Abstract: Disclosed are a contactless card manufacturing apparatus and a contactless card manufacturing method. The contactless card manufacturing apparatus comprises: an antenna implantation device, wherein the antenna implantation device is used for implanting a copper wire into a card manufacturing base material; a chip fixing device, wherein the chip fixing device is used for placing a chip at a fixed position on the card manufacturing base material; a pin welding device, wherein the pin welding device is used for respectively welding two ends of a wire to a pin of the chip and to the copper wire; and a transmission device, wherein the transmission device is used for transmitting the card manufacturing base material between the antenna implantation device, the chip fixing device and the pin welding device.

Abstract: A security element, called a security dome, intended to be glued onto an electronic board. The security element includes at least: a metal part intended to be in contact with at least one electrical circuit of the electronic board; and a protective part covering the metal part and having a first face comprising an adhesive portion intended to ensure the gluing of the security element on the electronic board by an automatic assembly method having at least one reflow step. The metal part and protective part are resistant to temperatures used during the reflow step.

Abstract: An alignment mechanism of a bonding machine includes a support pedestal, three first alignment members, and three second alignment members. The support pedestal includes a supporting surface having a placement area for supporting a first substrate, and the first and second alignment members are arranged around the placement area. The first alignment members each include a protruding part and a base. The protruding part is used in supporting a second substrate, and protrudes from the base and directed to the placement area. The base is used to position the first substrate. The second alignment members position the second substrate to align the first and second substrates and facilitate the bonding of the first and second substrates.

Abstract: A suction unit, including a first module, a second module, and a third module. The first module is provided with an air-permeable zone. The second module is provided with air holes a. The third module is provided with air holes b. A solder ribbon and a solar cell are sequentially stacked on the first module. A channel S2 is formed by the air holes b and the air holes a to fix the first module to the second module. A channel Si is formed by the air holes b, the air holes a and the air-permeable zone to fix the solder ribbon and the solar cell on the first module.

Abstract: A continuous aluminum melting furnace with a porous spray pipe heat exchanger, comprising a furnace body, combustion nozzles, a smoke pipeline and a heat exchanger. The heat exchanger comprises a smoke channel and heat exchange cylinders, wherein each of the heat exchange cylinders comprises a head end, a tail end, and a porous spray pipe in at least one of the cylinders. The porous spray pipe comprises a closed end and a pipe body, with several air spray holes provided on a peripheral wall of the pipe body so that cold air entering the at least one heat exchange cylinder is sprayed to an inner wall of the cylinder so as to exchange heat with high-temperature smoke which flows through an outer wall of the cylinder, thus keeping the temperature of the cylinder lower than the rated tolerant temperature of the material from which the cylinder is made.

Abstract: Aspects of the disclosure provide a pallet and a method for supporting a printed circuit board (PCB) during a circuit board assembly process. The pallet includes a panel having a frame area surrounding a depression area for receiving a PCB. The pallet includes at least one fixed tooling pin attached to the panel at a first location in the depression area. The pallet further includes at least one movable tooling pin positioned at a second location in the depression area, and the movable tooling pin is movable between a release position for installing the PCB in the depression area and a secure position for securing the PCB in the depression area.

Abstract: A system and a method for inspection aided printing, the method may include printing, by a printing unit of a system, a pattern on an area of a substrate, during a printing process; inspecting, by an inspection unit of the system, the area to provide inspection results; searching, by a processor of the system, for a defect, based upon the inspection results; and wherein if a defect is found—determining whether to (a) repair the substrate, (b) perform a corrective measure for improving the printing process, or (c) perform no corrective measure in response to the defect.

Abstract: A working system including: a working machine having a door operated so as to be closed at a time of working and be opened at a time of non-working; an automatic changer provided so as to enter and exit from an inside of the working machine through the door to change a worked object and/or a tool; and an actuator operating the door. The actuator is a servo motor dedicated to operating the door.

Abstract: A device for bonding of one bond side of a first substrate to one bond side of a second substrate, the device having one module group with a common working space which can be closed especially gastight to the environment, at least one bond module is connected in a sealed manner to the working space, and a movement apparatus for moving the first and second substrate in the working space, The module group has a reduction module which is connected, in a sealed manner to the working space for reducing the bond sides.

