Abstract: A fully-automatic cutting and welding apparatus for stepped steel plate, comprising a multi-function motion module (1), an automatic feed library turntable (2), a product flip platform (3), a steel plate bearing module (4), a pedestal (5), and a base (6). The multi-function motion module (1) is capable of performing motion in a Y-axis direction on the pedestal (5); the pedestal (5) is fixed on a surface edge of the base (6);the automatic feed library turntable (2) is fixed at one end of the base (6); the product flip platform (3) is disposed between the automatic feed library turntable (2) and the steel plate bearing module (4), and the steel plate bearing module (4) is fixed at the other end of the base (6) for bearing and fixing a steel plate, and is used as a welding platform for the final steel plate step part.

Abstract: A tooling for holding a set of preformed parts to be friction-welded together to construct a generally plane hollow structure is provide. The tooling includes a framework for receiving the preformed parts inside the framework for welding together to form the hollow structure. The framework includes shape-holder members which are shaped to correspond and contact the outer surfaces of the preformed parts. At least one anvil is disposed inside the framework. A reversible clamp is installed inside the framework and movable into a clamping position in which the clamp inflates to apply opposing thrust in at least two directions such that thrust is applied in a lateral direction to the anvil and applied in a second direction to the inside surface of the preformed parts disposed. The set of preformed parts is held in a welding position with the clamp and framework while a welding operation is performed.

Abstract: A coating process includes preheating a workpiece having an aluminum-containing layer through a temperature range in a reducing atmosphere having hydrogen to limit formation of thermally grown oxides on the surface of the workpiece. A source of oxygen is introduced to establish an oxidizing atmosphere at a temperature above the temperature range to form a desired type of thermally grown oxide on the surfaces of the workpiece. A coating is then deposited on the desired type of thermally grown oxide.

Abstract: Disclosed herein is a system for manufacturing a membrane electrode assembly of a fuel cell stack, in which the concept of automation is introduced to the entire process for manufacturing the membrane electrode assembly and, in particular, bonding and stamping processes for the membrane electrode assembly and a gas diffusion layer are integrated. According to the present invention, it may be possible to reduce the installation area of the system and reduce the production cycle type, thus facilitating mass production.

Abstract: Provided is a robot cell apparatus in which a cooperatively operable area for a pair of robot arms can be widened and which has an excellent workability. The present invention includes a table with a plane having a quadrangular shape in plan view, a workpiece being placed on the plane. Proximal ends of robot arms are respectively fixed to two corners at diagonal positions among four corners of the plane of the table. A cooperatively operable area in which the pair of robot arms are cooperatively operable is formed in a space above the plane of the table.

Abstract: A beverage bottle handling machine construction method for constructing a beverage bottle handling machine, such as a beverage bottle cleaning machine, a beverage bottle treating machine, and a beverage bottle shrink wrapping machine in a beverage bottling plant and container handling machines corresponding to the beverage bottle handling machine. The abstract of the disclosure is submitted herewith as required by 37 C.F.R. §1.72(b). As stated in 37 C.F.R. §1.72(b): A brief abstract of the technical disclosure in the specification must commence on a separate sheet, preferably following the claims, under the heading “Abstract of the Disclosure.” The purpose of the abstract is to enable the Patent and Trademark Office and the public generally to determine quickly from a cursory inspection the nature and gist of the technical disclosure. The abstract shall not be used for interpreting the scope of the claims.

Abstract: A beverage bottle handling machine construction method for constructing a beverage bottle handling machine, such as a beverage bottle cleaning machine, a beverage bottle pasteurization machine, and a beverage bottle shrink wrap machine in a beverage bottling plant. The abstract of the disclosure is submitted herewith as required by 37 C.F.R. §1.72(b). As stated in 37 C.F.R. §1.72(b): A brief abstract of the technical disclosure in the specification must commence on a separate sheet, preferably following the claims, under the heading “Abstract of the Disclosure.” The purpose of the abstract is to enable the Patent and Trademark Office and the public generally to determine quickly from a cursory inspection the nature and gist of the technical disclosure. The abstract shall not be used for interpreting the scope of the claims. Therefore, any statements made relating to the abstract are not intended to limit the claims in any manner and should not be interpreted as limiting the claims in any manner.

