Vacuum-type Holding Means Patents (Class 269/21)
  • Patent number: 11940231
    Abstract: A heat dissipation device includes a heat absorbing member being provided with a first accommodating chamber for accommodating a working medium and a mounting hole in communication with the first accommodating chamber; and a valve installed in the mounting hole. The valve is adjustable between a first state and a second state to change the first accommodating chamber between a closed state and an open state. When the first accommodating chamber is in the open state, the first accommodating chamber is in fluid communication with outside so that the working medium can be injected into or discharged from the first accommodating chamber, so as to adjust the amount of the working medium in the first accommodating chamber. Thus, the heat dissipation device is applicable to various applications with different heat dissipating requirements.
    Type: Grant
    Filed: February 25, 2022
    Date of Patent: March 26, 2024
    Assignee: GUANGDONG ENVICOOL TECHNOLOGY CO., LTD.
    Inventors: Jing Zhang, Genglin Ding
  • Patent number: 11897069
    Abstract: A device for stabilizing a workpiece, in particular a thin-walled workpiece mounted in a machine tool, comprises at least one base; and a plurality of stabilizing elements. The stabilizing elements protrude away from one surface of the base, wherein the stabilizing element comprises a cylinder and a rod arranged therein and the rod can be driven hydraulically to move in the axial direction of the stabilizing element such that the rod of at least two of the stabilizing elements can be brought into contact with one surface of the workpiece.
    Type: Grant
    Filed: November 2, 2021
    Date of Patent: February 13, 2024
    Inventors: Christoph Urfer, Andreas Scheidegger, Ernst Haueter
  • Patent number: 11901214
    Abstract: The disclosed wafer processing apparatus includes a vacuum chuck unit configured to adsorb and support a wafer assembly including a wafer; a rotary chuck unit configured to rotate the vacuum chuck unit; a rotating shaft connected to the rotary chuck unit to rotate the rotary chuck unit; a ring cover unit configured to press the wafer assembly such that a processing solution sprayed onto the wafer is not diffused into the vacuum chuck unit; a sealing ring installed in the vacuum chuck unit and configured to support the wafer assembly; and a medium supply unit configured to supply an inspection medium to the vacuum chuck unit such that the inspection medium for identifying damage to the sealing ring flows into the sealing ring.
    Type: Grant
    Filed: March 25, 2022
    Date of Patent: February 13, 2024
    Assignee: ZEUS CO., LTD.
    Inventors: Ji Ho Park, Woon Kong, Ung Jo Moon, Ki Hun Park
  • Patent number: 11883873
    Abstract: The machine tool (1) having a work head (9) adapted to support a tool (21), a workpiece holder (30) having a two substantially parallel beams (31) arranged at a distance adjustable orthogonally to the longitudinal extension of the beams, a carriage (35) on each beam (31) movable along the longitudinal extension of the beam (31), on each carriage (35) a suction cup (39) for blocking the workpieces (P) to be machined. The position of each suction cup (39) with respect to the carriage (35) onto which the cup is mounted is adjustable by rotating around an axis (D-D) which is substantially orthogonal to a blocking surface, for blocking the workpieces, defined by the suction cups (39). To each suction cup (39) an actuator (46, 48) is associated, controlling the rotation of the suction cup (39) with respect to the carriage (35) onto which the cup is mounted.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: January 30, 2024
    Assignee: PAOLINO BACCI S.R.L.
    Inventors: Giuseppe Bacci, Paolo Bacci, Nino Bacci
  • Patent number: 11857099
    Abstract: A fruit peeler includes a base and a planing blade. The base includes a first rotating member and a second rotating member rotatable relative to the first rotating member. The first rotating member has a fixed arm that has a first position perpendicular to the first rotating member. One end of the fixed arm is connected to the first rotating member, and another end of the fixed arm has an insertion pin extending toward an inner side direction of the fixed arm and rotatable relative to the fixed arm. The planing blade is mounted on a planer frame that is arranged at the fixed arm, and is connected to the second rotating member. The planer frame has a third position perpendicular to the second rotating member. The planing blade can perform a reciprocating curve movement in an axial direction of the insertion pin when the second rotating member rotates.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: January 2, 2024
    Inventor: Pian Chen
  • Patent number: 11862506
    Abstract: A substrate processing system includes a substrate processing module, an atmospheric substrate transfer module, a first and a second vacuum substrate transfer module, a load lock module, and a vacuum substrate transfer robot. The first vacuum substrate transfer module having a first transfer space is disposed adjacent to the atmospheric substrate transfer module and the substrate processing module. The second vacuum substrate transfer module, having a second transfer space in communication with the first transfer space and external dimensions smaller than those of the first vacuum substrate transfer module in a plan view, is disposed on or under the first vacuum substrate transfer module. The load lock module is disposed between the atmospheric substrate transfer module and the second vacuum substrate transfer module. The vacuum substrate transfer robot is disposed in the first transfer space or the second transfer space to transfer a substrate.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: January 2, 2024
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Norihiko Amikura, Masatomo Kita
  • Patent number: 11851761
    Abstract: A chuck vacuum line of a semiconductor processing tool includes a first portion that penetrates a sidewall of a main pumping line of the semiconductor processing tool. The chuck vacuum line includes a second portion that is substantially parallel to the sidewall of the main pumping line and to a direction of flow in the main pumping line. A size of the second portion increases between an inlet end of the second portion and an outlet end of the second portion along the direction of flow in the main pumping line.