Abstract: An automated brazing system by which an apparatus is conveyed along a path defined through a brazing zone is provided and includes first and second sets of burners disposed within the brazing zone at first and second opposing sides of the path, respectively, to heat the components of the apparatus substantially uniformly at the first and second sides and to heat the components of the apparatus substantially uniformly along the brazing zone, such that each side of each of the components is heated to a substantially similar temperature as each side of each of the other components.

Abstract: Disclosed herein are systems for assembly of a component, in particular a roof panel, on a motor-vehicle body structure. One system comprises a device designed to clamp the component on the body structure in the proper position; a center for welding the component on the body structure; and a conveying line for carrying to and from the welding center a succession of the body structures. The clamping device is provided with means for gripping the component and comprises first manipulator means for bringing the device into connection with the component in a pick-up position according to a predetermined mutual positioning, and for carrying the device connected to the component to a body structure that is located in a position on the conveying line, upstream of the welding center, for constraining it to the body structure according to a mutual positioning whereby the component is in the proper position of assembly.

Abstract: A beam includes at least three web plates that are connected to a bottom flange and top flange.

Abstract: Provide is an apparatus for thermal melting processes that is capable of directly cooling the process object without requiring a separate cooling plate. The apparatus for thermal melting process according to the present invention is an apparatus 1 for thermal melting process that thermally melts objects 100 including solder in an atmosphere containing carbonic acid vapor, and the hand part 4 for carrying and transferring the thermally melted process objects 100 is used as a cooling plate as well.

Abstract: An in-line package apparatus includes a first treating unit, an input storage unit, a heating unit and an output storage unit. The first treating unit performs a ball attach process or a chip mount process. A processing object that a process is completed in the first treating unit is received in a magazine so as to be vertically stacked and a plurality of magazines each having one or more processing objects is stored in an input stacker. The heating unit performs a reflow process on the processing objects in the magazine stored in the input stacker by an induction heating method. A processing object that a reflow process is completed is received in a magazine and then stored in an output stacker.

Abstract: A system for manufacturing a side panel of a vehicle, the system including upper running rails and lower running rails to provide a movement path of a cart, the cart having a support frame, a transfer roller, and a friction bar provided at a bottom surface of the support frame, wherein the side panel may be mounted on the cart and the cart moves selectively along the upper running rails and the lower running rails, at least a friction drive unit and at least a friction wheel disposed along the upper and lower running rails wherein the at least a friction drive selectively rotates the at least a friction wheel to move the cart by selectively engaging at least one of the friction wheels with the friction bar of the cart, and an external unit supporting an edge portion of the side panel during key welding process.

Abstract: A fetching mechanism includes a support base, a fetching member positioned on the support base and an adsorbing assembly. The adsorbing assembly is positioned on the support base and is spaced from the fetching member. The adsorbing assembly includes a driving member positioned on the support base and an adsorbing member driven by the driving member. The fetching member fetches one welding member, the adsorbing member is driven by the driving member to extend out and adsorbs the workpiece, and the adsorbing member is driven to drawback until each welding member attaches the workpiece. The application also supplies an automatic welding system using the fetching mechanism.

Abstract: An apparatus (10) for the production of brazed aluminum products on a continuous flow basis includes, in sequence, a flux application zone (12), a tunnel furnace (14), a cooling zone (15,16) and a transportation element (25) for conveying (26) component parts or products though the apparatus, the transportation element including a closed loop conveyor having both conveying (26) and return (27) runs within the tunnel furnace.

Abstract: In one aspect, the present invention provides a vehicle floor production system, in which a carrier is moved through a loop formed by a return line provided at the top of the system and a welding line provided at the bottom, and the carrier is horizontally moved by the frictional force of a horizontal movement driving means. Preferred systems can reduce the manufacturing cost and required installation area.

Abstract: A solder drawing member (402) is detachably attached on the outer side of a jet nozzle (303) that jets molten solder pumped from a solder tank (102) storing the molten solder. The solder drawing member (402) is made of a material having higher wettability to the molten solder than the surface material of the jet nozzle (303). Thus a force of separating the solder from a point to be soldered can be increased by a surface tension of the molten solder flowing on the solder drawing member (402), thereby reducing bridge phenomena and icicle phenomena.

