Abstract: A magnetic field detection apparatus includes a magnetoresistive effect element and a conductor. The magnetoresistive effect element includes a magnetoresistive effect film extending in a first axis direction and including a first end part, a second end part, and an intermediate part between the first and second end parts. The conductor includes a first part and a second part that each extend in a second axis direction inclined with respect to the first axis direction. The conductor is configured to be supplied with a current and thereby configured to generate an induction magnetic field to be applied to the magnetoresistive effect film in a third axis direction orthogonal to the second axis direction. The first part and the second part respectively overlap the first end part and the second end part in a fourth axis direction orthogonal to both of the second axis direction and the third axis direction.

Abstract: A distributed power harvesting system including multiple direct current (DC) power sources with respective DC outputs adapted for interconnection into an interconnected DC power source output. A converter includes input terminals adapted for coupling to the interconnected DC power source output. A circuit loop sets the voltage and current at the input terminals of the converter according to predetermined criteria. A power conversion portion converts the power received at the input terminals to an output power at the output terminals. A power supplier is coupled to the output terminals. The power supplier includes a control part for maintaining the input to the power supplier at a predetermined value. The control part maintains the input voltage and/or input current to the power supplier at a predetermined value.

Abstract: An electronic component includes an element body including two end surfaces opposite to each other and a bottom surface connected between the two end surfaces. A coil is provided in the element body and an external electrode is provided in the element body. In a first cross-section intersecting with the two end surfaces and the bottom surface of the element body, the external electrode has a first portion extending along a first surface that is one of the end surface and the bottom surface of the element body. The coil is disposed such that an outer circumferential edge of the coil faces the first surface of the element body. A shortest distance between the outer circumferential edge of the coil and the first surface of the element body is smaller than a minimum width of the first portion in a direction orthogonal to the first surface.

Abstract: A multilayer coil component includes an insulator portion, a coil in the insulator portion and including coil conductor layers electrically connected together, and an outer electrode on a surface of the insulator portion and electrically connected to the coil. The multilayer coil component has a void at a boundary between one main surface of each coil conductor layer and the insulator portion. At least one of the coil conductor layers includes extended and winding portions, and is connected to the electrode via the extended portion. Viewing the multilayer coil component in plan view in a stacking direction, an end of the void at the extended portion facing the electrode to which the extended portion is connected is closer to the electrode than is an end, facing the electrode, of the void at the coil conductor layer to which the extended portion is adjacent in the stacking direction.

Abstract: A rate of change of current sensor includes two measurement coils, arranged such that the turns of the first and second measurement coils are interleaved. The rate of change of current sensor further comprises two return coils, arranged to progress in an opposite direction to the measurement coils. The coils form loops and progress substantially around a target measurement conductor. This ensures that the two measurement coils both receive the same electrostatic coupling from external conductors which are not the target of the measurement operation. Further, the two measurement coils are arranged such that the first coil and the second coil are, on average, the same distance to the current-carrying conductor of interest.

Abstract: A coil component includes an insulator part and a coil part. The insulator part is constituted by an electrical insulation material, and is no more than 600 ?m long and no more than 600 ?m high. The coil part is wound around one axis and placed inside the insulator part. The coil part has an opening part constituted by straight line parts and curved line parts and whose shape as viewed from the one axis direction is an approximate quadrangle, wherein the line length of the curved line parts along the inner periphery of the opening part is 20% or more but no more than 40% of the line length of the inner periphery of the opening part. The coil component can satisfy both a size reduction need and the properties need.

Abstract: A coil component includes an element and a coil disposed in the element. The element includes a plurality of first magnetic layers and second magnetic layers laminated. The coil includes a plurality of coil conductive layers laminated. Each of the coil conductive layers is disposed between a corresponding one of the first magnetic layers and a corresponding one of the second magnetic layers. A pore area proportion in the second magnetic layers is smaller than a pore area proportion in the first magnetic layers. A void is present between the coil conductive layer and the corresponding one of the second magnetic layers.