    Type: Grant
    Filed: April 16, 2021
    Date of Patent: December 26, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yung-Tsun Liu, Kuang-Wei Cheng, Sheng-chun Yang, Chih-Tsung Lee, Chyi-Tsong Ni
  • Patent number: 11846890
    Abstract: An imprint lithography system includes: a first chuck configured to support a first substrate; a first bushing surrounding the first chuck and configured to pneumatically suspend the first chuck laterally within the first bushing; one or more supportive mechanisms disposed beneath the first chuck and configured to support the first chuck vertically within the first bushing, wherein the first chuck is configured to be forced in a downward direction against first vertical resistive forces provided by the one or more supportive mechanisms, while the first chuck is suspended laterally within the first bushing and while the first chuck is maintained in the first fixed rotational orientation.
    Type: Grant
    Filed: January 26, 2023
    Date of Patent: December 19, 2023
    Assignee: Molecular Imprints, Inc.
    Inventors: Roy Matthew Patterson, Charles Scott Carden, Satish Sadam
  • Patent number: 11845567
    Abstract: Systems and methods are provided for trimming and installation. One embodiment is a system for cutting out portions of a fuselage section. The system includes an Inner Mold Line (IML) tool comprising an inner gripping element configured to apply suction to a portion of the fuselage section, and further comprising an outer gripping element configured to apply suction to an area surrounding the portion, an Outer Mold Line (OML) tool configured to operate a cutter to cut the portion out from the fuselage section while suction is applied to the portion and to the area surrounding the portion, and a track that is disposed between the IML tool and the OML tool, wherein the fuselage section is configured to be pulsed in a process direction along the track, such that the fuselage section remains disposed between the IML tool and the OML tool when pulsed in the process direction.
    Type: Grant
    Filed: November 11, 2021
    Date of Patent: December 19, 2023
    Assignee: The Boeing Company
    Inventors: Jeffrey Alan Truess, Richard Calawa, Justin Michael Foisy
  • Patent number: 11834896
    Abstract: An insulated glass assembly line generally includes a first and second automated lite picker, a washer, a vertical gas filling and wetting station, a robot, and an applicator station.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: December 5, 2023
    Assignee: Erdman Automation Corporation
    Inventor: Morgan Donohue
  • Patent number: 11814721
    Abstract: The present disclosure provides a holding arrangement. The holding arrangement for holding a substrate includes: a body portion having a first side; a dry adhesive material provided on the first side of the body portion; a seal surrounding the dry adhesive material and configured to provide a vacuum region on the first side, wherein the dry adhesive material is provided in the vacuum region; and a conduit to evacuate the vacuum region.
    Type: Grant
    Filed: April 18, 2022
    Date of Patent: November 14, 2023
    Assignee: APPLIED MATERIALS, INC.
    Inventor: Simon Lau
  • Patent number: 11806776
    Abstract: A mouthpiece for a setting device setting a blind rivet element is disclosed which comprises a hollow, which may be a hollow-cylindrical, body having an abutting end and a central through bore through which a pulling mandrel of the setting device is movable. Further, a first endless sealing is arranged adjacent to the central through bore at the abutting end for abutting at a head portion of the blind rivet element. Additionally, a second endless sealing is arranged radially outwardly of the first endless sealing at the abutting end for abutting at a component. Finally, a fluid channel extends at least partly through the hollow, which may be a hollow-cylindrical, body such that an exit opening is provided between the first and the second endless sealing and an entry opening for supplying a testing fluid is provided, which may be remote to the abutting end.
