Abstract: The present disclosure provides a semiconductor IC structure having vertical wire bonding and method of making it. The method includes two steps. First step: providing a semiconductor chip, disposing a first solder joint and a second solder joint separately on its surface, disposing a wire bonding pad at the first solder joint, to connect to an internal functioning device of the semiconductor chip, and disposing a dummy pad at the second solder joint. Second step: bonding a metal wire on the wire bonding pad, cutting the metal wire on the dummy pad, and breaking the metal wire by pulling above the wire bonding pad, to obtain a vertical conductive column connected to the wire bonding pad.

Abstract: A soldering apparatus has a soldering iron unit having a soldering tip for carrying out a soldering process to a printed circuit board, a heater unit for heating the soldering iron unit, and a gas supply device for operatively supplying a burning-assist gas to the soldering iron unit, when a cleaning process is carried out for the soldering iron unit. The cleaning process for the soldering iron unit is carried out when the soldering process to the printed circuit board is stopped. In the cleaning process, the soldering iron unit is heated by the heater unit and the burning-assist gas is supplied to the soldering iron unit, so that material attached to the soldering iron unit can be easily burnt out.

Abstract: A robot transferring system of a component and a transferring method thereof are provided. The robot transferring system of a component includes a hanger in which components including at least one of a cowl plate, a roof rail, and a package tray are disposed. A first sensor detects a reference position of the components disposed in the hanger to detect a shape of the component and a first loading robot capture each component based on a predetermined position determined by the sensor. A first loading jig is disposed at a location in which one of the components captured by the loading robot is disposed and a setting robot transfers the components disposed in the loading jig to a vehicle body to dispose the component to a predetermined position of the vehicle body.

Abstract: A clamping device which uses its own weight to apply pressure during a soldering operation to a solderable part or component for attachment to a circuit board is provided. The clamping device includes a base plate and at least one press block which is configured to be arranged on the base plate and is free to move up or down by gravity relative to the base plate. When the gravitational orientation of the clamping device is correct, the press block moves down relative to the base plate and so presses on the solderable part during soldering.

Abstract: The invention relates to a tong system for connecting a drill rod element (12) to an often stationary drill rod element (12) or for disconnecting a drill rod element from another drill rod element (12), wherein the tong system comprises at least two clamping blocks (20, 22), which face each other and are intended to fasten the tong system to the stationary drill rod element (12), and wherein at least one clamping block (20, 22) comprises movable means (30, 32) having a centering contour, which movable means (30, 32) are effective for adjusting the tong system in relation to the stationary drill rod element (12). The invention further relates to a clamping block (20, 22) as a component of such a tong system.

Abstract: A vehicle body manufacturing apparatus includes: side jig frames disposed respectively on the right and left sides of a vehicle body; an upper jig frame installed between the side jig frames, the upper jig frames including a pair of front and rear frame members insertable into the inside of the vehicle body through front and rear openings of the vehicle body, respectively; a connection mechanism that removably connects insertion ends of the pair of frame members; and a clamping mechanism that is held on the upper jig frame and that positions the vehicle body.

Abstract: A system for determining a welding sequence is disclosed. The system may have a welding sequence generator configured to create an initial population of welding sequences based on a user-generated constraint. The system may also have a welding simulator configured to simulate welding for at least one welding sequence in the initial population of welding sequences to model distortion for the at least one welding sequence. The welding sequence generator may be further configured to receive the distortion for the at least one welding sequence in the initial population from the welding simulator, determine whether a merit value derived from at least the distortion for the at least one welding sequence satisfies one or more predetermined criteria, output the at least one welding sequence as a potential welding sequence if the merit value satisfies the predetermined criteria.

Abstract: A slot-die coating apparatus for manufacturing a patterned coating layer (3) on a substrate (1) comprises a substrate carrier (6), a coating device, a sensor facility (70) and a controller (80). The substrate carrier (6) is arranged on a support for providing the substrate (1). The coating device comprises a head-side unit and a support-side unit (50, 55; 52 resp.) that are mutually movable with respect to each other by a motor (52, 56). The head-side unit comprises a translator part (52) and a slot-die coating head (2). The support-side unit (55) comprises a stator part (56) of the motor. The controller (80) controls the motor (52) to position the slot-die coating head at a desired distance (Ds). The support-side unit (55) has a mass that is at least equal to the mass of the head-side unit (50), and the support-side unit (55) is flexibly coupled to the support (60).