Abstract: A manufacturing method of a coil component includes: providing an assembly including a wound-wire part formed by winding, around a core, a conductive wire coated with a coating; and a lead part pulled out outwardly from the wound-wire; removing a portion of the coating from the conductive wire at a location outwardly extending away from the wound-wire part, wherein an entire coating over an entire circumference of the conductive wire at the portion of the coating is removed; providing a terminal electrode with a connecting part; forming a joining part at an end of the coating-removed lead conductive wire to electrically connect the terminal electrode to the lead part via the joining part by irradiating a laser from the connecting part toward the coating-removed lead conductive wire while restricting an irradiation range of the laser within a range where the coated lead conductive wire is not included.

Abstract: To improve the accuracy in the use of inductive components, the invention provides a method for producing a planar coil assembly (32) comprising n planar coil units (10) arranged on top of the other, wherein n is a natural number greater than 1, the method comprising: a) creating an i-th planar coil unit (10) by producing, with the aid of a computer, at least one planar coil (12) made of an electric conductor and having a planar coil thickness diPS on an insulating material layer (14) made of electric insulating material having a layer thickness di,IM, for i equal to 1 to n, and b) arranging the planar coil units (10) in layers, with the interposition of the insulating material layer (14) between the planar coils (12), wherein the thicknesses di,PS and di,IM, are selected such that 0 , 6 ? D PS D IM + D PS ? 0 , 9 , applies.

Abstract: A transformer comprising a primary winding and a secondary winding. The primary winding has N2 number turns and having a first terminal and a second terminal. The secondary winding has having N1 fractional portions, which together form a full turn, are in close proximity to the primary winding to establish coupling between the primary winding and the N1 fractional coil portions, the transformer turn ratio from the primary winding to the secondary winding is N2:(N3/N1) where N2 is an integer equal to or greater than 1, N1 is an integer greater than or equal to 2, and N3 is an integer greater than or equal to 1. Also disclosed is a stacked integrated transformer having a primary winding and secondary winding of which one or both have a waterfall structure and a portion of which functions as a ground connected shield between the secondary winding and the primary winding.

Abstract: A coil device includes: a drum core having first and second flange portions and a winding core portion therebetween; a coil wound around the core portion; a plate core connected to first and second flange portions first and second flange surfaces at a first direction side; a first electrode terminal on the first flange portion, one coil end portion electrically connected on the first electrode terminal; and a second electrode terminal on the second flange portion, the other coil end portion electrically connected on the second electrode terminal. The plate core has a first and second projecting portions respectively protruding toward the first and second flange surfaces and having first and second flat surfaces facing the first and second flange surfaces. The drum core and the plate core are connected by abutting and bonding the first and second flange surfaces against the first and second flat surfaces.

Abstract: An apparatus includes a laminate, the laminate including a dielectric layer having a first surface and a second surface opposed to the first surface, and a conductive layer forming a circuit element overlying the first surface of the dielectric layer. The apparatus further includes a magnetic layer over the conductive layer. A first edge surface of the magnetic layer is coplanar with a first edge surface of the laminate, and a second edge surface of the magnetic layer is coplanar with a second edge surface of the laminate.

Abstract: An inductor component includes an element body including a magnetic layer containing a resin and a magnetic powder; a coil wiring line arranged inside the element body; and an insulating coating film covering the coil wiring line and not including a magnetic material. In a cross section perpendicular to an extension direction of the coil wiring line, a top surface thickness of a part of the insulating coating film covering the top surface of the coil wiring line and a side surface thickness of parts of the insulating coating film covering side surfaces of the coil wiring line are less than or equal to 10 ?m, and a corner thickness of parts of the insulating coating film that cover corners of the coil wiring line interposed between the top surface and the side surfaces is at least half of the top surface thickness and/or the side surface thickness.

Abstract: A power module includes a power circuit and a magnetic assembly. The power circuit includes at least one switch element. The magnetic assembly includes at least one first electrical conductor and a magnetic core module comprising at least one hole, wherein the at least one first electrical conductor passes through the at least one hole, and a terminal of the at least one first electrical conductor is electrically connected to the at least one switch element. The power circuit and the magnetic assembly are arranged in sequence along a same direction.

