Abstract: Apparatuses and methods are disclosed for handling integrated circuits in automated testing. The handler apparatus includes an upper assembly that is selectively translatable above a testing surface and a lower bracket extending from and positioned below the upper assembly. The lower bracket forms a first opening, is selectively moveable upward and downward, and includes a rotatable finger extending downward to pick up and place an integrated circuit in a socket. The handier may further include an image sensor to detect potential error conditions, and a tool extending from the lower bracket to open and close a lid on the socket. The methods include sensing an image of an integrated circuit during certain phases of testing, analyzing the image to determine if the integrated circuit is positioned correctly, and correcting any detected error conditions before continuing with the automated testing.

Abstract: A device for laser projection comprises a first laser diode configured to emit a first linearly polarized laser beam extending along a first polarization axis and a second laser diode configured to emit a second linearly polarized laser beam extending along a second polarization axis that is perpendicular to the first polarization axis. A polarization combiner is configured to combine the first and second linearly polarizing laser beams into a combined laser beam, wherein the combined laser beam comprises one of: (1) circular polarization; and (2) elliptical polarization. A measuring device is configured to measure an intensity of the combined laser beam. A control unit is configured to receive the measured intensity of the combined laser beam and is further configured to adjust an intensity of at least one of: (1) the first laser diode; and (2) the second laser diode.

Abstract: System in package (SiP) modules are compact packages that include components such as processors, memory, sensors, and passive components on a single substrate. One low cost and compact way to integrate an antenna into a SiP module is to suspend an antenna in molding compound so that the antenna is embedded in the real estate of the molding compound layer. To embed the antenna, the molding compound is first deposited. A cavity can be cut in the molding compound to hold the antenna. The cavity can be filled with conductive material to form the antenna. Further molding compound can be deposited to cover the antenna and enclose the antenna in the molding compound layer. Ground structures can also be suspended in the molding compound. Such an embedded antenna can be particularly useful for radio applications.

Abstract: A substrate processing apparatus includes a substrate cleaning unit cleaning a substrate, a substrate drying unit drying the substrate, and a transfer robot transferring the substrate between the substrate cleaning unit and the substrate drying unit. The substrate drying unit includes a substrate processing container having a substrate processing space accommodating the substrate, and the transfer robot includes a surface temperature measurement sensor measuring a surface temperature of the substrate processing container.

Abstract: A transfer method transfers a substrate between a transfer unit configured to hold and transfer the substrate and a substrate stage serving as a transfer destination or a transfer source of the substrate. The transfer method includes: acquiring positional information of the transfer unit and positional information of the substrate stage; determining whether or not there is a risk for the substrate to contact with the substrate stage, based on the acquired positional information of the transfer unit and positional information of the substrate stage; and when determined that there is a risk for the substrate to contact with the substrate stage, notifying the risk according to the determination at the determining.

Abstract: Disclosed are methods and systems for providing silicon carbide films. A layer of silicon carbide can be provided under process conditions that employ one or more silicon-containing precursors that have one or more silicon-hydrogen bonds and/or silicon-silicon bonds. The silicon-containing precursors may also have one or more silicon-oxygen bonds and/or silicon-carbon bonds. One or more radical species in a substantially low energy state can react with the silicon-containing precursors to form the silicon carbide film. The one or more radical species can be formed in a remote plasma source.

Abstract: According to one embodiment, a display device includes a display panel and a light-emitting module. The light-emitting module includes a first light source having a first light-emitting point, a second light source having a second light-emitting point, a first light guide and a second light guide forming a contact portion in contact with the first light guide. The first light guide and the second light guide are arranged in a first direction, and a distance between the contact portion and the first light-emitting point along the first direction is equal to a distance between the contact portion and the second light-emitting point along the first direction.

Abstract: An arithmetic processing device includes: a memory; and a processor coupled to the memory and configured to: execute a plurality of data processes each of which is divided into a plurality of pipeline stages in parallel at different timings; measure a processing time of each of the plurality of pipeline stages; and set a priority of the plurality of pipeline stages in a descending order of the measured processing time.

Abstract: A semiconductor wafer inspection system includes a wafer chuck disposed inside a chamber and on which a wafer is disposed, a light source configured to emit light for inspecting a pattern on the wafer to the wafer, an inspection controller configured to control the driving of the light source, a cooling gas gun disposed adjacent to the light source and configured to spray a cooling gas on a surface of the wafer, and a cooling controller configured to supply cooling air to the wafer chuck before light is emitted to the wafer and supply the cooling gas to the cooling gas gun.