Abstract: An apparatus includes a guide ring, and a bond head installed on the guide ring. The bond head is configured to move in loops along the guide ring.

Abstract: A multi-station, gantry-based automated welding system includes a gantry mounting robotic arc welders or other equipment. The gantry has a range of travel over multiple workstations, each workstation being adapted for rotatably mounting a respective workpiece on a headstock assembly and a tailstock assembly, which define a workpiece or weldment rotational axis extending therebetween. The tailstock assembly can be located at different positions within a workstation for accommodating different lengths of workpieces. Encoders are installed at the moving elements of the system for precisely tracking and providing output to the computer controller. Primary and secondary power/data distribution systems include cable and hose carriers for providing mobile power/data connections to the gantry and also to the robotic arc welders mounted thereon. The power/data distribution systems are elevated above a facility floor to avoid interfering with equipment, personnel and activities at floor level.

Abstract: A solder return apparatus for a wave solder machine that collects solder exiting a nozzle and returns the solder to a solder reservoir while limiting solder from splashing onto electronic substrates (e.g., printed circuit boards), components of the wave solder machine, and/or the like. The apparatus includes a mounting section that may be placed over an upper surface of the nozzle and a collection section that collects the solder and returns the solder to the solder reservoir. The collection section includes a trough having an opening in a bottom wall of the trough and a flow control member that can adjust a quantity of solder exiting the trough as well as the velocity of the solder exiting the trough. One or more deflection plates can be mounted to extend from the trough into solder in the solder reservoir to further limit splashing solder from reaching unintended locations.

Abstract: An apparatus (10) for the production of brazed aluminium products on a continuous flow basis includes, in sequence, a flux application zone (12), a tunnel furnace (14), a cooling zone (15,16) and a transportation element (25) for conveying (26) component parts or products though the apparatus, the transportation element including a closed loop conveyor having both conveying (26) and return (27) runs within the tunnel furnace.

Abstract: In one aspect, the present invention provides a vehicle floor production system, in which a carrier is moved through a loop formed by a return line provided at the top of the system and a welding line provided at the bottom, and the carrier is horizontally moved by the frictional force of a horizontal movement driving means. Preferred systems can reduce the manufacturing cost and required installation area.

Abstract: In one aspect, the present invention provides a vehicle floor production system, in which a carrier is moved through a loop formed by a return line provided at the top of the system and a welding line provided at the bottom, and the carrier is horizontally moved by the frictional force of a horizontal movement driving means. Preferred systems can reduce the manufacturing cost and required installation area.

Abstract: A quick-loading soldering apparatus for soldering PCBs comprises a rotatable deck which has a plurality of angularly spaced PCB work sites. While a first PCB work site is angularly positioned for pre-loading and pre-heating PCB components at a pre-loading station, a second PCB work site is angularly positioned for soldering pre-loaded PCB components at a soldering station. Correct rotation of the deck is ensured by a sensor mounted on the deck. If the rotation angle is correct, locator pins provided externally of the deck become actionable by an operator to register the deck prior to the PCB being soldered.

Abstract: A bonding apparatus includes a thermal treating unit and a bonding unit that are integrally bonded together. The thermal treating unit includes a first thermal treating plate for supporting and thermally processing a superimposed substrate. The bonding unit includes a second thermal treating plate for supporting and thermally processing the superimposed substrate processed in thermal treating unit, and a pressing mechanism for pressing the superimposed substrate against the second thermal treating plate. The first thermal treating plate includes a cooling mechanism for cooling the superimposed substrate placed on the first heating plate. Each unit can depressurize the internal atmosphere to a specified degree of vacuum. The thermal treating unit has a plurality of carrying mechanisms for conveying the wafers between the two units.

Abstract: A multi-station, gantry-based automated welding system includes a gantry mounting robotic arc welders or other equipment. The gantry has a range of travel over multiple workstations, each workstation being adapted for rotatably mounting a respective workpiece. A control system controls and coordinates the movements and operation of the gantry, the robotic arc welders and the workpiece-rotating motors located at the workstations. Encoders are installed at the moving elements of the system for precisely tracking and providing output to the computer controller. Primary and secondary power/data distribution systems include cable and hose carriers for providing mobile power/data connections to the gantry and also to the robotic arc welders mounted thereon. The power/data distribution systems are elevated above a facility floor to avoid interfering with equipment, personnel and activities at floor level.