Abstract: The coil electronic component includes: a body including a support member having a through-hole, an internal coil disposed on one or more of upper and lower surfaces of the support member, and an encapsulant encapsulating the support member and the internal coil; and external electrodes disposed on an external surface of the body and connected to the internal coil. The internal coil has coil patterns including an innermost and an outermost coil patterns. A portion of cross section of the innermost coil pattern has a different width than a remainder of the cross section of the innermost coil pattern.

Abstract: A common-mode choke coil includes a multilayer body, and first and second coils incorporated in the multilayer body. The multilayer body is a cuboid shape including plural stacked non-conductor layers. The first coil includes a first coil conductor. The second coil includes a second coil conductor. With the common-mode choke coil, in a frequency region greater than or equal to 0.1 GHz and less than or equal to 100 GHz (i.e., from 0.1 GHz to 100 GHz), the Sdd21 transmission characteristic is less than or equal to ?3 dB at or above 30 GHz, and in a frequency region greater than or equal to 10 GHz and less than or equal to 60 GHz (i.e., from 10 GHz to 60 GHz), the Scc21 transmission characteristic is minimum at or above 20 GHz, and the Scc21 transmission characteristic has a minimum value of less than or equal to ?20 dB.

Abstract: An inductor includes: a first conductor layer including: a pair of first metal pieces; and a first conductor, wherein the first conductor is wound in a spiral shape in the same plane; a second conductor layer including: a pair of second metal pieces, wherein each of the pair of second metal pieces is bonded to a corresponding one of the pair of first metal pieces; and a second conductor, wherein the second conductor is wound in a spiral shape in the same plane, and the second conductor includes an inner circumferential side end portion bonded to an inner circumferential side end portion of the first conductor; a pair of electrodes each of which is bonded to a corresponding one of the pair of second metal pieces; and a sealing resin that covers the first conductor layer, the second conductor layer and the pair of electrodes.

Abstract: An inductor device includes a first and a second inductor and a first and a second connection member. A first and a second trace of the first inductor is located on a first and a second layer respectively. The second trace is coupled to the first trace located at a first and a second area. The first connection member is coupled to the second trace. A third and a fourth trace of the second inductor is located on the first and the second layer respectively. The first trace and the third trace are disposed in turn at the first area and the second area. The fourth trace is coupled to the third trace located at the first and the second area. The second and the fourth trace are disposed in turn at the first and the second area. The second connection member is coupled to the fourth trace.

Abstract: A method for manufacturing a coil component having a coil part with a flat-shaped connection end parts, includes step of physically and electrically connecting ends of the coil part and terminal electrodes, respectively, by thermocompression bonding wherein the ends of the coil part are heated and compressed, thereby deforming the ends of the coil part into the flat-shaped connection end parts and bonding the flat-shaped connection end parts to the terminal electrodes, respectively.

Abstract: A coil device includes: a core including a winding core part and a flange part at an axial end part of the winding core part, a coil part including a first wire and a second wire wound around the winding core part, a first terminal electrode, formed on a flange part mounting surface and a lead-out part of the first wire is connected, and a second terminal electrode, formed on the mounting surface of the flange part spaced apart from the first terminal electrode and a lead-out part of the second wire is connected, in which the flange part includes a concave part, recessed from the upper surface of the flange part and from an outer end surface of the flange part in order to have bottoms. The coil device is easy to connect a wire and has excellent bonding strength even when the connecting part becomes the mounting surface.

Abstract: A motor drive device includes: a first inverter including a plurality of first switching elements and connected to a plurality of coils; a second inverter including a plurality of second switching elements and connected to the plurality of coils; a plurality of transfer switching elements connected to the second ends; a capacitor disposed at one side of a casing of a motor; first and second cooling channels disposed at both sides of the capacitor; a plurality of first power modules including some of the plurality of first switching elements and some of the transfer switching elements; and a plurality of second power modules including some of the plurality of second switching elements.