Abstract: An antenna array module includes two or more antenna elements arranged in an array, each of the two or more antenna elements formed as a respective integrated passive device (IPD), and a multi-layer printed circuit board (PCB) including one or more metal layers forming one or more feed lines of the antenna elements. The antenna array module may include a radio frequency (RF) front end integrated circuit disposed on an opposite side of the multi-layer PCB from the two or more antenna elements. One or more signal output pins of the RF front end integrated circuit may be connected to the one or more feed lines. The antenna array module may include conductive contacts external to the multi-layer PCB for routing input signals through the multi-layer PCB to one or more signal input pins of the RF front end integrated circuit.

Abstract: An instruction can be received at a sequencer from a controller. The sequencer can be in a package including the sequencer and one or more memory components. The sequencer is operatively coupled to a controller that is separate from the package. A processing device of the sequencer can perform an operation based on the instruction on at least one of the one or more memory components in the package.

Abstract: A press-pack semiconductor fixture 200 includes a housing defining an interior passage. A first conductor and a second conductor are mechanically coupled with the housing. The mechanical coupling of the first conductor and the second conductor with the housing is effective to apply a clamping force to a press pack semiconductor. A number of apertures or openings are provided in the housing, the first conductor, and the second conductor to permit fluidic flow 290 between the interior passage 239 and spaces or structures exterior to the housing.

Abstract: A robot includes: a first arm that is a horizontal multi-joint type arm provided with a first base link provided to be rotatable around a pivoting axis, a first intermediate link, and a first hand that holds a workpiece W thereon, and configured to move the first hand along a first diameter direction; a second arm that is a horizontal multi-joint type arm provided with a second base link provided to be independently rotatable from the first base link around the pivoting axis, a second intermediate link, and a second hand that holds the workpiece W thereon, and configured to move the second hand along a second diameter direction, and a pivoting device configured to pivot the first arm and the second arm together in the circumferential direction while maintaining a positional relationship of the first arm and the second arm in the circumferential direction.

Abstract: Microelectronic structure comprising at least one movable mass that is mechanically connected to a first mechanical element by a first mechanically linking connector and to a second mechanical element (24) by electrically conductive second mechanically linking connector, and a device for electrically biasing the second mechanically linking connector, the second mechanically linking connector being such that they are the seat of a thermo-piezoresistive effect, the second linking connector and the movable mass being placed with respect to each other so that a movement of the movable mass applies a mechanical stress to the second linking connector, wherein the electrically biasing device are DC voltage biasing device and form, with at least the second mechanically linking connector, a thermo-piezoresistive feedback electric circuit.

Abstract: A substrate processing apparatus includes a container carrying in/out section on which a substrate conveyance container accommodating a substrate is placed; a processing unit that performs a process on the substrate; a conveyance space through which the substrate is conveyed; a substrate conveyor that conveys the substrate between the container carrying in/out section and the processing unit through the conveyance space; a first gas supply passage that supplies an atmosphere adjusting gas to the processing unit; a first gas discharge passage that discharges the atmosphere adjusting gas from the processing unit; a circulation passage that returns the atmosphere adjusting gas flowing out from the conveyance space to the conveyance space; a second gas supply passage that supplies the atmosphere adjusting gas to a circulation system constituted by the conveyance space and the circulation passage; and a second gas discharge passage that discharges the atmosphere adjusting gas from the circulation system.

Abstract: A plasma processing apparatus includes a processing container; a placement table provided in the processing container and including a placement region on which a workpiece is placed for a plasma processing; a baffle structure that defines a first space and a second space, and including a first member and at least one second member; a gas supply portion connected to the first space; a first pressure gauge connected to the first space; an exhaust apparatus connected to the second space; a second pressure gauge connected to the second space; a driving mechanism that moves the at least one second member in a vertical direction; a displacement gauge configured to measure a position or a distance of the second member; and a controller that controls the driving mechanism. The controller controls the driving mechanism such that a pressure of the first space becomes a predetermined pressure designated by a recipe.

Abstract: Metal coordination complexes comprising at least one diazabutadiene based ligand having a structure represented by: where R1 and R4 are selected from the group consisting of C4-C10 alkyl groups; and R2 and R3 are each independently selected from the group consisting of H, C1-C6 alkyl, cycloalkyl, or aryl groups and the difference in the number of carbons in R2 and R3 is greater than or equal to 2. Processing methods using the metal coordination complexes are also described.

