Abstract: A wire bonding apparatus connecting a lead of a mounted member with an electrode of a semiconductor die through a wire comprises a capillary through which the wire is inserted, a shape acquisition part which acquires the shape of the lead to which the wire is connected, a calculating part which calculates an extending direction of a wire tail extending from the end of the capillary based on the shape of a lead to which the wire is connected next, and a cutting part which moves the capillary in the extending direction and cuts the wire to form the wire tail after the lead is connected with the electrode through the wire. Thus, in the wire bonding using wedge bonding, joining part tails (183a, 283a, 383a) formed in continuation to a first bonding point can be prevented from coming into contact with each other.

Abstract: A wire bonding apparatus connecting a lead of a mounted member with an electrode of a semiconductor die through a wire comprises a capillary through which the wire is inserted, a shape acquisition part which acquires the shape of the lead to which the wire is connected, a calculating part which calculates an extending direction of a wire tail extending from the end of the capillary based on the shape of a lead to which the wire is connected next, and a cutting part which moves the capillary in the extending direction and cuts the wire to form the wire tail after the lead is connected with the electrode through the wire. Thus, in the wire bonding using wedge bonding, joining part tails (183a, 283a, 383a) formed in continuation to a first bonding point can be prevented from coming into contact with each other.

Abstract: A method of forming a semiconductor structure includes: attaching a semiconductor device to a first surface of a substrate; placing a thermal interface material (TIM) film over a first side of the semiconductor device distal from the substrate, where the TIM film is pre-formed before the placing, where after the placing, a peripheral portion of the TIM film extends laterally beyond sidewalls of the semiconductor device; and attaching a lid to the first surface of the substrate to form an enclosed space between the lid and the substrate, where after attaching the lid, the semiconductor device and the TIM film are disposed in the enclosed space, where a first side of the TIM film distal from the substrate contacts the lid.

Abstract: An apparatus comprising a bonding nozzle that has one or more channels in a bonding surface. The one or more channels comprise a first channel portion in an inner region of the bonding surface and a second channel portion along an outer periphery of the bonding surface. The one or more channels are in fluid communication with a vacuum port. A vacuum relief conduit within the bonding nozzle comprises a first opening into the second channel portion along the outer periphery of the bonding surface, and a second opening along an exterior wall of the bonding nozzle.

Abstract: A method of bonding a double-ended cable to a multi-tier substrate (such as a multi-tier printed circuit board) includes picking up the double-ended cable, and imaging alignment markers on a first head of the double-ended cable, a second substrate of the multi-tier substrate, a second head of the double-ended cable, and a first substrate of the multi-tier substrate. The method also includes aligning the alignment marker on the first head of the cable to the alignment marker on the second substrate of the multi-tier substrate, coupling the first head of the cable to the second substrate, and releasing the first head of the cable. The method further includes aligning the alignment marker on the second head of the cable to the alignment marker on the first substrate of the multi-tier substrate, coupling the second head of the cable to the first substrate, and releasing the second head of the cable.

Abstract: A soldering system includes a temperature measurement device that measures a temperature distribution of a surface of a substrate. The soldering system also includes a driver that drives the soldering system based on a control parameter obtained from the temperature distribution measured by the temperature measurement device.

Abstract: A method for surface treatment of a matte tin-plated product, which is configured for heating the matte tin electroplated on a surface of the product into a bright tin. The method for surface treatment includes heating the surface of the matte tin-plated product with infrared rays.

Abstract: A holder including syringe configured to move up and down as the lifting and lowering section moves up and down, a first displacement portion configured to move up and down with respect to the syringe and to which the component holding section is attached, and a second displacement portion provided separately from the first displacement portion and configured to move up and down with respect to the syringe and the first displacement portion. The second displacement portion includes an engaging portion configured to engage the first displacement portion urged downward by the first urging portion in a vertical direction, and a target detection portion coupled to the engaging portion and positioned above the syringe. The contact determination section determines that an electronic component has contacted the circuit board when displacement of the target detection portion is detected with the sensor.