Abstract: An inductive device may be provided, including a first winding layer, a second winding layer arranged over the first winding layer and connected to the first winding layer to form a plurality of turns around a first axis, and a magnetic core arranged vertically between the first winding layer and the second winding layer. The magnetic core may include a portion entirely over the first winding layer and entirely under the second winding layer, where this portion may include a magnetic segment and a non-magnetic segment arranged laterally adjacent to each other along the first axis.

Abstract: A coil electronic component includes a support substrate, a coil pattern disposed on the support substrate, an encapsulant encapsulating at least portions of the support substrate and the coil pattern, and external electrodes disposed externally on the encapsulant and connected to the coil pattern. The coil pattern includes a seed layer having a thickness of 1.5 ?m or less and a plating layer disposed on the seed layer.

Abstract: A coil, such as, by way of example, an inductance communication coil, that includes a conductor including a first portion extending in a first level and a second portion extending in a second level, wherein the conductor includes a third portion located on a different level than that of the second portion, wherein an electrical path of the conductor is such that the second portion is located between the first portion and the third portion.

Abstract: A method of making a slow wave inductive structure includes depositing a first dielectric layer over a first substrate. The method further includes forming a first conductive winding in the first dielectric layer. The method further includes bonding a second substrate to the first dielectric layer, wherein the second substrate is physically separated from the first conductive winding, and the second substrate has a thickness ranging from about 50 nanometers (nm) to about 150 nm. The method further includes depositing a second dielectric layer over the second substrate. The method further includes forming a second conductive winding in the second dielectric layer, wherein the second substrate is physically separated from the second conductive winding.

Abstract: Systems, methods, and devices are provided for producing and using a low-value inductor which is stable at high frequencies, the inductor including a plurality of radial spokes extending between two concentric rings. The inductance of the inductor is controlled by the number and dimensions of the plurality of spokes, as well as the materials of the inductor. In some cases, the inductor is used as a low value inductance standard for directly measuring a low value electrical inductance.

Abstract: A surface mount inductor includes a coil including a wound portion and a feeder end portion drawn out from the wound portion, a compact that contains a magnetic powder and that encapsulates the coil, and an external terminal disposed on the compact and connected to the coil. The compact has surfaces including two pressed surfaces, opposing each other in a direction of an axis of the wound portion and formed by being pressed in the direction of the axis, and a non-pressed surface, adjacent to the two surfaces and not pressed. The coil is disposed so that the axis of the wound portion is parallel to a mount surface of the compact. The mount surface is included in the non-pressed surface, the feeder end portion is exposed from the mount surface, and the external terminal is formed on only the non-pressed surface and connected to the feeder end portion.

Abstract: A multilayer substrate includes first and second insulating layers stacked in a stacking direction with the second insulating layer located at a first side of the first insulating layer in the stacking direction, a first coil pattern disposed on a first principal surface of the first insulating layer on the first side of the first insulating layer in the stacking direction, and a second coil pattern disposed on a first principal surface of the second insulating layer on the first side of the second insulating layer in the stacking direction. The first and second coil patterns have spiral shapes. When viewed from the layer stacking direction, at least a portion of a first area in which the first coil pattern is disposed and at least a portion of a second area in which the second coil pattern is disposed overlap each other.

Abstract: A coil component includes a drum core including a winding core portion extending in a first direction and a pair of flange portions provided at both ends of the winding core portion. At least one flange of the pair of flange portions has at least one step or gradient portion. A terminal electrode is provided on the step or gradient portion, and a wire is wound around the winding core portion with an end bonded to the terminal electrode. The terminal electrode includes plural metal layers, an outermost layer of which is an Sn film having a flattened mounting surface. The flattened mounting surface overlaps the step or gradient portion when seen in a second direction perpendicular to the first direction.

Abstract: A coil component includes a body having one surface, and one end surface and the other end surface, respectively connected to the one surface and opposing each other, a support substrate embedded in the body, and a coil portion disposed on the support substrate and including first and second lead-out patterns respectively exposed from surfaces of the body. The first lead-out pattern is exposed from the one surface of the body and the one end surface of the body. The second lead-out pattern is exposed from the one surface of the body and the other end surface of the body. The body includes an anchor portion disposed in each of the first and second lead-out patterns.