Abstract: A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates, wherein the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck, and wherein a plate is arranged between the second substrate and the second chuck, wherein the second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding. Furthermore, the present invention relates to a corresponding device and a corresponding plate.

Abstract: The inventive substrate treatment method includes: an organic solvent supplying step of supplying an organic solvent having a smaller surface tension than a rinse liquid to the upper surface of a substrate so that rinse liquid adhering to the upper surface of the substrate is replaced with the organic solvent; a higher temperature maintaining step of maintaining the upper surface of the substrate at a predetermined temperature higher than the boiling point of the organic solvent to thereby form a gas film of the organic solvent on the entire upper surface of the substrate including the gap of the minute pattern and to form a liquid film of the organic solvent on the gas film, the higher temperature maintaining step being performed after the organic solvent supplying step is started; and an organic solvent removing step of removing the organic solvent liquid film from the upper surface of the substrate.

Abstract: A method for electrical wiring of electronic components in switchgear construction, the method comprising the steps: a. providing a plurality of electronic components which are mounted on a shared workpiece, in particular on a mounting plate; b. wiring the electronic components according to a predetermined circuit diagram and in a predetermined order by at least one robot, wherein a cable sequence of pre-assembled cables is fed to the at least one robot and the cables are arranged in the predetermined order in the cable sequence; wherein the wiring comprises gripping a free cable end of the cable sequence by a multifunctional end effector of the robot, feeding the free cable end to an electrical connection of one of the electronic components by the multifunctional end effector, and detaching the cable from the cable sequence by a separation unit of the multifunctional end effector.

Abstract: A non-vacuum, non-contact spinner wafer chuck including: a basal member including; a fastener receiver that receives a fastener; a chuck collar including: an inner collar wall; and an outer collar wall; and an engagement surface that: receives and engages a wafer; a wafer engagement cam including: an engagement face that engages the wafer; an index cam disposed on the chuck collar and comprising: an index face that faces toward the fastener receiver and that engages the wafer; and a spinner engager disposed on the spinner-side surface of the basal member and comprising: a spinner arm receiver bounded by a wall and that receives a spinner of the wafer processing machine, wherein the wafer engagement cam and the index cam engage the wafer and maintains an orientation of the wafer with respect to the index cam in response to rotation of the wafer relative to the non-vacuum, non-contact spinner wafer chuck.

Abstract: A substrate processing apparatus includes an inner tube configured to accommodate a plurality of substrates and having a first opening portion; an outer tube surrounding the inner tube; a movable wall movably provided in the inner tube or between the inner tube and the outer tube and having a second opening portion; a gas supply part configured to supply a processing gas into the inner tube; an exhaust part provided outside the movable wall and configured to exhaust the processing gas supplied into the inner tube through the first opening portion and the second opening portion; and a pressure detection part configured to detect a pressure inside the inner tube.

Abstract: There is disclosed a substrate processing apparatus which can align a center of a substrate, such as a wafer, with a central axis of a substrate stage with high accuracy. The substrate processing apparatus includes: an eccentricity detector configured to obtain an amount of eccentricity and an eccentricity direction of a center of the substrate, when held on a centering stage, from a central axis of the centering stage; and an aligner configured to perform a centering operation of moving and rotating the centering stage until the center of the substrate on the centering stage is located on a central axis of a processing stage. The aligner is configured to calculate a distance by which the centering stage is to be moved and an angle through which the centering stage is to be rotated, based on an initial relative position of the central axis of the centering stage with respect to the central axis of the processing stage, the amount of eccentricity, and the eccentricity direction.

Abstract: A design assistance system includes a component information management server and a design terminal. The component information management server includes an issue/measure information memory and a priority index memory. The issue/measure information memory stores a component to be used in a design assistance tool, an issue on the component, and measures to address the issue in association with each other. Each measure is at least one of addition of an addition target component and removal of a removal target component. The priority index memory stores a priority index in association with the addition target component and the removal target component. The design terminal includes a measure display that displays measures to address an issue on a focused component in a format based on the priority index associated with at least one of the addition target component and the removal target component included in each measure.

Abstract: A substrate transfer method includes: acquiring sensing information from a sensor by moving a substrate by a robot arm such that the substrate passes through a sensing region; calculating a center position of the substrate with respect to the robot arm based on the sensing information; detecting a marker indicating a reference direction of the substrate by the sensor by controlling the robot arm to rotate the substrate about the center position in a state where an edge of the substrate is located in the sensing region; calculating a direction of the substrate with respect to the robot arm based on a position of the marker; calculating a correction amount based on the center position and the direction of the substrate; and placing the substrate on the stage in the processing chamber such that the center position and the direction of the substrate are corrected according to the correction amount.

