
    Publication date: May 24, 2012
    Applicant: Medtronic, Inc.
    Inventors: Christian S. NIELSEN, Timothty T. BOMSTAD, Anthony M. CHASENSKY
  • Patent number: 8038048
    Abstract: A cold weld is formed in a multilayer material. A first pin is coupled to a first block. A second pin is coupled to a second block. The multilayer material is disposed between the first pin and the second pin. The first pin opposes the second pin. The multilayer material is held in the XY plane and floats in the Z axis.
    Type: Grant
    Filed: August 30, 2005
    Date of Patent: October 18, 2011
    Assignee: Medtronic, Inc.
    Inventors: Christian S. Nielsen, Timothy T. Bomstad, Anthony M. Chasensky
  • Patent number: 7959057
    Abstract: A tool for assembling a part made of a ferromagnetic material with a part made of a paramagnetic material. The tool includes a first tool part including a first abutment and a first electromagnetic coil. The tool also includes a second part including a second abutment, wherein the second part is mechanically assembled with the first part such that the first and second abutments are selectively attracted or repelled with respect to each other. The first electromagnetic coil is used for generating an electromagnetic flux that enables the paramagnetic part to be pushed towards the second abutment and/or the ferromagnetic part to be attracted thereto when the first and/or second part is placed between the first and second abutments.
    Type: Grant
    Filed: March 28, 2006
    Date of Patent: June 14, 2011
    Assignee: Renault S.A.S.
    Inventor: Bernard Criqui
  • Publication number: 20110095072
    Abstract: A press apparatus includes a mounting table and a pressing member. A workpiece formed of a plurality of laminated core sheets is placed on the mounting table, and the pressing member is used for pressing the workpiece on the mounting table from above. The mounting table is supported by a base member so as to be loosely movable in a horizontal plane. When the pressing member is lowered, a positioning member determines the position of the workpiece such that the core sheets of the workpiece are aligned along a single vertical axis.
    Type: Application
    Filed: October 5, 2010
    Publication date: April 28, 2011
    Applicant: TOYOTA BOSHOKU KABUSHIKI KAISHA
    Inventors: Shirou FUJIMURA, Takuma WATANABE, Hajime BANNO
  • Publication number: 20110000953
    Abstract: A laser, aimed at a flyer plate tab, causes optical energy to be directed at the tab, specifically, at a top surface thereof. Energy impacting the tab accelerates the tab out of an initial bent position, straightening it into an impact with a target sheet. The impact occurs in excess of 100 m/s, resulting in a metallurgical bond between the tab and the target sheet. The laser preferably strikes the top surface in a normal direction, based upon an initial angularity of the tab relative to the target. The laser emission, preferably in the range of 1 to 100 Joules delivered in a microsecond, may be augmented by an ablative layer on the top surface or a transparent covering on the top surface that reacts against the expanding gas from ablative activity on the top surface. The weld is formed without physical contact between the welding device and the tab.
    Type: Application
    Filed: March 9, 2009
    Publication date: January 6, 2011
    Applicant: THE OHIO STATE UNIVERSITY
    Inventors: Glenn S. Daehn, John C. Lippold
  • Publication number: 20100242843
    Abstract: Tooling systems including a mandrel for receiving, and providing shape to, a metallic deposit applied using a high temperature additive manufacturing device; a metallic cladding applied to the mandrel for reducing contamination of the metallic deposit; and at least one cooling channel associated with the mandrel for removing heat from the system.
    Type: Application
    Filed: March 24, 2009
    Publication date: September 30, 2010
    Inventors: Michael W. Peretti, Timothy Trapp
  • Publication number: 20100206861
    Abstract: A pressure welding method is provided and a pressure welding machine (1) is provided with a frame (10), two welding heads (13, 14), mobile along a feed axis (41), and two adjusting units (17, 18). The adjusting units (17, 18) include feed drives (23) for the welding heads (13, 14). The two adjusting units (17, 18) are mounted so as to be axially movable (41) on the frame (10) and are interlinked with an adjusting drive (25) by means of a common adjusting element (26) and supported in a closed system of forces while receiving the pressure welding forces, thereby relieving the frame (10). The common adjusting element (26) is configured as a continuous spindle (27) having two self-locking threads (28, 29) that run in opposite directions.