    Type: Grant
    Filed: June 13, 2023
    Date of Patent: November 7, 2023
    Assignee: Bollhoff Otalu S.A.
    Inventors: Jordi Gargallo, Bastien Billiemaz
  • Patent number: 11804399
    Abstract: Vacuum clamping device for clamping workpieces, in particular for clamping flat substrates, such as wafers for example, comprising a base plate having a suction surface, wherein a plurality of suction openings are formed in the suction surface of the base plate, wherein the base plate can be connected to at least one negative-pressure device via at least one suction line, characterized in that the suction openings are arranged in a peripheral region of the suction surface of the base plate.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: October 31, 2023
    Assignee: WITRINS S.R.O.
    Inventor: Roman Franz Wieser
  • Patent number: 11772232
    Abstract: A grinding equipment includes: a frame which has a central shaft disposed collinearly to one side of the polishing wheel and rotates about the central shaft; a plurality of seating portions which are disposed on the upper side of the frame, each have a space formed in the central portion thereof, seat a workpiece on the upper surfaces thereof, and are arranged radially from the central shaft of the frame; a plurality of vacuum portions which are disposed in the central portions of the plurality of seating portions respectively, seat the workpiece on the upper surfaces thereof, and each have a plurality of flow channels so as to secure the workpiece by suctioning air through the flow channels; and a control unit for controlling the rotation of the frame.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: October 3, 2023
    Assignee: AM TECHNOLOGY CO., LTD.
    Inventor: Hyoung Joo Kim
  • Patent number: 11774864
    Abstract: A carrier device that carries a substrate to a noncontact holder that is configured to support the substrate in a noncontact manner is equipped with: holding pads that hold a part of the substrate at a first position located above the noncontact holder; a drive section that moves downward the holding pads holding the substrate so that the substrate is supported in a noncontact manner by the noncontact holder; and adsorption pads that hold the substrate supported in a noncontact manner by the noncontact holder, after the substrate held by the holding pads is moved by the drive section, wherein the drive section moves the holding pads from the first position to a second position where the substrate can be delivered to the adsorption pads.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: October 3, 2023
    Assignee: NIKON CORPORATION
    Inventor: Yasuo Aoki
  • Patent number: 11776840
    Abstract: A chuck for retaining a superstrate or a template. The chuck comprises a geometric structure formed on a surface of the chuck. The geometric structure includes at least one of a rounded edge portion and a roughened surface portion, such that an intensity variation of light transmitting through the geometric structure and an area of the chuck adjacent to the geometric structure is reduced.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: October 3, 2023
    Assignee: Canon Kabushiki Kaisha
    Inventors: Nilabh K. Roy, Mario Johannes Meissl, Seth J. Bamesberger, Ozkan Ozturk, Byung-Jin Choi
  • Patent number: 11764071
    Abstract: Apparatus for use in preparing heterostructures having a reduced concentration of defects including apparatus for stressing semiconductor substrates to allow them to conform to a crystal having a different crystal lattice constant.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: September 19, 2023
    Assignee: GlobalWafers Co., Ltd.
    Inventors: Robert J. Falster, Vladimir V. Voronkov, John A. Pitney, Peter D. Albrecht
  • Patent number: 11759967
    Abstract: An automated sheet material cutting and handling system for producing sheet material articles having a planar shape comprises a cutting surface with a suction hold-down, a suction lifting apparatus, a robotic actuation system for moving the suction lifting apparatus, and a control system for controlling the operation of the cutting device and the suction lifting apparatus. The suction lifting apparatus comprises a suction lifting head including a suction lifting portion comprising a suction lifting plate for applying suction through a plurality of holes in the plate. The control system is configured to operate the cutting device to make at least one cut through the planiform blanks. A resiliently compressible template is adhered to the suction lifting plate. Also, methods.
    Type: Grant
    Filed: February 20, 2019
    Date of Patent: September 19, 2023
    Assignee: Kongsberg Precision Cutting Systems Belgium BV
    Inventor: Colin Maxwell Wade
  • Patent number: 11764099
    Abstract: Embodiments described herein relate to a substrate chucking apparatus having a plurality of cavities formed therein. The cavities are formed in a body of the chucking apparatus and a plurality of support elements extend from the body and separate each of the plurality of cavities. In one embodiment, a first plurality of ports are formed in a top surface of the body and extend to a bottom surface of the body through one or more of the plurality of support elements. In another embodiment, a second plurality of ports are formed in a bottom surface of the plurality of cavities and extend through the body to a bottom surface of the body. In yet another embodiment, a first electrode assembly is disposed adjacent the top surface of the body within each of the plurality of support elements and a second electrode assembly is disposed within the body adjacent each of the plurality of cavities.
