Abstract: The invention relates to a heating device for a hot melt glue gun, comprising a tip and a heating piece; the tip comprises a connecting portion, a tapered heating portion and a glue output portion which are connected in turn; the inner cavities of the connecting portion, the tapered heating portion and the glue output portion communicate with one another in turn; at least one straight wall parallel to the axis of the tapered heating portion is disposed on the outer wall of the tapered heating portion, and the inner wall of the heating piece fits tightly with the straight wall; the heating device for a hot melt glue gun has a rational structure and high accuracy, is conveniently assembled and tightly fitted, accelerates the melting of the glue rod, and enhances the utilization efficiency of the hot melt glue gun.

Abstract: A heater cartridge comprises a heater contained within a distal section of housing pipe near a working portion, such as soldering iron tip or a blade for stripping wire. The wall thickness of the housing pipe is generally thin to limit heat transfer to a proximal section of the housing pipe near where a user's hand would be normally located. The wall thickness is thinner in a region near the heater as compared to a region expected to have a high bending moment.

Abstract: The present invention relates to a soldering tip fastening sleeve (3) comprising a soldering device fastening portion (7) and a soldering tip fastening portion (6). The soldering device fastening portion (7) has an internal measurement (15) and an external measurement. Also the soldering tip fastening portion (6) has an internal measurement (16) and an external measurement (14) as well as a collar holder (10). The soldering tip fastening portion (6) and the soldering device fastening portion (7) are associated with different ends of the soldering tip fastening sleeve (3). The soldering tip fastening sleeve (3) according to the present invention is characterized in that the collar holder (10) is provided on a first subsector (17) of a circumference of the soldering tip fastening sleeve (3). The present invention also relates to a soldering tip (2) comprising a soldering portion (4) and a fastening portion (5).

Abstract: The invention relates to a method for dispensing solder and a method for mounting a semiconductor chip on the dispensed solder. The substrate is heated to a temperature which lies above the melting temperature of the solder and a solder portion is applied. A pin is thereafter immersed in the solder portion until it touches the solder portion and presses against the substrate. The pin is subjected to ultrasonic sound in such a way that ultrasonic waves are generated in the pin, which are directed perpendicularly or angularly in relation to the surface of the substrate, and is then moved along a predetermined path in order to distribute the solder. The treatment with ultrasonic sound locally improves the wettability of the substrate. The temperature of the pin is preferably lower than the melting temperature of the solder.

Abstract: A soldering iron (and a desoldering iron) with a replaceable tip, which is releasably securable on the forward heat-conducting end of a soldering (or desoldering) iron heat assembly. The tip has a heat conducting core in a tip cap. Methods of manufacturing and using the tip are also disclosed. A method of manufacturing a replaceable soldering or desoldering iron tip can comprise preparing a cap having a base opening and at least substantially filling the cap through the base opening with a heat conducting material so that a tip core is formed in the cap, the tip core having a core face at the base opening.

Abstract: A solder tip having a bottom end. The bottom end includes a concave channel between a front side of the bottom end and a back side of the bottom end. The concave channel has a substantially uniform cross-sectional shape.

Abstract: A soldering device includes a tip member and a temperature sensor embedded within the tip member by a buckled copper pipe that is thermally conductive. A soldering device includes a tip member and a temperature sensor embedded within the tip portion by application of a crimping force that deforms the tip portion onto the temperature sensor. A soldering device includes a tip member, a heater member, and a thermally conductive wedge that is pushed into a gap between the tip member and the heater member. A soldering device includes a tip cartridge carried by a handle assembly that includes an o-ring and an o-ring cover that keeps the o-ring from falling off of the handle assembly. The o-ring cover includes a hook portion that engages a catch feature of the handle housing.

