Abstract: A cable includes a plurality of electric wires including a conductor and an insulating member coating a periphery of the conductor, a tape member provided over a periphery of an aggregate configured by laying the plurality of electric wires together, and an outer sheath provided over an outer periphery of the tape member. The tape member includes a mixture of a first fiber having a melting point and a second fiber having a melting point lower than the melting point of the first fiber. The first fiber has the melting point higher than an extrusion molding temperature of the outer sheath, and the second fiber has the melting point lower than the extrusion molding temperature of the outer sheath.

Abstract: In some embodiments, an apparatus includes a plurality of first conductive traces oriented in a first direction in a first layer and plurality of second conductive traces oriented in a second direction in a second layer coupled by vias to define first hierarchical networks. A plurality of third conductive traces oriented in the first direction in a third layer and a plurality of fourth conductive traces oriented in the second direction in a fourth layer are coupled by vias to define second hierarchical networks. Open ends of the first or second traces at a last stage of the first hierarchical networks comprise first ends and open ends of the third or fourth traces at a last stage of the second hierarchical networks comprise second ends. A first end and a corresponding second end are non-collinear to each other and perpendicular to a major plane of the first layer.

Abstract: An epsilon-and-mu-near-zero (EMNZ) metamaterial. The EMNZ metamaterial includes a waveguide. A length l of the waveguide satisfies a length condition according to l?0.1?, where ? is an operating wavelength of the EMNZ metamaterial. The EMNZ metamaterial further includes a magneto-dielectric material deposited on a lower wall of the waveguide. The waveguide includes an impedance surface placed on the magneto-dielectric material.

Abstract: A wireline cable, method, and system for broadband communications and data transfer. The wireline cable comprises insulated conductors, arranged such that circumferentially spaced conductors surround a central conductor. One or more of the conductors is insulated with a magnetic permeable insulation configured to reduce electrical interference with an adjacent conductor.

Abstract: An assembly includes: first and second printed circuit boards (PCBs), the PCBs being disposed generally parallel to each other; a first coaxial connector mounted to the first PCB, the first coaxial connector comprising a first inner contact and a first outer connector body, the first outer connector body having a first thickness; and a second coaxial connector mounted to the second PCB, the second axial connector comprising a second inner contact and a second outer connector body. The second outer connector body includes an engagement surface, the engagement surface being flexible in a direction normal to the second PCB, the engagement surface having a second thickness that is greater than the first thickness.

Abstract: An electrical heating cable with a first power supply conductor, a second power supply conductor, and a third power supply conductor. Each of the first, second and third power supply conductors extend along a length of the cable. The electrical heating cable also includes an electrically conductive heating element body, wherein the first, second and third power supply conductors are electrically coupled to each other via the electrically conductive heating element body. The second power supply conductor is provided with a layer of electrically insulating material which covers only a part of a surface of the second power supply conductor. The layer is provided between the surface of the second power supply conductor and the electrically conductive heating element body.

Abstract: An apparatus for a coaxial transmission line is provided. The apparatus can include a first and a second section of a conductor of the coaxial transmission line and a connector for connecting the first and the second sections in end-to-end relation. Each of the first and the second sections of the conductor have an exterior lateral surface and an interior lateral surface. For inner conductors, the connector is connected to the interior lateral surfaces of the first and second sections of the conductor. For outer conductors, the connector is connected to the exterior lateral surfaces of the first and second sections of the conductor. The connector allows the inner and outer diameters of the annulus between the inner and outer conductors line to be substantially uniform along the length of the coaxial transmission line.

Abstract: Generating, during a first and second signaling interval, an aggregated data signal by forming a linear combination of wire signals received in parallel from wires of a multi-wire bus, wherein at least some of the wire signals undergo a signal level transition during the first and second signaling interval; measuring a signal skew characteristic of the aggregated data signal; and, generating wire-specific skew offset metrics, each wire-specific skew offset metric based on the signal skew characteristic.