    Type: Application
    Filed: April 27, 2010
    Publication date: August 19, 2010
    Inventors: Frank RUDOLPH, Thomas Hauck, Harald Meyer, Klaus Schneider, Manfred Menzinger, Otmar Fischer
  • Publication number: 20100140328
    Abstract: A first sheet, includes, but is not limited to at least one attachment region inclined at an angle to a sheet plane. The first sheet is arranged on a second sheet so that the attachment region of the first sheet is spaced at a distance from the second sheet. A magnetic field pulse is applied so as to cause a force on the attachment region in directions generally perpendicular to the first sheet plane and the second sheet plane so that the attachment region of the first sheet is driven against the second sheet with sufficient force to produce a cold-welded joint between the attachment region of the first sheet and the second sheet.
    Type: Application
    Filed: December 18, 2007
    Publication date: June 10, 2010
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
    Inventor: Sven Ove Olsson
  • Publication number: 20100089978
    Abstract: An improved apparatus for bonding semiconductor structures includes equipment for treating a first surface of a first semiconductor structure and a first surface of a second semiconductor structure with formic acid, equipment for positioning the first surface of the first semiconductor structure directly opposite and in contact with the first surface of the second semiconductor structure and equipment for forming a bond interface between the treated first surfaces of the first and second semiconductor structures by pressing the first and second semiconductor structures together. The equipment for treating the surfaces of the first and second semiconductor structures with formic acid includes a sealed tank filled partially with liquid formic acid and partially with formic acid vapor. Opening an inlet valve connects the tank to a nitrogen gas source and allows nitrogen gas to flow through the tank. Opening an outlet valve allows a mixture of formic acid vapor with nitrogen gas to flow out of the tank.
    Type: Application
    Filed: June 10, 2009
    Publication date: April 15, 2010
    Applicant: SUSS MICROTEC INC
    Inventors: EMMETT HUGHLETT, THOMAS PRICE, HALE JOHNSON
  • Patent number: 7677430
    Abstract: A welded metal product includes a first metal plate having a first surface and a second surface opposed to the first surface; and a second metal plate being cold-pressure welded with the second surface of the first metal plate by directly pressing the first metal plate with the die. The first surface has a recess portion which is deformed by directly pressing with a die. A hardness of the first metal plate is greater than a hardness of the second metal plate.
    Type: Grant
    Filed: July 21, 2005
    Date of Patent: March 16, 2010
    Assignees: Autonetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd., Sumiden Asahi Industries, Ltd.
    Inventors: Kunihiko Watanabe, Toshiaki Suzuki, Shiko Kodama
  • Publication number: 20090263598
    Abstract: A method for producing a metal tube including arranging at least one metal profile to form at least one channel for conduction of a fluid. The at least one metal profiled is fed into a clad-rolling mill. A first and second portion of the at least one metal profile are clad-rolled to each other, so that the first and the second portions are joined with each other. The first and the second portions form a seal that holds the at least one metal profile together and seals at least part of the channel. A clad-rolling mill is adapted to produce a metal tube and a metal tube.
    Type: Application
    Filed: August 27, 2007
    Publication date: October 22, 2009
    Applicant: LUVATA OY
    Inventors: Mark Irwin, Hans Keife
  • Publication number: 20090050676
    Abstract: A tool for assembling a part made of a ferromagnetic material with a part made of a paramagnetic material. The tool includes a first tool part including a first abutment and a first electromagnetic coil. The tool also includes a second part including a second abutment, wherein the second part is mechanically assembled with the first part such that the first and second abutments are selectively attracted or repelled with respect to each other. The first electromagnetic coil is used for generating an electromagnetic flux that enables the paramagnetic part to be pushed towards the second abutment and/or the ferromagnetic part to be attracted thereto when the first and/or second part is placed between the first and second abutments.