Abstract: A soldering iron (and a desoldering iron) with a replaceable tip, which is releasably securable on the forward heat-conducting end of a soldering (or desoldering) iron heat assembly. The tip has a tapered heat conducting core in a tip cap. The face of the core can have a depression for mating engagement with a protrusion of the heat-conducting end. Also, the face can lie in the rear plane of the tip cap. An assembly which allows for the easy removal and application of a replacement tip can include a sleeve with tightening bolt, a coil spring sleeve, or a slotted compressible sleeve. The tip can thus be replaced after it has worn out, and the heat assembly unit need not be replaced until it has burnt out. Methods of manufacturing and using the tip are also disclosed.

Abstract: An automatic soldering machine includes a frame assembly, an electric iron and a movable module fixed on the frame assembly. The movable module is used for making the electric iron connected with the movable module randomly move to a specified position at a predetermined area. The movable module includes a first driving unit having a first leading element movable along a first axis, a second driving unit having a second leading element movable along a second axis perpendicular to the first axis, a third driving unit having a third leading element movable along a third axis perpendicular to the first and second axis and a rotating unit capable of rotating around an axis thereof. The third driving unit is connected with the first leading element. The second driving unit is connected with the third leading element. The rotating unit is connected with the second leading element.

Abstract: A soldering apparatus includes a base body, an actuator connected to the base body, and a pair of soldering arms connected to the actuator, each of the pair of soldering arms including a heating member and a soldering tip thermally coupled to the heating member. The pair of soldering arms is moveable and the actuator is controllable to move one soldering arm relative to the other soldering arm.

Abstract: A brazing process and assembly utilizing microwave radiation and a plasma generator that is heated by microwave radiation and generates a localized plasma capable of selectively heating and melting a braze alloy. The plasma generator contains a microwave-susceptible material that is susceptible to heating by microwave radiation, and a plasma-generating material capable of volatilizing and generating the plasma when the plasma generator is subjected to heating and microwave radiation. The brazing process includes applying a braze material to a surface of a substrate, positioning the plasma generator in proximity to the braze material, and then subjecting the plasma generator to microwave radiation to volatilize the plasma-generating material and generate a plasma that melts the braze alloy within the braze material.

Abstract: A bonding head includes a pressure plate to press a component (e.g., a semiconductor chip) onto a substrate. The pressure plate includes a holding surface configured to hold the component and to allow the component to be pressed uniformly onto the substrate, thus allowing a particularly reliable connection. The bonding head can further include an apparatus configured to vary the curvature of the holding surface of the pressure plate.

Abstract: A soldering system for melting a solder to form a joint between a first workpiece and a second workpiece is described. The system may comprise an energy generating system, a soldering tip, and a dispenser adapted to dispense controlled amounts of the solder. The soldering tip includes a non-wetting solder contact layer in operative communication with the energy generating system. The energy generating system may include induction, electrical, or heat generating systems in communication with the soldering tip. The non-wetting solder contact layer comprises a material that is not wettable by the molten solder. The system permits control of an amount of the solder in the joint.

Abstract: A soldering tip for a soldering device which comprises a heat generating or heat conducting base body, and which on the outside thereof has a contact surface that can be wetted by solder at least in sections. The material of the contact surface has a lattice structure. Charged elementary particles of at least one foreign material are incorporated into the lattice structure of the contact surface.

Abstract: A repair apparatus includes a heating head device configured to heat a soldering member, which is soldered to a circuit board. The heating head device includes a heating head and a contact member heated by the heating head. The contact member is formed of a material having a spring characteristic and a thermal conductivity higher than a thermal conductivity of the heating head. The contact member is configured to be brought into contact with a soldered surface of the soldering member with an elastic force so as to melt a solder joining the soldering member to the circuit board.

Abstract: A soldering system for melting a solder to form a joint between a first workpiece and a second workpiece is described. The system may comprise an energy generating system, a soldering tip, and a dispenser adapted to dispense controlled amounts of the solder. The soldering tip includes a non-wetting solder contact layer in operative communication with the energy generating system. The energy generating system may include induction, electrical, or heat generating systems in communication with the soldering tip. The non-wetting solder contact layer comprises a material that is not wettable by the molten solder. The system permits control of an amount of the solder in the joint.