    Type: Grant
    Filed: March 28, 2022
    Date of Patent: September 19, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Ludovic Godet, Rutger Meyer Timmerman Thijssen
  • Patent number: 11745360
    Abstract: Various embodiments disclosed herein provide for a lip assembly for a vacuum gripper or suction device that is designed to work well with both soft flexible packages and articles with rigid surfaces. The lip assembly can have a compliant or flexible inner lip that soft packages can blossom over when suction is applied, while the outer lip of the lip assembly is also suited to working with hard, rigid packages. The vacuum gripper can be mounted on an end of arm tool of a robotic arm and can therefore be configured to work with a wide variety of packages and package types. The small footprint achieved by having a single vacuum gripper that is able to work with both types of packages enables a better opportunity to pick individual packages at one time and maintain a grasp on the package during medium to high-speed transport.
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: September 5, 2023
    Assignee: INTELLIGRATED HEADQUARTERS, LLC
    Inventors: James D. Wilson, II, Matthew Brandriff
  • Patent number: 11742113
    Abstract: Systems and methods for designing and assembling form boards with attached wire routing devices for use in wire bundle assembly. The assembly method comprises: (a) establishing a coordinate system of a form board having a multiplicity of holes; (b) using a computer system to determine locations of form board devices of different types with reference to the coordinate system of the form board based on engineering data specifying a wire bundle configuration; and (c) fastening the form board devices of different types to respective holes of the form board having centers closest to respective locations determined in step (b). The form board devices may be inserted robotically or manually.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: August 29, 2023
    Assignee: The Boeing Company
    Inventors: Damien O. Martin, Lars E. Blacken, Bradley J. Mitchell, Grace L. Duncan, Eerik J. Helmick
  • Patent number: 11725992
    Abstract: A sensor includes a capacitive sensor electrode layer, a reference electrode layer, and an elastic layer provided between the sensor electrode layer and the reference electrode layer. A thickness of the elastic layer is 100 ?m or less, and a weight per unit area of the elastic layer is less than 3 mg/cm2.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: August 15, 2023
    Assignee: SONY CORPORATION
    Inventors: Ken Kobayashi, Akira Ebisui, Yoshiaki Sakakura, Tomoko Katsuhara, Hayato Hasegawa, Manami Miyawaki
  • Patent number: 11698584
    Abstract: The present invention provides a conveyance apparatus that conveys an object to a processing space in which processing is performed using the object, including a hand configured to hold the object, and a moving unit configured to freely move the hand in the processing space, wherein the hand includes a suction hole provided in a surface different from a holding surface configured to come into contact with the object and hold the object, and a first flow path configured to allow the suction hole and an exhaust source to communicate with each other, and exhaust an atmosphere around the suction hole sucked via the exhaust source and the suction hole to an outside.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: July 11, 2023
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Osamu Yasunobe
  • Patent number: 11661286
    Abstract: A vacuum holder for articles, a combination of a vacuum holder and an article, a system for holding and conveying articles, and a method for holding and conveying articles are disclosed. The vacuum holder includes a main body having a surface and an air passageway leading to the surface, and a valve joined to the main body and in fluid communication with the air passageway. The vacuum holder includes an extensible skirt gasket with an opening therein. An article can be placed adjacent to the surface of the main body, and a vacuum can be drawn through the air passageway to hold the article to the vacuum holder. The valve maintains the vacuum between the article and the vacuum holder without being connected to a vacuum source, until it is desired to release the article from the vacuum holder.
    Type: Grant
    Filed: December 16, 2021
    Date of Patent: May 30, 2023
    Assignee: The Procter & Gamble Company
    Inventors: Christopher Robert Lyman, Jason Matthew Orndorff, Marcus Shen
  • Patent number: 11658058
    Abstract: Provided is a substrate holding apparatus capable of appropriately holding a substrate. The substrate holding apparatus is suggested to hold a substrate including a portion to be plated that is exposed to a plating solution and an edge portion that is an area outside the portion to be plated. The substrate holding apparatus comprises a grasp module to come in contact with the edge portion of the substrate and thereby grasp the substrate, a suction module to attract the portion to be plated of the substrate by suction to hold the portion to be plated, and a protrusion provided at a position corresponding to the portion to be plated in the substrate, and protruding toward the substrate to be held by the substrate holding apparatus more than the suction module.