    Type: Application
    Filed: March 28, 2006
    Publication date: February 26, 2009
    Applicant: RENAULT S.A.S
    Inventor: Bernard Criqui
  • Publication number: 20090014498
    Abstract: A compression bonding device capable of packaging electric components on both sides of a substrate is provided. A compression bonding device includes first and second pressing rubbers. Electric components can be simultaneously packaged on the front face and the rear face of a substrate by sandwiching the substrate between the first and second pressing rubbers. The electric components are not subjected to a force for horizontally moving them because the first and second pressing rubbers are prevented from horizontal extension by a first dam member. Thus, the electric components are connected to the substrate without misalignment, thereby obtaining a highly reliable electric device.
    Type: Application
    Filed: August 5, 2008
    Publication date: January 15, 2009
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventor: Takashi Matsumura
  • Publication number: 20080245843
    Abstract: A practical bonding technique is provided for solid-phase room-temperature bonding which does not require a profile irregularity of the order of several nanometers, in which a high-vacuum energy wave treatment and continuous high-vacuum bonding are not required. Since an adhering substance layer is thin immediately after a surface activating treatment using an energy wave, a bonding interface is spread by crushing the adhering substance layer to perform bonding, so that a new surface appears on a bonding surface, and objects to be bonded are bonded together. In order to crush the adhering substance layer more easily, a bonding metal of a bonding portion of the object to be bonded needs to have a low hardness. According to the results of various experiments conducted by the present inventors, it was found that the hardness of the bonding portion which is a Vickers hardness of 200 Hv or less is particularly effective for room-temperature bonding.
    Type: Application
    Filed: January 21, 2005
    Publication date: October 9, 2008
    Applicant: BONDTECH INC.
    Inventors: Tadatomo Suga, Masuaki Okada
  • Publication number: 20080179377
    Abstract: The present invention has as its object the provision of a restoration method for a deteriorated part, which is capable of easily and reliably repairing and restoring a deteriorated part generated in a metal member to reliably prolong the lifetime of the metal member. Specifically, a local heating step of locally heating a deteriorated part C by a main heater 25 and pressure-welding the deteriorated part C by a compression force by thermal expansion and a peripheral heating step of heating the periphery and vicinity of a heated region HA1 in the local heating step by a sub heater 26 are carried out, followed by carrying out a cooling step of cooling the heated region HA1 by the main heater 25 and a heated region HA2 by the sub heater 26 at the same time.
    Type: Application
    Filed: October 19, 2007
    Publication date: July 31, 2008
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Masashi OZAKI, Nobuhiko NISHIMURA, Fumitoshi SAKATA, Masaru KODAMA, Masahiro KOBAYASHI, Akira SHIIBASHI, Hideshi TEZUKA, Ko TAKEUCHI
  • Patent number: 6921013
    Abstract: A pair of metallic components are co-axially aligned prior to full energization of the magnetic pulse welding inductor to provide for improved control of the magnetic pulse welding process. To accomplish this, either or both of the components are supported in a floating manner. An electromagnetic coil is then energized so as to generate a magnetic field of relatively small intensity within or about one of the components. This relatively small intensity magnetic field exerts a relatively small force on the two components, causing them to move to a co-axially aligned position relative to one another and to the coil. Then, while the components are co-axially aligned, they are subjected to a magnetic field of relatively large intensity for the purpose of permanently joining such components together. This relatively large intensity magnetic field exerts a large pressure on one of the two components, causing it to deform toward the other of the two components at a high velocity.