Abstract: The present invention provides a desoldering sheath and a method for making the same. The desoldering sheath is comprised of multiple metal ropes that are each made from two or more fine-gauge wire threads. The metal ropes are woven together to form a metal fabric that approximates the shape of a soldering tool tip. The metal fabric is formed by weaving the metal ropes around a mold that approximates the shape of the soldering tip. In the preferred embodiment, several such molds are strung together when the metal fabric is woven. After the weaving is complete, the fabric is then cut at those points along its length where the consecutive molds meet, and the molds are then removed, while the fabric retains the approximate shape of the molds. The desoldering sheath is mounted over a soldering tool tip and can conduct heat directly from the soldering tool to the solder and then absorb molten solder by capillary action, making desoldering a one-handed task.

Abstract: A soldering iron tip having a copper or copper alloy core and a metal particle sintered member connected to the core to transfer heat therefrom to form a working soldering tip. The sintered member can be manufactured by powder metallurgy from a base material (iron, nickel and/or cobalt particles) and an additive (silicon, copper, silver, tin, boron and/or carbon particles) where needed. The sintered member can be formed as a cap which is fitted onto the working tip with a silver paste sandwiched therebetween, a brazing filler metal ring is positioned between an abutment shoulder and the cap, flux applied to the joint and the cap brazed into place. A metal, cermet or ceramic coating sprayed on the outer surface of the core, except for the (masked) working tip end, is not wettable by solder. An Ag—Al—Cu alloy coating layer in the rearwardly-disposed cavity improves heat conduction from the heater therein.

Abstract: In an iron tip for a soldering iron, composed of Fe plated copper or copper alloy, an outer surface excluding a solder coating portion in a leading end portion of the iron tip is plated with Cu in a film thickness range of approximately 10 to 50 &mgr;m, the surface is coated with a mixture of Al particles and flux, only the Al particles are melted in an inert gas atmosphere, and the surface is modified into a surface with a Cu—Al alloy coated layer having a high Al concentration. As a result, without using Cr plating, it is possible to provide an electric soldering iron having an excellent resistance to oxidation under high temperature environment and a high heat conductivity.

Abstract: A soldering heater cartridge with replaceable tips and a soldering iron for use therewith is constructed of a tip heater cartridge with an elongated cartridge body that has a tubular body member, electrical connectors at a first end of the tubular body member for plug-in connection with an electrical connector assembly of a soldering iron handpiece, a soldering tip for mounting on the cartridge body and a heater mounted within the cartridge body and electrically connected to the electrical connectors. The tip end part is located at a second end of the cartridge body and the heater is located within the tip end part, the soldering tip being replaceably mountable over the tip end part in heat exchange contact with it.

Abstract: A pressure gauge or monitor is attached to a soldering iron so that the pressure with which the iron is being applied can be precisely monitored. Such a pressure monitor on a soldering iron can be used to monitor the pressure applied with the soldering iron when forming a solder electrode on an anti-reflective film of a cathode ray tube. This allows such electrodes to be consistently and optimally formed for grounding the anti-reflective film.

Abstract: An apparatus for ultrasonically welding workpieces that reduces sonotrode adhesion during the ultrasonic welding process. The sonotrode tip has a specific surface configuration, including a curvilinear shaped outer surface combined with a plurality of grooves and lands. Due to the curvilinear surface, the depth of the grooves gradually decreases near the outer edge or periphery of a contact surface of the sonotrode tip. Further, such a groove and land combination also provides a sharp edge or corner that reduces sliding of the tip on the workpiece and correspondingly reduces sticking. In addition, various types of coatings or inserts may also be used to reduce sticking of the sonotrode tip to the workpiece.

Abstract: A tip of a soldering iron is provided which separates any solder bridge, sucks up excess solder, and performs normal soldering operation. The tip has a cutter blade-like portion with its edge inclined. Grooves are formed on both side surfaces of the cutter blade-like portion. Solder guides extend along the grooves, and cylindrical through-holes penetrating the tip are formed at the ends of the grooves closer to an iron handle. When the cutter blade-like portion is applied to a solder bridge, solder is melted, and sucked up from the solder guides through the grooves by capillary action. Excess melted solder is collected to be stored by its surface tension.

