Abstract: An ultrasonic transducer system is provided. The ultrasonic transducer system includes a transducer body, wherein at least a portion of a surface of the transducer body includes a processed area. The processed area has a changed condition at the surface of the transducer body.

Abstract: Gerber data for a substrate includes coordinates for physical features on the substrate. The coordinates are relative to a substrate origin point on the substrate. The gerber data allows a user to specify any of the physical features as soldering targets of a soldering apparatus that includes a motor for moving a soldering iron according to coordinates relative to a system origin point of the soldering apparatus. When the substrate is placed on the soldering apparatus, its substrate origin point differs from the system origin point of the soldering apparatus. The user may input coordinates for the substrate origin point, which are used by the soldering apparatus to derive coordinates, usable by soldering apparatus, from coordinates in the gerber data. In this way, it is possible to reduce the workload of the user when programming the soldering apparatus to perform a soldering process.

Abstract: A soldering tip fastening device includes a soldering device fastener configured for fastening the soldering tip fastening device on a soldering device, and a soldering tip fastener configured to fasten a soldering tip on a soldering device when the soldering tip fastening device is fastened to the soldering device. The soldering tip fastener and the soldering device fastener are associated with opposite ends of the soldering tip fastening device. The soldering tip fastening device has a sleeve with an elastic element, the sleeve being configured such that the elastic element is tensioned during the fastening of the soldering tip on the soldering device by the soldering tip fastening device.

Abstract: The invention relates to a method for dispensing solder and a method for mounting a semiconductor chip on the dispensed solder. The substrate is heated to a temperature which lies above the melting temperature of the solder and a solder portion is applied. A pin is thereafter immersed in the solder portion until it touches the solder portion and presses against the substrate. The pin is subjected to ultrasonic sound in such a way that ultrasonic waves are generated in the pin, which are directed perpendicularly or angularly in relation to the surface of the substrate, and is then moved along a predetermined path in order to distribute the solder. The treatment with ultrasonic sound locally improves the wettability of the substrate. The temperature of the pin is preferably lower than the melting temperature of the solder.

Abstract: A soldering assembly comprises a heater, a lock member, and a bias member. The lock member is moveable relative to the heater, includes a ramp feature, and is configured to receive a tip or a tip holder. The bias member is configured to urge movement of the lock member away from a distal segment of the heater.

Abstract: A chisel blade with a permanently attached shaft is disclosed. The chisel blade and shaft are dimensioned and configured such that shaft is removably attachable to a portable heating element. The chisel blade with an attached shaft may include a portable soldering iron with the soldering tip removed. In the two possible embodiments, the chisel blade has a rectangular shape with a beveled cutting surface having a straight cutting edge. In a third embodiment, the chisel blade is concave and the beveled cutting edge is concave.

Abstract: A soldering device includes a tip member and a temperature sensor embedded within the tip member by a buckled copper pipe that is thermally conductive. A soldering device includes a tip member and a temperature sensor embedded within the tip portion by application of a crimping force that deforms the tip portion onto the temperature sensor. A soldering device includes a tip member, a heater member, and a thermally conductive wedge that is pushed into a gap between the tip member and the heater member. A soldering device includes a tip cartridge carried by a handle assembly that includes an o-ring and an o-ring cover that keeps the o-ring from falling off of the handle assembly. The o-ring cover includes a hook portion that engages a catch feature of the handle housing.

Abstract: An automatic soldering machine includes a frame assembly, an electric iron and a movable module fixed on the frame assembly. The movable module is used for making the electric iron connected with the movable module randomly move to a specified position at a predetermined area. The movable module includes a first driving unit having a first leading element movable along a first axis, a second driving unit having a second leading element movable along a second axis perpendicular to the first axis, a third driving unit having a third leading element movable along a third axis perpendicular to the first and second axis and a rotating unit capable of rotating around an axis thereof. The third driving unit is connected with the first leading element. The second driving unit is connected with the third leading element. The rotating unit is connected with the second leading element.

Abstract: A pair of soldering tweezers having a first arm having a distal end that is adjustably positionable in a direction parallel to its central longitudinal axis and a second arm having a distal end that is adjustably positionable in a direction perpendicular to its central longitudinal axis. The tweezers also include a biasing mechanism configured to urge the distal ends of the first and second arms apart.