    Type: Grant
    Filed: April 4, 2003
    Date of Patent: July 26, 2005
    Assignee: Dana Corporation
    Inventors: John L. Kichline, Jr., Jason A. Poirier
  • Publication number: 20030084563
    Abstract: To stabilize the form of a letter S of an inner lead after bonding in a method of manufacturing &mgr;BGA·IC in which a chip is fixed via an insulating film on a tape carrier on one main surface of which plural inner leads are laid and each electrode pad of the chip is bonded to each inner lead, when the inner lead is bonded to the electrode pad, first, the chip is supplied in a fixed position for a bonding tool using a sprocket hole of the tape carrier. Next, the respective positions of the inner lead and the electrode pad are recognized using a feature lead and an electrode pad. Afterward, the center line of the inner lead is recognized, the inner lead is touched to the chip by the bonding tool and after the inner lead is pushed in the direction of the base and bent in the form of a letter S, the end of the inner lead is bonded to the electrode pad by thermocompression by the bonding tool.
    Type: Application
    Filed: December 13, 2002
    Publication date: May 8, 2003
    Applicant: Hitachi, Ltd.
    Inventors: Tatsuyuki Ohkubo, Keisuke Nadamoto, Yoshifumi Katayama
  • Patent number: 6513695
    Abstract: A terminal pressure-welding apparatus is provided, which includes: a first pattern; a second pattern facing the first pattern, one of the first and second patterns is provided approachably and disapproachably with respect to the other thereof; a mounting portion to mount the other of the first and second patterns; a displacing member carrying the one of the first and second patterns and being movable relatively to the other of the first and second patterns; and a stopping means to check an abutment of the first pattern and the second pattern, wherein a terminal metal fitting and an end portion of an electric wire are placed between the first and second patterns, and the terminal metal fitting and the end portion are pressure-welded by making the first and second patterns approach each other.
    Type: Grant
    Filed: February 14, 2001
    Date of Patent: February 4, 2003
    Assignee: Yazaki Corporation
    Inventor: Nobuaki Yamakawa
  • Patent number: 6371353
    Abstract: A pressure welding apparatus includes a pressing die assembly 50 which has a plurality of stuffers 54 that pressure-weld electric wires 45 to the pressure-welding parts 34 of contacts 30, and a comb 70. The pressing die assembly 50 has a plurality of pins 60 which are located adjacent to the respective stuffers 54 and which are constantly driven downward by springs 62 so that the pins 60 protrude beyond the lower ends of the stuffers 54. The widths of the respective pins 60 are set so that these widths are substantially equal to the widths of the cavities 16 of the housing 10 in which the contacts 30 are accommodated. As a result, the pins 60 advance into the housing cavities 16 located adjacent to the contact 30 on which pressure-welding is to be performed, and support the housing partition walls 20 from the sides during the pressure welding process.
    Type: Grant
    Filed: March 15, 2000
    Date of Patent: April 16, 2002
    Assignee: Tyco Electronics, Amp, Ltd.
    Inventors: Yuji Ikeda, Koji Imai, Shigeru Isohata, Shinji Amemiya
  • Patent number: 6352787
    Abstract: The invention relates to a method for producing an insulating pack (10), according to which a stack (9) of metallic lamellae is cold-welded simultaneously along a predefined contour and separated from a remaining area. The insulating pack produced according to the invention preferably has a plurality of knobbed and/or perforated aluminium foils (12, 14, 16) and at least one stretch film (18) and is characterized by a narrow welding seam (20) extending along the edge. The insulating pack can be used as an insulating part on its own or loosely inserted into an additional supporting or covering layer. Such insulating parts can be configured in an acoustically active manner and are used in the motor industry, machine industry and/or electronic or computer industry. Means for carrying out the method provided for in the invention provide for the use of a cutting blade with two cutting flanks.