Abstract: The invention refers to a feed and load unit serving for feeding or removing one or more work pieces in the machining chamber of a machine tool for machining purposes. For this the feed and load unit comprises at least two work piece carriers movably on a guide path. The work piece carrier serves for picking up at least one work piece. In the guide path a guide path section, angularly or diagonally to the direction of conveying of the work pieces on the guide path, movably by a drive is, provided. The guide path section is able to pick up at least one work piece carrier. The guide path section is shifted for loading and unloading purposes in the direction of the machining chamber.

Abstract: In a method of manufacturing a vehicle body a side structure and a center structure are positioned in place using a fixture or the like, and fixed by welding with maintained accuracy of mounting positions; annular parts along the width of the cabin of the vehicle and other parts are temporarily mounted to be retained without being welded; additional welding is performed on the center structure and the side structure, and the annular parts along the width of the cabin of the vehicle and other parts are positioned in place using a fixture or the like, and are fixed by welding with maintained accuracy of mounting positions; additional welding is performed on the parts; and a roof complex is mounted and fixed by welding with maintained accuracy of mounting positions.

Abstract: A method of forming a wire bond having a free end includes joining an end of a metal wire to a conductive element at a surface of a first component, the end of the metal wire being proximate a surface of a bonding tool adjacent an aperture through which the metal wire extends. A predetermined length of the metal wire is drawn out from the aperture. The surface of the bonding tool is used to plastically deform a region of the metal wire between the surface of the bonding tool and a metal element at the surface of the first component. The bonding tool then applies tension to the metal wire to cause a first portion of the metal wire having the end joined to the conductive element to detach from a remaining portion of the metal wire at the plastically deformed region.

Abstract: A multi-vehicle type co-production line flexible framing is disclosed, comprising a robot welding system, a high speed transport system, a floor panel intelligent flexible positioning system, and a side panel flexible positioning and switching system. The floor panel intelligent flexible positioning system is correspondingly connected to a transfer rail of the high speed transport system. The side panel flexible positioning and switching system comprises a side panel fixture consolidation system, a fixture storage system, and a fixture switching and rail system. The side panel fixture consolidation system corresponds to the side of the floor panel intelligent flexible positioning system. The fixture storage system is arranged on two sides of the side panel fixture consolidation system in the transfer direction of the high speed transport system. The fixture switching and rail system is connected between the side panel fixture consolidation system and the fixture storage system.

Abstract: A vehicle charging system may include a charge receptacle and an alignment pin mounted to a vehicle and a ground station. The ground station may include a guide having a locating region configured to receive the alignment pin and in response to the alignment pin contacting the locating region translate along a track. An electrical connector may be configured to engage the charge receptacle. The electrical connector may be disposed within a housing associated with the guide.

Abstract: A pick tool for picking a planar object from a supply station is presented, in particular to be used for picking a semiconductor die from a carrier tape, said pick tool comprising: a work surface, said work surface comprising at least one contact region that may be brought into contact with a first surface on a first side of the planar object; one or more vacuum outlets in the work surface that may be connected to a vacuum source to allow for temporarily fixing the planar object to the work surface; and wherein a flexible seal is provided to maintain vacuum if the planar object becomes deformed.

Abstract: The invention relates to a method and a device for guiding bands to be joined to one another along their longitudinal edges, comprising guide elements which form tracks for guiding the bands that are configured such that the bands approach one another in the transport direction and the longitudinal edges thereof rest on one another at a non-overlapping contact point. At least one of the tracks may be configured to undulate with a wavelength of ¼???2, such that transverse displacement of the band guided thereon occurs. The axes of rotation and/or longitudinal central axes of the guide elements may also be inclined towards one another at different angles of inclination in relation to a horizontal plane of reference, such that the band guided on said track is rotated about its longitudinal axis in the transport direction.

Abstract: In a method for assembling a component on a motor-vehicle body structure, a device is set with a manipulator into a condition of connection with a component placed in a pick-up position, according to a predetermined mutual positioning; the component is gripped with the device to connect the component thereto; the device connected to the component is carried with the manipulator to a motor-vehicle body structure that is located in a position, on a conveying line, upstream of a centre for welding or fixing the component on the body structure; the component is constrained with the device to the body structure according to a mutual positioning whereby the component comes to occupy the proper position of assembly; the device is supported with the body structure; and with the device supported by the body structure, the body structure is conveyed with the conveying line to the center.