Abstract: A technique for producing soldering iron tips entails cutting clad wire into a plurality of segments, each segment comprising a core of material (such as copper) and an outer protective layer (such as stainless steel, Ni, Cr, or alloy thereof). Each clad wire segment is then shaped into a soldering iron tip by a cold or hot heading process, or other metal forming process. In the finished tip, the protective outer layer is disposed behind the working area of the tip, and serves to reduce the corrosion of the tip, and to improve the electrical conductivity between the tip and the soldering iron handle. A heater element can be formed at one end of the soldering iron tip from the same clad wire segment used to produce the tip itself, thereby ensuring good thermal transfer properties between the heater element and the tip. The invention also pertains to a technique for forming a protective outer layer on the working area of the tip.

Abstract: The present invention relates to post manufacturing operations for improving the working life of known bonding tools such as capillaries, wedges and single point TAB tools of the type used in the semiconductor industry to make fine wire or TAB finger interconnections. After the desired bonding tool is manufactured to predetermined specifications, dimensions and tolerances, it is placed in a sputtering chamber with hard target material with an ionizing gas. A controlled volume of sputtered hard material is generated at high temperature by plasma ion bombardment and deposited onto the working face of the bonding tool while the tool is held at a temperature that prevents distortion. A very thin amorphous hard layer is bonded onto the working face of the bonding tool which increases the working life of most tools by an order of magnitude and there is no requirement for additional processing.

Abstract: A method and apparatus for placing and attaching solder balls to a substrate having conductive pads in a predetermined pattern is disclosed. The substrate is placed on a carrier plate. An alignment plate having holes corresponding to the predetermined pattern is mated to the carrier plate with its holes aligned with the predetermine pattern on the substrate. Solder balls are loaded into each hole of the alignment plate. The solder balls may be loaded with a vacuum plate which uses vacuum to pick up solder balls in the predetermined pattern and place them over the holes on the alignment plate. The vacuum is released for dropping the balls in the holes of the alignment plate. Alternatively a shutter plate having holes corresponding to the holes on the alignment plate is fitted on the alignment plate and afforded slidable movement between an offset position and an aligned position. A ball is loaded in each hole in the shutter plate when it is in its offset position.

Abstract: A heating tip in which an insertion cavity is formed in a tip substrate made of copper or copper alloy for insertion and containment of a heat generating portion, wherein the inner circumferential wall surface of the insertion cavity is formed by forging into a non-circular cross sectional shape which is identical with a non-circular cross sectional shape on the outer circumferential surface of the heat generating portion. The insertion cavity has the non-circular cross sectional shape and, accordingly, the area of contact with the heat generating portion is enlarged compared with a case of a circular cross sectional shape with the hole volume being assumed identical, thereby increasing the heat conductivity from the heat generating portion and enhancing the temperature rising characteristics and the thermal response of the heating tip. Since the insertion cavity is formed by forging loss of the material can be decreased, neatly and easily and, in addition, working life of the tool can be extended.

Abstract: A soldering iron tip includes a removable Invar shield covering a copper core plated with other metals. In one embodiment, the core is plated with iron and, outside a working section of the tip, with nickel and chrome. In another embodiment, the core is plated with chrome.

Abstract: The invention concerns a method of bonding a diamond substrate to at least one metal substrate. According to the invention:at least one of the faces of the diamond substrate is covered with a piece of aluminum foil;said diamond substrate and said piece of aluminum foil are disposed in a chamber under a controlled atmosphere, and they are bonded together by a first thermocompression step under Argon or under a vacuum, thereby forming a composite multilayer substrate;said composite multilayer substrate is disposed on a metal substrate, the aluminum surface being in contact with the metal substrate; andsaid composite multilayer substrate and said metal substrate are bonded together by performing a second thermocompression step.