Abstract: A power conversion device includes a multilayer board including conductive layers that form a primary-side coil and a secondary-side coil of a transformer; and a circuit board electrically connected to the multilayer board, having a first conversion circuit formed therein or thereon. The multilayer board includes a transformer region in which the transformer is formed; a core member disposed in the transformer region and around the primary-side coil and secondary-side coil are wound; a circuit formed region which is adjacent to the transformer region and a second conversion circuit is formed, the second conversion circuit being electrically connected to the primary-side coil or the secondary-side coil; and a terminal portion which is electrically connected to the secondary-side coil or the primary-side coil. The first conversion circuit is electrically connected to the transformer via the terminal portion. One of the coils has a smaller number of turns than the other coil.

Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at a pair of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. A mark portion is provided on one of the board main surfaces.

Abstract: An electronic component according to an aspect of the present disclosure includes an element body and a terminal electrode. The element body includes an outer surface provided with a depression. The terminal electrode is disposed on the element body. The terminal electrode includes a first electrode portion and a second electrode portion. The first electrode portion is disposed in the depression. The second electrode portion protrudes from the depression. The second electrode portion is thicker than the first electrode portion.

Abstract: An inductor includes an external terminal and an element body that includes a magnetic portion containing a magnetic powder and a coil embedded in the magnetic portion. The magnetic powder has a particle size D50 at 50% of the cumulative volume of 5 ?m or less, a D90/D10 of 19 or lower, and a Vickers hardness of 1000 (kgf/mm2) or lower, the D90/D10 being the ratio of particle size D90 at 90% of the cumulative volume to particle size D10 at 10% of the cumulative volume in the cumulative particle size distribution by volume. In the magnetic portion, the packing density of the magnetic powder by volume is 60% or higher.

Abstract: An inductor component comprising an element body; a helically wound coil disposed in the element body; and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a plurality of insulating layers and a mark layer constituting a portion of an outer surface of the element body, and a K abundance ratio (atom %) in the mark layer is higher than a K abundance ratio (atom %) in the insulating layers.

Abstract: An inductor device includes an 8-shaped inductor structure, a first spiral wire, a first connector, a second connector, and a first interlaced component. The 8-shaped inductor structure includes two first-wires and two second-wires. The first spiral wire is disposed on an inner side of the two first-wires. The first connector is coupled to one of the two first-wires and one of the two second-wires. The second connector is coupled to another one of the two first-wires. The first interlaced component is coupled to the first spiral wire and another one of the two second-wires, and the first interlaced component is coupled to the first connector and the second connector in an interlaced manner respectively.

Abstract: A sensor package can include a substrate including a plurality of layers. The plurality of layers can include a first pair of layers and a second pair of layers different from the first pair of layers. The substrate can have a first side and a second side opposite the first side. The sensor package can include a transducer coupled to the second side of the substrate. The sensor package can include an inductor electrically coupled to the transducer. The inductor can be configured as a single layer trace on an inductor layer within the substrate and disposed between the first pair of layers within the substrate. The first pair of layers can be more distal from the second side of the substrate than the second pair of layers.

Abstract: An integrated inductor is provided. The integrated inductor includes a first winding and a second winding, and has a first end, a second end, and a node. The first winding utilizes the first end and the node as two ends thereof and includes a first coil and a second coil, which do not overlap. The second winding utilizes the second end and the node as two ends thereof and includes a third coil and a fourth coil, which do not overlap. The first coil and the third coil have an overlapping area, and the second coil and the fourth coil have an overlapping area. The first coil is surrounded by the third coil, and the fourth coil is surrounded by the second coil.

Abstract: A system may include a first semiconductor substrate having a first side and a second side opposite the first side. The system may further include multiple device layers positioned on the first side of the substrate. The system may also include a first portion of an antenna structure positioned within at least one of the multiple device layers. The system may include a second portion of the antenna structure positioned over the second side of the substrate. The system may further include a via passing through the substrate and electrically coupling the first portion of the antenna structure to the second portion of the antenna structure.