    Type: Grant
    Filed: February 9, 2021
    Date of Patent: May 23, 2023
    Assignee: EBARA CORPORATION
    Inventors: Takahiro Abe, Takuya Tsushima, Tomonori Hirao
  • Patent number: 11658057
    Abstract: A wafer chuck includes a body portion; a vacuum barrier portion including a wall structure arranged at the same distance from a center point of the body portion; f protrusions arranged inside and outside the vacuum barrier portion, protruding from a top surface of the body portion and spaced apart from each other; and a vacuum portion including vacuum holes spaced apart from each other penetrating the body portion inside the vacuum barrier portion.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: May 23, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sungil Choi, Hyeondong Song, Myeongshik Shim, Jonghyun Hong, Bonggyo Seo
  • Patent number: 11623326
    Abstract: Apparatus for use in handling windscreens for example for installation in a vehicle, includes a windscreen anchor assembly comprising a windscreen anchor device and a support arm extending away from the windscreen anchor device. A mount assembly is provided for supporting the windscreen anchor assembly. The mount assembly includes a mount structure for engaging with the support arm such that the support arm can slide bodily in its longitudinal direction with respect to the mount structure.
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: April 11, 2023
    Assignee: Belron International Limited
    Inventors: William Finck, Christopher Davies
  • Patent number: 11621182
    Abstract: An equipment front end module (EFEM) includes sidewalls forming an EFEM chamber configured to receive inert gas from an inert gas supply. The sidewalls include a first sidewall configured to attach to a panel first side of a panel. The panel forms a panel opening extending between the panel first side and a panel second side. The panel second side is configured to attach to a side storage pod. The EFEM further includes a robot disposed in the EFEM chamber. The robot is configured to transfer substrates from the EFEM chamber into the side storage pod via the panel opening. An exhaust conduit is coupled to the side storage pod to exhaust gas from the side storage pod to an exterior of the side storage pod.
    Type: Grant
    Filed: October 26, 2020
    Date of Patent: April 4, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Devendra Channappa Holeyannavar, Sandesh Doddamane Ramappa, Dean C. Hruzek, Michael R. Rice, Jeffrey A. Brodine
  • Patent number: 11618133
    Abstract: The purpose of the present invention is to facilitate bonding between a jig and a plate-shaped workpiece and to suitably support the workpiece. A support device is provided with: a jig that has a bent support surface for supporting a plate-shaped workpiece; a first abutment that abuts against one end of the workpiece mounted on the support surface; and a second abutment that is disposed so as to face the first abutment across the support surface and that abuts against the other end of the workpiece mounted on the support surface. The first and second abutments move toward each other and apply a load, in the tangential direction load of the support surface, with respect to the workpiece mounted on the support surface.
    Type: Grant
    Filed: February 14, 2019
    Date of Patent: April 4, 2023
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Jun Eto, Manabu Hayashi, Osamu Katsuchi
  • Patent number: 11590665
    Abstract: A robot includes a base, a movable unit coupled to the base, and a control board having an imaging calculation unit that calculates output from an imaging unit, a force calculation unit that calculates output from a first force detection unit, and an action calculation unit that calculates an action of the movable unit based on a calculation result by the imaging calculation unit and a calculation result by the force calculation unit, wherein the control board is located inside of the base.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: February 28, 2023
    Inventor: Ryosuke Teranaka
  • Patent number: 11583965
    Abstract: A system for supporting workpieces during machining. The system comprises one or more adjustable workpiece support assemblies and a robotic unit. Each workpiece support assembly comprises a pedestal and a rotatable fixture element. The robotic assembly comprises means of mobilizing and immobilizing each support assembly, so that the fixture element may be secured in a particular orientation. The robotic unit moves along a frame, and manipulates and fixes the position of the fixture elements to match the contour of a workpiece. Vacuum forces may be applied through the workpiece support assemblies to secure the workpiece against the fixture elements.
    Type: Grant
    Filed: April 9, 2019
    Date of Patent: February 21, 2023
    Assignee: ADVANCED MACHINE WORKS, LLC
    Inventor: Larry Don Kirby
  • Patent number: 11577981
    Abstract: A method of separating a transparent mother sheet includes contacting a first surface of the transparent mother sheet with an open ended pressure assembly including a pressure vessel shell, thereby forming a shell cavity defined by the first surface of the transparent mother sheet and the pressure vessel shell, where the transparent mother sheet comprises a damage path. The method also includes removing gas from the shell cavity through a fluid removal outlet extending through the pressure vessel shell to reduce a cavity pressure in the shell cavity, thereby applying stress to the damage path to separate a portion of the transparent mother sheet along the damage path.