Abstract: The invention relates to a device for fitting and equipping motor vehicle battery housings as a compact system, which comprises individual production stations and associated transport devices, wherein the battery plate packs to be processed are arranged in clamping cassettes and are provided to the device in the necessary pack width for the intended battery cells by a feeding station arranged upstream.

Abstract: A palletized framing system for a motor vehicle body assembly system in which the pallet with a body structure positioned thereon is positioned at the framing station on balls to establish the vertical Z dimension with the pallet free to float on the balls in longitudinal X and lateral Y dimensions, whereafter positioners carried by one of the gates of the framing station engage and lock onto the pallet to precisely position the pallet and the body structure at the framing station at X and Y dimensions corresponding to the precisely attainable X and Y positioning of the gate.

Abstract: A palletized framing system for a motor vehicle body assembly system in which the pallet with a body structure positioned thereon is positioned at the framing station on balls to establish the vertical Z dimension with the pallet free to float on the balls in longitudinal X and lateral Y dimensions, whereafter positioners carried by one of the gates of the framing station engage and lock onto the pallet to precisely position the pallet and the body structure at the framing station at X and Y dimensions corresponding to the precisely attainable X and Y positioning of the gate.

Abstract: A minute ball array apparatus includes: an array jig including insert parts, into which minute balls are to be inserted, and which are formed in a predetermined pattern; a ball moving unit, which comprises a thrust surface, and which moves the thrust surface along an upper surface of the array jig so as to move the minute balls supplied onto the upper surface of the array jig to drop the minute balls into the insert parts of the array jig; a collapsing member, which is provided in a vicinity of the thrust surface, and which collapses a buildup of the minute balls rising along the thrust surface when the thrust surface is moved by the ball moving unit; and a motion imparting unit that imparts the collapse member with motion for collapsing the rising buildup of the minute balls.

Abstract: A method for batch brazing in a diffusion furnace includes inserting a plurality of fusible parts into a plurality of slots of at least one quartz boat, transporting the at least one quartz boat, including the fusible parts, into an interior of a reaction chamber of the diffusion furnace, sealing the interior of the reaction chamber, adjusting an atmosphere of the interior of the reaction chamber according to a recipe, moving a preheated furnace heating element from a location spaced apart from the reaction chamber to a location in substantial proximity with the reaction chamber to increase a temperature of the atmosphere of the interior of the reaction chamber above a predefined brazing temperature for a predefined brazing time period according to the recipe.

Abstract: An automatic soldering system includes a conveyance mechanism, a vehicle, a first part assembling mechanism, a first soldering mechanism, a turn-over mechanism, a second part assembling mechanism, a second soldering mechanism, and a control system. The vehicle is conveyed by the conveyor mechanism for carrying a workpiece. The first part assembling mechanism and the first soldering mechanism assemble and solder a first part to the primary workpiece carried by the vehicle. The turn-over mechanism turns the vehicle that is conveyed by the conveyor mechanism and carries the primary workpiece having the first part assembled thereto by a predetermined angle. The second part assembling mechanism and the second soldering mechanism assemble and solder and position a second part to the primary workpiece. The control system is electrically connected to and thus controls the first part and second part assembling mechanisms, the first and second soldering mechanisms, and the turn-over mechanism.

Abstract: A device for machining components, in particular of a vehicle body has a transport and positioning unit for the component and several machining stations, which are arranged around said unit and to which the component held by a component holder of the transport and positioning unit can be fed in a position ready for machining. To transport the component from one machining station to the other machining stations while taking up the smallest possible surface area, the transport and positioning unit includes a rotor and a pivoting arm that is mounted eccentrically on said rotor, driven in opposition to the latter and supports the component holder. The drives of the rotor and the pivoting arm are synchronized in such a way that the component holder is displaced along a closed curved path comprising spaces between the neighboring apexes of said path.

Abstract: An automatic soldering system includes a conveyance mechanism, a vehicle, a first part assembling mechanism, a first soldering mechanism, a turn-over mechanism, a second part assembling mechanism, a second soldering mechanism, and a control system. The vehicle is conveyed by the conveyor mechanism for carrying a workpiece. The first part assembling mechanism and the first soldering mechanism assemble and solder a first part to the primary workpiece carried by the vehicle. The turn-over mechanism turns the vehicle that is conveyed by the conveyor mechanism and carries the primary workpiece having the first part assembled thereto by a predetermined angle. The second part assembling mechanism and the second soldering mechanism assemble and solder and position a second part to the primary workpiece. The control system is electrically connected to and thus controls the first part and second part assembling mechanisms, the first and second soldering mechanisms, and the turn-over mechanism.