Abstract: A system for assembling a vehicle includes a first assembly line having a plurality of first stations, including a welding station for welding first structural components that define a vehicle body portion. The first structural components are formed of a first material. The second assembly line receives the vehicle body portion from the first assembly line and has a plurality of second stations, including a second welding station where a second structural component is secured to the first structural components. The second structural component is formed of the first material or a second material. The second assembly line is configured such that the second component is one of welded to the first components in the second welding station when the second component is formed of the first material and fastened to the first components in the second welding station when the second component is formed of the second material.

Abstract: A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure configured to support a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; and a calibration tool including a contact portion configured to be positioned between the bonding tool and the support structure, the contact portion configured to be contacted by each of the bonding tool and the support structure simultaneously during a calibration operation.

Abstract: A vehicle body assemble system includes a moving unit loaded with a floor panel of a vehicle body that is configured to move the floor panel to a working place of a main buck process. A robot hanger clamps a side panel transferred to the working place from an inside of the side panel and rotates the side panel accordingly. An arranging jig is disposed on each side portion of the working place and is moveable up and down and arranges the side panel rotated by the robot hanger in an upright position. A side common jig is mounted to a handling robot and clamps the side panel on the arranging jig. Finally, a side post unit is disposed each side of the floor panel, clamps the side common jig, and moves the side common jig to each side of the floor panel.

Abstract: A beverage bottle handling machine construction method for constructing a beverage bottle handling machine, such as a beverage bottle cleaning machine, a beverage bottle treating machine, and a beverage bottle shrink wrapping machine in a beverage bottling plant and container handling machines corresponding to the beverage bottle handling machine. The abstract of the disclosure is submitted herewith as required by 37 C.F.R. §1.72(b). As stated in 37 C.F.R. §1.72(b): A brief abstract of the technical disclosure in the specification must commence on a separate sheet, preferably following the claims, under the heading “Abstract of the Disclosure.” The purpose of the abstract is to enable the Patent and Trademark Office and the public generally to determine quickly from a cursory inspection the nature and gist of the technical disclosure. The abstract shall not be used for interpreting the scope of the claims.

Abstract: A clamping module for a pipe line-up system uses bell crank linkages to transmit pipe alignment and clamping forces between radially moving clamping feet and a central axially moving driving head. The clamping feet are arranged in axially spaced sets to internally engage two pipe sections to be welded independently on either side of a weld zone between the pipe sections, with welding shoes in between the clamping feet and spanning the weld zone. The bell crank linkages provide a force multiplier between the driving heads and the clamping feet.

Abstract: A beverage bottle handling machine construction method for constructing a beverage bottle handling machine, such as a beverage bottle cleaning machine, a beverage bottle pasteurization machine, and a beverage bottle shrink wrap machine in a beverage bottling plant. The abstract of the disclosure is submitted herewith as required by 37 C.F.R. §1.72(b). As stated in 37 C.F.R. §1.72(b): A brief abstract of the technical disclosure in the specification must commence on a separate sheet, preferably following the claims, under the heading “Abstract of the Disclosure.” The purpose of the abstract is to enable the Patent and Trademark Office and the public generally to determine quickly from a cursory inspection the nature and gist of the technical disclosure. The abstract shall not be used for interpreting the scope of the claims. Therefore, any statements made relating to the abstract are not intended to limit the claims in any manner and should not be interpreted as limiting the claims in any manner.

Abstract: In certain embodiments, a system includes a deposition system and a plasma/bonding system. The deposition system deposits a solder outwardly from a substrate of a number of substrates. The plasma/bonding system comprises a plasma system configured to plasma clean the substrate and a bonding system configured to bond the substrates. The plasma/bonding system at least reduces reoxidation of the solder. In certain embodiments, a method comprises depositing solder outwardly from a substrate, removing metal oxide from the substrate, and depositing a capping layer outwardly from the substrate to at least reduce reoxidation of the solder.

Abstract: A method includes placing a plurality of first package components over second package components, which are included in a third package component. First metal connectors in the first package components are aligned to respective second metal connectors of the second package components. After the plurality of first package components is placed, a metal-to-metal bonding is performed to bond the first metal connectors to the second metal connectors.

Abstract: A thermocompression bonding method for mounting semiconductor chips on a substrate comprises: picking up the semiconductor chip with a chip gripper displaceably mounted on a TC bonding head; positioning of the chip gripper above the assigned substrate location; lowering the TC bonding head up to a position in which the chip gripper is deflected by a predetermined distance relative to the TC bonding head; heating of the semiconductor chip to a temperature above the melting point of the solder, so that the deflection of the chip gripper becomes zero again; waiting until the temperature of the semiconductor chip has fallen to a value beneath the melting temperature of the solder, and lifting of the TC bonding head.