    Type: Grant
    Filed: June 28, 2000
    Date of Patent: March 5, 2002
    Assignee: Rieter Automotive (International)AG
    Inventors: Evelyn Zwick, Alexander Wildhaber
  • Publication number: 20010017312
    Abstract: An upper shearing blade 3 equipped with a protrusion 30 of a triangle-columnar shape and a lower shearing blade 4 equipped with a protrusion 40 of the same shape are applied onto the overlapped portion of metal plates 1 and 2 to be bonded, and then pressed into the metal plates 1 and 2 in an oblique direction inclined with respect to the thickness direction by a stroke in such a range that the metal plates 1 and 2 are not completely cut off. The operating loci of the upper shearing blade 3 and the lower shearing blade 4 are overlapped each other so that one falls inside the other, and the sheared surfaces of the metal plates 1 and 2 are formed into a bonded portion by plastic flow deformation. Therein, since a compressive force is applied onto the portions to be bonded, the portion being defined by the amount of overlap, and the portions are compressed to form a compressed portion after completion of bonding, the bonding strength enhances.
    Type: Application
    Filed: December 14, 2000
    Publication date: August 30, 2001
    Applicant: HITACHI, LTD., POHANG IRON & STEEL CO., LTD.
    Inventors: kenji Horii, Yasutsugu Yoshimura, Tadashi Nishino, Takashi Kamoshita, Takayoshi Tomino, Fuminori Ishikawa, Takao Funamoto, Takashi Mashiko, Kenjiro Narita, Jong-Keun Kim, Ki-Chol Kim, Jong-Sub Lee, Hwang-Kyu Hwang, Jung-Sik Lee, Jin-Hee kim
  • Publication number: 20010015366
    Abstract: A terminal pressure-welding apparatus is provided, which includes: a first pattern; a second pattern facing the first pattern, one of the first and second patterns is provided approachably and disapproachably with respect to the other thereof; a mounting portion to mount the other of the first and second patterns; a displacing member carrying the one of the first and second patterns and being movable relatively to the other of the first and second patterns; and a stopping means to check an abutment of the first pattern and the second pattern, wherein a terminal metal fitting and an end portion of an electric wire are placed between the first and second patterns, and the terminal metal fitting and the end portion are pressure-welded by making the first and second patterns approach each other.
    Type: Application
    Filed: February 14, 2001
    Publication date: August 23, 2001
    Applicant: Yazaki Corporation
    Inventor: Nobuaki Yamakawa
  • Patent number: 6234375
    Abstract: A method and apparatus for permanently joining two or more metallic vehicle frame components using magnetic impulse welding techniques. The vehicle frame may include a pair of similar or dissimilar tubular side rail members in multiple sections joined together by a plurality of transversely extending tubular or “C” of “U” shaped cross members. A plurality of similar or dissimilar material brackets are joined to the side rails and/or cross members to facilitate the attachment of other portions of the vehicle to the vehicle frame. These components are joined via an overlap joint between two individual side rail sections, a cross member section and a side rail section, or a bracket and a side rail section or a cross member section. The first component and the second component, if tubular side rails, are sized so that they may be disposed telescopically with clearance.
    Type: Grant
    Filed: August 22, 1998
    Date of Patent: May 22, 2001
    Assignee: Dana Corporation
    Inventor: Robert D. Durand
  • Patent number: 6193138
    Abstract: A terminal pressure welding device and method are provided. In this improved device and method, a pair of wires are pushed into a space between a pair of barrels by a wire holding member, and the pair of barrels are caulked by lapping one of them on the other by a crimper. At the start of the barrel caulking by the crimper, the wires are fixed to a position between the pair of the barrels by the wire holding member 16, so that an ingress allowance space is ensured for allowing the edge of one of the barrels to get under the other barrel. With this device and method, a terminal can be pressure welded onto even two thick wires as desired, and the pressure welding widths of terminals can be as uniform as possible so that the terminals can surely be inserted into the terminal receiving chambers of a connector.
    Type: Grant
    Filed: September 3, 1998
    Date of Patent: February 27, 2001
    Assignee: Yazaki Corporation
    Inventor: Yoshimi Wada