Abstract: Methods and systems described include a first dielectric material having a plurality of embedded conductors of a multi-wire channel, the plurality of embedded conductors comprising at least a first, second and third conductor, wherein a first distance between the first and second conductors is less than a second distance between the first and third conductors, wherein the first dielectric material has a first dielectric constant ?1 and a second dielectric material embedded in the first dielectric material, the second dielectric material embedded in between the first and third conductors, the second dielectric material having a second dielectric constant ?2, wherein ?2>?1.

Abstract: Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.

Abstract: An electrical connector electrically connects a first printed circuit board and a second printed circuit board, where the electrical connector includes: (a) an insulative housing; (b) a plurality of signal conductors, with at least a portion of each of the plurality of signal conductors disposed within the insulative housing; (c) each of the plurality of signal conductors having a first contact end, a second contact end and an intermediate portion therebetween; and (d) a passive circuit element electrically connected to the intermediate portion of each of the plurality of signal conductors, where the passive circuit element is housed in an insulative package and includes at least a capacitor or an inductor.

Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.

Abstract: Structures, materials, and methods to control the spread of a solder material or other flowable conductive material in electronic and/or electromagnetic devices are provided.

Abstract: A soft dilute copper alloy material includes 2 mass ppm to 12 mass ppm of sulfur, more than 2 mass ppm and not more than 30 mass ppm of oxygen, 4 mass ppm to 55 mass ppm of Ti, and a balance including copper. An average crystal grain size is not more than 20 ?m in a surface layer up to a depth of 50 ?m from a surface. The average crystal grain size in the surface layer is less than the average crystal grain size in an inner portion located more interiorly than the surface layer.

Abstract: Embodiments of the present disclosure provide a radio frequency (RF) conductive medium for reducing the undesirable insertion loss of all RF hardware components and improving the Q factor or “quality factor” of RF resonant cavities. The RF conductive medium decreases the insertion loss of the RF device by including one or more conductive pathways in a transverse electromagnetic axis that are immune to skin effect loss and, by extension, are substantially free from resistance to the conduction of RF energy.

Abstract: A quantum computing system includes a quantum circuit device, a substrate having a first surface on which the quantum processing device is disposed, and one or more vias each extending through the substrate. The vias include a material that is a superconducting material during operation of the quantum computing system.

Abstract: A technique relates to a qubit readout system. A cavity-qubit system has a qubit and a readout resonator and outputs a readout signal. A lossless superconducting circulator is configured to receive the microwave readout signal from the cavity-qubit system and transmit the microwave readout signal according to a rotation. A quantum limited directional amplifier amplifies the readout signal. A directional coupler is connected to and biases the amplifier to set a working point. A microwave bandpass filter transmits in a microwave frequency band by passing the readout signal while blocking electromagnetic radiation outside of the microwave frequency band. A low-loss infrared filter has a distributed Bragg reflector integrated into a transmission line. The low-loss filter is configured to block infrared electromagnetic radiation while passing the microwave readout signal. The low-loss infrared filter is connected to the microwave bandpass filter to receive input of the microwave readout signal.

Abstract: Embodiments of the present disclosure provide a radio frequency (RF) conductive medium for reducing the undesirable insertion loss of all RE hardware components and improving the Q factor or “quality factor” of RF resonant cavities. The RF conductive medium decreases the insertion loss of the RF device by including one or more conductive pathways in a transverse electromagnetic axis that are immune to skin effect loss and, by extension, are substantially free from resistance to the conduction of RF energy.

Abstract: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).

Abstract: A transmission line structure includes a first transition element, a second transition element, and an active element. The first transition element has a radio frequency injection port and the second transition element, which is spaced from the first transition element, has a radio frequency termination port. An active element is in electrical communication with the first transition element and the second transition element. The active element includes a first and second connection region where the active element is attached to the first and second transition elements. The connection regions are configured to reduce reflection of electromagnetic energy.

Abstract: A coplanar waveguide transition includes a substrate, a first coplanar waveguide on a first side of the substrate, and a second coplanar waveguide on a second side of the substrate. The coplanar waveguide transition includes a first, a second, and a third via through the substrate electrically coupling the first coplanar waveguide to the second coplanar waveguide. The coplanar waveguide transition includes voids through the substrate between the first, second, and third vias and edges of the first coplanar waveguide and edges of the second coplanar waveguide.