Abstract: A cartridge system for a cartridge type soldering iron has a sleeve stopper with hooks and a sleeve which goes over the stopper. The hooks of the sleeve stopper lock with a socket assembly of the soldering iron which connects to an electrical source. A tip cartridge of the soldering iron has a tip retaining mechanism to fix the sleeve stopper with respect to the tip cartridge. The sleeve is made from a non-heat conducting material to protect a user's fingers from heat.

Abstract: A chisel blade with a permanently attached shaft is disclosed. The chisel blade and shaft are dimensioned and configured such that shaft is removably attachable to a portable heating element. The chisel blade with an attached shaft may include a portable soldering iron with the soldering tip removed. In the two possible embodiments, the chisel blade has a rectangular shape with a beveled cutting surface having a straight cutting edge. In a third embodiment, the chisel blade is concave and the beveled cutting edge is concave.

Abstract: A soldering or a desoldering tool includes a replaceable tip with a recess adapted to receive a portion of a temperature sensor to measure the temperature of the tip. Positioning the temperature sensor within the tip allows the temperature to be quickly measured so that the temperature near the tip may be more accurately monitored and controlled. The temperature sensor may be also integrated with the heater near the tip such that the temperature sensor is between the tip and the heater and near both of them so that the temperature of the tip is substantially that of the temperature of the heater. A sleeve may enclose the temperature sensor and the heater with a portion of the temperature sensor extending out from the foreward end of the sleeve. The replaceable tip may also have a bore adapted to receive a head protruding from the foreward end of the sleeve to couple the tip at a predetermined orientation with respect to the sleeve.

Abstract: A soldering iron including: a soldering tip that melts solder at a distal end; an iron body to which the soldering tip is fixed; at least one male connecting end provided at a base end of the soldering tip; at least one female connecting end built into the distal end of the iron body and into which the male connecting end is fittingly inserted; and a grip having heat insulating properties provided around the outer periphery of the soldering tip to cover the base end region of the soldering tip.

Abstract: The present application discloses a fixture-free, hands-free soldering apparatus having a base support assembly and a solder assembly. The base support assembly has a base member supporting a power supply and an electronic temperature, time and speed control system, and an actuator for remotely actuating the solder assembly without the use of the operator's hands or fixtures. The solder assembly is supported on the base member by vertically movable support arms. A main body supports a spool of solder, a solder feed mechanism operated by the actuator and a solder mechanism having adjustable operating temperature, speed and position. The main body and adjustable solder mechanism of the solder assembly adjust the angle and position of the solder being fed by the solder feed mechanism and an adjustable solder head supporting a concave solder tip. In addition to vertical movement, the main body is rotatable by about 60 degrees with respect to a central horizontal plane along the main body.

Abstract: The present invention provides a desoldering sheath and a method for making the same. The desoldering sheath is comprised of multiple metal ropes that are each made from two or more fine-gauge wire threads. The metal ropes are woven together to form a metal fabric that approximates the shape of a soldering tool tip. The metal fabric is formed by weaving the metal ropes around a mold that approximates the shape of the soldering tip. In the preferred embodiment, several such molds are strung together when the metal fabric is woven. After the weaving is complete, the fabric is then cut at those points along its length where the consecutive molds meet, and the molds are then removed, while the fabric retains the approximate shape of the molds. The desoldering sheath is mounted over a soldering tool tip and can conduct heat directly from the soldering tool to the solder and then absorb molten solder by capillary action, making desoldering a one-handed task.

Abstract: An electric soldering iron useful for heavy duty applications, such as sheet metal lamination, comprises a soldering tip held between two carbon electrodes which are electrically connected through busses to a source of low voltage, variable amperage current. The carbon electrodes are preferably graphite. An additional feature allows the tip to pivot to various angles with respect to the handle to provide optimum comfort and soldering efficiency. The body of the soldering tip is provided with longitudinal grooves into which the shaped carbon electrodes are slid and are secured in place with suitable fasteners, such as bolts. Alternatively, the electrodes may have a contour corresponding to the surface of the body of the soldering tip and are then clamped or otherwise secured to the body. Another option is to use electrodes that are shaped as cylindrical plugs seated in blind recesses in the body of the soldering tip.