Abstract: A storage device for use with at least one batch furnace for batch treatment of wafers supported in a wafer boat is disclosed. The storage device comprises a cassette storage carousel for storing a plurality of wafer cassettes on rotatable platform stages. A carousel housing bounds a mini-environment chamber in which the platform stages are accommodated. A gas recirculation circuit of the storage device subsequently comprises a gas inlet channel, a gas inlet filter, the mini-environment chamber, a plurality of gas outlet openings in a bottom wall of the carousel housing, a plenum housing bounding a plenum chamber, a plenum chamber outlet, a gas circulation pump connecting the plenum chamber outlet to an inlet end of the gas inlet duct.

Abstract: The invention relates to a method for producing an interconnection comprising a via (V) extending through a substrate (1), said method successively comprising: (a) the deposition of a layer (11) of titanium nitride or tantalum nitride on a main surface (1A) of the substrate and on the inner surface (10A, 10B) of at least one hole (10) extending into at least part of the thickness of said substrate; (b) the deposition of a layer (12) of copper on said layer (11) of titanium nitride or tantalum nitride; and (c) the filling of the hole (10) with copper, said method being characterized in that, during step (a), the substrate (1) is arranged in a first deposition chamber (100), and in that said step (a) comprises the injection of a titanium or tantalum precursor in a gaseous phase into the deposition chamber via a first injection path according to a first pulse sequence, and the injection of a nitrogen-containing reactive gas into the deposition chamber via a second injection path different from the first injectio

Abstract: A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.

Abstract: A surgical robot comprising a base and an arm extending from a proximal end attached to the base to a distal end attachable to a surgical instrument via a series of links interspersed by articulations. The arm comprises a receiver, a proximity sensor and a controller. The receiver is configured to receive data from the surgical instrument over a short-range wireless communications link with the surgical instrument. The proximity sensor is configured to detect the proximal presence of the surgical instrument. The controller is configured to respond to the proximity sensor detecting the proximal presence of the surgical instrument by enabling the short-range wireless communications link between the receiver and a transmitter of the surgical instrument to be established.

Abstract: A semiconductor packaging apparatus and methods of manufacturing semiconductor devices using the same. The semiconductor packaging apparatus includes a process unit, and a controller associated with the process unit. The process unit includes a bonding part that bonds a semiconductor substrate and a carrier substrate to each other to form a bonded substrate, a cooling part that cools the bonded substrate, and a detection part in the cooling part and configured to detect a defect of the bonded substrate. The controller is configured to control the process unit using data obtained from the detection part.

Abstract: A method for securing a bonding product in a working region of a bonder via a clamping device. The bonding product and the clamping device are positioned in the working region of the bonder and a partial characteristic contour is captured to determine the position of the bonding product in the working region. The previously set clamping position of the clamping fingers is captured via a camera and a clamping position is calculated. A current position and orientation of clamping fingers and a new misalignment of the clamping fingers is calculated and displayed until the current position and orientation of the clamping fingers corresponds to a clamping finger reference position.

Abstract: The present invention relates to a novel integrated system for providing nitrogen (N2) to a variety of industrial service applications such as, for example, process unit drying, pipeline purging, reactor cooling, vessel inerting, pipeline displacement.

Abstract: A process chamber and a substrate processing apparatus including the same are disclosed. The process chamber includes a first housing and a second housing on the first housing. The first housing includes a first outer wall, a first partition wall facing the first outer wall, and a first side wall connecting the first outer wall and the first partition wall. The second housing includes a second outer wall, a second partition wall between the second outer wall and the first partition wall, and a second side wall connecting the second outer wall and the second partition wall. Each of the first and second outer walls has a thickness greater than a thickness of the first partition wall and a thickness of the second partition wall.

Abstract: Embodiments of a method and apparatus for annealing a substrate are disclosed herein. In some embodiments, a substrate anneal chamber includes a chamber body having a chamber wall and an interior volume; a lamp assembly disposed in the interior volume and having a plurality of lamps configured to heat a substrate; a slit valve disposed through a wall of the chamber body and above the lamp assembly to allow the substrate to pass into and out of the interior volume; an annular lamp assembly having at least one lamp disposed in a processing volume in an upper portion of the substrate anneal chamber above the slit valve; and a top reflector disposed above the annular lamp assembly to define an upper portion of the processing volume and to reflect radiation downwards towards the lamp assembly, wherein a bottom surface of the top reflector is exposed to the interior volume.

