With Means To Skim Dross Patents (Class 228/34)
  • Patent number: 11342478
    Abstract: In a Sapphire Collector (SC), one or more features, both structural and parametric, are included for capturing the die-size sapphire chips that are removed from a semiconductor structure during die-level laser lift-off (LLO). These features are designed to increase the likelihood that each sapphire chip is securely captured by the Sapphire Collector immediately after it is released from the semiconductor structure.
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: May 24, 2022
    Assignee: Lumileds LLC
    Inventors: Dong Nie, Kian Hock Tee
  • Patent number: 11311967
    Abstract: In a Sapphire Collector (SC), one or more features, both structural and parametric, are included for capturing the die-size sapphire chips that are removed from a semiconductor structure during die-level laser lift-off (LLO). These features are designed to increase the likelihood that each sapphire chip is securely captured by the Sapphire Collector immediately after it is released from the semiconductor structure. The Sapphire Collector includes a vacuum-enhance collector with a pickup element that lifts each released chip into the collector, and air pushers that direct the chips further into the collection tunnel leading to a discard bin.
    Type: Grant
    Filed: July 29, 2015
    Date of Patent: April 26, 2022
    Assignee: Lumileds LLC
    Inventors: Dong Nie, Kian-Hock Tee
  • Patent number: 9232664
    Abstract: A structure including a circuit board including a plane and a pin-in-hole component; and a heat transfer device, where the heat transfer device is thermally connected to the plane at a leading edge of the circuit board, the heat transfer device transfers heat from a wave of molten solder to the plane.
    Type: Grant
    Filed: December 11, 2013
    Date of Patent: January 5, 2016
    Assignee: International Business Machines Corporation
    Inventors: Stephen M. Hugo, Matthew S. Kelly
  • Patent number: 9198300
    Abstract: A wave solder machine is configured to perform a wave solder operation on an electronic substrate. The wave solder machine includes a fluxing station configured to apply flux onto the electronic substrate, a pre-heating station configured to heat the electronic substrate, a wave soldering station configured to attach electronic components to the electronic substrate with solder, and a conveyor configured to transport substrates through a tunnel passing through the fluxing station, the pre-heating station and the wave soldering station. The wave solder machine further includes a flux management system configured to remove contaminants from the tunnel. The flux management system is in fluid communication with the tunnel for passage of a vapor stream from the tunnel through the flux management system and back to the tunnel. Methods of performing a wave solder operation are further disclosed.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: November 24, 2015
    Assignee: Illinois Tool Works Inc.
    Inventor: Jonathan M. Dautenhahn
  • Patent number: 8453915
    Abstract: A solder return apparatus for a wave solder machine that collects solder exiting a nozzle and returns the solder to a solder reservoir while limiting the degree to which the solder can splash onto electronic substrates (e.g., printed circuit boards), components of the wave solder machine, and/or the like. The apparatus includes a mounting section that may be placed over an upper surface of the nozzle and a collection section that collects the solder and returns the solder to the solder reservoir. The collection section includes a trough having an opening in a bottom wall of the trough and a flow control member that can adjust a quantity of solder exiting the trough as well as the velocity of the solder exiting the trough. One or more deflection plates can be mounted so as to extend from the trough into solder in the solder reservoir to further contain the solder and limit the degree to which splashing solder can reach unintended locations.
    Type: Grant
    Filed: October 8, 2012
    Date of Patent: June 4, 2013
    Assignee: Flextronics AP, LLC
    Inventors: Larry Yanaros, Frederick Wagner
  • Patent number: 8424743
    Abstract: A solder return apparatus for a wave solder machine that collects solder exiting a nozzle and returns the solder to a solder reservoir while limiting solder from splashing onto electronic substrates (e.g., printed circuit boards), components of the wave solder machine, and/or the like. The apparatus includes a mounting section that may be placed over an upper surface of the nozzle and a collection section that collects the solder and returns the solder to the solder reservoir. The collection section includes a trough having an opening in a bottom wall of the trough and a flow control member that can adjust a quantity of solder exiting the trough as well as the velocity of the solder exiting the trough. One or more deflection plates can be mounted to extend from the trough into solder in the solder reservoir to further limit splashing solder from reaching unintended locations.