Abstract: A metal joining system having a first burner assembly configured to selectively heat a first zone and an assembly support at least partially vertically lower than at least a portion of the first heat zone and a first hood vertically above at least a portion of the assembly support.

Abstract: A reflow oven chamber assembly that is configured to be installed within a reflow oven chamber of a reflow oven includes a chamber housing disposed within the reflow oven chamber, one or more heating elements disposed in the chamber housing, and one or more compression box assemblies disposed in the chamber housing. The compression box assembly includes a compression box housing having an intake port located adjacent the heating element, an intake duct disposed in the compression box, and a diffuser plate disposed above the intake duct. The intake duct has an inlet opening in fluid communication with the intake port of the compression box housing and an outlet opening. The compression box assembly is configured to draw heated air into the compression box housing from the reflow oven chamber through the intake port and into the inlet opening of the intake duct and exhaust air out of the outlet opening of the intake duct to the diffuser plate.

Abstract: To enable the circuit board to be fixed on a predetermined position and to be conveyed to the solder processing portion. Conveying hooks 10 that hold the printed circuit board W1 therebetween, conveying chains 15a, 15b that drive so that the conveying hooks 10 are movable from a heater part 4 to a solder bath 5, first frames 9A that guide the conveying chains 15a, 15b along the heater part 4, second frames 9B that guide the conveying chain 15 along the solder bath 5, and an absorbing member 124 that is provided between each of the first frames 9A and each of the second frames 9B and absorbs an expansion and contraction based on difference of any thermal expansion between the frames 9A, 9B and the conveying chains 15a, 15b are provided. Since the absorbing member 124 absorbs the expansion and contraction based on difference of any thermal expansion between the frames 9A, 9B and the conveying chains 15a, 15b, it is possible to prevent the conveying chains 15a, 15b from being deviated from the frames 9A, 9B.

Abstract: The present invention relates to a device for assembly by brazing an end cover onto a cylindrical body, said end cover presenting a circular peripheral rim via which said cover is brazed onto a part of one of the end surfaces of the cylindrical body, this device being characterized in that the above-mentioned cover is shaped in such a way that, on the above-mentioned end surface of the cylindrical body, the circular peripheral part of the above-mentioned cover exerts a compressive stress, after brazing, on substantially the whole contact area between the end surface of the cover and the end surface of the cylindrical body.

Abstract: A solder return apparatus for a wave solder machine that collects solder exiting a nozzle and returns the solder to a solder reservoir while limiting the degree to which the solder can splash onto electronic substrates (e.g., printed circuit boards), components of the wave solder machine, and/or the like. The apparatus includes a mounting section that may be placed over an upper surface of the nozzle and a collection section that collects the solder and returns the solder to the solder reservoir. The collection section includes a trough having an opening in a bottom wall of the trough and a flow control member that can adjust a quantity of solder exiting the trough as well as the velocity of the solder exiting the trough. One or more deflection plates can be mounted so as to extend from the trough into solder in the solder reservoir to further contain the solder and limit the degree to which splashing solder can reach unintended locations.

Abstract: An automatic soldering system includes a conveyance mechanism, a vehicle, a first part assembling mechanism, a first soldering mechanism, a turn-over mechanism, a second part assembling mechanism, a second soldering mechanism, and a control system. The vehicle is conveyed by the conveyor mechanism for carrying a workpiece. The first part assembling mechanism and the first soldering mechanism assemble and solder a first part to the primary workpiece carried by the vehicle. The turn-over mechanism turns the vehicle that is conveyed by the conveyor mechanism and carries the primary workpiece having the first part assembled thereto by a predetermined angle. The second part assembling mechanism and the second soldering mechanism assemble and solder and position a second part to the primary workpiece. The control system is electrically connected to and thus controls the first part and second part assembling mechanisms, the first and second soldering mechanisms, and the turn-over mechanism.