Abstract: A semiconductor manufacturing apparatus includes a loadlock module including a loadlock chamber in which a substrate container is received, wherein the loadlock module is configured to switch an internal pressure of the loadlock chamber between atmospheric pressure and a vacuum; and a transfer module configured to transfer a substrate between the substrate container received in the loadlock chamber and a process module for performing a semiconductor manufacturing process on the substrate, wherein the loadlock module includes a purge gas supply unit configured to supply a purge gas into the substrate container through a gas supply line connected to the substrate container; and an exhaust unit configured to discharge a gas in the substrate container through an exhaust line connected to the substrate container.

Abstract: In an embodiment, a method for designing an integrated circuit with target characteristics uses a physical design graph. The physical design graph includes a plurality of physical design sub-configurations, each of the plurality of physical design sub-configurations including a placement of a group of physical cells and having annotated characteristics. The method includes partitioning an integrated circuit electrical design into a plurality of electrical design sub-configurations, including a specific electrical design sub-configuration requiring a specific group of the physical cells. The method includes selecting from the physical design graph, based on the required specific group of the physical cells and the target characteristics, a physical design sub-configuration including the specific group of the physical cells in a specific placement and having the target characteristics. The method includes determining an integrated circuit physical design for manufacturing the integrated circuit.

Abstract: A semiconductor processing chamber is provided and may include a wafer transfer passage that extends through a chamber wall and has an inner passage surface defining an opening, an insert including an insert inner surface defining an insert opening, and a gas inlet. A first recessed surface of the wafer transfer passage extending at least partially around and outwardly offset from the inner passage surface, a first insert outer surface extending at least partially around and outwardly offset from the insert inner surface, and a first wall surface extending between the inner passage surface and the first recessed surface, at least partially define a gas distribution channel fluidically connected to the gas inlet, the first recessed surface is separated from the first insert outer surface by a first distance and an insert front surface faces and is separated from the first wall surface by a first gap distance.

Abstract: A wafer conveying apparatus conveying a wafer onto a supporting table in manufacturing a semiconductor. A first arm retains the wafer to move to an upper region of the supporting table, and is retracted from the upper region of the supporting table after the wafer is elevated. A second arm contacts the wafer by an opening provided in the supporting table to elevate the wafer, and lowers the wafer to place the wafer on the supporting table.

Abstract: A transfer chamber for semiconductor device manufacturing includes (1) a plurality of sides that define a region configured to maintain a vacuum level and allow transport of substrates between processing chambers, the plurality of sides defining a first portion and a second portion of the transfer chamber and including (a) a first side that couples to two twinned processing chambers; and (b) a second side that couples to a single processing chamber; (2) a first substrate handler located in the first portion of the transfer chamber; (3) a second substrate handler located in the second portion of the transfer chamber; and (4) a hand-off location configured to allow substrates to be passed between the first portion and the second portion of the transfer chamber using the first and second substrate handlers. Method aspects are also provided.

Abstract: A test socket and method for using the same are disclosed herein. In one embodiment, the test socket comprises a base having a top loading area, an actuator rotatably coupled to the base, and a pushing device rotatably coupled to the actuator, where the pushing device is pressed against a semiconductor device when the semiconductor device is placed onto the top loading area and the actuator is moved to a first position (e.g., a test position).

Abstract: A platform for testing a solar cell is disclosed. The platform includes a plate defining a conductive surface configured to electrically contact the solar cell, two or more first vacuum ports disposed along a first area of the conductive surface of the plate, and two or more second vacuum ports disposed along a second area of the conductive surface of the plate. The second area covers a larger portion of the conductive surface compared to the first area. The solar cell is sized to seat against the first area of the conductive surface. The platform also includes a valve-sensor unit in fluid communication with the first vacuum ports and the second vacuum ports and a control board connected to the valve-sensor unit. The control board executes instructions to monitor a first pressure in the first vacuum ports and a second pressure in the second vacuum ports by the valve-sensor unit.

Abstract: The present disclosure relates to a substrate processing apparatus and a substrate processing method using the same, and more particularly, to a substrate processing apparatus that is capable of improving a flow of a process gas that is participated in a substrate processing process and a substrate processing method using the same.