    Type: Grant
    Filed: July 15, 2020
    Date of Patent: February 14, 2023
    Assignee: Corning Incorporated
    Inventors: Andreas Simon Gaab, Michael Albert Joseph, II, Albert Roth Nieber, John Charles Speeckaert, Sergio Tsuda, Heather Nicole Vanselous
  • Patent number: 11567418
    Abstract: An imprint lithography method for positioning substrates includes supporting first and second substrates respectively atop first and second chucks, pneumatically suspending the first and second chucks laterally within first and second bushings, supporting the first and second chucks vertically within the first and second bushings, maintaining the first and second chucks respectively in first and second fixed rotational orientations, and forcing the first and second chucks in a downward direction independently of each other respectively against first and second vertical resistive forces until first and second top surfaces of the first and second substrates are coplanar, while maintaining the first and second chucks suspended laterally within the first and second bushings and while maintaining the first and second chucks in the first and second fixed rotational orientations.
    Type: Grant
    Filed: February 22, 2021
    Date of Patent: January 31, 2023
    Assignee: Molecular Imprints, Inc.
    Inventors: Roy Matthew Patterson, Charles Scott Carden, Satish Sadam
  • Patent number: 11565382
    Abstract: A mounting device for fastening a component, such as in particular a fixture, at a defined location has a base body having a holder or receptacle for the component and a suction device for retaining the component held in the holder at the defined location. In addition, the mounting device contains a pressing device to press the component held in the holder or receptacle to the defined location. A method for the validatable fixation of a component, such as in particular a fixture or bracket, at a defined location is also provided.
    Type: Grant
    Filed: July 4, 2019
    Date of Patent: January 31, 2023
    Assignee: XENIOS AG
    Inventors: Michael Rau, Sven Filipon
  • Patent number: 11555515
    Abstract: An active suction cup includes a vacuum chamber provided with at least one opening with an elastic rim adapted to be applied against a surface sealingly closing the chamber vacuum, and air extraction means from inside the chamber, adapted to extract the air from inside the chamber to reduce the pressure inside the chamber so that the suction cup remains adhered to the surface. The suction cup is characterized in that the air extraction means are arranged inside the vacuum chamber and connected to a conduit that opens outside the chamber, the suction cup also comprising a pressure sensor inside the chamber to detect the pressure inside the chamber. The pressure sensor is connected to control means adapted to actuate the air extraction means if the pressure detected by the pressure sensor is greater than a predetermined maximum pressure threshold.
    Type: Grant
    Filed: November 23, 2021
    Date of Patent: January 17, 2023
    Inventor: Pierre Michel Nothman
  • Patent number: 11548121
    Abstract: The invention relates to a suction device (12) comprising a valve housing (18), a flexible partition wall (28) which runs in such a way that a control space (30) extends on one side and an intake side (21) lies on the other side, wherein the control space (30) is connected to the intake side (21) via a throttle passage (38), wherein the throttle passage (38) is formed in such a way that a flow resistance for flows is defined by the throttle passage (38) in such a way that, in the case of free suction, a negative pressure in relation to the intake side occurs in the control space (30) on account of the flow resistance.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: January 10, 2023
    Assignees: J. SCHMALZ GMBH, TRUMPF WERKZEUGMASCHINEN GMBH & CO. KG
    Inventors: Rainer Hoehn, Jonas Horst, Magnus Deiss
  • Patent number: 11538712
    Abstract: A suction holder for sucking and holding a holding target member includes a sucker, a tube bellows connected to a lower end of the sucker, and a tube arranged inside the tube bellows and having an upper end positioned lower than an upper end of the sucker. A lower opening of the tube is communicated with a suction source and the holding target member is contacted with the upper end of the sucker to form a closed room, and the inside of the closed room is placed into a negative pressure state to hold the holding target member.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: December 27, 2022
    Assignee: DISCO CORPORATION
    Inventors: Masahiro Wada, Naohisa Watanabe
  • Patent number: 11529849
    Abstract: A vehicle windshield triangulation assembly (11), and triangulation method using it with a railing (22) fixed to a vehicle (16) via sliding/rotatable/orientation-adjustable/height-adjustable mounts (18). A sliding seat (21) on railing (22) receives the telescoping end (1) of assembly (11) after its two connected 360-degree rotation swivel clamps (7), each having a suction cup (8), are secured against the old windshield's (17) exterior surface. Assembly (11) triangulation transfers to a new/replacement windshield (17) by releasing suction cups (8) and pairing them in the same manner with the new/replacement windshield (17), and making needed height adjustment to a top stop (12/13) and the swivel clamp (7) remote from top stop (12/13). The telescoping end (1) of assembly (11) is then engaged with sliding seat (21), allowing one person to easily and accurately move the new windshield (17) into the same positioning of the old windshield (17).