Abstract: A device for machining components, in particular of a vehicle body has a transport and positioning unit for the component and several machining stations, which are arranged around said unit and to which the component held by a component holder of the transport and positioning unit can be fed in a position ready for machining. To transport the component from one machining station to the other machining stations while taking up the smallest possible surface area, the transport and positioning unit includes a rotor and a pivoting arm that is mounted eccentrically on said rotor, driven in opposition to the latter and supports the component holder. The drives of the rotor and the pivoting arm are synchronized in such a way that the component holder is displaced along a closed curved path comprising spaces between the neighboring apexes of said path.

Abstract: The invention relates to a device for heat sealing two layers of foil material. To that end, the device comprises two blocks arranged opposite each other and conveying means for guiding the foil material between these blocks. Between the blocks, at least one heating element is provided, for heating the foil locally, and at least one circulating belt (20), which, in use, is guided along the blocks. The circulating belt (20) is built up from at least one layer of resilient material, so that a force applied by the blocks to the foil material is uniformly distributed over the sealing seam to be formed. The invention further relates to a circulating belt for use in a device according to the invention.

Abstract: A device for mounting an array of solder balls to a plurality of substrates of integrated circuits, comprising: a first plate for receiving a first substrate in a loading position; said first plate adapted to translate laterally from a substrate loading position to a flux receiving position; said first plate further adapted to rotate 180° from the substrate loading position to a such that the first plate is in a solder ball receiving position, and; mounting solder balls to the first plate.

Abstract: A manufacturing apparatus (2) for components (3), which has at least one movable loading station (20) designed as a tool magazine (13) and having reception points (39) with different tools (4, 5, 6, 7) for different component types A-I. The loading station (20) is connected to one or more machining stations (20, 22?) at which at least one machining device (23) and at least one handling device (24) for handling and releasing the components (3) from the tool (4, 5, 6, 7, 8) are arranged. The selected Figure is FIG. 5.

Abstract: This invention has an object to provide a method for precisely fabricating transportation pallets readily adaptable to model change and other alterations. In the method for fabricating a transportation pallet according to the invention, in which jig mounting plates are fixed on a steel pallet base, projecting pieces having holes to which jigs are attached are provided on one longer side of the jig mounting plates (12, 13) at a predetermined interval, a positioning member is secured on the pallet base, the jig mounting plates are temporarily secured along the positioning member, and the jig mounting plates are welded to be fixed on the pallet base.

Abstract: This invention has an object to provide a method for precisely fabricating transportation pallets readily adaptable to model change and other alterations. In the method for fabricating a transportation pallet according to the invention, in which jig mounting plates are fixed on a steel pallet base, projecting pieces having holes to which jigs are attached are provided on one longer side of the jig mounting plates at a predetermined interval, a positioning member is secured on the pallet base, the jig mounting plates are temporarily secured along the positioning member, and the jig mounting plates are welded to be fixed on the pallet base.

Abstract: A die bonding apparatus is presented which is capable of realizing different semiconductor packages, for example, a face up package and a face down package in a single die bonding apparatus. The die bonding apparatus includes a substrate transportation unit for transporting a substrate. A first bonding head unit is included which has a first bonding head for bonding a semiconductor chip disposed in a mount table adjacent to the substrate transportation unit over the substrate. A die transportation unit is included for transporting the semiconductor chip disposed in a mount table to a mount stage disposed at a lower portion of the substrate. A second bonding head unit is included in which the mount stage and a second bonding head disposed at an upper portion of the substrate corresponding to the mount stage and bonding the semiconductor chip disposed in the mount stage to the lower portion of the substrate.

Abstract: An automotive body framing system includes a setter supported by parallel spaced tracks for movement from a work position to a standby position and to a gate change position and driven by corresponding racks and synchronized pinion drive units. Opposing gate storage belt shuttles are located at the gate change position for receiving the setter therebetween, and a gate staging cart is supported in back of the setter by parallel tracks and is also moved between opposing gate storage belt shuttles by synchronized rack and pinion drive units. Power operated registration units are positioned on the setter to register each gate received at precise horizontal and vertical positions, and the setter, staging cart and gate storage belt shuttles each have a series of resilient guide and support rollers to provide for quiet operation during rapid transfer of the gates on the setter, staging cart and belt shuttles.