    Type: Grant
    Filed: February 29, 2012
    Date of Patent: April 23, 2013
    Assignee: Flextronics AP, LLC
    Inventors: Larry Yanaros, Frederick Wagner
  • Patent number: 8146792
    Abstract: A solder return apparatus for a wave solder machine that collects solder exiting a nozzle and returns the solder to a solder reservoir while limiting the degree to which the solder can splash onto electronic substrates (e.g., printed circuit boards), components of the wave solder machine, and/or the like. The apparatus includes a mounting section that may be placed over an upper surface of the nozzle and a collection section that collects the solder and returns the solder to the solder reservoir. The collection section includes a trough having an opening in a bottom wall of the trough and a flow control member that can adjust a quantity of solder exiting the trough as well as the velocity of the solder exiting the trough. One or more deflection plates can be mounted so as to extend from the trough into solder in the solder reservoir to further contain the solder and limit the degree to which splashing solder can reach unintended locations.
    Type: Grant
    Filed: March 16, 2010
    Date of Patent: April 3, 2012
    Assignee: Flextronics AP, LLC
    Inventors: Larry Yanaros, Frederick Wagner
  • Patent number: 7959055
    Abstract: In a wave soldering tank using a conventional screw pump, pulsation sometimes occurred in which molten solder spouting from the discharge nozzle moved up and down. The cause of the occurrence of the pulsation in a screw pump was that the gap between the screw pump and the casing was wide, so there was reverse flow through the gap. It is conceivable to narrow the gap, but if the gap is made narrow, the screw pump ends up contacting the casing if the screw pump becomes eccentric. A wave soldering tank according to the present invention makes the diameter of the inlet in the bottom of the casing smaller than the diameter of the screw pump so that reverse flow does not take place even if the gap between the screw pump and the casing is wide. Flow is made more stable by providing outwardly flaring guide walls on the outlet of the casing.
    Type: Grant
    Filed: April 2, 2007
    Date of Patent: June 14, 2011
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Mitsuo Zen, Hirokazu Ichikawa, Satoshi Ozawa
  • Patent number: 7905382
    Abstract: A wave soldering tank is provided on which it is easy to perform maintenance, which does not have fluctuation of the height of spouted solder, which does not damage the rotating shaft of a discharge pump, and which can be stably used for long periods. The wave soldering tank 1 has a tank body 1a which houses molten solder S, a discharge pump 5 which pumps molten solder S, a discharge nozzle 4 which spouts molten solder S which was sent to it by the discharge pump 5 upwards, a duct 2 having the discharge pump 5 installed at one of its ends and the discharge nozzle 4 installed at its other end, an oxidation preventing member 22 which has a prescribed size and which floats on the surface of the molten solder S, and an engaging means 13 which controls rotation of the oxidation preventing member 22 in a horizontal plane.
    Type: Grant
    Filed: April 24, 2007
    Date of Patent: March 15, 2011
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Mitsuo Zen, Hirokazu Ichikawa, Satoshi Ozawa
  • Patent number: 7861915
    Abstract: A process by which molten solder is purified in-situ, making the soldering process more efficient and yielding better results, particularly for lead-free soldering. Lead-free solder becomes practical for use since the temperature for reliable soldering is reduced. A layer of active additive is maintained on the surface of molten solder for scavenging metal oxide from the solder and assimilating metal oxide into a liquid layer. The active additive is an organic liquid having nucleophilic and/or electrophilic groups. As an example, a layer of dimer acid maintained on a wave soldering apparatus scavenges metal oxide from the bath, and assimilates dross that may form on the surface. Scavenging metal oxide cleanses the bath and lowers viscosity of the solder, and PC boards or the like soldered on the wave have reliable solder joints.
    Type: Grant
    Filed: April 18, 2005
    Date of Patent: January 4, 2011
    Assignee: MS2 Technologies, LLC
    Inventors: Lawrence C. Kay, Erik J. Severin, Luis A. Aguirre
  • Publication number: 20090261147
    Abstract: This invention relates to for devices, systems, and methods for separating dross, carried by molten solder, into solder and residue.
    Type: Application
    Filed: April 22, 2008
    Publication date: October 22, 2009
    Inventor: Lambertus Petrus Christinus Willemen
  • Patent number: 7331498
    Abstract: Method for refining and homogeneously distributing alloying partners and for removing undesired reaction products such as oxides and/or slag in or from soft solder during the production of fine solder powder, in which the solder alloy is melted in a high temperature-resistant plant and/or animal oil, the melt is moved to another container of oil with a temperature of at least 20° C. greater than the liquidus temperature, stirred there, and subjected to multiple shear treatments using rotors and stators for forming a dispersion comprising solder balls and oil, from which dispersion the solder balls are separated by means of subsequent sedimentation.
