Abstract: On a semiconductor substrate, a well is formed. In the well, one MOS transistor including a gate electrode, a source region, a source field limiting layer and a source/drain region, and another MOS transistor including a gate electrode, a drain electrode, a drain field limiting layer and a source/drain region are formed. The one and another MOS transistors are connected in series through the source/drain region common to the two transistors. Accordingly, a semiconductor device can be provided in which increase in pattern layout area is suppressed when elements including a high-breakdown voltage MOS transistor are to be connected in series.

Abstract: A transistor device having a conformal depth of impurities implanted by isotropic ion implantation into etched junction recesses. For example, a conformal depth of arsenic impurities and/or carbon impurities may be implanted by plasma immersion ion implantation in junction recesses to reduce boron diffusion and current leakage from boron doped junction region material deposited in the junction recesses. This may be accomplished by removing, such as by etching, portions of a substrate adjacent to a gate electrode to form junction recesses. The junction recesses may then be conformally implanted with a depth of arsenic and carbon impurities using plasma immersion ion implantation. After impurity implantation, boron doped silicon germanium can be formed in the junction recesses.

Abstract: A technology of restraining junction leakage in a semiconductor device is to be provided. There is provided a semiconductor device provided with a semiconductor substrate, a gate electrode 9 formed on the semiconductor substrate, and a source/drain region formed beside the gate electrode, wherein the source/drain region 4 comprises a first impurity diffusion region including a first P-type impurity and located in the proximity of a surface of the semiconductor substrate, and a second P-type impurity diffusion region located below the first impurity diffusion region and including a second P-type impurity having a smaller diffusion coefficient in the semiconductor substrate than the first P-type impurity.

Abstract: An ESD-protection structure is located substantially under an integrated circuit bond pad. This ESD-protection structure is formed as a low capacitance structure by inserting a forward diode between the bond pad and the ESD clamp circuit. Placing the ESD-protection structure under the bond pad eliminates parasitic substrate capacitance and utilizes a parasitic PNP transistor formed from the inserted forward biased diode. The ESD-protection structure includes adjacent alternating P+ and N+ diffusions located substantially under a bond pad to be ESD protected. The P+ diffusions are connected to the bond pad metal with metal vias through an insulating layer. The N+ diffusions are adjacent to the P+ diffusions. An N+ diffusion surrounds the N+ and P+ diffusions, and ties together the N+ diffusions so as to form a continuous N+ diffusion completely around each of the P+ diffusions. An N? well is located substantially under the N+ and P+ diffusions.

Abstract: On a semiconductor substrate, a well is formed. In the well, one MOS transistor including a gate electrode, a source region, a source field limiting layer and a source/drain region, and another MOS transistor including a gate electrode, a drain electrode, a drain field limiting layer and a source/drain region are formed. The one and another MOS transistors are connected in series through the source/drain region common to the two transistors. Accordingly, a semiconductor device can be provided in which increase in pattern layout area is suppressed when elements including a high-breakdown voltage MOS transistor are to be connected in series.

Abstract: The present invention discloses a semiconductor device, and a method of fabricating the same, where the semiconductor device has a gate electrode, a source-drain diffused layer of a first conductivity type, and a sidewall insulating film formed on the side face of the gate electrode, wherein the source-drain diffused layer has a lightly doped region formed below the sidewall insulating film, and a heavily doped region with impurity concentration higher than that of the lightly doped region, and the lightly doped region includes at least two kinds of impurities of the first conductivity type.

Abstract: A preferred embodiment of this invention comprises a conductive lightly donor doped perovskite layer (e.g. lightly La doped BST 34), and a high-dielectric-constant material layer (e.g. undoped BST 36) overlaying the conductive lightly donor doped perovskite layer. The conductive lightly donor doped perovskite layer provides a substantially chemically and structurally stable electrical connection to the high-dielectric-constant material layer. A lightly donor doped perovskite generally has much less resistance than undoped, acceptor doped, or heavily donor doped HDC materials. The amount of donor doping to make the material conductive (or resistive) is normally dependent on the process conditions (e.g. temperature, atmosphere, grain size, film thickness and composition). This resistivity may be further decreased if the perovskite is exposed to reducing conditions.

Abstract: Methods and apparatus are provided for forming ultrashallow junctions in semiconductor wafers. The method includes the step of introducing into a shallow surface layer of a semiconductor wafer a dopant material that is selected to form charge carrier complexes, such as exciton complexes, which produce at least two charge carriers per complex. The semiconductor wafer containing the dopant material may be processed, such as by thermal processing, to form the charge carrier complexes. The charge carrier complexes are interstitial and therefore are not subject to the limitations imposed by the electrical solubility limits resulting from incorporation into substitutional sites. Thus, low sheet resistance can be obtained.

Abstract: A gate insulating film and gate electrodes are formed on a substrate containing N-type impurities such as P or As. Under the gate insulating film is a gate region on both sides of which are a first and a second source drain region. The gate region is furnished in its central part with a high-concentration channel injection region containing N-type impurities at a concentration higher than that of the substrate. Between the high-concentration channel injection region on the one hand and the first and the second source drain region and on the other hand, there are formed a first and a second low-concentration channel injection region and having substantially the same impurity concentration as that of the substrate.