Abstract: Disclosed is an apparatus for electrically interconnecting a plurality of solar cells. The apparatus comprises: i) a roller operative to roll along a solar cell to press an electrical conductor against an electrical contact of the solar cell, the electrical conductor being for electrically interconnecting the solar cell with one or more other solar cells; and ii) a heat-generating device arranged and configured to provide heat for soldering the electrical conductor to the electrical contact of the solar cell while the roller is pressing the electrical conductor against the electrical contact of the solar cell. A method of electrically interconnecting a plurality of solar cells, and a mechanism for laying and soldering an electrical conductor onto a solar cell, are also disclosed.

Abstract: A method of aligning electronic components comprising providing a positioning member 110 having at least one formation 120 for receiving an electronic component; said at least one formation having lateral boundaries 35, 36 for constraining movement of an electronic component; placing a first electronic component 10a in said at least one formation; and providing a force for actively aligning said first electronic component with a lateral boundary of said at least one formation. The force may, for example, be provided by tilting the positioning member, by providing suction or by using an actuator. An apparatus for aligning electronic components and a 3D system of stacked electronic components is also disclosed.

Abstract: A linear, serial chip/substrate assembly processing machine for stepwise advancing a pre-assembled chip/die substrate on a support plate through a series of sealable chambers having displacable bottom processing portions. The process begins at a loading station and ends up at an unloading station after various melting and vacuuming of chip/substrate components supported on a device tray through those various chambers to the final joining thereof.

Abstract: A rack feeds sticks of pipe to a machine for serial fusion to the trailing end of a pipeline. Multiple independent spaced apart feeders support transverse bundles of sticks of pipe on beams. Legs which support the beams above the ground have jacks to vary the height and slope of the beams. The slope is set so that sticks tend to roll toward the lower front end of the beam where roller assemblies receive the sticks of pipe as they are manually rolled, one at a time, off the beams. All of the rack components are modular and interchangeably connectable so that the feeder can be quickly adapted for a variety of conditions and applications.

Abstract: An apparatus for aligning a bonding tool of a die bonder with respect to a bond stage is disclosed. The apparatus comprises: a connecting member to which the bonding tool is coupleable such that the connecting member is located between the bonding tool and a main body of a die bonder; and a plurality of actuators engaged to the connecting member. In particular, the plurality of actuators are actuable to rotate the connecting member and the bonding tool relative to the main body of the die bonder about a plurality of axes, to align the bonding tool with respect to the bond stage.

Abstract: A bonding apparatus for conducting bonding on substrates comprises a first substrate holding device for clamping a first substrate during bonding and a second substrate holding device for clamping a second substrate during bonding. Each substrate holding device is operative to move sequentially between its respective onloading position for receiving substrates, bonding position whereat substrates are bonded and offloading position whereat bonded substrates are removed from the substrate holding device. A first actuator is operative to drive the first substrate holding device along a first feeding path from its onloading position to its bonding position and from its offloading position to its onloading position along a first return path. A second actuator is operative to drive the second substrate holding device along a second feeding path from its onloading position to its bonding position and from its offloading position to its onloading position along a second return path.

Abstract: A minute ball array apparatus includes: an array jig including insert parts, into which minute balls are to be inserted, and which are formed in a predetermined pattern; a ball moving unit, which comprises a thrust surface, and which moves the thrust surface along an upper surface of the array jig so as to move the minute balls supplied onto the upper surface of the array jig to drop the minute balls into the insert parts of the array jig; a collapsing member, which is provided in a vicinity of the thrust surface, and which collapses a buildup of the minute balls rising along the thrust surface when the thrust surface is moved by the ball moving unit; and a motion imparting unit that imparts the collapse member with motion for collapsing the rising buildup of the minute balls.

Abstract: A wire bonding apparatus, comprising a bonding tool mounted on a bondhead body which is in turn mounted on a positioning table, is provided for bonding electronic devices. The positioning table has first and second motors coupled to it that are operative to drive the bondhead body to positions along respective first and second orthogonal axes. The bondhead body is connected to the positioning table through a pivot such that the bondhead body is rotatable relative to the positioning table about a third axis which is substantially orthogonal to the first and second axes. Further, a third motor drives the bondhead body to rotate about the third axis.