Abstract: A system and method for reworking, repairing and upgrading flatwire is disclosed. A repair tool for reworking and/or repairing the flatwire is disclosed for creating subsequent electrical and mechanical joints of equal or greater quality as compared to the original system. The repair tool includes a heating blade, a power controller, a tool assembly, an inerting system, a cooling system, a flatwire cassette, a tool material, a flatwire material, an upgrade/repair procedure and various other aspects for rapidly heating flatwire two join two separate portions of the flatwire. The system and method of the present invention addresses the challenges of working with substrate materials which typically degrade at temperatures commonly used to form solder joints. Further, the soldering tool of the present invention may be a portable, lightweight unit that can be used in the field, for automotive and aerospace applications.

Abstract: A device for fastening a barrel of a gas operated soldering gun to a spout of a combustion chamber thereof is disclosed. The device comprises a cavity in a rear end of the barrel, a resilient clip disposed in the cavity, and a plurality of latched pieces on the clip, the latched pieces being disposed inside the clip. The spout can be fastened in the barrel by clinging the barrel to the spout as the latched pieces exert a strong, resilient force onto the spout. The invention can carry out a quick assembly or disassembly of the barrel and the spout and increase soldering efficiency and safety.

Abstract: A soldering heater cartridge with replaceable tips and a soldering iron for use therewith is constructed of a tip heater cartridge with an elongated cartridge body that has a tubular body member, electrical connectors at a first end of the tubular body member for plug-in connection with an electrical connector assembly of a soldering iron handpiece, a soldering tip for mounting on the cartridge body and a heater mounted within the cartridge body and electrically connected to the electrical connectors. The tip end part is located at a second end of the cartridge body and the heater is located within the tip end part, the soldering tip being replaceably mountable over the tip end part in heat exchange contact with it.

Abstract: A soldering iron comprises a tip end; a heater portion for electrically heating the tip end of the soldering iron; a holding portion provided at the rear end of the heater portion: a heat pipe structure provided in the holding portion; a first heat pipe holder for holding a frontal portion of the heat pipe structure to which heat generated at the heater portion is transferred; a second heat pipe holder for holding a rear part of the heat pipe structure; and a grip portion placed externally around the first heat pipe holder.

Abstract: The present invention allows a user to select a handle that is ergonomically friendly to a user's hand and replace it with the replaceable handle that is designed to fit over a soldering iron rod. There are a number of advantages to the present invention. One of the advantages is that a user can choose an individual handle with the desired shape, size, color, and material. Another advantage is that since each user has an individual handle, hygiene problems may be minimized. Still another advantage is the cost savings because as the replaceable handle wears out, only the handle needs to be replaced rather than the whole soldering iron.

Abstract: A tip of a soldering iron is provided which separates any solder bridge, sucks up excess solder, and performs normal soldering operation. The tip has a cutter blade-like portion with its edge inclined. Grooves are formed on both side surfaces of the cutter blade-like portion. Solder guides extend along the grooves, and cylindrical through-holes penetrating the tip are formed at the ends of the grooves closer to an iron handle. When the cutter blade-like portion is applied to a solder bridge, solder is melted, and sucked up from the solder guides through the grooves by capillary action. Excess melted solder is collected to be stored by its surface tension.

Abstract: A soldering heater cartridge with replaceable tips and a soldering iron for use therewith is constructed of a tip heater cartridge with an elongated cartridge body that has a tubular body member, electrical connectors at a first end of the tubular body member for plug-in connection with an electrical connector assembly of a soldering iron handpiece, a soldering tip for mounting on the cartridge body and a heater mounted within the cartridge body and electrically connected to the electrical connectors. The tip end part is located at a second end of the cartridge body and the heater is located within the tip end part, the soldering tip being replaceably mountable over the tip end part in heat exchange contact with it.

Abstract: A soldering station with a control unit and a soldering iron having a replaceable soldering tip, the soldering iron being connected to the control unit by a power cord for receiving electrical power from said control unit is provided with an automatic calibration feature. The control unit has circuitry for controlling the temperature of the soldering iron at the tip by adjusting the supply of power to the tip heater of the soldering iron, a temperature selector for enabling selection of a temperature to which the soldering iron is to be heated by a user, a calibration temperature sensor connected to said circuitry and exposed for enabling it to be engaged by the tip of the soldering iron.