Abstract: A die-bonding method and a spraying device for an LED include: providing a substrate provided with a pad and a white oil layer covering wiring, placing a steel mesh on the substrate, and then spraying suspension containing solder paste on the pad by the spraying device, to form a solder paste film layer. Finally, a reflow process for the solder is performed. The solder paste is prepared on the pad by spraying, so that a crystal wafer is prevented from being tilted or short-circuited due to pulling or dragging of the solder paste during the reflow process for the solder, thereby improving uneven brightness of the surface light source.

Abstract: A sealant applying device for applying a sealant along a joint line formed on a panel joint, may include a nozzle device including a nozzle tip mounted through a fixing block to apply the sealant to the joint line, a guide unit mounted on one side of the fixing block adjacent to the nozzle tip and configured to be slidably movable along the joint line to guide the nozzle tip and a floating unit connected to the fixing block and a robot and allowing the fixing block to move upwards and downwards.

Abstract: Fabrication of a reliable circuit board assembly with soldered, plated through-hole structures is facilitated by characterizing plating of a plated through-hole of the circuit board using time-domain reflectance to obtain a base reflectance measurement, and applying solder to the plated through-hole. Based on applying the solder, the plating of the plated through-hole of the circuit board is re-characterized using time-domain reflectance to obtain a new reflectance value. Based on a deviation between the new reflectance measurement and the base reflectance measurement exceeding a threshold, dissolution, at least in part, of the plating of the plated through-hole due to applying the solder is identified.

Abstract: A deburring apparatus including: a robot that uses a deburring tool to deburr an object supported by a support in a machine tool, a visual sensor, a relative movement mechanism for causing relative movement between the visual sensor and the object supported by the support; and a controller, wherein the controller is configured to conduct: an operation process that operates the relative movement mechanism based on a visual sensor relative movement program for controlling an operation of the relative movement mechanism so that a ridge of the object supported by the support is detected by the visual sensor during the relative movement; and a deburring operation program generation process which generates a deburring operation program by using the detected ridge obtained by the visual sensor when the relative movement mechanism is operated based on the visual sensor relative movement program.

Abstract: In a case in which mounting deviation is occurring in a component which is mounted onto a solder surface of a board, a pad jig is pushed against the component, and the mounting deviation of the component is corrected through a friction force between the pad jig and the component by causing the pad jig to move in a horizontal direction.

Abstract: A method of operating a thermocompression bonding system is provided. The method includes the steps of: bringing first conductive structures of a semiconductor element into contact with second conductive structures of a substrate in connection with a thermocompression bonding operation; and moving the semiconductor element relative to the substrate along at least one substantially horizontal direction using a motion system of at least one of the semiconductor element and the substrate.

Abstract: A bonding apparatus bonds a plurality of device chips on a plurality of electrode pads that are provided to a surface of a substrate. The bonding apparatus includes a stage, a head unit, a head lifting mechanism, a head vibrator, a heater, and a bonding region observation component. The substrate is placed and supported on the stage. The head unit holds the device chips. The head lifting mechanism raises and lowers the head unit in an up and down direction relative to the stage. The head vibrator vibrate the head unit in the up and down direction. The heater heats a bonding paste that bonds the device chips and the electrode pads. The bonding region observation component observes a region that includes at least a peripheral part of the electrode pads.

Abstract: A solar cell module comprises a solar cell soldered to a mounting element, such as a ceramic substrate. The solder bond can comprise a void. A method of reducing a solder void comprises reflowing the solder using a vacuum source and a heat source in a sealed chamber. The chamber is formed, at least in part, by a cowling into which the solar cell module is mounted. A system for reducing voids in a solder bond comprises a heat source and a vacuum source coupled to the sealed chamber into which a solar cell module is placed. The system can optionally include a control system that automates the execution of methods of reducing solder voids. The system can further include a pressure source to aid in reducing the solder void and reflowing the solder after the void is reduced.

Abstract: A deformation state of a predetermined specific site as a site of singulated substrates where the electrodes are liable to be positionally deviated due to deformation is detected for each of the singulated substrates. In component mounting operation for picking up electronic components, and mounting the electronic components on the singulated substrates, it is determined whether the mounting of the electronic component on the specific site of the singulated substrates is suitable or not, based on the detection results of the deformation state for each of the singulated substrates. The operation of mounting all of the electronic components on the singulated substrate having the specific site determined to be not suitable in mounting is canceled.