Abstract: A semiconductor apparatus includes: a first sheet-like member having a light receiving surface of an imaging device and a first connection terminal disposed thereon, the imaging device generating an image by receiving incident light from a light collecting section for collecting external light disposed thereon; a second sheet-like member having a second connection terminal to be connected to the first connection terminal provided thereon; a conductive bonding portion made of a conductive material and bonded with the first connection terminal; and a bonding wire connecting the conductive bonding portion and the second connection terminal, wherein the bonding wire is disposed along the plane of the first sheet-like member such that reflected light from the bonding wire does not impinge on the light receiving surface.

Abstract: A manufacturing equipment for manufacturing an LED light bar includes a reflow oven and a clamping device. The LED light bar includes a printed circuit board and a plurality of LEDs arranged on the printed circuit board. The reflow oven includes a hearth box and a transmitting belt extended through the hearth box. The hearth box includes a heating area and a cooling area in an interior thereof. The clamping device is mounted on the transmitting belt. The clamping device defines a receiving space for receiving the LED light bar therein. The clamping device is changed between a clamping state for maintaining the LEDs in positions and a releasing state whereby the LED light bar can be removed from the clamping device.

Abstract: A device for machining components, in particular of a vehicle body has a transport and positioning unit for the component and several machining stations, which are arranged around said unit and to which the component held by a component holder of the transport and positioning unit can be fed in a position ready for machining. To transport the component from one machining station to the other machining stations while taking up the smallest possible surface area, the transport and positioning unit includes a rotor and a pivoting arm that is mounted eccentrically on said rotor, driven in opposition to the latter and supports the component holder. The drives of the rotor and the pivoting arm are synchronized in such a way that the component holder is displaced along a closed curved path comprising spaces between the neighboring apexes of said path.

Abstract: A flexible semiconductor package apparatus having a responsive bendable conductive wire member is presented. The apparatus includes a flexible substrate, semiconductor chips, and conductive wires. The semiconductor chips are disposed on the flexible substrate and spaced apart from each other on the flexible substrate. Each semiconductor chip has bonding pads. The conductive wires are electrically connected to the bonding pads of the semiconductor chip. Each conductive wire has at least one elastic portion. One preferred configuration is that part of the conductive wire is wound to form a coil spring shape so that the coil spring shape of the conductive wire aid in preventing the conductive wire from being separated from the corresponding bonding pad of the semiconductor chip when the flexible substrate on which the semiconductor chips are mounted are bent, expanded or twisted.

Abstract: The invention relates to a method for producing a ceramic-metal connection that is repeatedly subjected to great changes in temperature during use, in which the metal and ceramic are brazed to one another two-dimensionally.

Abstract: A manufacturing apparatus (2) for components (3), which has at least one movable loading station (20) designed as a tool magazine (13) and having reception points (39) with different tools (4, 5, 6, 7) for different component types A-I. The loading station (20) is connected to one or more machining stations (20, 22?) at which at least one machining device (23) and at least one handling device (24) for handling and releasing the components (3) from the tool (4, 5, 6, 7, 8) are arranged. The selected Figure is FIG. 5.

Abstract: This invention has an object to provide a method for precisely fabricating transportation pallets readily adaptable to model change and other alterations. In the method for fabricating a transportation pallet according to the invention, in which jig mounting plates are fixed on a steel pallet base, projecting pieces having holes to which jigs are attached are provided on one longer side of the jig mounting plates (12, 13) at a predetermined interval, a positioning member is secured on the pallet base, the jig mounting plates are temporarily secured along the positioning member, and the jig mounting plates are welded to be fixed on the pallet base.

Abstract: The invention relates to a device (100) for the connecting of strips to an endless strip with a clamping arrangement (110, 120) with a clamping device (110-r, 120-r) on the inlet side and a clamping device (110-l, 120-l) on the outlet side, a cutting arrangement (155) with an upper cutter (150) and a lower cutter (130) and with a joining arrangement, in which at least the clamping device (110-r, 120-r) on the inlet side and/or the clamping device (110-l, 120-l) on the outlet side is constructed as a premountable unit.

Abstract: This invention has an object to provide a method for precisely fabricating transportation pallets readily adaptable to model change and other alterations. In the method for fabricating a transportation pallet according to the invention, in which jig mounting plates are fixed on a steel pallet base, projecting pieces having holes to which jigs are attached are provided on one longer side of the jig mounting plates at a predetermined interval, a positioning member is secured on the pallet base, the jig mounting plates are temporarily secured along the positioning member, and the jig mounting plates are welded to be fixed on the pallet base.