    Type: Grant
    Filed: July 28, 2005
    Date of Patent: February 19, 2008
    Assignee: W. C. Heraeus GmbH
    Inventors: Walter Protsch, Juergen Schulze
  • Patent number: 6948650
    Abstract: When dross is removed from a molten-solder reservoir, a substantial amount of molten solder is often removed with the dross. This molten solder can be separated from the dross and returned to reservoir via a conduit for reuse. Additionally, a skimmer for removing the dross from the reservoir includes a skimming plate pivotally attached to a displaceable structure; a stop is provided to restrict the degree to which the skimming plate can pivot so that the skimming plate will not pivot more than 90° from vertical to enable the skimming plate to dig into the dross and collect dross when the displaceable structure is displaced toward on outlet of the reservoir. Further still, the displaceable structure of the skimmer can be controlled via a computer control system storing software code instructions for a motor to extend and retract the displaceable structure such that the skimming plate extends to a position further from the outlet port of the reservoir with each displacement cycle.
    Type: Grant
    Filed: May 27, 2003
    Date of Patent: September 27, 2005
    Assignee: Speedline Technologies, Inc.
    Inventors: Keith A. Howell, James M. Morris, David M. McDonald, Eric Wayne Becker, Joseph Wayne Brickell
  • Patent number: 6942791
    Abstract: An apparatus and method for eliminating dross in a solder pot of a soldering machine by converting the dross into usable solder. The conversion apparatus is comprised of an impeller, a shroud, an electric motor for driving the impeller, a vacuum source operatively connected to the shroud, an arrangement of guides immersed in the solder pot for recirculating liquid solder and a chemical de-oxidizing agent. The impeller and shroud are adjacent to a free surface of the dross which forms at the top portion of the liquid solder. The method includes the steps of adding a measured amount of de-oxidizing agent to the solder pot, agitating and recirculating the liquid solder/de-oxidizer mixture with the impeller to break-up the dross into smaller particles and separate the solder from the dross, and removing a residue of the dross by suction as the recirculating mixture passes beneath the shroud.
    Type: Grant
    Filed: July 11, 2003
    Date of Patent: September 13, 2005
    Inventors: Radko G. Petrov, Mark Razdolsky
  • Patent number: 6890430
    Abstract: A solder dross removal apparatus includes a holder adapted to be pivotably mounted to a container within which a pool of molten solder is kept at preset temperature. Dross is introduced into the container. A dross cutter assembly includes shafts rotatably supported by the holder and flat elongated cutter elements mounted on the shafts. The cutter elements are disposed perpendicular to the surface of the molten solder and partly submerged in the molten solder when the container is closed by the holder. The cutter elements are angularly offset from each other so that each end of the cutter elements lies on a spiral path. The cutter elements are rotated to repeatedly cut the dross into smaller pieces and force the dross as cut into the molten solder. This process removes oxides from the dross, and any free, reclaimed solder is returned to the molten solder.
    Type: Grant
    Filed: August 5, 2002
    Date of Patent: May 10, 2005
    Assignee: Senju Metal Industry Co., Ltd.
    Inventor: Shohei Mawatari
  • Patent number: 6666370
    Abstract: The invention provides an apparatus that separates solder from solder dross, comprising first and second rolls and a fixture. The first roll has a substantially cylindrical surface and is rotatable about a first longitudinal axis. The second roll has a substantially cylindrical surface and is rotatable about a second longitudinal axis parallel to the first longitudinal axis. The fixture is coupled to the first and second rolls and spaces the second roll apart from the first roll by a first distance, such as 0.001 to 0.015 inches, the first distance sufficient to separate a solder-dross mixture directed between the first roll and the second roll into a liquid solder and a dross powder when the first and second rolls are rotated in opposite directions.
    Type: Grant
    Filed: January 18, 2002
    Date of Patent: December 23, 2003
    Assignee: Speedline Technologies, Inc.
    Inventor: David M. McDonald
  • Patent number: 6592017
    Abstract: An automatic dross removal apparatus, which can be used with a solder wave apparatus, is provided, that generally includes a reservoir having a cavity for containing liquid solder, dross removal apparatus having a first end extending within the cavity of the reservoir for removing dross on the surface of the liquid solder, and a motor engaged with the dross removal apparatus. In one embodiment of the invention, the dross is automatically removed by a conveyor driven by a motor. In another embodiment of the invention, the dross is automatically removed by a motor driven receptacle. Means for moving the dross from one part of the solder reservoir to another, such as a pump, can be included. Preferably, a computer is used to control the automatic dross removal. The dross can be placed in a dross separation device which can include apparatus for processing the dross to remove any remaining solder.