Abstract: A method of splicing a trailing end of a downstream metal strip to the leading end of an upstream metal strip. The method has the steps of overlapping the leading end of the upstream strip with the trailing end of the downstream strip, and thereafter friction welding the overlapping ends together at a plurality of spots at which respective spot welds are thereby formed.

Abstract: A novel inert environment enclosure includes an object inlet where production objects enter the enclosure and an object outlet where the production objects exit. At least one of the object inlet and the object outlet includes both a top-side flow obstructer and a bottom-side flow obstructer for preventing air from entering the enclosure. In a particular embodiment, the top-side flow obstructer and the bottom-side flow obstructer each include a curtain constructed from a flexible fabric having a plurality of individual adjacent fingers. In another particular embodiment, the inert environment enclosure is a nitrogen hood that houses a wave soldering machine. A inert gas nozzle is mounted at or near the inlet and/or the outlet. The inert environment enclosure maintains a positive pressure with respect to the surrounding environment when production objects are passed through the enclosure.

Abstract: The invention concerns to a device for fixing conductor tracks on at least one first main-surface of at least one solar cell.

Abstract: The present general inventive concept includes a wave soldering apparatus, a soldering method using the wave soldering apparatus, and a method of forming a solder bump for a flip chip. The wave soldering apparatus includes a solder bath containing a molten solder. A nozzle is arranged in the solder bath so as to upwardly spout the molten solder toward a bottom surface of a substrate that passes an upper portion of the solder bath. A liquid that is separated from the molten solder is contained in a downstream area of the solder bath, and buoyancy is applied to the molten solder, which is adhered to the substrate, by the liquid. Since the amount of the molten solder adhered to the substrate is increased by the buoyancy, it is possible to form the solder bump to have a height sufficient to use it as a flip chip.

Abstract: A quick-loading soldering apparatus for soldering PCBs comprises a rotatable deck which has a plurality of angularly spaced PCB work sites. While a first PCB work site is angularly positioned for pre-loading and pre-heating PCB components at a pre-loading station, a second PCB work site is angularly positioned for soldering pre-loaded PCB components at a soldering station. Correct rotation of the deck is ensured by a sensor mounted on the deck. If the rotation angle is correct, locator pins provided externally of the deck become actionable by an operator to register the deck prior to the PCB being soldered.

Abstract: A welding facility includes a main welding line for manufacturing an assembly of frame members, and a sub-welding line for manufacturing an assembly of panel members, the sub-welding line merging with the main welding line. The main welding line is comprised of a plurality of welding stages provided with a welding robot, the sub-welding line is provided at the end with a transfer mechanism for transferring the panel member assembly to the desired welding stage, and the merging parts are changeable according to the type of product to be welded. The facility permits a plurality of vehicle bodies having different vehicle types to be manufactured using the same manufacturing line.

Abstract: An automatic soldering machine for soldering wires, each exposing at least one core wire and electronic components with at least one soldering portion respectively is disclosed. The automatic soldering machine comprises an equipment, a delivery mechanism, a plurality of clamps, a feeding mechanism, an insulation removing mechanism, a soldering mechanism, an unloading mechanism and a programmable control system. The delivery mechanism delivers the wires. The clamps locate the wires. The feeding mechanism conveys the electronic components. The insulation removing mechanism cuts the core wires and strips insulations at tops of the core wires. The soldering mechanism solders the core wires and the soldering portions of the electronic components. The unloading mechanism separates the soldered electronic components and core wires off from the clamps. The programmable control system is connect to the aforesaid mechanisms and controls thereof with high production efficacy and stable production quality.

Abstract: The invention concerns a method and an apparatus for the application of solder onto a work piece, wherein the solder is soldered on at a soldering temperature TL and subject to the influence of ultrasound. In order to be able to solder without difficulties the solder onto work pieces that exhibit sensitivity to breakage it is proposed that the solder is heated, is applied to the work piece that is supported in particular in a spring-mounted manner, and is soldered-on subject to the influence of ultrasound.

Abstract: A mold plate to parking location interface includes: a mold plate for holding solder; a fill head with an o-ring for dispensing solder bumps on the mold plate; a parking location for locating the fill head; and a platform between the mold plate and the parking location for relatively moving the fill head from the first location to the second location such that the o-ring decompresses as it passes over the platform.

