Long Lines Patents (Class 333/236)
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Patent number: 11870124Abstract: Embodiments of this application provide a balance-unbalance conversion apparatus. The apparatus includes an insulation substrate, a first microstrip, a second microstrip, and a conductive ground. The first microstrip includes a first balance signal connection section, a first impedance matching section, and an unbalance signal connecting section. The unbalance signal connecting section is configured to transmit an unbalance signal. The second microstrip includes a second balance signal connecting section, a second impedance matching section, and a ground section. The second balance signal connecting section is configured to transmit a second component of the balance signal. The ground section is configured to connect to a ground signal. The first microstrip, the second microstrip, and the conductive ground are all disposed on the insulation substrate, and a cross-sectional area of at least a part of the first microstrip and/or at least a part of the second microstrip is gradient.Type: GrantFiled: April 29, 2021Date of Patent: January 9, 2024Assignee: Huawei Technologies Co., Ltd.Inventors: Dajun Zang, Cuicui Wang, Daochun Mo, Yuchun Lu, Linchun Wang
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Patent number: 11830820Abstract: An electronic package includes a package substrate of a rectangular shape, and a chip package including a first interface circuit die and a second interface circuit die. The first interface circuit die and second interface circuit die are mounted on a redistribution layer structure and encapsulated within a molding compound. The chip package is mounted on a top surface of the package substrate and rotated relative to the package substrate above a vertical axis that is orthogonal to the top surface through a rotation offset angle. A metal ring is mounted on the top surface of the package substrate.Type: GrantFiled: December 16, 2021Date of Patent: November 28, 2023Assignee: MEDIATEK INC.Inventors: Yao-Chun Su, Chih-Jung Hsu, Yi-Jou Lin, I-Hsuan Peng
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Patent number: 11764456Abstract: A ring resonator based T-shaped duplexer for use in communication systems, the T-shaped duplexer comprising a T-shaped microstrip duplexer body having a first rectangular-shaped body section and a second rectangular-shaped body section that extends from the first-rectangular shaped section in a perpendicular position relative to the first rectangular-shaped section, three connection ports including a first connection port disposed at an open end of the second rectangular-shaped body section, a second connection port disposed at one end of the first rectangular-shaped body section, and a third connection port disposed at another end of the first rectangular-shaped body section, and two bandpass filters, each bandpass filter comprising a ring resonator structure having a circular shape, an outer edge of the ring resonator structure being connected to the first rectangular-shaped body section of the T-shaped microstrip duplexer body, wherein each of the two bandpass filters creates an Electromagnetically InducedType: GrantFiled: May 13, 2022Date of Patent: September 19, 2023Assignee: Wi-LAN Research Inc.Inventors: Muhammad Rashad Ramzan, Muhammad Omar, Kenneth Stanwood
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Patent number: 11705177Abstract: A semiconductor device comprises a first conductive structure extending along a vertical direction and a second conductive structure extending along the vertical direction. The second conductive structure is spaced apart from the first conductive structure along a lateral direction. The semiconductor device further comprises a plurality of third conductive structures each extending along the lateral direction. The plurality of third conductive structures are disposed across the first and second conductive structures. The first and second conductive structures each have a varying width along the lateral direction. The plurality of third conductive structures are configured to be applied with respective different voltages in accordance with the varying width of the first and second conductive structures.Type: GrantFiled: September 9, 2021Date of Patent: July 18, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Peng-Chun Liou, Zhiqiang Wu, Chung-Wei Wu, Yi-Ching Liu, Yih Wang
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Patent number: 11668610Abstract: An electronic device is provided. The electronic device includes a housing configured to form an external shape thereof, a first board disposed in a first direction that is away from the housing, wherein at least one processor is mounted at the first board, a second board disposed between the housing and the first board and electrically connected with the first board, and a thermistor mounted on the second board, wherein the at least one processor measures a temperature of the housing based on an electrical signal received from the second board.Type: GrantFiled: March 19, 2021Date of Patent: June 6, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Wanjae Ju, Hyoseok Na, Chanho Park