    Type: Grant
    Filed: January 12, 2001
    Date of Patent: July 15, 2003
    Assignee: Speedline Technologies, Inc.
    Inventors: James M. Morris, Scott Willis, David M. McDonald
  • Patent number: 6578752
    Abstract: A method for separating dross floating on solder into solder and a residue, comprising of repeatedly cutting through the dross with at least one knife extending substantially parallel to the direction of movement and removing the residue from the solder. The invention also relates to an apparatus for separating dross floating on solder present in a vessel into solder and a residue, wherein the apparatus comprises at least one knife which is movable along a path extending through the vessel, and wherein the at least one knife is adapted to cut through the dross during the movement along the path. Due to the above stated cutting operation the units of the dross formed by nuclei of solder enveloped by metal oxides are destroyed, whereby the solder enveloped by metal oxides are destroyed, whereby the solder is released and added to the solder already present in the bath, and the released metal oxide will float on the solder. A considerable volume and mass reduction of dross to metal oxide herein takes place.
    Type: Grant
    Filed: April 6, 2001
    Date of Patent: June 17, 2003
    Assignee: Vitronics Soltec B.V.
    Inventor: Lambertus P. C. Willemen
  • Patent number: 6499650
    Abstract: An apparatus and method for recovering solder from dross present on the surface of a molten solder includes a solder reservoir for holding a pool of molten solder, and a solder nozzle disposed in the solder reservoir and adapted to direct a solder wave against a printed circuit board to be soldered. The solder nozzle includes opposite side troughs inclined downwardly toward one side of the solder reservoir to direct dross toward a dross zone. A semicircular hood extends across the solder reservoir and is located above the dross zone. A screw extends across the solder reservoir and is covered by the hood. The screw is activated to agitate the dross so as to remove oxides and recover solder from the dross.
    Type: Grant
    Filed: September 5, 2001
    Date of Patent: December 31, 2002
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Hiroshi Takano, Hirokazu Ichikawa
  • Publication number: 20020027157
    Abstract: An apparatus and method for recovering solder from dross present on the surface of a molten solder where it is exposed to atmospheric air. The apparatus includes a solder reservoir for holding a pool of molten solder, and a solder nozzle disposed in the solder reservoir and adapted to direct a solder wave against a printed circuit board to be soldered. The solder nozzle includes opposite side troughs inclined downwardly toward one side of the solder reservoir to direct dross toward a dross zone. A semicircular hood extends across the solder reservoir and located above the dross zone. A screw extends across the solder reservoir and covered by the hood. The screw is activated to agitate the dross so as to remove oxides and recover solder from the dross.
    Type: Application
    Filed: September 5, 2001
    Publication date: March 7, 2002
    Inventors: Hiroshi Takano, Hirokazu Ichikawa
  • Patent number: 6250537
    Abstract: A self-cleaning soldering thimble assembly includes a thimble and a scraper disposed therein. The scraper is supported by two support rods that extend through the bottom of the thimble. The thimble slides along the support rods. When the thimble is dipped into a solder pot to refill the thimble with solder, the support rods abut the bottom of the solder pot, and the thimble continues to slide down the support rods causing the scraper to scrape away dross on the thimble.
    Type: Grant
    Filed: March 6, 2000
    Date of Patent: June 26, 2001
    Assignee: Delphi Technologies, Inc.
    Inventors: Miguel I. Avila, Oscar Vazquez
  • Patent number: 5934540
    Abstract: A solder immersion chamber in a solder crater/leveler includes a solder manifold having upper and lower solder chambers, from which solder is directed onto the top and bottom surfaces of printed circuit boards conveyed therebetween. The solder immersion chamber has a pair of driven rollers at either end thereof for conveying the printed circuit boards through the solder immersion chamber, and for damming and holding the molten solder within the solder immersion chamber. A pair of oil weirs is provided adjacent either side of the upper solder chamber for continuously flowing oil to flood the top surface of the molten solder in the solder immersion chamber. A skimmer skims oil from the top surface of the molten solder, and returns the separated oil to the pair of oil weirs.
    Type: Grant
    Filed: July 31, 1997
    Date of Patent: August 10, 1999
    Assignee: Teledyne Industries, Inc.