Abstract: The present invention provides a thermocompression tool, i.e. high strength bonding tool used for mounting a semiconductor device or element such as IC, LSI, etc. on a substrate, for example, a tool of pulse heating type used for soldering, and a mounting tool (bonding tool) used for heating, melting and bonding or thermocompression bonding in a lump a number of workpieces to be bonded, making up a part of electronic parts, in particular, a high precision tool called outer lead bonding tool. The high strength bonding tool comprises a substrate consisting of a cemented carbide having microscopic protrusions of hard carbides and/or hard carbonitrides on at least one surface and a coefficient of linear expansion of 4.0.times.10.sup.-6 to 5.5.times.10.sup.-6 /.degree. C. at room temperature to 400.degree. C.

Abstract: The present invention relates to post manufacturing operations for improving the working life of known bonding tools such as capillaries, wedges and single point TAB tools of the type used in the semiconductor industry to make fine wire or TAB finger interconnections. After the desired bonding tool is manufactured to predetermined specifications, dimensions and tolerances, it is placed in a sputtering chamber with hard target material with an ionizing gas. A controlled volume of sputtered hard material is generated at high temperature by plasma ion bombardment and deposited onto the working face of the bonding tool while the tool is held at a temperature that prevents distortion. A very thin amorphous hard layer is bonded onto the working face of the bonding tool which increases the working life of most tools by an order of magnitude and there is no requirement for additional processing.

Abstract: The misapplication or misplacement of solder bumps on chips and/or circuit boards presents financially significant waste and cost efficiency problems in the manufacture of electronic components. The present invention describes an article and a process for using the article to more quickly remove such spurious solder during manufacture of components. The present invention may comprise an article for assisting in the removal of solder from a surface comprising: a) a surface layer of textured material which can be wet by molten solder, b) a first thermally conductive layer having a surface which is in thermal contact with said surface layer, and c) preferably a flux which is present on at least one of said surface layer and said thermally conductive layer having a surface in thermal contact with said surface layer. The article may be preferably provided where the first thermally conductive layer comprises a sheet of flexible, thermally conductive metal, especially aluminum.

Abstract: The present invention provides a thermocompression tool, i.e. high strength bonding tool used for mounting a semiconductor device or element such as IC, LSI, etc. on a substrate, for example, a tool of pulse heating type used for soldering, and a mounting tool (bonding tool). The tool is used for heating, melting and bonding or thermocompression bonding in a lump a number of workpieces to be bonded, making up a part of electronic parts, in particular, a high precision tool called outer lead bonding tool. The high strength bonding tool has a substrate that is composed of a cemented carbide having microscopic protrusions of hard carbides and/or hard carbonitrides on at least one surface and having a coefficient of linear expansion of 4.0.times.10.sup.-6 to 5.5.times.10.sup.-6 /.degree.C. at room temperature to 400.degree. C.

Abstract: A method for improving the tip and nozzle of a gas welder in which a conventional or new surface oxidation chemical treatment was applied to improve the surface properties of the tip and nozzle of a gas welder made of copper or copper alloys. Continuous welding operation could then be possible for extended periods of time. If a black copper oxide layer is formed by chemical conversion coating treatment on the surface of the nozzle which is made of copper or copper alloys, then the splatters do not easily stick to the surface. Further, even if the splatters stick, they are more easily removed. In the case of the tip, a black copper oxide layer formed by chemical conversion coating treatment in the small hole of the tip makes the supply of the filler metal wire flow smoothly without troubles. Further, the black copper oxide layer formed by chemical conversion coating treatment also inhibits the sticking of splatters, so that the supply of the filler metal wire is smooth.

Abstract: A solder gun or soldering iron contains a pair of electrical terminals that hold a solder tip containing a pair of straight parallel leads. Each lead has a substantially U-shaped cross-section that creates a circular cavity filled which is filled with an insulative material. The soldering tip is made from either a low impedance material such as copper or high impedance material such as a multi-layer material of steel, copper and nickel that automatically maintains the soldering tip at a constant temperature. The soldering device also comprises a universal connector that receives both a solid solder tip and a hollow soldering tip. A rack extending around the soldering device allows quick and easy exchange of various solder tips into the universal connector. In another embodiment of the invention, the soldering device includes a multiple position trigger that both initiates heating of a solder tip and activates a suction mechanism.