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Patent number: 11658411Abstract: A dielectric substrate for RF, microwave, or millimeter wave devices, circuits, or surfaces includes a propagating region for transmitting or reflecting an electromagnetic field, and one or more material-filled vias located within the propagating region. The application of an external electric or magnetic field to the material-filled vias may be used to tune the electric permittivity or the magnetic permeability of the fill material and hence control the effective electric permittivity or the effective magnetic permeability of the dielectric substrate within the propagating region. A dimension of the material-filled vias may be less than half of a wavelength of the propagating electromagnetic field. The fill material may include liquid crystals, a ferroelectric crystal composite, a ferromagnetic crystal composite, organic semiconductors, and/or electro-optic or magneto-optic polymers.Type: GrantFiled: November 16, 2020Date of Patent: May 23, 2023Assignee: DR. ALAN EVANS BUSINESS AND SCIENTIFIC CONSULTING, LLCInventor: Alan Frank Evans
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Patent number: 11621466Abstract: A stripline that is usable in a quantum application (q-stripline) includes a first polyimide film and a second polyimide film. The q-stripline further includes a first center conductor and a second center conductor formed between the first polyimide film and the second polyimide film. The q-stripline has a first pin configured through the second polyimide film to make electrical and thermal contact with the first center conductor.Type: GrantFiled: December 21, 2020Date of Patent: April 4, 2023Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Salvatore B. Olivadese, Patryk Gumann, Jerry M. Chow
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Well thermalized microstrip formation for flexible cryogenic microwave lines in quantum applications
Patent number: 11621467Abstract: A microstrip that is usable in a quantum application (q-microstrip) includes a ground plane, a polyimide film disposed over the ground plane at a first surface of the polyimide film, and a conductor formed on a second side of the polyimide film such that the first surface is substantially opposite to the second surface. A material of the conductor provides greater than a threshold thermal conductivity (TH) with a structure of a dilution fridge stage (stage).Type: GrantFiled: December 21, 2020Date of Patent: April 4, 2023Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Salvatore B. Olivadese, Patryk Gumann, Jerry M. Chow -
Patent number: 11575190Abstract: In a transmission path transmitting high-frequency signals each signal contains a frequency component of over 8 GHz. The transmission path includes a nickel-phosphorus layer containing nickel and phosphorus, and a phosphorus concentration of the nickel-phosphorus layer is over 0 mass % and less than 8 mass %. Such a structure enables the transmission path to have little loss even when a signal at a frequency of over 8 GHz is transmitted.Type: GrantFiled: May 22, 2019Date of Patent: February 7, 2023Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Fumie Yamaguchi, Satoru Torimitsu
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Patent number: 11474136Abstract: A method for examining differential pair transmission lines, performed by a processor, comprising: capturing a plurality of first insertion losses of a first signal line within a frequency range and a plurality of second insertion losses of a second signal line within the frequency range, wherein the first signal line and the second signal line are configured to transmit a pair of differential signals; calculating a plurality of maximum error ratios between the first insertion losses and the second insertion losses within the frequency range; determining whether any one of the maximum error ratios is greater than or equal to an upper threshold; outputting a warning signal when the processor determines one of the maximum error ratios is greater than or equal to the upper threshold; and ending the method when the processor determines each one of the maximum error ratios is smaller than the upper threshold.Type: GrantFiled: December 13, 2019Date of Patent: October 18, 2022Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventors: Chun I Tseng, Yen-Hao Chen
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Patent number: 11223095Abstract: The present disclosure relates to a filter for filtering wavelengths of an electromagnetic signal to provide a filtered signal. The filter includes: at least one commensurate-line structure (CLS); and, at least one stub-modified commensurate-line structure (SMCLS) arranged to provide a corresponding at least one transmission zero in the filtered signal.Type: GrantFiled: July 24, 2020Date of Patent: January 11, 2022Assignee: EUROPEAN SPACE AGENCYInventors: Petronilo Martin-Iglesias, Fernando Teberio
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Patent number: 11171399Abstract: Antenna assemblies for vehicles, such as RADAR sensor antenna assemblies, and related waveguide assemblies. In some embodiments, the assembly may comprise a waveguide groove having a waveguide ridge positioned therein. The waveguide groove may extend along an axis with the waveguide ridge intermittently extending on opposite sides of the axis in a periodic or at least quasiperiodic manner along at least a portion of the waveguide ridge. An antenna structure, such as a plurality of slots, may be operably coupled with the waveguide ridge and may be positioned and configured to deliver electromagnetic radiation from the waveguide groove therethrough.Type: GrantFiled: July 23, 2019Date of Patent: November 9, 2021Assignee: Veoneer US, Inc.Inventors: Angelos Alexanian, Konstantinos Konstantinidis