Abstract: A self-grounding soldering tip having a spring which serves for connecting the soldering tip to a heater bobbin for establishing a secure grounding of the soldering tip. A bobbin tube extends within the heater bobbin for removably retaining the soldering tip within the bobbin. The connection between the spring and bobbin tube provide tip-to-ground continuity. Moreover, the contact surfaces of the spring and bobbin tube are wiped clean upon plug-in and plug-out. The spring and bobbin tube are located in a cooler area of the soldering iron to slow down the rate of oxidation. Also, the spring and bobbin tube are made of the same or compatible materials, e.g., stainless steel, to prevent reactions that normally occur between incompatible metals.

Abstract: A tip heater cartridge and a soldering iron with handpiece for use therewith in which, according to a preferred embodiment, a precision molded plastic sleeve is provided on the tip heater cartridge body. The sleeve is provided with an axially extending, radially projecting key which assures accurate tip-to-handpiece orientation and also produces a rigid mechanical interlock between the tip heater cartridge and the handpiece to ensure that there is no axial rotational or lateral movement or load transmitted from the tip of the tip heater cartridge to the electrical connector. In a particularly preferred arrangement, the end of the key acts with the handle keyway to prevent over insertion of the tip heater cartridge into the handpiece, which could damage the electrical connector assembly, and an O-ring on the electrical connector assembly acts to produces a seal relative to the body of the cartridge that prevents solder fumes from flowing into the connector assembly.

Abstract: The present invention allows a user to select a handle that is ergonomically friendly to a user's hand and replace it with the replaceable handle that is design to fit over a soldering iron rod. There are a number of advantages to the present invention. One of the advantages is that a user can choose its own handle with the desired, shape, size, color, and material. Another advantage is that since each user has its own handle, hygiene problems may be minimized. Still another advantage is the cost savings because as the replaceable handle wares out, only the handle needs to be replaced rather than the whole soldering iron.

Abstract: The present invention allows a user to select a handle that is ergonomically friendly to a user's hand and replace it with the replaceable handle that is designed to fit over a soldering iron rod. There are a number of advantages to the present invention. One of the advantages is that a user can choose an individual handle with the desired shape, size, color, and material. Another advantage is that since each user has an individual handle, hygiene problems may be minimized. Still another advantage is the cost savings because as the replaceable handle wears out, only the handle needs to be replaced rather than the whole soldering iron.

Abstract: A tip of a soldering iron is provided which separates any solder bridge, sucks up excess solder, and performs normal soldering operation. The tip has a cutter blade-like portion with its edge inclined. Grooves are formed on both side surfaces of the cutter blade-like portion. Solder guides extend along the grooves, and cylindrical through-holes penetrating the tip are formed at the ends of the grooves closer to an iron handle. When the cutter blade-like portion is applied to a solder bridge, solder is melted, and sucked up from the solder guides through the grooves by capillary action. Excess melted solder is collected to be stored by its surface tension.

Abstract: A wire bonding method includes aligning the face of a capillary along a first direction to make a first wire bond at a first bond point. The capillary face is realigned to a second direction to make a second wire bond at a second bond point. The realignment may be achieved by a system including an wire bonding capillary having an indicator located thereon. A detector detects a signal from the indicator. The signal corresponds to a rotational alignment of the capillary and, therefore, to a direction of alignment of the capillary face. A first signal indicates a first alignment of the capillary face and a second signal indicates a second alignment of the capillary face. The signals may each have a relative signal strength which indicates rotational an offset of the capillary face from a given direction.

Abstract: In a fixing device for fixing a soldering tip to a soldering device, the soldering tip comprises a front working end and a rear fixing end opposite the front working end, and the soldering device comprises a joining end for fixing the fixing end. A rotational-symmetric section is arranged at least at one end. In order to enable in a constructive and simple manner a safe and easily detachable fixing of a soldering tip in the soldering device, one end comprises a conical section, which is provided with an outer cone at least at some portions in the circumferential direction. This outer cone is arranged eccentrically with respect to the rotational-symmetric section, wherein the other end is provided with an inner cone in which the outer cone is supported rotatable between an insertion position and a fixing position.

Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.

Abstract: In order to realize effective and economical bonding operation even on workpiece whose inside is quite deep, a bonding tool, which has a length equivalent to a whole number of multiples of half the wavelength of the resonance frequency, is secured to an ultrasonic horn by a screw member which can advance or retreat in a direction perpendicular to the vibration direction indicated by an arrow X,thereby causing a front end surface of the bonding tool vibrate in the same direction as the vibration of the ultrasonic horn.

Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.