Abstract: According to an embodiment, a welding target position measuring device comprises: a groove wall welding part detection means for detecting a groove wall welding part based on a result of the calculation performed by a groove shape change amount calculation means; a weld bead end detection means for detecting a weld bead end based on a result of the calculation performed by a groove shape difference amount calculation means; and a welding target position selection means for obtaining a welding pass number of a subsequent pass in a welding information stored in a welding information recording means and selecting a welding target position of the subsequent pass which differs depending on welding positions based on results of the detection of the groove wall welding part and the weld bead end.

Abstract: A method of fabricating a module for an airframe or fuselage structure of an aircraft or spacecraft includes positioning a first member adjacent to a second member at an assembly station; welding the first member to the second member at the assembly station to produce a module having a welded joint between the first and second members; and peening at least one of the first member, the second member, and the welded joint at the assembly station to compensate for or to correct distortion caused by the welding.

Abstract: A substrate bonding apparatus that bonds a first substrate and a second substrate together, comprising a joining section that joins the first substrate and second substrate together aligned to each other for stacking; a detecting section that detects an uneven state on at least one of the first substrate and second substrate prior to joining by the joining section; and a determining section that determines whether the uneven state detected by the detecting section satisfies a predetermined condition, wherein the joining section does not join the first substrate and the second substrate if it is determined by the determining section that the uneven state does not satisfy the predetermined condition.

Abstract: An aluminum welding system includes a welding machine configured to weld a workpiece with an aluminum nugget and a measurement device configured to measure an attribute of at least one of the aluminum nugget and a welding process. The system further includes a processing device configured to output a weld quality signal representing a quality of an aluminum weld based at least in part on the attribute measured. A method includes measuring an attribute of at least one of an aluminum nugget forming a joint of a workpiece and a welding process, determining a quality of an aluminum weld based at least in part on the attribute measured, and outputting a weld quality signal representing the determined quality.

Abstract: This disclosure describes a method and apparatus for controlling the temperature of a welding zone for welding together pipe sections. The temperature is controlled by a flow of inert gas through the pipes. The inert gas flow is cooled and acts as a heat sink to remove heat from the weld zone thereby controlling the weld zone temperature.

Abstract: Plume shield shroud (10) for a plasma gun (30) includes a substantially tubular member (14) comprising an axial length, a plume entry end (11), and a plume exit end (13). The shroud (10) is adapted to be mounted to a plasma gun (30). A method of protecting, confining or shielding of a gas plume of a plasma gun (30) includes mounting (20) a gas plume shroud (10) on the plasma gun (30) such that the shroud (10) is sized and configured to substantially surround at least a portion of the gas plume.

Abstract: An additive manufacturing system includes an additive manufacturing tool configured to receive a plurality of metallic anchoring materials and to supply a plurality of droplets to a part, and a controller configured to independently control the composition, formation, and application of each droplet to the plurality of droplets to the part. The plurality of droplets is configured to build up the part. Each droplet of the plurality of droplets includes at least one metallic anchoring material of the plurality of metallic anchoring materials.

Abstract: A beam includes at least three web plates that are connected to a bottom flange and top flange.

Abstract: A temperature triggering ejector system for lock pin soldering type component is provided. There is provided a temperature triggering ejector system for a lock pin soldering type component, lock pins of said component are fixed in through holes of a circuit board and solder is filled in the through holes after soldering, said system comprising: an ejector that is located at one side of the circuit board that is opposed to said component, and has ejector pins aligned with the through holes of the circuit board and a cylinder that drives the ejector pins; a temperature sensor for sensing the temperature of said solder being heated; a controller for driving the ejector pins of the ejector within a solder melting temperature range based on the temperature sensed by the temperature sensor, to eject the lock pins of said component from said circuit board.

Abstract: The described embodiments relate generally to electronic devices and more particularly to methods for forming mechanical and electrical connections between components within an electronic device. In one embodiment, an interconnect component such as a flex cable is attached to a substrate such as a printed circuit board. A plurality of apertures can be created in the interconnect component, passing through bonding pads located on one end of the interconnect component. The interconnect component can then be aligned with bonding pads on the substrate with the bonding pads on the interconnect component facing away from the substrate. A conductive compound can be injected into the apertures through the interconnect component, forming a mechanical and electrical connection between the bonding pads. In some embodiments, an adhesive layer can be used to further strengthen the bond between the interconnect component and the substrate.