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Patent number: 11018403Abstract: An electromagnetic wave transmission cable for transmitting an electromagnetic wave comprises a hollow waveguide tube and a foamed resin member. The hollowing waveguide tube includes a hollow dielectric layer formed in a tubular shape. The foamed resin member is provided over a predetermined length in a longitudinal direction of the hollow waveguide tube and covers a surface of the dielectric layer to surround an outer periphery of the hollow waveguide tube.Type: GrantFiled: October 18, 2017Date of Patent: May 25, 2021Assignee: PIONEER CORPORATIONInventors: Yasuo Hosoda, Tomoyuki Miyamoto, Katsunori Obata, Takahiro Togashi, Takao Tagiri
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Patent number: 10998605Abstract: A connecting unit for radio-frequency components has: a housing; a first interface and a second interface which are arranged on the housing and are designed to be coupled to in each case one radio-frequency component; an internal conductor which runs in the housing and is connected to the first interface and the second interface in order to establish a radio-frequency connection between the first interface and the second interface; a spacer which surrounds the internal conductor and extends at least along a portion of the length of the internal conductor. The housing is manufactured from an electrically conductive and rigid material and the spacer is arranged such that the internal conductor is at a distance from the housing at least in sections.Type: GrantFiled: October 15, 2018Date of Patent: May 4, 2021Inventors: Christian Arnold, Andreas Wacker, Andreas Fisher, Michael Glasbrenner, Florian Essig, Daniel Reicherter, David Diez, Andreas Scheffel, Patrick Thiemer
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Patent number: 10978769Abstract: A stripline that is usable in a quantum application (q-stripline) includes a first polyimide film and a second polyimide film. The q-stripline further includes a first center conductor and a second center conductor formed between the first polyimide film and the second polyimide film. The q-stripline has a first pin configured through the second polyimide film to make electrical and thermal contact with the first center conductor.Type: GrantFiled: June 22, 2020Date of Patent: April 13, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Salvatore B. Olivadese, Patryk Gumann, Jerry M. Chow
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Well thermalized microstrip formation for flexible cryogenic microwave lines in quantum applications
Patent number: 10971790Abstract: A microstrip that is usable in a quantum application (q-microstrip) includes a ground plane, a polyimide film disposed over the ground plane at a first surface of the polyimide film, and a conductor formed on a second side of the polyimide film such that the first surface is substantially opposite to the second surface. A material of the conductor provides greater than a threshold thermal conductivity (TH) with a structure of a dilution fridge stage (stage).Type: GrantFiled: May 21, 2020Date of Patent: April 6, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Salvatore B. Olivadese, Patryk Gumann, Jerry M. Chow -
Patent number: 10892644Abstract: To provide a power supply system to a two-dimensional communication sheet that can prevent generation of leakage power without lowering a power efficiency, there are included a two-dimensional communication sheet 1 that has an dielectric layer 11, a first conductor layer 12 covering a rear surface of the dielectric layer 11, and a second conductor layer 13 covering a front surface of the dielectric layer 11 and composed of a mesh-shaped wiring pattern; and a power supply port 16 for supplying power to the two-dimensional communication sheet 1, the power supply port 16 having a first power supply plate 163 provided separately at a rear side of the first conductor layer 12, a second power supply plate 164 provided at a position opposite to the first power supply plate 163 separately at a front side of the second conductor layer 13, a first power supply body 161 electrically connected with the first power supply plate 163, and a second power supply body 162 electrically connected with the second power supply plaType: GrantFiled: August 6, 2017Date of Patent: January 12, 2021Assignee: NATIONAL INSTITUTE OF INFORMATION AND COMMUNICATIONS TECHNOLOGYInventors: Bing Zhang, Takashi Matsuda, Toshinori Kagawa, Ryu Miura
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Patent number: 10784553Abstract: A stripline that is usable in a quantum application (q-stripline) includes a first polyimide film and a second polyimide film. The q-stripline further includes a first center conductor and a second center conductor formed between the first polyimide film and the second polyimide film. The q-stripline has a first pin configured through a first recess in the second polyimide film to make electrical and thermal contact with the first center conductor.Type: GrantFiled: September 7, 2018Date of Patent: September 22, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Salvatore B. Olivadese, Patryk Gumann, Jerry M. Chow
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Patent number: 10749238Abstract: A dielectric waveguide for propagating electromagnetic signals comprises a cladding and an electrically conductive shield. The cladding has a body composed of a first dielectric material. The body defines a core region therethrough that is filled with a second dielectric material different than the first dielectric material. The cladding includes at least two ribs extending from an outer surface of the body to distal ends of the ribs. The electrically conductive shield engages the distal ends of the ribs and peripherally surrounds the cladding such that air gaps are defined radially between the outer surface of the body and an interior surface of the shield.Type: GrantFiled: June 14, 2018Date of Patent: August 18, 2020Assignees: TE Connectivity Germany GmbH TE, Connectivity Corporation, Tyco Electronics (Shanghai) Co., Ltd.Inventors: Christian Rusch, Markus Dittmann, Carlos Almeida, Chad William Morgan, Liang (Vincent) Huang