Abstract: A bonding tool for use with an ultrasonic horn comprising an orifice at a first end of the ultrasonic horn and a capillary having a first tapered end coupled, the first tapered end to the orifice of the ultrasonic horn.

Abstract: A system for bringing the joint edges of first and second sheet metal components into butting relationship. The components are clamped in opposing clamping assemblies with one of the assemblies being movable toward and away from the other. A fluid motor is mounted on one clamping assembly and a piston extending therefrom is connected to the other clamping assembly through a pair of expandable bladders. By sequentially introducing high and low pressure air to first one bladder and then the other, the movable clamping assembly is caused to move one component toward the other while accommodating any initial misalignment between the edges.

Abstract: A soldering member includes an elongated heating element for soldering a series of connectors. The elongated heating element of the soldering member is flexibly supported via a rigid base for adjusting the orientation of the heating element to align with a series of connectors rigidly supported for soldering. A method of using the soldering member is also described.

Abstract: An alignment apparatus is provided for ensuring proper positioning of a wire bonding capillary during installation of the wire bonding capillary onto the horn of a wire bonding machine. The apparatus ensures that the capillary is in a correct position relative to its longitudinal axis and is also in a desired rotational position with respect to the horn. The apparatus includes a first arm and a second arm which are movable toward each other to engage an outer surface of the horn thereby gripping the horn between the first and second arms. The apparatus also includes a support for holding the capillary. When the apparatus is properly positioned on the horn the support holds the capillary in a predetermined position in which the capillary is properly aligned with respect to the horn. A locking mechanism of the horn may then,be used to lock the capillary onto the horn.

Abstract: The apparatus, in preparation of soft soldering semiconductor chips to a substrate (6), is for the shaping of spherically domed liquid portions of solder (8) into flat solder applications (8"), as evenly distributed as possible and correctly positioned on the substrate. On a shaft (10) which can be lifted and lowered, a punch (20) with a punch surface (22) is guided vertically, spring mounted and slewable all around the axis of motion (16) and also frictionally engaged. The punch (20) is provided with distance keeping means--e.g. in the form of a circumferential rim (24)--which extends beyond the punch surface (22) and is intended for touching down on the substrate (6). In each operation cycle the punch (20) is automatically aligned to the substrate (6). Since the punch (20) is self-adjusting with respect to the shaft (10), it is unnecessary to maintain an exactly defined height position above the substrate.

Abstract: An improvement in a reflow soldering apparatus for bonding a connector element such as flexible circuitry or a pin type input/output (I/O) connector to a printed circuit board (PCB) is disclosed wherein a fixture tray included in the apparatus automatically aligns or self levels itself with the heating bars, or thermodes, of the apparatus. The fixture tray includes a body for supporting the connector/PCB assembly and cylindrical rods extending from the body. The rods are rotatably supported in corresponding grooves on the surface of the fixture tray table. As a thermode is pressed onto the connector/PCB assembly, the fixture tray rotates about its axis of rotation until the work area is aligned with the thermode. In a sandwich type soldering application including a pair of thermodes for simultaneously soldering opposite sides of a connector/PCB assembly, the fixture tray rests on an upper plate of a tray table supported by resilient means such as springs.

Abstract: A heating tip in which an insertion cavity is formed in a tip substrate made of copper or copper alloy for insertion and containment of a heat generating portion, wherein the inner circumferential wall surface of the insertion cavity is formed by forging into a non-circular cross sectional shape which is identical with a non-circular cross sectional shape on the outer circumferential surface of the heat generating portion. The insertion cavity has the non-circular cross sectional shape and, accordingly, the area of contact with the heat generating portion is enlarged compared with a case of a circular cross sectional shape with the hole volume being assumed identical, thereby increasing the heat conductivity from the heat generating portion and enhancing the temperature rising characteristics and the thermal response of the heating tip. Since the insertion cavity is formed by forging loss of the material can be decreased, neatly and easily and, in addition, working life of the tool can be extended.

Abstract: A friction-stir welding probe tip is disclosed which has right-handed threads on one portion of the probe and left-handed threads on another portion of the probe such that weld material is drawn to the middle of the weld as the friction-stir welding probe is rotated and passed along the joint region of the pieces to be joined. This probe tip is also fitted with a shoulder region for gripping by a rotation means.