Abstract: Methods for joining material to an article comprising one or more passageways include fluidly connecting a temperature controlled fluid source comprising temperature controlled fluid to at least one passageway and passing the temperature controlled fluid through the at least one passageway, wherein the temperature controlled fluid at least partially controls a temperature profile of the article. The methods further include joining material to the article, wherein the temperature profile of the article at least partially controls a resulting joined material characteristic.

Abstract: An object of the invention is to provide an electronic component mounting system which can execute component mounting work on a plurality of boards simultaneously, concurrently and efficiently so that high productivity and responsiveness to production of many items can be achieved consistently.

Abstract: A device includes a vacuum nozzle, a driver, a measuring unit, and a controller. The nozzle lifts and holds a photoelectric element having a first electrode and a second electrode. The driver drives the nozzle to press the photoelectric element onto a substrate having a soldering pad and a contact, such that the second electrode is electrically connected to the soldering pad via a layer of conductive glue. The measuring unit measures a resistance across the first electrode and the contact of the substrate when the photoelectric element is pressed onto the substrate. The controller controls the driver to drive the nozzle to keep pressing the photoelectric element harder and harder into the substrate until the resistance stops decreasing, that is, when the layer of conductive glue is at its thinnest.

Abstract: A reflow soldering system wherein a heating oven is provided with a contact heating unit which has a transport rail and a top heat transfer heater, and with a hot gas blowing heating unit, the transport rail and top heat transfer heater are respectively provided with heaters which heat the outer edge part of the printed circuit board, and the transport rail or top heat transfer heater moves in an up-down direction so that the transport rail and top heat transfer heater clamp and heat the outer edge part of the printed circuit board.

Abstract: A method of manufacturing an electronic device includes a positioning step of positioning a first member supporting a laser diode with respect to a second member having a waveguide, a bonding step of bonding the first member and the second member together, and a checking step of checking the accuracy of positioning of the first member with respect to the second member. In the positioning step, the laser diode is energized to allow laser light to be emitted, and the laser light is allowed to be incident on the incidence end of the waveguide. In the bonding step, a bonding material is melted by irradiating the first member with heating light while the laser diode is not energized. In the checking step, the laser diode is energized again.

Abstract: A method and apparatus for assessing the cure status of a fibrous blanket manufactured with mineral fibers and binder is disclosed and comprises using continuous thermal measurement as an assessment of cure status. A plurality of thermocouples are installed in various oven locations both above and below the path of the fibrous pack to be cured and readings from the thermocouples are compared by a processor. The thermal measurements may be inlet or outlet temperatures of any particular zone or series of zones; or entry or egress temperatures; or averages or differences of measurements from selected thermocouple locations.

Abstract: A method for friction stir welding is provided. The method may include determining the temperature of one or both parts being welded. The parts may then be heated to a desired temperature and then friction stir welded together. By preheating the parts, the friction required to plasticize the parts during welding may be reduced. Thereby, the rotational speed of the friction stir welding tool may be reduced, and thus the tool life may be extended without decreasing the rate at which welds are created. Additionally, the cooling rate of the weld may be regulated with a thermal control device.

Abstract: A substrate is mounted on a first conveying carrier including a flat surface, transferred onto a printing table of a flux printer, transferred from the flux printer onto a second conveying carrier, transferred from the second conveying carrier onto a printing table of a solder ball printer, and transferred from the solder ball printer onto a third conveying carrier using a first carry-in mechanism, a first carry-out mechanism, a second carry-in mechanism, and a second carry-out mechanism including a plurality of vacuum attraction pads. Images of alignment marks provided at four corners of the substrate on the printing tables and four corners of a mask are simultaneously picked up by separate camera units on a front side and a rear side in a conveying direction to calculate a positional deviation amount.