Abstract: There is provided a substrate processing system, including: a carrier transfer region in which a carrier that accommodates a substrate is transferred to a substrate processing apparatus, and a substrate transfer region in which the substrate accommodated in the carrier is transferred to a processing furnace, the substrate transfer region being partitioned from the carrier transfer region by a partition wall; a transfer port formed in the partition wall and through which the substrate is transferred between the carrier transfer region and the substrate transfer region; an opening/closing door configured to open and close the transfer port; and a pressure equalizing part configured to substantially equalize a pressure of the substrate transfer region and a pressure of a space surrounded by the carrier and the opening/closing door.

Abstract: A cleaning apparatus is provided. This cleaning apparatus includes an inlet, an outlet, a first conveyance path, a second conveyance path, a cleaning unit disposed on the first conveyance path and configured to clean the target object in a non-contacting manner, and a drying unit disposed on the first conveyance path and configured to dry the target object in a non-contacting manner. The first conveyance path and the second conveyance path are vertically arranged side by side. The second conveyance path is positioned above the first conveyance path and connected with the outlet at an end point. The second conveyance path functions as a stocker configured to temporarily store the target object.

Abstract: A substrate processing system includes a processing chamber and a pedestal arranged in the processing chamber. An edge coupling ring is arranged adjacent to a radially outer edge of the pedestal. A first actuator is configured to selectively move the edge coupling ring to a raised position, relative to the pedestal to provide clearance between the edge coupling ring and the pedestal to allow a robot arm to remove the edge coupling ring from the processing chamber.

Abstract: A wafer processing method for processing a wafer having devices on the front side is provided. The wafer processing method includes a back grinding step of grinding the wafer to form a recess and an annular reinforcing portion surrounding the recess on the back side of the wafer, and a dividing step of cutting the wafer along division lines formed on the front side of the wafer. In the back grinding step, a taper surface is formed between the bottom surface of the recess and the annular reinforcing portion. The taper surface is inclined with respect to a direction perpendicular to the bottom surface of the recess. In the dividing step, a cutting blade is lowered to start cutting at a position radially inside the outer circumference of the wafer and is subsequently raised to stop cutting at another position radially inside the outer circumference of the wafer.

Abstract: The integrated circuit chip programming apparatus comprises a fixing device, an actuating device and a flexible device. The fixing device comprises a supporting part and a cover. One end of the cover is coupled with one end of the supporting part and comprises an accommodation space for accommodating a chip therein. The cover selectively covers or uncovers the supporting part so as to close or expose the accommodation space. The flexible device is coupled between the fixing device and the actuating device. When a force is against the forced end, the actuating device is rotated to drive the cover to expose the accommodation space. When no force is against the forced end or the force against the forced end is stopped, the flexible device provides a recovery force to allow the actuating device to rotate to drive the cover to close the accommodation space of the supporting part.

Abstract: An electronic device manufacturing system is disclosed. The system includes a processing tool having one or more processing chambers each adapted to perform an electronic device manufacturing process on one or more substrates; a substrate carrier adapted to couple to the system and carry one or more substrates; and a component adapted to create a sealed environment relative to at least a portion of the substrate carrier and to substantially equalize the sealed environment with an environment within the substrate carrier. Methods of the invention are described as are numerous other aspects.

Abstract: A plating apparatus enabling a user to conduct maintenance of a substrate holder while an operation of the plating apparatus is being performed is disclosed. The plating apparatus includes: a processing section for plating a substrate; a storage container configured to store the substrate holder for holding the substrate; a transport machine configured to transport the substrate holder between the processing section and the storage container; a maintenance area adjacent to the storage container; and a substrate-holder carrier supported by the storage container. The substrate-holder carrier is movable between the storage container and the maintenance area while supporting the substrate holder.

Abstract: A ladder filter includes a piezoelectric substrate, an antenna terminal, a transmission terminal, and ground terminals on the piezoelectric substrate, and IDT electrodes. Each of the IDT electrodes is disposed on the piezoelectric substrate and includes a plurality of electrode fingers and a pair of busbars to which first ends of the plurality of electrode fingers are connected commonly. The IDT electrodes define elastic wave resonators. The ladder filter further includes an interlayer insulating film disposed on at least one of the busbars and a thermally conductive member made of a material with thermal conductivity higher than that of the interlayer insulating film and disposed on the interlayer insulating film. The thermally conductive member is in contact with at least one of the antenna terminal, the transmission terminal, and the ground terminals.