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Well thermalized microstrip formation for flexible cryogenic microwave lines in quantum applications
Patent number: 10749235Abstract: A microstrip that is usable in a quantum application (q-microstrip) includes a ground plane, a polyimide film disposed over the ground plane at a first surface of the polyimide film, and a conductor formed on a second side of the polyimide film such that the first surface is substantially opposite to the second surface. A material of the conductor provides greater than a threshold thermal conductivity (TH) with a structure of a dilution fridge stage (stage). The stage is maintained at a cryogenic temperature, and the material of the conductor bonds at the cryogenic temperature with a second material of a part of a connector of a microwave line.Type: GrantFiled: September 7, 2018Date of Patent: August 18, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Salvatore B. Olivadese, Patryk Gumann, Jerry M. Chow -
Patent number: 10484120Abstract: Embodiments include a wavelength selective communication system for use in vehicles. In an embodiment, the communication system may include a primary dielectric waveguide having a first cross-sectional area. In an embodiment, a coupling arm dielectric waveguide may be communicatively coupled to the primary dielectric waveguide. In an embodiment, the coupling arm has a second cross-sectional area that is smaller than or equal to the cross-sectional area of the first cross-sectional area. According to an embodiment, the coupling arm is communicatively coupled to the primary dielectric waveguide by a waveguide connector.Type: GrantFiled: September 30, 2017Date of Patent: November 19, 2019Assignee: Intel CorporationInventors: Sasha N. Oster, Georgios C. Dogiamis, Telesphor Kamgaing, Adel A. Elsherbini, Johanna M. Swan, Erich N. Ewy
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Patent number: 10320083Abstract: A waveguide device includes: a first conductive member having an electrically conductive surface; a second conductive member having a plurality of electrically conductive rods arrayed thereon, each conductive rod having a leading end opposing the conductive surface; and a waveguide member having an electrically conductive waveguide face opposing the conductive surface, the waveguide member being disposed among the conductive rods and extending along the conductive surface. The waveguide member includes at least one of a bend and a branching portion. A measure of an outer shape of a cross section of at least one of the plurality of conductive rods that is adjacent to the bend or the branching portion, taken perpendicular to an axial direction of the at least one conductive rod, monotonically decreases from a root that is in contact with the second conductive member toward a leading end.Type: GrantFiled: June 18, 2018Date of Patent: June 11, 2019Assignees: NIDEC CORPORATION, WGR CO., LTD.Inventors: Hideki Kirino, Hiroyuki Kamo
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Patent number: 10027032Abstract: A waveguide device includes: a first conductive member having an electrically conductive surface; a second conductive member having a plurality of electrically conductive rods arrayed thereon, each conductive rod having a leading end opposing the conductive surface; and a waveguide member having an electrically conductive waveguide face opposing the conductive surface, the waveguide member being disposed among the conductive rods and extending along the conductive surface. The waveguide member includes at least one of a bend and a branching portion. A measure of an outer shape of a cross section of at least one of the plurality of conductive rods that is adjacent to the bend or the branching portion, taken perpendicular to an axial direction of the at least one conductive rod, monotonically decreases from a root that is in contact with the second conductive member toward a leading end.Type: GrantFiled: October 13, 2016Date of Patent: July 17, 2018Assignees: NIDEC CORPORATION, WGR CO., LTD.Inventors: Hideki Kirino, Hiroyuki Kamo
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Patent number: 10014903Abstract: In a circularly polarized wave antenna apparatus including a non-reciprocal transmission line apparatus having forward and backward propagation constants different from each other, the non-reciprocal transmission line apparatus includes a transmission line part for a microwave, a series branch circuit equivalently including a capacitive element, and a shunt branch circuit branched from the transmission line part and equivalently includes an inductive element. The non-reciprocal transmission line apparatus is formed in a nonlinear shape and magnetized in a magnetization direction different from a propagation direction of the microwave.Type: GrantFiled: February 25, 2015Date of Patent: July 3, 2018Assignee: JAPAN SCIENCE AND TECHNOLOGY AGENCYInventors: Tetsuya Ueda, Andrey Porokhnyuk