Abstract: For selecting suitable bonding parameters for forming wire bonds onto bond pads of a substrate, one or more indentations are made onto at least one bond pad of the substrate with an indentation tool by applying a series of predetermined forces onto the at least one bond pad with the indentation tool. A depth-force profile of the substrate is measured comprising a relationship between each predetermined force that is applied and a resultant depth of the indentation made by the indentation tool. An appropriate set of bonding parameters suitable for forming wire bonds on the substrate is determined based on the measured depth-force profile.

Abstract: A bonding tool is adjusted to a desired operational position by viewing the bonding tool with an image-capturing device and displaying an image of the bonding tool as viewed by the image-capturing device onto a display screen. A corresponding image of a reference bonding tool showing the desired operational position of the bonding tool is superimposed onto the display screen and the position of the bonding tool is adjusted with an adjustment mechanism until the bonding tool as viewed by the image-capturing device is aligned with the superimposed image of the reference bonding tool.

Abstract: Disclosed is an apparatus for electrically interconnecting a plurality of solar cells. The apparatus comprises: i) a roller operative to roll along a solar cell to press an electrical conductor against an electrical contact of the solar cell, the electrical conductor being for electrically interconnecting the solar cell with one or more other solar cells; and ii) a heat-generating device arranged and configured to provide heat for soldering the electrical conductor to the electrical contact of the solar cell while the roller is pressing the electrical conductor against the electrical contact of the solar cell. A method of electrically interconnecting a plurality of solar cells, and a mechanism for laying and soldering an electrical conductor onto a solar cell, are also disclosed.

Abstract: A method for friction stir welding is provided. The method may include beginning a friction stir welding operation by directing a rotating friction stir welding tool along a joint between two parts. A temperature of the resulting weld may be measured. Thereby, a controller may adjust process parameters associated with the friction stir welding process to decrease a difference between desired and measured temperatures of the weld. The desired temperature may correspond to a temperature at which the parts are plasticized. The process parameters may include rotational speed of the friction stir welding tool, feed rate, axial force along the length of the friction stir welding tool, and tilt angle of the friction stir welding tool.

Abstract: Methods, devices, and systems for providing certification of friction stir welds are disclosed. A sensor is used to collect information related to a friction stir weld. Data from the sensor is compared to threshold values provided by an extrinsic standard setting organizations using a certification engine. The certification engine subsequently produces a report on the certification status of the weld.

Abstract: A mounting apparatus bonds an electrode of an electronic component and an electrode of a substrate with thermally fusible bond metal to mount the component on a substrate. The apparatus includes a heater base that moves on a path to and from the substrate, a bonding tool, a pedestal to hold the electronic component by vacuum. The bonding tool is heated with a ceramic heater in the heater base to thermally bond the electronic component retained on the pedestal. The bonding tool includes a cooling flow passage providing communication between the upper surface and a side surface of the pedestal. This offers the advantage of shortening the time for cooling during mounting of the electronic component.

Abstract: Disclosed is an apparatus and method for manufacturing a swing-ring plate. More particularly, the apparatus and method for manufacturing the swing-ring plate comprises a bending mechanism that moves a linear plate cut to a certain length from a first side to a second side, and bends the linear plate so as to face both ends thereof each other to form a ring shape; a pre-bonding mechanism that fixes the bent plate in the ring shape and pre-bonds the ends in the horizontal and vertical directions; and a final bonding mechanism that completely bonds the pre-bonded part of the plate by revolving around the fixed pre-bonded plate and positioning so that the top and bottom surfaces of the pre-bonded plate face upward.

Abstract: An electronic component mounting apparatus includes a bonding tool for thermally bonding an electronic component onto a substrate, the bonding tool to be driven in a direction getting close to and from the substrate, a linear scale and a linear scale head detecting the position of the bonding tool in the direction getting close to and from the substrate, and a control unit configured to hold the position of the bonding tool in the direction getting close to and from the substrate when a solder film between an electrode of the electronic component and an electrode of the substrate is thermally fused when the bonding tool gets close to the substrate by a predetermined distance from a reference position while heating the electronic component. The electronic component mounting apparatus for bonding the electronic component and the substrate with thermally fusible bond metal offers an improvement in the bonding quality.