Abstract: A welding facility includes a main welding line for manufacturing an assembly of frame members, and a sub-welding line for manufacturing an assembly of panel members, the sub-welding line merging with the main welding line. The main welding line is comprised of a plurality of welding stages provided with a welding robot, the sub-welding line is provided at the end with a transfer mechanism for transferring the panel member assembly to the desired welding stage, and the merging parts are changeable according to the type of product to be welded. The facility permits a plurality of vehicle bodies having different vehicle types to be manufactured using the same manufacturing line.

Abstract: A machining station and a method produce vehicle bodies of different types. A clamping station has interchangeable clamping frames, at least one clamping frame magazine, into which the interchangeable clamping frames are deposited when not in use and from which the interchangeable clamping frames are removed when in use, and at least one robot for transporting the interchangeable clamping frames. The interchangeable clamping frames, in particular the clamping frames for the vehicle body side parts, are divided into a plurality of separable segmental clamping frames, with, to convert to a different type of vehicle body, one segmental clamping frame in each case being transported by a robot from the clamping station to the clamping frame magazine, being deposited there, a segmental clamping frame of a different type being removed from the clamping frame magazine and this segmental clamping frame being transported to the clamping station.

Abstract: A method of manufacturing a structural part through diffusion bonding in solid state without secondary materials after stacking multi-sheet metal and a tool thereof are disclosed. The tool for diffusion boding of multi-sheet metal includes a top tool having a top gas inlet, a central tool coupled to the top tool for installing the multi-sheet metal inside the central tool, a bottom tool coupled to the central tool for supporting the multi-sheet metal and having a bottom gas inlet and a vacuum path for making a vacuum state or an inert gas environment, and a sealing plate interposed between the top tool and the central tool.

Abstract: A method is disclosed for manufacturing a plurality of vehicle bodies having different vehicle types using the same manufacturing line. In the method, when a frame member assembly and a panel member assembly of the vehicle body are to be joined, the frame member assembly and the panel member assembly are welded on a different welding stage, enabling the welding stage to be changed according to the vehicle type.

Abstract: The assembly of body components using a geometry box (1) and clamping frames (7, 8) is described. At least for the larger components (9, 10), in particular the side wall parts of the body, a multipart clamping frame (8a, 8b) is used. The component (9, 10) is grasped and fed to the geometry box (1) using one clamping frame part, while the other clamping frame part is fed empty. Using both clamping frame parts, the component (9, 10) is then fixed precisely in position using positioning and fixing units acting between the geometry box (1) and the clamping frame (7, 8) in such a way that the components (6, 9, 10) to be connected to one another may be connected to one another, in particular welded.

Abstract: The present disclosure provides for a method of welding an adapter fitting to a fitting on a measuring device system. The present disclosure also provides for a measuring device system having a first fitting that includes a stem, a second fitting that defines an opening sized to receive the first fitting, where the second fitting also defines an abutment face, wherein the second fitting is positioned around the first fitting with the abutment face abutting an outward end of the first fitting, and where at least one weld secures the first fitting to the second fitting.

Abstract: A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.

Abstract: In a welding system comprising a welding station and various pairs of side frames, which can be positioned selectively in the welding station for clamping in the welding position bodies of different types, are provided magazines of side frames both upstream and downstream of the welding station. There are moreover provided auxiliary guide means, which connect directly together at least one magazine upstream of the welding station and at least one magazine downstream of the welding station so as to enable transfer of pairs of side frames directly from a magazine upstream to a magazine downstream or vice versa, without passing through the welding station.

Abstract: A manufacturing plant (1) is provided for vehicle body parts (2, 3). The manufacturing plant includes a number of processing stations (4, 5, 6, 7, 8, 9, 10), which are situated one behind the other along a transfer line (22), and of a number of multiaxial robots (18, 19). In at least one processing station (4, 5, 6, 7, 8, 9, 10), one or more handling robots (18) for transporting parts is/are arranged on at least one axis of travel (20, 21). Next to the handling robot (18), one or more processing robots (19) is/are displaceably arranged on the same axis of travel (20). Working locations (11, 12) are arranged on both sides of a common axis of travel (20), whereby another common axis of travel can be provided on the rear side of the working locations.