    Inventor: Nicholas J. Scheurich
  • Patent number: 5411197
    Abstract: A flow of waste fused solder, which has been ejected from ejection nozzles 2, 3 but has not been effectively used during a soldering process, is received in troughs 10 provided on either sides of each of the ejection nozzles 2, 3. The flow of waste fused solder, containing therein oxides, is directed through the troughs 10 into a filtration chamber 13 defined in a vessel body 1. The flow of fused solder is filtrated by means of a partition plate 12 as it flows from the filtration chamber 13 into a solder reservoir 14, so that the oxides in the fused solder are removed. The troughs 10 do not become clogged with the oxides in the fused solder, since the top each of the troughs is opened. Due to an appropriate configuration of the partition plate 12, depending upon difference in specific gravity between the fused solder and the oxides, it is possible to effectively remove oxides from the solder ejection vessel.
    Type: Grant
    Filed: October 19, 1993
    Date of Patent: May 2, 1995
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Hideki Nakamura, Tadamichi Ogawa
  • Patent number: 5209782
    Abstract: Apparatus for soldering, leveling and cooling printed circuit panels including a preheater, a fluxer, and soldering, leveling and cooling stations. The cooperation of the soldering, leveling and cooling stations provides for efficient processing of printed circuit panels. The soldering station, which includes a solder immersion chamber through which the panels are conveyed, provides an oil coating on the solder to minimize formation of dross. Automatic replenishment of oil through use of suitable flux on the panels to be soldered provide continuous cleaning of the soldering system to permit extended operation. A cooling table transports the soldered panels on a cushion of air to prevent marring.
    Type: Grant
    Filed: January 25, 1991
    Date of Patent: May 11, 1993
    Assignee: Teledyne Industries, Inc.
    Inventor: Gilbert V. Morris
  • Patent number: 5192014
    Abstract: In a dip soldering apparatus, a first scraper blade scrapes the surface of the solder bath before a pot is raised through the surface of the bath, and a second blade then scrapes the surface of solder in the pot when the pot has been lifted through the surface. The blades are swept around in a circle to facilitate operation of the device. A rotary station for feeding components to the soldering apparatus comprises a rotatable table carrying a plurality of pneumatically operated stations to index them sequentially through operating positions. The air supply lines, for pneumatic control and operation of each station, are discrete to the respective operating positions and so it is not necessary to provide a system of supply lines which rotate with the stations. An end of a supply line is sealed to a conduit in the table by a PTFE sealing member which has an inwardly directed, tapered lip. As air pressure in the line is increased (to operate the station) the lip is urged against the underside of the table.
    Type: Grant
    Filed: October 15, 1991
    Date of Patent: March 9, 1993
    Assignee: Pillarhouse International Limited
    Inventors: Alexander J. Ciniglio, Neil C. Squire
  • Patent number: 5087356
    Abstract: An automatic dross removal apparatus (10) is disclosed for removing dross from the surface of a solder bath (22) in an automated electric component handling system. A rotatable wiper blade (14) is positioned adjacent the solder bath (22) which skims the dross off of the surface prior to the dipping of a robot conveyed component into the bath. An electronic control circuit (34) causes a motor (32) to rotate the wiper arm (14) one full rotational cycle each time a pulse is received from a robot controller (44) as a component approaches the solder bath (22).
    Type: Grant
    Filed: May 16, 1990
    Date of Patent: February 11, 1992
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Winston S. Webb
  • Patent number: 4951597
    Abstract: A roller-type solder coating device for applying a coating of liquid solder to a workpiece. The device has a solder bath tank, a coating roller, and a nozzle connected to a pumping chamber provided in the tank to provide a flow of the solder bath to the coating roller. A trough is positioned underneath the coating roller and similarly connected to the nozzle so as to prevent direct re-entry of the solder delivered from the nozzle into the solder bath. The tank may be sealed and inert gas introduced therein to prevent oxidation of the solder contained within the tank. A second coating roller may be provided so as to permit simultaneous coating of opposite sides of a workpiece during its passage between the coating rollers.
    Type: Grant
    Filed: September 21, 1989
    Date of Patent: August 28, 1990
    Assignee: Fuji Seiki Machine Works, Ltd.
    Inventor: Shigeaki Kataoka
  • Patent number: 4858816
    Abstract: The wave barrier device of the invention comprises a flap which is rigidly joined to the soldering machine. This flap plunges lightly into the molten tin bath and pushes it before the board which is precedes.