Abstract: A specialized tool is provided for the removal of components in a microwave module in which a fixed tool having a channeled tip is positioned adjacent the component to be removed, with a hot stream of gas, forced through the channel to the top of the component which serves to heat the component, the component being removed through shearing when the component is forced against the tip.

Abstract: A receiving element which can be introduced into a borehole of at least one component includes a bolt presenting an outer surface that is approximately parallel and advantageously coaxial to a longitudinal axis of the bolt. The receiving element requires few materials and can therefore be produced at a low constructional cost while being provided with high dimensional stability and positioning accuracy. The bold includes an abrasion-resistant sintered material, and a metal tip provided on the front end of the shaft. The end part of the tip is engageable in a recess of the bolt, and there is a direct connection between the end part and the recess in the connection region on the front end of the bolt.

Abstract: A die bonding apparatus is presented which is capable of realizing different semiconductor packages, for example, a face up package and a face down package in a single die bonding apparatus. The die bonding apparatus includes a substrate transportation unit for transporting a substrate. A first bonding head unit is included which has a first bonding head for bonding a semiconductor chip disposed in a mount table adjacent to the substrate transportation unit over the substrate. A die transportation unit is included for transporting the semiconductor chip disposed in a mount table to a mount stage disposed at a lower portion of the substrate. A second bonding head unit is included in which the mount stage and a second bonding head disposed at an upper portion of the substrate corresponding to the mount stage and bonding the semiconductor chip disposed in the mount stage to the lower portion of the substrate.

Abstract: An apparatus for connecting a component with a substrate by means of diffusion soldering in a closed evacuated chamber, wherein the component and the substrate to be connected are displaceable separate from one another in the chamber, and the chamber comprises a combined transfer and pressing unit being displaceable between a current position of the component and a current position of the substrate, for placing and pressing the component on the substrate, and the combined transfer and pressing unit comprises a rotatable element, which, in response to the placing and pressing of the component on the substrate, assumes an angle between the normal of a lower side of the component to be connected and a pressing direction of the component, the angle corresponding to an angle between the normal of a surface area of the substrate to be connected and the pressing direction of the component.

Abstract: The assembly of body components using a geometry box (1) and clamping frames (7, 8) is described. At least for the larger components (9, 10), in particular the side wall parts of the body, a multipart clamping frame (8a, 8b) is used. The component (9, 10) is grasped and fed to the geometry box (1) using one clamping frame part, while the other clamping frame part is fed empty. Using both clamping frame parts, the component (9, 10) is then fixed precisely in position using positioning and fixing units acting between the geometry box (1) and the clamping frame (7, 8) in such a way that the components (6, 9, 10) to be connected to one another may be connected to one another, in particular welded.

Abstract: A wire bonding machine is provided. The wire bonding machine includes (1) a bond site area for holding a semiconductor device during a wire bonding operation, and (2) a gas supply line configured to provide a gas at the bond site area from above the bond site area.

Abstract: A ball-implantation method and a system applying the method are provided. To begin with, solder balls are implanted onto a flux applied to each of the ball pads on a substrate plate. Then, a vibration force of preset magnitude is exerted on the substrate plate, inducing vibration and causing any solder balls that have deviated from positions corresponding to the ball pads exposed from the openings of a solder mask provided on the substrate plate to return to the correct orientation and be kept therein by the vibration force and gravity. Subsequently, the ball implantation process is completed using a reflow process to solder the implanted solder balls. Using this method and the system thereof, the problem of missing or misaligned solder balls that occurs after the reflow process is solved, thereby dispensing with rework and improving the production yield and product reliability.

Abstract: A machining station and a method produce vehicle bodies of different types. A clamping station has interchangeable clamping frames, at least one clamping frame magazine, into which the interchangeable clamping frames are deposited when not in use and from which the interchangeable clamping frames are removed when in use, and at least one robot for transporting the interchangeable clamping frames. The interchangeable clamping frames, in particular the clamping frames for the vehicle body side parts, are divided into a plurality of separable segmental clamping frames, with, to convert to a different type of vehicle body, one segmental clamping frame in each case being transported by a robot from the clamping station to the clamping frame magazine, being deposited there, a segmental clamping frame of a different type being removed from the clamping frame magazine and this segmental clamping frame being transported to the clamping station.