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Patent number: 9917342Abstract: A wave cable transceiver system is disclosed incorporating an air-core or noble gas filled hollow plastic waveguide. The system may include a transmitter receiver, in-antennas and a tubular plastic waveguide with the inner air-core. The hollow plastic waveguide is a low loss and low dispersion guiding channel for the electromagnetic radiation.Type: GrantFiled: September 10, 2015Date of Patent: March 13, 2018Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIAInventors: Mau-Chung Frank Chang, Lan Nan, Yanghyo Kim
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Patent number: 9912030Abstract: A dielectric waveguide for propagating electromagnetic signals includes a cladding and an electrically conductive shield. The cladding has a body composed of a first dielectric material. The body defines a core region therethrough that is filled with a second dielectric material different than the first dielectric material. The cladding further includes at least two ribs extending from an outer surface of the body to distal ends. The shield engages the distal ends of the ribs and peripherally surrounds the cladding such that air gaps are defined radially between the outer surface of the body and an interior surface of the shield.Type: GrantFiled: January 21, 2016Date of Patent: March 6, 2018Assignees: TE CONNECTIVITY CORPORATION, TYCO ELECTRONICS (SHANGHAI) CO., LTD.Inventors: Chad William Morgan, Liang Huang
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Patent number: 9899721Abstract: A dielectric waveguide for propagating electromagnetic signals includes a cladding member and a jacket member. The cladding member extends a length between two ends. The cladding member is formed of an intermediate dielectric material. The cladding member defines a core region that extends through the cladding member along the length of the cladding member. The core region is filled with a central dielectric material having a dielectric constant value that is less than a dielectric constant value of the intermediate dielectric material of the cladding member. The jacket member engages and surrounds the cladding member along the length of the cladding member. The jacket member is formed of an outer dielectric material having a dielectric constant value that is less than the dielectric constant value of the intermediate dielectric material of the cladding member.Type: GrantFiled: August 21, 2015Date of Patent: February 20, 2018Assignees: TE CONNECTIVITY CORPORATION, TYCO ELECTRONICS (SHANGHAI) CO., LTD.Inventors: Chad Morgan, Liang Huang
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Patent number: 9899720Abstract: A dielectric waveguide for propagating electromagnetic signals includes a cladding member. The cladding member extends a length between two ends. The cladding member has an oblong cross sectional shape. The cladding member is formed of a first dielectric material. The cladding member defines a core region that extends through the cladding member the length of the cladding member. The core region has a circular cross sectional shape. The core region is filled with a second dielectric material having a dielectric constant value that differs from a dielectric constant value of the first dielectric material of the cladding member.Type: GrantFiled: August 21, 2015Date of Patent: February 20, 2018Assignees: TE CONNECTIVITY CORPORATION, TYCO ELECTRONICS (SHANGHAI) CO., LTD.Inventors: Chad Morgan, Liang Huang
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Patent number: 9731445Abstract: Techniques are disclosed for systems and methods to provide a magnetic materials additive manufacturing system (MMAMS) configured to form compact magnetic structures and/or devices. A MMAMS includes a controller and one or more dispensers configured to dispense magnetic material matrix in a high resolution pattern in order to form the compact magnetic structures and/or devices. The MMAMS receives a magnetic device design including a magnetic structure to be formed from a magnetic material matrix, where the magnetic material matrix is configured to be used in the MMAMS. The MMAMS receives magnetic material matrix and dispenses the magnetic material matrix to form the magnetic structure.Type: GrantFiled: August 20, 2015Date of Patent: August 15, 2017Assignee: The Boeing CompanyInventor: John D. Williams
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Patent number: 9490653Abstract: Systems and methods for converting voltages between different voltage levels in a receiver are disclosed. In an aspect, a wireless power receiver apparatus for charging a chargeable device is provided. The apparatus includes a plurality of receive antennas disposed on a cover of the chargeable device, wherein at least one of the plurality of receive antennas is configured to wirelessly receive power according to a wireless charging protocol different from at least one other of the plurality of receive antennas. The apparatus includes a switching circuit disposed on the cover and configured to receive the wireless power from at least one of the plurality of receive antennas and selectively provide a respective voltage from a corresponding one of the plurality of receive antennas across an output configured to be connected to an input of the chargeable device.Type: GrantFiled: July 21, 2014Date of Patent: November 8, 2016Assignee: QUALCOMM IncorporatedInventors: Sumukh Ashok Shevde, Joseph Najib Maalouf, Francesco Carobolante