    Type: Grant
    Filed: February 29, 1988
    Date of Patent: August 22, 1989
    Assignee: Societe Electronique de la Region Pays de Loire
    Inventor: Bruno Gontier
  • Patent number: 4802617
    Abstract: An improved method and apparatus restricts or limits dross formation in a soldering apparatus where liquid solder overflows such as wave soldering and the like. The improvement comprises a solder receiving tray positioned beneath at least a portion of liquid solder falling from an overflow or solder wave to a reservoir and a level control means limits the maximum solder level in the tray above a dynamic solder level in the reservoir, the solder level in the tray being a predetermined distance below the overflow to limit dross formation thus restricting dross recirculation.
    Type: Grant
    Filed: February 19, 1988
    Date of Patent: February 7, 1989
    Assignee: Electrovert Limited
    Inventor: Carlos A. Deambrosio
  • Patent number: 4755261
    Abstract: An apparatus for vaporizing a liquid and condensing the vapor includes at least one chamber in which the liquid is vaporized and in which the vaporized liquid is condensed. The vaporizing chamber contains a heat emitting device providing a surface temperature above the vapor temperature for substantially instantaneously vaporizing the liquid condensate maintaining a predetermined vapor level in the vaporizing chamber, and a heat absorbing device for condensing the vaporized liquid.
    Type: Grant
    Filed: January 2, 1987
    Date of Patent: July 5, 1988
    Inventors: James W. McCord, Lamont I. Hoppestad, Michael J. Ruckriegel
  • Patent number: 4709846
    Abstract: Apparatus for the continuous hot tinning of printed circuit boards includes conveying rollers for passing the circuit boards through the apparatus, and a trough for accommodating the molten tin, together with nozzles for applying tin from the trough to appropriate locations on the circuit boards. A hollow column is disposed at at least one side and preferably at both sides of the path of conveying movement of the circuit boards through the apparatus, with the open lower end of the or each column dipping into the trough so as to be below the level of the molten tin therein. Tin is pumped from the trough through the columns by pumps at the lower ends thereof, and then to the nozzles arranged above and below the path of conveying movement and directed so as to spray molten tin on to the printed circuit boards. In a process using the apparatus for soldering the connecting pins of components to a circuit board, molten tin from a trough is sprayed against the underside of the board at the appropriate locations.
    Type: Grant
    Filed: October 6, 1986
    Date of Patent: December 1, 1987
    Inventor: Kaspar Eidenberg
  • Patent number: 4509670
    Abstract: A solder station for production dipping of small parts equipped with an automatic dross removal arrangement which consists of a vertically oriented skimmer motor positioned above the solder pot with a long drive shaft extending vertically downward to the pot and a rotating skimmer blade attached to the drive shaft. The skimmer blade rotates slowly and ejects the dross from the top of the solder pot from where it drops down onto a unique sloping dross tray and into a trough from where it may be readily removed. The solder station may be equipped with a forced air filtering system that draws the fumes from the solder pot through a removable filter and expels the filtered air through louvered openings through ducts to the outside. The skimmer motor may be equipped with a friction clutch that prevents damage to the motor in case the rotation of the skimmer should be obstructed. The solder station may have an auxilliary power outlet and thermostatic control of the solder pot temperature.
    Type: Grant
    Filed: April 14, 1983
    Date of Patent: April 9, 1985
    Inventor: Edward Cammarata
  • Patent number: 4256252
    Abstract: A method and apparatus for soldering tubular, metal return bends to the ends of tubes in which the article carrying the tubes with the bends secured thereto is first pivoted around a horizontal axis from a horizontal loading and unloading first position to a second position in which the bends and tube ends are immersed in molten solder in a pot and is then pivoted around such axis into a third position in which the bends are above the ends of the tubes, the solder between the ends of the tubes and the bends being permitted to cool and solidify in the third position. Intermediate the first and second positions and intermediate the second and third positions, pivotally mounted burners heat at least the bends to a temperature at least as high as the melting temperature of the solder, the heating between the second and third positions being for the purposes of causing any solder in the bends to flow out of the bends and of minimizing or eliminating icicles of solder on the bends.
    Type: Grant
    Filed: February 26, 1979
    Date of Patent: March 17, 1981
    Assignee: Thermatool Corp.
    Inventors: Robert D. Huppunen, Robert R. Harriau
  • Patent number: 3980219
    Abstract: A vessel for containing molten solder has a cover movable by a drive so as alternately to uncover and cover the molten slag in the vessel. A slag stripper is also movable by the drive during uncovering movement of the lid to remove slag skin from the molten solder.
    Type: Grant
    Filed: April 16, 1975
    Date of Patent: September 14, 1976
    Assignee: Meteor AG
    Inventor: Hans Schmid