Abstract: A flip chip bonding tool and ball placement capillary system comprising a dissipative material with a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to avoid current flow to the device being bonded is disclosed.

Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.

Abstract: Methods for making and using dissipative ceramic bonding tool tips for wire bonding electrical connections to bonding pads on integrated circuit chips and packages. The method of using the dissipative ceramic bonding tool tip includes dissipating charge while bonding to avoid damaging delicate electronic devices by a sudden surge of accumulated charge. The method of making the tool tip includes affecting its conductivity so that it conducts electricity at a rate sufficient to prevent charge buildup, but not sufficient to overload the device being bonded. For best results, a resistance in the tip assembly itself should range from 5×104 or 105 to 1012 ohms. In addition, the tips must also have specific mechanical properties to function satisfactorily.

Abstract: A heating head for soldering and de-soldering surface mount devices (SMD's) using hot inert gas or air is comprised of a handle in which there is placed a heater sub-assembly on which there is secured a quick connect mechanism for mounting a heating nozzle. The heater sub-assembly is enclosed in a shroud and is secured to the end of the handle by a thermal insulating ring, such shroud housing a ceramic rod having elongated bosses on which a heating element is secured, while a laminar flow equilizer is used to provide more uniform gas flow across the heating element. Quick connect mechanism is secured to the heater sub-assembly shroud and uses a spring loaded winged locking mechanism to the secure heating nozzles to the heater head. In one embodiment, the heating nozzles have a truncated pyramid shaped chamber to which individual end nozzles are attached for directing gas flow.

Abstract: Methods for making and using dissipative ceramic bonding tool tips for wire bonding electrical connections to bonding pads on integrated circuit chips and packages. The method of using the dissipative ceramic bonding tool tip includes dissipating charge while bonding to avoid damaging delicate electronic devices by a sudden surge of accumulated charge. The method of making the tool tip includes affecting its conductivity so that it conducts electricity at a rate sufficient to prevent charge buildup, but not sufficient to overload the device being bonded. For best results, a resistance in the tip assembly itself should range from 5×104 or 105 to 1012 ohms. In addition, the tips must also have specific mechanical properties to function satisfactorily.

Abstract: A method and apparatus for joining multiple layers of materials using an ultrasonic welding apparatus. The ultrasonic welding apparatus utilizes a sonotrode to perform a weld between at least the top and intermediate layer of the multi-layer member. Then, either the multi-layer member or the ultrasonic welding apparatus is rotated such that the bottom layer is positioned adjacent the sonotrode wherein the sonotrode forms a weld between at least the bottom layer and intermediate layer of the multi-layer member. The apparatus includes an ultrasonic welding gun having a C-shape frame including a base portion and a head portion. An ultrasonic welding device, including a sonotrode, is secured to the head portion and an anvil secured to the base portion. The ultrasonic welding gun is connected to a robot operative to position the ultrasonic welding gun to perform the welding operation.

Abstract: A method of teaching a robot off-line having a traveling axis, by which the final position and final posture are determined when a robot having a traveling axis stops at an arbitrary position on a traveling axis. The method is able to take an arbitrary posture at the arbitrary position, change from the arbitrary position and arbitrary posture, and move a control point of the robot until it agrees with a movement target point. This position on the traveling axis of the robot is determined so as to minimize the distance between a coordinate origin of the robot a movement target point.

Abstract: The present invention provides a sealing system for implementing an optimum temperature profile for solder melting and improving productivity, and a sealing method therefor. The present invention comprises a sealing machine for superimposing a pre-soldered cap onto a package on which an electronic device element is mounted, a multi-clip for receiving and holding a plurality of sets of the packages and caps superimposed by the sealing machine in batch, and a sealing furnace for heating the plurality of sets held in batch by the multi-clip, and generating a plurality of electronic devices in batch by melting the previously applied solder and sealing the plurality of sets of packages and caps. According to the present invention, the plurality of sets of the packages and caps held in batch by the multi-clip are heated and sealed, therefore the sealing efficiency of the packages and caps can be improved.