Abstract: A system for aligning and connecting components including a support structure and a measuring apparatus coupled to the support structure. The measuring apparatus is arranged to spatially analyze a first tubular component with respect to a second tubular component for determining an adjustment vector therebetween. An alignment apparatus is coupled to the support structure and in data communication with the measuring apparatus. The alignment apparatus includes a plurality of actuators operatively arranged in parallel for moving at least one of the first or second tubular components relative to the other for coaxially arranging the first and second tubular components in accordance with the adjustment vector. A connection apparatus is coupled to the support structure and operatively arranged for connecting the first and second tubular components together.

Abstract: A board printing system is provided with a printing apparatus for printing solder paste on each board, a printing inspection apparatus for inspecting a printed state of solder paste on each board, a transfer device for transferring each board in a forward direction from an unloading portion of the printing apparatus to a loading portion of the printing inspection apparatus, a reversible feed holding device configured to be able to hold a failure board which was taken out from the loading portion of the printing inspection apparatus as a result of being judged by the printing inspection apparatus to be rejected, after feeding the failure board in a reverse direction and then, to load the failure board to the loading portion of the printing inspection apparatus by feeding the failure board in the forward direction, and a selection device for enabling the transfer device and the reversible feed holding device to be used selectively.

Abstract: A joining method includes melting a hot melt joining material provided between a board and a component to be joined to the board; and reducing the pressure of the ambient atmosphere of the hot melt joining material and tilting the board while the hot melt joining material is in a molten state.

Abstract: A multi-station, gantry-based automated welding system includes a gantry mounting robotic arc welders or other equipment. The gantry has a range of travel over multiple workstations, each workstation being adapted for rotatably mounting a respective workpiece on a headstock assembly and a tailstock assembly, which define a workpiece or weldment rotational axis extending therebetween. The tailstock assembly can be located at different positions within a workstation for accommodating different lengths of workpieces. Encoders are installed at the moving elements of the system for precisely tracking and providing output to the computer controller. Primary and secondary power/data distribution systems include cable and hose carriers for providing mobile power/data connections to the gantry and also to the robotic arc welders mounted thereon. The power/data distribution systems are elevated above a facility floor to avoid interfering with equipment, personnel and activities at floor level.

Abstract: The invention relates to a method of displaying and monitoring the profile of a weld bead (4), in which, placed inside the groove, there is an assembly (10) comprising, facing one another, an image acquisition means (11), a light source (12), the beam of which is directed towards said image acquisition means, and, between the image acquisition means and the light source, a mask (13); the optical axis of the image acquisition means (11) is oriented so as to be approximately parallel to the sidewalls (5, 6) of the groove (3); a light beam produced by the light source (12) is directed towards the mask (13) and the image acquisition means (11); a central shadow zone and a peripheral halo are formed by means of the light beam and the mask (13), said halo illuminating, approximately perpendicularly, the weld bead (4) and the sidewalls (5, 6); the profile of the weld bead (4) and the sidewalls (5, 6) are displayed on a display/monitoring means; and said assembly (10) is moved inside the groove (3) longitudinally and

Abstract: A method having a step of heating a mass forming a braze. Before the heating step, the method includes steps of arranging the mass and the member on the support. In particular, it includes a step of positioning the mass on the support and a step of applying a first compressive force on the mass so as to compress said mass against the support, the intensity of the first force increasing up to a predetermined first value chosen so as to flatten the mass. Next, the method includes a step of positioning the member on the flattened mass and a step of applying a second compressive force to the member so as to compress said member against the flattened mass and the support, the intensity of the second force increasing up to a second predefined value, the second predefined value being lower than the first predefined value.

Abstract: A device for cooling a rail weld zone according to the invention includes a first cooler cooling a head portion of the rail weld zone, a second cooler cooling a rail web portion of the rail weld zone, and a control section controlling the first and second coolers. The first cooler includes a first temperature detecting section that detects the temperature of the head portion, and a first ejection section that ejects a first cooling fluid to the head portion. The second cooler includes a second temperature detecting section that detects the temperature of the rail web portion, and a second ejection section that ejects a second cooling fluid to the rail web portion. The control section individually changes the kinds, the flow rates, and the flow velocities of the first and second cooling fluids while cooling the head portion and the rail web portion.