Abstract: Systems and methods for low loss wireless power transmission are described herein. In one aspect, a transmission coil for transmitting wireless power comprises a first and second spiral coil. Each spiral coil comprises a plurality of turns. A center of the first spiral coil to an outermost turn of the first spiral coil defines a first cross section, and a center of the second spiral coil to an outermost turn of the second spiral coil defines a second cross section. Portions of the first spiral coil along the first cross section and the second spiral coil along the second cross section have a mutual inductance with respect to a receive coil greater than 65% of a maximum mutual inductance along the first and second cross sections. The second spiral coil is counter-wound relative to the first spiral coil.

Abstract: A coplanar waveguide device includes a coplanar waveguide structure disposed on a substrate, at least one qubit coupled to the coplanar waveguide structure and an add-on chip having a metallized trench, and disposed over the substrate.

Abstract: A controlled impedance microwave surface to surface interface utilizes compression contact technologies.

Abstract: A method for insulating wires is disclosed. A portion of the plurality of wires and an insulating material are placed in a tube having an open end. Pressure is applied to the tube. During the application of pressure, the tube, the plurality of wires, and the insulating material are heated to a temperature above a melting point of the insulating material. As a result, the insulating material is melted and driven toward the open end of the tube. Upon removal of the heat, the insulating material solidifies and forms a barrier proximal to the open end of the tube.

Abstract: A wideband antenna is disclosed. The wideband antenna comprises an inverted cone, at least one sinuous arm coupled to the cone, and a ground plane behind the apex of the cone. The sinuous arm comprises at least two active resonators.

Abstract: A rigid RF coaxial transmission line is positioned within a wellbore in a subterranean formation. The rigid RF coaxial transmission line includes a series of rigid coaxial sections coupled together in end-to-end relation and to be positioned within the wellbore of the subterranean formation. Each rigid coaxial section includes an inner conductor, a rigid outer conductor surrounding the inner conductor, and a dielectric therebetween. Each of the rigid outer conductors has threaded ends. The rigid RF coaxial transmission line includes a respective connector between adjacent ones of the series of rigid coaxial sections, each connector having a rigid outer layer threadingly secured to respective threaded ends of adjacent rigid outer conductors, and an electrically conductive liner carried by the rigid outer layer and defining an electrical joint between the adjacent rigid outer conductors.

Abstract: A rigid radio frequency (RF) coaxial transmission line to be positioned within a wellbore in a subterranean formation may include a series of rigid coaxial sections coupled together in end-to-end relation. Each rigid coaxial section may include an inner conductor, a rigid outer conductor surrounding the inner conductor, and a dielectric therebetween. Each of the rigid outer conductors may include a rigid outer layer having opposing threaded ends defining overlapping mechanical threaded joints with adjacent rigid outer layers. Each of the rigid outer conductors may also include an electrically conductive inner layer coupled to the rigid outer layer and having opposing ends defining electrical joints with adjacent electrically conductive inner layers.

Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

Abstract: Carbon nanostructures can be formed into polymer composites that are electrically conductive and highly reflective of microwave radiation, thereby facilitating transmission of the microwave radiation. Microwave transmission assemblies containing carbon nanostructures can include an elongate structure containing elongate opposing surfaces that extend the length of the elongate structure and that are spaced apart from one another with a channel region defined in between. The elongate opposing surfaces include a polymer composite containing a polymer matrix and a plurality of carbon nanostructures. Each carbon nanostructure can include a plurality of carbon nanotubes that are branched, crosslinked, and share common walls with one another.

Abstract: A system is provided for three dimensional coaxial transmission of signals in a micro-machined component, the system having, a micro-machined component matrix with a first metallic sheet having a plurality of first access holes disposed therein; a second metallic sheet having a plurality of second access holes disposed therein; a plurality of metal posts disposed between the first and second metallic sheets such that the metallic sheets are maintained at a desired distance; walls defining a coaxial transmission channel; and a coaxial transmission core disposed within the channel.