Abstract: A soldering tip comprising 50-95 weight percent uncoated copper particles and 5-50 weight percent iron particles is prepared by a method in which the particles are compacted, sintered and shaped into a soldering tip. The soldering tips are durable, resistant to pitting by molten solder, and thermally conductive.

Abstract: A bonding tool has a head portion made essentially of vapor-deposited diamond, wherein a principal diamond crystal plane forming a head face is a (111) plane. Such a head face has high hardness and a good wear resistance. In order to improve the toughness of a bonding head which is mainly made of vapor-deposited diamond, a portion or ply forming the head face consists essentially of high-purity diamond, and another portion or ply supporting the head face consists essentially of low-purity diamond. The head face has a high rigidity, while the portion supporting the head face has a high toughness. In order to provide a bonding head portion which is mainly made of vapor-deposited diamond with electrical conductivity, a first portion or ply forming a head face consists essentially of polycrystalline diamond containing a relatively small amount of dopant, and another portion or ply supporting the first portion or ply contains a large amount of dopant.

Abstract: A method for bonding the ends of the conductors 52 to circuit pads 54 is disclosed whereby the cable 20 is placed over the circuit pads 54; a bonding tool 44 is pressed against an upper surface 58 of the cable 20; the substrate 46 of the cable 20 is compressed beyond its elastic limit; and ultrasonic energy is applied to the bonding tool 44 and transmitted through the substrate 46 to effect a metallic bond between the conductors 52 and circuit pads 54.

Abstract: A bonding tool has a head portion made essentially of vapor-deposited diamond, wherein a principal diamond crystal plane forming a head face is a (111) plane. Such a head face has high hardness and a good wear resistance. In order to improve the toughness of a bonding head which is mainly made of vapor-deposited diamond, a portion or ply forming the head face consists essentially of high-purity diamond, and another portion or ply supporting the head face consists essentially of low-purity diamond. The head face has a high rigidity, while the portion supporting the head face has a high toughness. In order to provide a bonding head portion which is mainly made of vapor-deposited diamond with electrical conductivity, a first portion or ply forming a head face consists essentially of polycrystalline diamond containing a relatively small amount of dopant, and another portion or ply supporting the first portion or ply contains a large amount of dopant.

Abstract: In accordance with a preferred embodiment of the present invention, a concavity of an elliptical shape is formed in a chisel-shaped soldering tip to create a reservoir in which a quantity of molten solder is retained by surface tension. In a preferred method of use, the leads of an electronic component and the lands of a circuit board to which they are to be electrically connected are pretreated with flux. The tip, with a blob of solder in its concavity, is drawn along the lead/land region with the blob of molten solder making contact therewith, so that molten solder is wicked into the region, and joints are formed between the leads the lands.

Abstract: A soldering tool comprises a handle (10) and a rod-shaped or tubular heating element fastened to the front end of the handle. A soldering tip (4) can be placed on the free end of the heating element. The soldering tip (4) has a borehole for receiving the free end of the heating element and can be fixed to the handle (10) or heating element by means of a fastening sleeve (1). The end of the fastening sleeve (1) nearer the soldering tip has first rotary catches (2, 3) which can be locked by second rotary catches (5) arranged at the rear end of the soldering tip (4) by turning the fastening sleeve (1) relative to the soldering tip (4).

Abstract: Latent heat of fusion is used to store and extract a relatively large quantity of temperature controlled heat from the small volume of a soldering iron tip. This is accomplished by fabricating the tip from a composite material comprised of a porous metal matrix, the interstices of which have been filled with an element or alloy having a melting temperature at or near a desired working point. The latent heat of fusion associated with the change of state of this working substance provides a constant temperature reservoir of heat immediately adjacent to a heat consuming operation such as solder joint formation. This proximity of heat source and sink allows the formation of a series of solder joints with only minor tool temperature variation from one to the next, thereby contributing to a uniformity among them that is considered desirable.