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: December 20, 2022
    Inventor: Christian M. Foss
  • Patent number: 11504825
    Abstract: A holding apparatus, in particular a chuck, for a substrate comprises a main body with a upper side, a carrier element arranged in a recess of the main body so as to be vertically movable such that it can be adjusted between a protruding loading position and a retracted clamping position, the carrier element comprising a support surface for placement of the substrate. The support surface has a smaller diameter than the main body. A lifting element lifts the carrier element to the loading position. The carrier element seals the recess such that a sealed cavity is provided between the main body and the carrier element, which cavity can have a negative pressure applied thereto which counteracts the effect of the lifting element.
    Type: Grant
    Filed: September 3, 2021
    Date of Patent: November 22, 2022
    Assignee: SUSS MICROTEC LITHOGRAPHY GMBH
    Inventors: Thomas Grund, Rainer Targus
  • Patent number: 11507046
    Abstract: Manufacturing of a shoe or a portion of a shoe is enhanced by executing various shoe-manufacturing processes in an automated fashion. For example, information describing a shoe part may be determined, such as an identification, an orientation, a color, a surface topography, an alignment, a size, etc. Based on the information describing the shoe part, automated shoe-manufacturing apparatuses may be instructed to apply various shoe-manufacturing processes to the shoe part, such as a pickup and placement of the shoe part with a pickup tool.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: November 22, 2022
    Assignee: NIKE, Inc.
    Inventors: Dragan Jurkovic, Patrick Conall Regan, Chih-Chi Chang, Chang-Chu Liao, Ming-Feng Jean, Kuo-Hung Lee, Yen-Hsi Liu, Hung-Yu Wu
  • Patent number: 11508608
    Abstract: Disclosed is a vacuum chuck and a method for securing a warped semiconductor substrate during a semiconductor manufacturing process so as to improve its flatness during a semiconductor manufacturing process. For example, a semiconductor manufacturing system includes: a vacuum chuck configured to hold a substrate, wherein the vacuum chuck comprises, a plurality of vacuum grooves located on a top surface of the vacuum chuck, wherein the top surface is configured to face the substrate; and a plurality of flexible seal rings disposed on the vacuum chuck and extending outwardly from the top surface, wherein the plurality of flexible seal rings are configured to directly contact a bottom surface of the substrate and in adjacent to the plurality of vacuum grooves so as to form a vacuum seal between the substrate and the vacuum chuck, and wherein each of the plurality of flexible seal rings has a zigzag cross section.
    Type: Grant
    Filed: August 20, 2020
    Date of Patent: November 22, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chien-Fa Lee, Chin-Lin Chou, Shang-Ying Tsai, Shou-Wen Kuo, Kuei-Sung Chang, Jiun-Rong Pai, Hsu-Shui Liu, Chun-wen Cheng
  • Patent number: 11477926
    Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: October 18, 2022
    Assignee: JABIL INC.
    Inventors: Darin Burgess, Randy Crockett, Timothy DeRosett, Charles Santhakumar, Scott Klimczak, Anwar A. Mohammed, Luke Rodgers, Harpuneet Singh, Daniel Torres, Felipe Torres
  • Patent number: 11469121
    Abstract: A spin coating device and method. The spin coating device includes a rotatable rotary shaft and sucker fixed on an end portion of the shaft, and an electromagnetic induction device below the sucker which includes an annular magnet fixed below the sucker, coil group formed by a first and second coil, and strip-shaped magnet fixed at the rotary shaft. A base on the sucker has a notch. The unbalanced centrifugal force during rotation of the sucker causes vibration. The electromagnetic induction device enables the centrifugal force generated during rotation of the sucker to be in balance with the magnetic force generated by the electromagnetic induction device to adjust the levelness of the sucker surface. The device does not need manual manipulation, enables the sucker to be more stable, reduces damage to the equipment due to vibration, and improves the effect of photoresist spin-coating while saving time and labor.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: October 11, 2022
    Assignee: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    Inventors: Shiliang Lu, Hang Ran, Yihui Li, Xiaoping Yan, Jun Zhao, Shanshan Chen
  • Patent number: 11420340
    Abstract: A robot suction hand mountable on an industrial robot and configured to hold a workpiece by suction using a suction unit. The robot suction hand includes: a vacuum pump incorporated in the robot suction hand. The vacuum pump has a housing in which an intake port and an exhaust port are formed, and configured to intermittently take in air from the intake port and intermittently discharge air from the exhaust port. The robot suction hand includes a suction path that communicates with the suction unit and the intake port and a first member made of a porous material. The first member covers the exhaust port.