Abstract: A method to improve the characteristics of bipolar silicon high-frequency transistor by adding indium into the base of the transistor is described. Instead of replacing boron in the base with indium to improve the beta-Early voltage product, at the price of high beta and high base resistance, separate boron and indium doping profiles are combined in the base. Thus, a transistor, which preserves most of the properties of pure boron-base transistor, is obtained, but with some parameters improved due to the added indium profile. This “double-profile” or “indium-enhanced” transistor exhibits improved beta-Early voltage product, reduced collector-base capacitance swing and lower temperature dependence of beta, but preserves the advantageous properties of a pure boron-base transistor.

Abstract: Methods of forming field effect transistors and related field effect transistor constructions are described. A masking layer is formed over a semiconductive substrate and an opening having sidewalls is formed therethrough. The opening defines a substrate area over which a field effect transistor gate is to be formed. A dopant of a first conductivity type is provided through the opening and into the substrate. Sidewall spacers are formed over respective sidewalls of the opening. Enhancement dopant of a second conductivity type which is different from the first conductivity type is provided through the opening and into the substrate. A transistor gate is formed within the opening proximate the sidewall spacers, and source/drain regions of the second conductivity type are diffused into the substrate operably proximate the transistor gate. The first conductivity type dopant forms a halo region proximate the source/drain regions and lightly doped drain (LDD) regions for the transistor.

Abstract: A gate insulating film and gate electrodes are formed on a substrate containing N-type impurities such as P or As. Under the gate insulating film is a gate region on both sides of which are a first and a second source drain region. The gate region is furnished in its central part with a high-concentration channel injection region containing N-type impurities at a concentration higher than that of the substrate. Between the high-concentration channel injection region on the one hand and the first and the second source drain region and on the other hand, there are formed a first and a second low-concentration channel injection region and having substantially the same impurity concentration as that of the substrate.

Abstract: A method for producing a semiconductor device which comprises a step for forming a gate electrode on a main surface of a semiconductor substrate via a gate oxide film, and a step for directing plasma ions with a gas mixture comprising a first gas containing a hydride of an impurity element and a second gas containing a fluoride of the impurity element into a surface of the semiconductor substrate.

Abstract: An improved semiconductor device including an MOS capacitance is provided, having enhanced MOS capacitance accuracy. A well of a first conductivity type is formed at the main surface of a semiconductor substrate. The above-described well is removed immediately under a capacitance dope layer.

Abstract: A CMOS semiconductor device is formed having an N-channel transistor comprising a graded junction with reduced junction capacitance. The graded junction is achieved by forming a second sidewall spacer on the gate electrode, after source/drain implantations, and ion-implanting an N-type impurity with high diffusivity, e.g., P into an A.sub.5 implant, followed by activation annealing.

Abstract: A process for grading the junctions of a lightly doped drain (LDD) N-channel MOSFET by performing a low dosage phosphorous implant after low and high dosage arsenic implants have been performed during the creation of the N-LDD regions and N+ source and drain electrodes. The phosphorous implant is driven to diffuse across both the electrode/LDD junctions and the LDD/channel junctions.

Abstract: An N-channel and P-channel MOSFET include counterdoping of a threshold voltage (V.sub.T) ion implant for reducing substrate sensitivity and source/drain junction capacitance. An arsenic (As) compensated boron (B) implant is provided in the N-channel MOSFET. A boron (B) compensated arsenic (As) implant is provided in the P-channel MOSFET.

Abstract: A method of manufacturing semiconductor devices with increased operating voltages is described. A dopant of a second conductivity type is implanted into a region of a first epitaxial layer of the first conductivity type to form a buried layer. A substantially smaller dosage of a faster-diffusing dopant of the second conductivity type is then implanted into the buried layer region. The second epitaxial layer of the first conductivity type is formed over the first epitaxial layer. A region of the second epitaxial layer overlying the doped region of the first epitaxial layer is implanted with a dopant of the second conductivity type and diffused to form a doped well. The faster-diffusing dopant diffuses upward to make good electrical contact with the doped well diffusing downward from the surface. The lateral diffusion of the faster-diffusing dopant can be contained, so that lateral spacing design rules do not have to be increased.

Abstract: The scanning of an operating integrated circuit (IC) substrate by an electron (e)-beam is detected by providing conductive plates in the substrate, and triggering a charge-sensitive mechanism such as a field effect transistor (FET) when an e-beam has scanned over the plate. The plates can be fabricated at different levels within the substrate, with a lower plate preferably shaded from the e-beam by an upper plate and providing a reference for the upper plate. E-beam detection occurs either through the positive or negative charging of capacitances associated with the FETs, or from instantaneous negative or positive current flows from the detector plates; a latch is actuated to hold an instantaneously detected current level exceeding a predetermined threshold. The logic state of this latch can be used to modify the functional operation of the IC in real time.

Abstract: A process for forming N-channel MOS sources and drains, by implanting both phosphorus and arsenic. The high diffusivity of phosphorus causes it to diffuse in advance of the bulk of the arsenic, so that, after annealing, the source/drain regions have graded regions of gradually decreasing conductivity adjacent to the end of the channels. Thus the electric potential gradient at the ends of the channels is reduced, and impact ionization and hot carrier effects are avoided. The effective radius of the source (or drain) junction is increased, providing increased breakdown voltage. The implantation of both phosphorus and arsenic with the resultant phosphorus peripheral band after annealing is used with self-aligned silicided source/drain regions to prevent silicide spiking through shallow arsenic regions to the P substrate and to prevent source/drain junction consumption during silicidation.