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Patent number: 9372214Abstract: High frequency interconnect structures, electronic assemblies that utilize high frequency interconnect structures, and methods of operating the same. The high frequency interconnect structures include a plurality of dielectric waveguides and are configured to communicatively connect a plurality of transmitters with a plurality of receivers and to convey a plurality of signals therebetween. The plurality of signals may include a plurality of electromagnetic waves and may have a frequency of at least 200 GHz. The high frequency interconnect structures further may be configured to decrease a potential for crosstalk between a first signal that is conveyed by a first dielectric waveguide of the plurality of dielectric waveguides and a second signal that is conveyed by a second dielectric waveguide of the plurality of dielectric waveguides, such as through control of a passband of the first dielectric waveguide relative to the second dielectric waveguide and/or the use of a crosstalk mitigation structure.Type: GrantFiled: May 31, 2012Date of Patent: June 21, 2016Assignee: Cascade Microtech, Inc.Inventors: Eric W. Strid, Richard L. Campbell, Kenneth R. Smith, K. Reed Gleason, Kooho Jung
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Patent number: 9349506Abstract: A shield member includes a metal foil layer and a base layer which have flexibility and are sheet-like or band-like, a bonding layer which bonds the metal foil layer and the base layer, and a cylindrical portion and an overlapping portion which are made by winding and folding the metal foil layer and the base layer so that the metal foil layer is on an inside. The overlapping portion is in a state of being brought down and arranged along the cylindrical portion.Type: GrantFiled: July 14, 2011Date of Patent: May 24, 2016Assignee: YAZAKI CORPORATIONInventors: Eiichi Toyama, Shigemi Hashizawa
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Patent number: 8933339Abstract: A differential path replacement component includes: a first signal line that comprises one end and the other end; and a second signal line that comprises one end adjacent to one end of the first signal line and the other end adjacent to the other end of the first signal line, that transmits a signal having a phase opposite to a phase of a signal transmitted through the first signal line, and that is paired with the first signal line. The first and second signal lines are twisted together such that an arranged sequence of one end of the first signal line and one end of the second signal line is reversed to an arranged sequence of the other end of the first signal line and the other end of the second signal line.Type: GrantFiled: September 14, 2011Date of Patent: January 13, 2015Assignee: Fujitsu LimitedInventors: Kouichiro Asou, Toshihiro Miyamoto
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Patent number: 8928543Abstract: A gyrotropic metamaterial structure that include a plurality of chiral metamaterials forming one or more pairs of dipole structures. A plurality of lumped circuits are positioned between the one or more pairs of dipole structures. The lumped circuits have a plurality of subwavelengths antennas that are combined to change the polarization states of an incident polarized wave by producing Faraday-like rotation allowing for nomeciprocal propagation of the incident polarized wave.Type: GrantFiled: July 13, 2012Date of Patent: January 6, 2015Assignee: Massachusetts Institute of TechnologyInventors: Zheng Wang, Marin Soljacic, Zhiyu Wang, John D. Joannopoulos, Lixin Ran
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Publication number: 20140294334Abstract: A configuration for routing electrical signals between a conventional electronic integrated circuit (IC) and an opto-electronic subassembly is formed as an array of signal paths carrying oppositely-signed signals on adjacent paths to lower the inductance associated with the connection between the IC and the opto-electronic subassembly. The array of signal paths can take the form of an array of wirebonds between the IC and the subassembly, an array of conductive traces formed on the opto-electronic subassembly, or both.Type: ApplicationFiled: March 18, 2014Publication date: October 2, 2014Applicant: Cisco Technology, Inc.Inventors: Kalpendu SHASTRI, Bipin DAMA, Mark WEBSTER, David PIEDE
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Patent number: 8816823Abstract: Provided is an electromagnetic wave transmission sheet having a mesh-shaped electrode. The sheet has a length of width in a direction vertical to the propagation direction of the transmitted electromagnetic wave which length is substantially identical to half of the wavelength of the transmitted electromagnetic wave multiplied by a natural number so that a resonance state is obtained in the vertical direction. It is preferable that the sheet have an electromagnetic wave absorbing medium for reducing reflection of the transmitted electromagnetic wave in the propagation direction, so as to eliminate the need of an electromagnetic wave absorbing medium for reducing reflection in the direction vertical to the propagation direction of the transmitted electromagnetic wave.Type: GrantFiled: September 15, 2009Date of Patent: August 26, 2014Assignee: Cell Cross CorporationInventors: Ken-Ichi Tezuka, Naoya Asamura, Hiroto Itai
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Publication number: 20140111290Abstract: A magneto-inductive waveguide comprising a plurality of resonant elements, the plurality of resonant elements including a first resonant element comprising a conductive loop broken by at least one capacitive gap, and a second resonant element comprising a conductive loop broken by at least one capacitive gap, the second resonant element for magneto-inductively coupling with the first resonant element; wherein the first resonant element and second resonant element are conductively coupled.Type: ApplicationFiled: June 18, 2012Publication date: April 24, 2014Applicant: ISIS INNOVATION LIMITEDInventor: Christopher Stevens