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: August 23, 2022
    Assignee: DENSO WAVE INCORPORATED
    Inventors: Masaki Yamanaka, Takayuki Saito
  • Patent number: 11413726
    Abstract: A method for holding a workpiece to be machined including the steps of: includes manufacturing a locking jig for locking the workpiece on a support base by additive production techniques wherein the locking jig includes a wall defining a loop. Irregularities present on at least one end of the wall arrangement are eliminated to define a support surface for the workpiece to be machined. A seat is formed in at least one end of the wall for housing a seal. At least one opening is formed on the support base and connected to at least one inner space of the loop on one side and with a suction device on the other side. A vacuum is supplied through the opening and the inner space which enables the workpiece to stick to and remain stationary with respect to the support surface during machining of the workpiece.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: August 16, 2022
    Inventor: Maurizio Bernini
  • Patent number: 11404979
    Abstract: A motor driving circuit includes a first motor driving circuit that controls driving of a first motor is disposed, a second motor driving circuit that controls driving of a second motor is disposed, and a constant current generation circuit that generates a constant current is disposed, and the constant current generation circuit is disposed at a position deviating from between the first motor driving circuit and the second motor driving circuit.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: August 2, 2022
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Haruo Hayashi, Motoaki Nishimura, Makoto Katase, Yusuke Sano
  • Patent number: 11367612
    Abstract: The present invention relates to a method for manufacturing semiconductor manufacturing parts used in a dry etching process, and a jig usable therein, and the method for manufacturing semiconductor manufacturing parts by using the jig, of the present invention, comprises the steps of: preparing a base material; supporting at least one surface of the base material by the jig; forming a deposition layer by spraying source gas on the base material supported by the jig; and processing the base material on which the deposition layer is formed, wherein the jig has a tapered cross-section of which the width increases in the direction of approaching the surface of the base material.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: June 21, 2022
    Assignee: Tokai Carbon Korea Co., LTD
    Inventor: Ki Won Kim
  • Patent number: 11345028
    Abstract: A grasping error correction method includes a position information acquisition step of acquiring position information of a plurality of areas of a lower component 2, a grasping error value calculation step of calculating a grasping error value based on the position information at the time of the reproduction and the position information of the plurality of areas of the lower component 2 at the time of teaching, and an arm control step of controlling an operation of a multi-axis articulated arm 11a so as to correct the grasping error value. Further, in the grasping error value calculation step, the grasping error value is calculated so that a grasping error in a processing nearby area, which is one of the plurality of areas of the lower component 2 that is closest to the processing area, is preferentially eliminated over those in the other areas of the lower component 2.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: May 31, 2022
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Takashi Sakui
  • Patent number: 11327406
    Abstract: A method for estimating a parameter across a region on a substrate, the region being divided into a plurality of sub-regions, the method including: obtaining values of the parameter for at least two sub-regions out of the plurality of sub-regions; and estimating the parameter for a position on the region by evaluation of a function having said values of the parameter as input values, wherein the function: a) has piecewise defined base functions, wherein a single base function is defined across a sub-region; and b) is continuous between one or more adjacent sub-regions of the at least two sub-regions within the region.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: May 10, 2022
    Assignee: ASML Netherlands B.V.
    Inventors: Svetla Petrova Matova, Jochem Sebastiaan Wildenberg, Roy Werkman, Luc Roumen
  • Patent number: 11316111
    Abstract: A mask assembly for manufacturing a display device, the mask assembly includes: a mask frame including a pair of first side portions arranged in a first direction, a pair of second side portions arranged in a second direction intersecting the first direction, and an opening portion defined by the first side portions and the second side portions; a mask sheet arranged on the opening portion of the mask frame, fixed on the mask frame, and including a plurality of openings; and a support member attached to at least one of the first side portions and the second side portions of the mask frame with tensile force applied.
    Type: Grant
    Filed: December 2, 2019
    Date of Patent: April 26, 2022
    Assignee: Samsung Display Co., Ltd.
    Inventor: Seil Kim