Abstract: Methods for making and using dissipative ceramic bonding tool tips for wire bonding electrical connections to bonding pads on integrated circuit chips and packages. The method of using the dissipative ceramic bonding tool tip includes dissipating charge while bonding to avoid damaging delicate electronic devices by a sudden surge of accumulated charge. The method of making the tool tip includes affecting its conductivity so that it conducts electricity at a rate sufficient to prevent charge buildup, but not sufficient to overload the device being bonded. For best results, a resistance in the tip assembly itself should range from 5×104 or 105 to 1012 ohms. In addition, the tips must also have specific mechanical properties to function satisfactorily.

Abstract: A production line for assembling a pair of left and right car components, capable of assembling a pair of high quality car components by on line at high operating efficiency and productivity and capable of controlling jigs and molds with high dimensional accuracy. The production line of this invention related to a production line for assembling a pair of left and right front doors for supply to an assembly line of the white body of a car, is constructed by arranging various processes on one line, which comprises a work tack welding process A comprising a work input device 3 for alternately inputting the left right front door panels LDP and RDP, an incremental welding process B for welding either one of the works while transferring the other, a marriage process C, a door skin input and sealing process D, a hemming process E, a hemming delivery process F, and a front door delivery portion.

Abstract: Dissipative ceramic bonding tips for wire bonding electrical connections to bonding pads on integrated circuits chips and packages are disclosed. In accordance with the principles of the present invention, to avoid damaging delicate electronic devices by any electrostatic discharge, an ultrasonic bonding wedge tool tip must conduct electricity at a rate sufficient to prevent charge buildup, but not at so high a rate as to overload the device being bonded. For best results, a resistance in the tip assembly itself should range from 105 to 1012 ohms. In addition, the wedges must also have specific mechanical properties to function satisfactorily.

Abstract: In a method of manufacturing multiple kinds of products in an arbitrarily selected order in one manufacturing apparatus, the rate of operation of the welding robots to be disposed in each of assembly lines for each of parts is improved, the cost for equipment investment is reduced, and the time required to introduce a new kind of motor vehicle into the manufacturing apparatus is shortened, whereby the productivity is improved. The manufacturing apparatus is made up of: a plurality of part assembly lines for assembling a plurality of parts; a combining station for tack-welding these parts to thereby assemble a product; and a reinforce-welding line for reinforce-welding the product. The number of welding points for welding each of the parts in the respective assembly lines is made equal to one another for all kinds of vehicles. Those welding points of each of the parts which fall short of a required number of welding points are welded in the reinforce-welding line.

Abstract: A chip carrier and lid are sealed by mounting the chip carrier in an inverted position and mounting a lid having a sealing preform in an inverted position beneath and facing the chip carrier. The chip carrier and lid are then heated to melt the sealing preform and the chip carrier and lid are moved together to join them at the sealing preform.

Abstract: In an apparatus for soldering/desoldering components having a nozzle with larger and smaller ends, the larger end for attaching to an exhaust for drawing a vacuum and to a supply of heated gas for at least softening solder, an insert is attached at the smaller end of the nozzle to adjust the size of that opening for receiving each of a plurality of components, fitting different inserts to different sizes of components.

Abstract: An electronic assembly is fabricated by tinning a solder to the electrical bonding pads of a printed circuit board, and applying an adhesive, preferably a filled polyurethane adhesive, to the component that is to be bonded to the printed circuit board. The component is contacted to its bonding location on the printed circuit board, and the electrical contact on the component is contacted to the tinned bonding pads. The assembly is heated in a single solder temperature/time reflow cycle to simultaneously cure the adhesive and solder the electrical contacts to the bonding pads.

Abstract: Apparatus for connecting a first area array component to a substrate with a joining material. The apparatus has a nozzle directing heat toward both the first area array component and the portion of the substrate beneath the first area array component to melt the joining material. An elastic seal contacts the substrate and prevents the heat from affecting other components adjacent the first area array component. The nozzle is pressed against the substrate to restrain warping of the substrate, which might be caused by the heating of the first area array component, and to prevent damage to the substrate. The nozzle can tilt so that it conforms to the surface of the substrate. The first area array component is allowed to move freely in the direction of a plane of the substrate under the surface tension of the molten joining material during heating to center the first area array component.