Abstract: The disclosure is directed to a bonding tool for use primarily in thermo-compression bonding of electronic circuit components and to a method of making the bonding tool. In one form of the disclosure, a holder is provided and has a substrate mounted at an end thereof. The holder is adapted to receive a heating element. A polycrystalline diamond film is disposed on the substrate, the film preferably being deposited by chemical vapor deposition. In a disclosed embodiment the substrate is a material selected from the group consisting of polycrystalline diamond, cemented tungsten carbide, silicon carbide, cubic boron nitride, and tungsten. In a further form of the disclosure, a ceramic substrate is provided which has a favorable thermal conductivity property as well as substantial electrical conductivity sufficient to permit shaping by electrical discharge machining ("EDM").

Abstract: A bonding tool for TAB, used in the production of semiconductor chips, which is provided with, at the end thereof, a substrate consisting of a member selected from the group consisting of sintered compacts of Si or Si.sub.3 N.sub.4 as a predominant component, sintered compacts of SiC as a predominant component, sintered compacts of AlN as a predominant component and composite compacts thereof, the substrate being coated with polycrystalline diamond deposited by gaseous phase synthesis method.

Abstract: A small solder tip, which advantageously allows for the rapid production of reliable solder joints without the addition of extra solder, flux or striping the insulation on the wire. The solder tip is preferably formed of tungsten carbide and is used in conjunction with a reflow power supply. In a specific application, the solder tip is utilized for hook-up of magnetic head wires to solder pads. The solder tip comprises a center shaft which allows expanding gases to escape in order to prevent solder from being squeezed out by the pressure build up. The base extremity of the solder tip which contacts the wire is structured with a stepped surface having an opening for accepting the wire therethrough and a projecting leg for contacting the wire and immersing the wire in molten solder. The solder tip additionally comprises a room which provides space for excess solder, enabling the solder tip to accommodate larger variation in solder volume on the pads.

Abstract: An ultrasonic seam welding apparatus having a head which is rotated to form contact, preferably rolling contact, between a metallurgically inert coated surface of the head and an outside foil of a plurality of layered foils or work materials. The head is vibrated at an ultrasonic frequency, preferably along a longitudinal axis of the head. The head is constructed to transmit vibration through a contacting surface of the head into each of the layered foils. The contacting surface of the head is preferably coated with aluminum oxide to prevent the head from becoming welded to layered stainless steel foils.

Abstract: A nozzle of a solder suction device maintaining wettability with solder, excellent in corrosion resistance and heat transfer property, and optimal for solder removal work of electronic components such as integrated circuits.

Abstract: A soldering iron tip comprises a coating layer of amorphous metal satisfactory in wettability in molten solder formed on the leading end part thereof. A soldering iron tip may comprise a coating layer of amorphous metal low in wettability in molten solder formed on at least the leading end part thereof and a coating layer of material excellent in wettability in molten solder formed on the coating layer of amorphous metal on the leading end part.

Abstract: A technique is provided for desoldering circuit components employing a desoldering aid that fits like a cap on a standard size rectangular circuit component. The aid has a rectangular top of high thermal conductivity metal substantially the same size as the circuit component. At least a pair of integral sides along opposite edes of the top are bent normal to the top and are not further apart than the outside of the electrical leads on the opposite sides of the circuit component for good thermal contact therewith. The depth of the inside of the box is greater than the height of the top of the component so that there is no contact between the top of the box and the top of the component. The top of the box over the component is heated sufficiently to melt solder on the electrical leads. The box and component can then be lifted together from the printed circuit board.

Abstract: A soldering iron tip comprises a copper body with a layer of glass bonded on the surface. The portion of the body used for melting solder is not coated. The glass is opaque to infrared, has high, uniform and stable emissivity, helps prevent oxidation, limits wetting of the tip by solder, and is easily kept clean. The glass is readily applied to a soldering iron tip by melting a frit. Such a glass layer provides electrical insulation from a soldering iron and prevents leakage electric current from damaging sensitive components. A method is provided for measuring temperature of an article during soldering by applying a glass which absorbs infrared to a portion of the article and measuring infrared emittance from the glass during soldering.