Abstract: An alignment board for interfacing arrays of infrared detectors to a multi-layer module concerns an insulating board having a multiplicity of conductive vias with insulating sealing plugs and enlarged metallic pads that are attached to the ends of the vias. Preferably, an insulating layer is formed on opposing sides of the board. Openings are delineated in the layer coinciding with the metallic pads, and preferably solder contacts are deposited in the openings. A multi-layer module may be attached to one side of the alignment board using reflow solder processes. Then, arrays of infrared detectors may be attached to the opposing side of the alignment board using a lower-temperature reflow soldering process. The alignment board facilitates the interfacing and assembly of the focal plane of infrared detection systems.

Abstract: A method for superimposing an image of an optoelectric component on a substrate with the use of a single camera. Specifically, the camera looks through a transparent alignment tool that is holding the component, to the substrate below it, thus allowing both the component and the substrate to be seen together by the camera. The alignment tool and substrate are adjusted to precisely align the two and then are brought together while being seen by the camera. On laser chips, the chip is energized while on the glass alignment tool to produce a laser spot that is superimposed on the visible light image via a series of lenses and mirrors.

Abstract: An apparatus and method is provided that superimposes an image of an optoelectric component on a substrate with the use of a single camera. Specifically, the camera looks through a transparent alignment tool that is holding the component, to the substrate below it, thus allowing both the component and the substrate to be seen together by the camera. The alignment tool and substrate are adjusted to precisely align the two and then are brought together while being seen by the camera. On laser chips, the chip is energized while on the glass alignment tool to produce a laser spot that is superimposed on the visible light image via a series of lenses and mirrors.

Abstract: Disclosed is a method of manufacturing an ink jet printhead comprising the steps of: (1) coating a substantially flat lower surface of an upper piezoelectric member with a first conductive coating, (2) coating a substantially flat upper surface of a lower piezoelectric member with a second conductive coating, (3) depositing a conductive metal over the first conductive coating, (4) forming a first elongated indentation in the lower surface, the first indentation extending through the first coating and into the upper member, (5) joining the metal with the second conductive coating by placing the upper piezoelectric member over the lower piezoelectric member, (6) inducing a current in the metal with an electromagnetic field having a specified frequency to thereby melt the metal and (7) cooling the metal, the metal electrically and mechanically joining the first coating to the second coating, the first indentation and the upper surface thereby forming the channel, the channel capable of containing ink and capable

Abstract: An indium-metal braid-indium sandwich is formed by applying indium ribbons to upper and lower surfaces of a metal braid and then working the sandwich, e.g., between rollers. The resulting product has enhanced tensile strength and stiffness, yet retains the attributes of indium for application as a gasket, gland, or seal.