Abstract: A solder machine includes a top flat carrier that holds PWBs just above a solder bath. Opposed edges of the carrier are coupled to a frame and each edge can be independently raised or lowered by a respective piston. Also, the base of the frame can pivot along one of its edges to provide a second degree of freedom of motion to the top flat carrier in dipping the PWBs relative to the solder bath, thereby providing a solder machine with a relatively small footprint that nonetheless can achieve precise soldering of PWBs.

Abstract: A method for generating data for a jetting program, includes the steps of: a) obtaining substrate data for a substrate, which is to be provided with deposits and components; and b) for each component which is to be placed on the substrate: —fetching component data for the component from said substrate data; and—selecting a matching predefined deposit pattern, comprising at least one deposit, which matches a desired deposit pattern for said component data, wherein the deposit pattern comprises, for the/each deposit, deposit data comprising deposit extension and deposit position; or—if no matching predefined deposit pattern exists, defining a deposit pattern, comprising at least one deposit, for the component data, comprising the step of defining, for the/each deposit, deposit data, which step comprises determining deposit extension and deposit position.

Abstract: In a conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of pads which are provided on a substrate and on which an adhesive is formed, the conductive ball mounting apparatus includes: a conductive ball container for containing a plurality of conductive balls therein and having an opening to pass through the plurality of conductive balls; a substrate holder disposed over the conductive ball container to face the opening, and holding the substrate in such a manner that the plurality of conductive balls and the plurality of pads face each other and the substrate is disposed over the conductive ball container with a space therebetween; and a conductive ball supplying unit for supplying the plurality of conductive balls to the plurality of pads via the opening by moving up the plurality of conductive balls.

Abstract: The present invention provides a flow soldering apparatus that can suppress the occurrence of soldering defects, even if VOC-free flux or low-VOC flux is applied to an electronic circuit substrate. In other words, the flow soldering apparatus according to the present invention includes: a water content sensor for measuring a residual water content of a surface of a substrate; and a monitoring device for judging whether soldering quality is satisfactory or not by using a residual water content value of the surface of the substrate acquired from the residual water content measured by the water content sensor, on the basis of a correlation between a residual water content value of a surface of a sample substrate and a residual water content value of through holes of the sample substrate, as acquired previously by using a plurality of substrate samples.

Abstract: A soldering apparatus has a fixture receiving an electronic component and a conducting wire, with a free end of the conducting wire superimposed on the soldering area of the electronic component, a convey mechanism capable of transmitting the fixture downstream, a daubing device, and a soldering device. The daubing device has a level movable element capable of moving along a convey direction of the convey mechanism, and a vertical movable element mounted on the level movable element and capable of moving along an upward and downward direction. A carrier mounted to the vertical movable element has a solder paste can for loading the solder paste, and an output portion for dispensing the solder paste to the soldering area. The soldering device has a soldering head heating the solder paste for shrinking the insulator, with the core wire exposing and connected to the soldering area by the cool solder paste.

Abstract: The application describes a soldering device comprising a soldering chamber for receiving a liquid and having a soldering chamber opening, an intermediate chamber arranged at the soldering chamber opening and having a substrate changing opening for supplying and removing items to be soldered, and a closure device for opening and closing the soldering chamber opening and the substrate changing opening. The closure device is designed as a unit such that, when the substrate changing opening is being closed, the soldering chamber opening is opened at the same time and vice versa. This soldering device is cost-effective in both production and operation.

Abstract: In a second horizontal plate (18a) bottoming an atmosphere recovery box (18), there are formed circular holes (21) between blowout pipes (20) adjacent to each other. Each of partition walls (2) positioned above a conveyor (5) includes an upper portion formed from a heat-insulating wall (2a) including a heat-insulative material having a thickness of T, and a lower portion formed from a metallic-plate wall (2b) extending downward from the heat-insulating wall (2a) toward the conveyor (5). The pitch P2 of the blowout pipes (20) across the metallic-plate wall (2b) is substantially same as the pitch P1 (12 mm) of the blowout pipes (20) disposed inside each of the chambers (R1 to R5) and adjacent to each other.