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Publication number: 20140079403Abstract: High-speed pluggable rigid-end flex circuit. A circuit includes a flexible section, rigid section, connector disposed on the rigid section, and electrically conductive signal transmission line electrically coupled to the connector. The flexible section includes a first portion of a flexible insulating layer. The rigid section includes a second portion of the flexible insulating layer and a rigid insulating layer disposed on the second portion of the flexible insulating layer. The connector is configured to form a pluggable conductive connection. The electrically conductive signal transmission line includes a first signal trace having a root mean square surface roughness below 20 micrometers and a filled signal via configured to pass through at least a portion of the rigid insulating layer. The flexible and rigid insulating layers have a dissipation factor equal to or below a ratio of 0.004 and a dielectric constant equal to or below a ratio of 3.7.Type: ApplicationFiled: September 20, 2012Publication date: March 20, 2014Applicant: FINISAR CORPORATIONInventors: Henry Daghighian, Steve Bird, Bruce Sramek
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Patent number: 8593233Abstract: A multiplexor includes an output having a characteristic impedance; a first input having a characteristic impedance equal to the output characteristic impedance; a second input; a first switch path including a first switch operable to connect/disconnect the first input center conductor and the output center conductor; a first input conductive path adjacent to the first switch path and being operable to provide the output characteristic impedance; a second switch path including a second switch operable to connect/disconnect the second input first signal conductor and the output center conductor; and a third switch path including a third switch operable to connect/disconnect the second input second signal conductor and the output intermediate conductor, the third switch path being operable to guard the second switch path when the third switch path is provided with a guard voltage.Type: GrantFiled: March 15, 2011Date of Patent: November 26, 2013Assignee: Keithley Instruments, Inc.Inventor: Wayne C. Goeke
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Publication number: 20130300522Abstract: Embodiments of the present disclosure provide a radio frequency (RF) conductive medium for reducing the undesirable insertion loss of all RE hardware components and improving the Q factor or “quality factor” of RF resonant cavities. The RF conductive medium decreases the insertion loss of the RF device by including one or more conductive pathways in a transverse electromagnetic axis that are immune to skin effect loss and, by extension, are substantially free from resistance to the conduction of RF energy.Type: ApplicationFiled: April 29, 2013Publication date: November 14, 2013Applicant: Nanoton, Inc.Inventor: Nanoton, Inc.
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Publication number: 20130293323Abstract: This electromagnetic wave transmission sheet is provided with: a first conductor plane; a second conductor plane arranged to be opposed the first conductor plane, and provided with a plurality of openings; a dielectric layer provided between the first conductor plane and the second conductor plane; a reflection element provided on outer edge of the dielectric layer; and a lossy material provided to cover the external side of the reflection element.Type: ApplicationFiled: December 16, 2011Publication date: November 7, 2013Inventor: Koichiro Nakase
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Patent number: 8542082Abstract: A high-impedance line includes a plurality of windings successively arranged. Each of the windings includes an upper portion and a lower portion parallel to the upper portion. The upper portions of each of the windings are electrically connected to the lower portions of adjacent windings. A resistance unit electrically connected between every two adjacent windings.Type: GrantFiled: May 19, 2010Date of Patent: September 24, 2013Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.Inventors: Xu Gao, Zhi-Jun Zhang, Zheng-He Feng, Steven-Philip Marcher, Zhan Li, Yong Yan
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Publication number: 20130147571Abstract: An HF feed bushing device is provided that is designed to connect an HF transmitter/receiver to an antenna via an external medium by means of a balanced two-wire line. The balanced two-wire line is at least partially encapsulated in a central part of a closed conduit including a wall isolating the balanced two-wire line from the external medium. Applications: Feeding of antennas via balanced two-wire lines.Type: ApplicationFiled: December 16, 2010Publication date: June 13, 2013Applicant: ThalesInventors: Frédéric Lamour, Alain Eberland, Alain Denechaud
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Patent number: 8461012Abstract: A method for forming a semiconductor structure includes forming an isolation region in a semiconductor substrate; forming a conductive layer over the isolation region; forming a first dielectric layer over the conductive layer; forming a plurality of conductive vias extending through the first dielectric layer to the conductive layer and electrically contacting the conductive layer; forming a second dielectric layer over the first dielectric layer; and forming a conductive ground plane in the second dielectric layer. Each of the plurality of conductive vias is in electrical contact with the conductive ground plane, and the conductive ground plane includes an opening, wherein the opening is located directly over the conductive layer. At least one interconnect layer may be formed over the second dielectric layer and may include a transmission line which transmits a signal having a frequency of at least 30 gigahertz.Type: GrantFiled: February 26, 2010Date of Patent: June 11, 2013Assignee: Freescale Semiconductor, Inc.Inventor: Vishal P. Trivedi