Abstract: A rigid radio frequency (RF) coaxial transmission line to be positioned within a wellbore in a subterranean formation may include a series of rigid coaxial sections coupled together in end-to-end relation. Each rigid coaxial section may include an inner conductor, a rigid outer conductor surrounding the inner conductor, and a dielectric therebetween. Each of the rigid outer conductors may include a rigid outer layer having opposing threaded ends defining overlapping mechanical threaded joints with adjacent rigid outer layers. Each of the rigid outer conductors may also include an electrically conductive inner layer coupled to the rigid outer layer and having opposing ends defining electrical joints with adjacent electrically conductive inner layers.

Abstract: A coaxial conductor structure for the interference-free transmission of a propagable TEM mode of an HF signal wave within at least one band of n frequency bands forming within a dispersion relation.

Abstract: A transmission line structure is disclosed. The structure includes at least one signal transmission line and a pair of ground transmission lines embedded in a first level of a dielectric layer on a substrate, wherein the pair of ground transmission lines are on both sides of the signal transmission line. A first ground layer is embedded in a second level lower than the first level of the dielectric layer and a second ground layer is embedded in a third level higher than the first level of the dielectric layer. First and second pairs of via connectors are embedded in the dielectric layer, wherein the first pair of via connectors electrically connects the pair of ground transmission lines to the first ground layer and the second pair of via connectors electrically connects the pair of ground transmission lines to the second ground layer.

Abstract: An integrated circuit structure includes an interconnect structure over a semiconductor substrate and a coaxial transmission line. The coaxial transmission line includes a signal line, a top plate over the signal line and electrically insulated from the signal line, and a bottom plate under the signal line and electrically insulated from the signal line. At least one of the top plate and the bottom plate includes metal strip shields and dielectric strips, with each of the dielectric strips being between two of the metal strip shields. The integrated circuit structure further includes a ground conductor electrically connecting the top plate and the bottom plate. The ground conductor is insulated from the signal line by a dielectric material.

Abstract: An apparatus for reducing a radiation power and an electric field includes a transmission end energy transfer unit configured to include a feeding roof and a transmission coil, a receiving end energy transfer unit configured to be symmetrically separated from the transmission end energy transfer unit at a predetermined distance, and to include a receiving roof and a receiving coil, a first electric field shield configured to be made of a nonconductor, to have a shape surrounding the transmission end energy transfer unit, and to have an empty space of a predetermined first thickness; and a second electric field shield to be made of a nonconductor, to have a shape surrounding the receiving end energy transfer unit, and to have an empty space of a predetermined second thickness, wherein the empty spaces are filled with a dielectric material for shielding the electric field.

Abstract: A semiconductor device having a GaAsFET and input and output matching circuits connected to the FET is provided. In the semiconductor device, a line, including a wire connection portion connected to the input or output matching circuit and a lead connection portion connected to an input or output lead which is connected to an external circuit, is formed in such a manner that a line width at the wire connection portion is wider than that at the lead connection portion. With the semiconductor device, the number of wires connecting the input or output matching circuits with the wire connection portion can be increased.

Abstract: Provided is a signal transmission circuit capable of realizing the same effects as those in a conventional manner that employs a complicated circuit by using no complicated circuit, that is, by a simple circuit. The signal transmission circuit includes: a transmission path having a first impedance; a terminating resistor having a predetermined resistance; a transmission path having a second impedance, which is connected to the transmission path and the terminating resistor, the second impedance being higher than both of the first impedance and the predetermined resistance; and an input buffer for receiving a signal at a connection portion of the transmission path and the transmission path.

Abstract: A pseudo-Marchand balun, compound balun and tunable multi-resonant coaxial balun, and NMR probes employing each such balun, and a fine balance and impedance adjustment module and a multi-layer transmission line for use in such NMR probes.

Abstract: An apparatus may include one or more conductive surfaces, waveguide structures and/or ports. One or more waveguide structures may include a portion disposed above a conductive surface, an outer conductor, and/or an inner conductor. A first portion of an outer conductor may be connected to a conductive surface. A port end of an outer conductor may be connected to an outer conductor port. An inner conductor may be disposed inside and spaced apart from an outer conductor. An inner conductor port may be connected to an inner conductor. An inner conductor of two or more waveguide structures may be connected to each other. A conductive surface may include at least one aperture portion, which may have a width substantially similar to the width of a waveguide structure. A substrate may be disposed between one or more waveguide structures and a conductive surface for a substantial portion of a waveguide structure.