Abstract: A soldering iron tip includes a removable Invar shield covering a copper core plated with other metals. In one embodiment, the core is plated with iron and, outside a working section of the tip, with nickel and chrome. In another embodiment, the core is plated with chrome.

Abstract: A system (30) is provided for interconnecting a first component (10) having multiple first bonding sites (16) and a second component (12) having multiple second bonding sites (18). The system (30) includes a leadframe (40) coupled to the first component (10) and the second component (12) that advances from a first position (50) to a second position (52). A film tape carrier (32) advances a wirefilm (20) removably coupled to the film tape carrier (32) into the first position (50). The wirefilm (20) includes a substantially planar film (22) and multiple wire strands (14), each wire strand (14) having a first end (24) that contacts a first bonding site (16) and a second end (26) that contacts a second bonding site (18). A film attach tool (62) contacts the first component (10) and the second component (12) with the wirefilm (20) at the first position (50) to interconnect the first component (10) and the second component (12).

Abstract: A fabricated gas turbine engine component and method of manufacturing. In one embodiment the component having a structural member with a cover member metalurgically bonded thereto. The bonding of the cover member being controlled by an apparatus that sequentially applies a substantially non-unifrom bonding load across the components radius of curvature. The patterns utilized in the casting process are formed in one embodiment to a precision preformed geometry by a closed die forming operation.

Abstract: A rotation device (100) provides precise, stepwise rotation of a wire bonding capillary (10) about the longitudinal axis of the capillary. This enables the capillary (10) to be rotated to different angular alignments to perform wire bonding in different directions. The rotation device (100) can be a click ring-type device, a cam-type device or any other device to provide stepwise rotation. At least a part of the rotation device (100) is coupled to the capillary (10). Another part of the rotation device is separate from the capillary but engageable with the first part to provide rotation. Indicators may be positioned on the capillary to provide signals to detectors. The signals can be used to initially align the capillary and to realign the capillary during wire bonding. A computer may be used to provide automated control of the indicators and detectors, and automated rotation of the rotation device.

Abstract: A pressure head (10) for contacting pressure areas through relative movement in the vertical Z-direction includes a frame (20), a pair of horn assemblies (12) each including a horn (100) for contacting a workpiece (230), the horn (100) supported by a gimbal (40) connected to the frame (20) and a pair of pressure assemblies 15, each including a pressure cylinder (310) for applying a force to its horn (100). The gimbal (40) has only a single outer torsion member (50) and supports the horn (100) such that the horn (100) can rotate about orthogonal X and Y rotation axes and can translate in the Z-direction relative to frame (20). Each gimbal (40) having only a single outer torsion member (50) allows a pair of gimbals (40) to support horns (100) in close proximity for operation on two proximal work areas.

Abstract: A capillary for bonding a wire between two bonding locations which comprises a capillary (1) having a body having an exterior surface, a bore (23) therethrough and a wall disposed between and defined by the bore and the exterior surface, the bore terminating at an end portion (9) of said body. The wall has at one end portion thereof first (21) and second opposing sectors spaced from each other by third and fourth opposing sectors (31), the first sector having a thickness greater than the rest of the sectors and the second sector having a thickness intermediate the first sector and the third and fourth sectors. A first bond, generally a ball bond (3), is formed at a first bonding location with the capillary. The capillary is moved to a second bonding location and a stitch bond is formed at the second location while the portion of the capillary of greater thickness is downstream of the path of travel of the capillary while making the stitch bond.

Abstract: A capillary for a wire bonding apparatus having a wire threading hole and a chamfer, in which the wire threading hole is formed in two stages as first and second wire threading holes, the diameter of the first wire threading hole which is located above the second wire threading hole exceeds the diameter of a bonding wire by no more than 3 to 8 microns, the diameter of the second wire threading hole is 5 to 10 microns greater than the first hole diameter, and the depth of the second wire threading hole is 10 to 50 microns.

Abstract: An ultrasonic horn used in, for instance, wire bonding having a structure for holding a capillary therein, the capillary holding structure including an external screw section which protrudes from the end surface of the horn and a spacer mount which is larger in diameter than the external screw section and formed on the root portion of the external screw section. A ring-form spacer is mounted on the spacer mount, and the spacer has a shape that prevents the rotation of the spacer on the spacer mount and is formed so that its vertically opposing end portions are positioned above and below the capillary attachment hole, and the length between the horizontally opposing end portions of the spacer is shorter than the length of the vertically opposing end portions.