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Patent number: 8446436Abstract: An overdrive topology structure for transmission of a RGB signal includes a signal sending terminal, a signal receiving terminal, and a transmission line to transmit the RGB signal from the signal sending terminal to the signal receiving terminal. The transmission line is divided into a number of section transmission lines. A node is formed between every two section transmission lines. An impedance of a first section transmission line approaching to the signal sending terminal is less than an impedance of a second section transmission line approaching to the first section transmission line to overdrive the RGB signal at a first node between the first and second section transmission lines. At least one node except the first node is grounded via a resistor. An equivalent resistance of the resistor is equal to a resistance of the first resistor.Type: GrantFiled: June 12, 2009Date of Patent: May 21, 2013Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Shou-Kuo Hsu, Yu-Chang Pai, Cheng-Shien Li, Jia-Chi Chen
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Patent number: 8334734Abstract: Printed multilayer filter design techniques and filters based on metamaterial structures including an extended composite left and right handed (E-CRLH) metamaterial unit cell.Type: GrantFiled: August 25, 2009Date of Patent: December 18, 2012Assignee: Hollinworth Fund, L.L.C.Inventor: Maha Achour
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Patent number: 8294533Abstract: Techniques, apparatus and systems that use composite left and right handed (CRLH) metamaterial structures to combine and divide electromagnetic signals at multiple frequencies. The metamaterial properties permit significant size reduction over a conventional N-way radial power combiner or divider. Dual-band serial power combiners and dividers and single-band and dual-band radial power combiners and dividers are described.Type: GrantFiled: October 1, 2010Date of Patent: October 23, 2012Assignee: Hollinworth Fund, L.L.C.Inventors: Alexandre Dupuy, Ajay Gummalla, Maha Achour
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Patent number: 8294538Abstract: A transmission line microwave apparatus includes at least one nonreciprocal transmission line part, which includes a series branch circuit equivalently including a capacitive element and a shunt branch circuit equivalently including an inductive element. The nonreciprocal transmission line part has gyrotropic characteristic by being magnetized in a magnetization direction different from the propagation direction of a microwave, and has an asymmetric structure to a plane formed by the propagation direction and the magnetization direction. The nonreciprocal transmission line part has a propagation constant and an operating frequency set in a dispersion curve that represents a relation between the propagation constant and the operating frequency so that the propagation constant in the forward direction and the propagation constant in the backward direction have nonreciprocal phase characteristics different from each other.Type: GrantFiled: March 5, 2008Date of Patent: October 23, 2012Assignee: National University Corporation Kyoto Institute of TechnologyInventor: Tetsuya Ueda
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Patent number: 8289100Abstract: A high-frequency electric field coupler is provided for use in a contactless communication system propagating high frequency signals in a wide band utilizing electric field coupling. The coupler includes a coupling electrode and a resonance unit operating to increase the amplitude of an electrical charge accumulated at the coupling electrode at a predetermined resonance frequency. The coupling electrode is a linear conductor in the form of a coil.Type: GrantFiled: July 19, 2011Date of Patent: October 16, 2012Assignee: Sony CorporationInventor: Takanori Washiro
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Patent number: 8237516Abstract: In enhancing signal quality through packages, meta-materials may be used. Meta-materials are designed to make the signal act in such a way as to make the shape of the signal behave as though the permittivity and permeability are different than the real permittivity and permeability of the insulator used. In an example embodiment, a substrate (10) is configured as a meta-material. The meta-material provides noise protection for a signal line (15) having a pre-determined length disposed on the meta-material. The substrate comprises a dielectric material (2, 4, 6) having a topside surface and an underside surface. A conductive material (30) is arranged into pre-determined shapes (35) having a collective length. Dielectric material envelops the conductive material and the conductive material is disposed at a first predetermined distance (55) from the topside surface and at a second predetermined distance from the underside surface.Type: GrantFiled: December 15, 2006Date of Patent: August 7, 2012Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventor: Chris Wyland