Abstract: A system is provided for three dimensional coaxial transmission of signals in a micro-machined component, the system having, a micro-machined component matrix with a first metallic sheet having a plurality of first access holes disposed therein; a second metallic sheet having a plurality of second access holes disposed therein; a plurality of metal posts disposed between the first and second metallic sheets such that the metallic sheets are maintained at a desired distance; walls defining a coaxial transmission channel; and a coaxial transmission core disposed within the channel.

Abstract: A communication device consistent with certain implementations has a coaxial cable having length and first and second ends. The coaxial cable further has a central conductor, a dielectric insulator surrounding the central conductor, and an electric shield conductor surrounding the dielectric insulator. The dielectric insulator serves as a dielectric waveguide having a characteristic impedance Z at an operating frequency range. A termination for electrical energy coupled into or out of the dielectric insulator at approximately the characteristic impedance Z at the operating frequency range to utilize the dielectric insulator as a waveguide for transmission of signals along the length of the coaxial cable, and wherein the center conductor is further used to communicate an electrical signal between the first and second ends. This abstract is not to be considered limiting, since other embodiments may deviate from the features described in this abstract.

Abstract: A high-frequency line structure includes a multi-layered resin substrate in which insulating layers of a resin are laminated. A high-frequency-signal input part is arranged on the resin substrate to input a high-frequency signal and supply the high-frequency signal to the resin substrate. A high-frequency-signal output part is arranged in the resin substrate to receive the high-frequency signal from the input part and output the received high-frequency signal. A first metal layer is arranged to encircle the input and output pads and electrically insulated from the input and output parts. A second metal layer is arranged on the resin substrate. A plurality of penetration vias are arranged in the resin substrate to encircle the input part and the output part, and each penetration via being connected to the first and second metal layers.

Abstract: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).

Abstract: A fixed or tunable resonator. The resonator includes an inner conductor, a hollow outer conductor, and a hollow insulating layer. The hollow outer conductor forms a first inner space. The hollow insulating layer is formed from an outer soft dielectric layer, an inner soft dielectric layer, and a ceramic layer disposed between the soft dielectric layers. The hollow insulating layer includes a second inner space formed by the inner soft dielectric layer. The inner conductor is disposed within the second inner space of the hollow insulating layer, and the hollow insulating layer is disposed within the first inner space of the hollow outer conductor.

Abstract: A communication device consistent with certain implementations has a coaxial cable having length and first and second ends. The coaxial cable further has a central conductor, a dielectric insulator surrounding the central conductor, and an electric shield conductor surrounding the dielectric insulator. The dielectric insulator serves as a dielectric waveguide having a characteristic impedance Z at an operating frequency range. A termination for electrical energy coupled into or out of the dielectric insulator at approximately the characteristic impedance Z at the operating frequency range to utilize the dielectric insulator as a waveguide for transmission of signals along the length of the coaxial cable, and wherein the center conductor is further used to communicate an electrical signal between the first and second ends. This abstract is not to be considered limiting, since other embodiments may deviate from the features described in this abstract.

Abstract: The invention is an electromagnetic wave or “EM” coupler for successfully connecting EM waves between an EM generator output and a conductive pathway or “c-pathway” that is not normally considered as an EM transmission medium or line. The coupler includes a dual surface shell-like structure with an electrically conductive outer surface that is insulated from an electrically conductive inner surface that is attached at a specified location along a c-pathway. The forward end of the inside surface of the coupler is attached to the c-pathway while the outside surface of the forward end of the coupler is left unconnected and open. To provide a successful EM connection between the coupler and the c-pathway, the physical size of the coupler is configured as a physically shaped component with a relationship to the c-pathway itself rather than to the particular EM wave required to make such connectivity.

Abstract: Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.

Abstract: Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.