Abstract: A wire bonding method for connecting a wire to two different surfaces by bonding with a single wire bonding step. The wire bonding method includes: bonding one end of a wire fed from a distal end of a capillary to a first bonding surface; moving the capillary in the Z direction; moving the capillary the X and/or Y direction; moving the capillary in the X, Y, and/or Z direction, a plurality of times; moving the capillary to a highest position; and bonding another end of the wire to the second bonding surface. The wire bonding method includes, at any timing, rotating the first bonding surface about a rotation axis to move the second bonding surface to a position capable of bonding. An angle formed by the first bonding surface and the second bonding surface on a side where the wire is stretched is 200° or more.

Abstract: A coil component in which stress is relieved and a coil is stably positioned is to be provided. A coil component of the present disclosure includes a base body; and a coil provided in the base body. The base body includes a plurality of laminated magnetic layers. The coil includes a plurality of laminated coil wirings. The magnetic layers and the coil wirings are alternately laminated. A gap portion is provided between each of the magnetic layers and each of the coil wirings. Part of the coil wirings contacts the magnetic layers, and a region containing a metal oxide is present on part of a surface of each of the coil wirings on a side of the gap portion.

Abstract: An inductor device includes a first wire, a second wire, at least one first connector, at least one second connector, and a first center-tapped terminal. The first wire includes a plurality of first sub-wires. The second wire includes a plurality of second sub-wires. The first sub-wires and the second sub-wires are disposed in an interlaced manner. The at least one first connector couples the first sub-wire that is disposed on an outer side and the first sub-wire that is disposed on an inner side in the first sub-wires. The at least one second connector couples the second sub-wire that is disposed on the outer side and the second sub-wire that is disposed on the inner side in the second sub-wires. The first center-tapped terminal is coupled to the first sub-wire that is disposed on the outer side in the first sub-wires.

Abstract: A coil element according to one embodiment of the present invention has a rectangular parallelepiped shape and has a principal surface including long sides and short sides. The coil element includes a drum core, a winding wound around the drum core, a first external electrode, a second external, and a covering portion covering at least a part of the winding core. The drum core in the embodiment includes a first flange, a second flange, and a winding core connecting between the first flange and the second flange. The winding core extends along the short sides of the principal surface. In one embodiment, the coil element has a height less than 0.85 mm.

Abstract: A highly reliable multilayer coil component in which the internal stress is further alleviated, and a method for producing the same. The method produces a multilayer coil component that includes an insulator portion, a coil that is embedded in the insulator portion and includes a plurality of coil conductor layers electrically connected to one another, and an outer electrode that is disposed on a surface of the insulator portion and is electrically connected to an extended portion of the coil. The method includes forming a conductive paste layer by using a conductive paste; forming an insulating paste layer by using an insulating paste; forming a multilayer compact that includes the conductive paste layer and the insulating paste layer; and firing the multilayer compact, in which the conductive paste has a PVC of 60% or more and 80% or less (i.e., from 60% to 80%).

Abstract: A common-mode choke coil includes a multilayer body, and first and second coils incorporated in the multilayer body. The multilayer body is a cuboid shape including plural stacked non-conductor layers. The first coil includes a first coil conductor. The second coil includes a second coil conductor. With the common-mode choke coil, in a frequency region greater than or equal to 0.1 GHz and less than or equal to 100 GHz (i.e., from 0.1 GHz to 100 GHz), the Sdd21 transmission characteristic is less than or equal to ?3 dB at or above 30 GHz, and in a frequency region greater than or equal to 10 GHz and less than or equal to 60 GHz (i.e., from 10 GHz to 60 GHz), the Scc21 transmission characteristic is minimum at or above 20 GHz, and the Scc21 transmission characteristic has a minimum value of less than or equal to ?20 dB.

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

Abstract: An inductor built-in substrate includes a core substrate having an opening and a first through hole, a first plating film formed in the first through hole of the core substrate, a magnetic resin body having a second through hole and including a magnetic resin filled in the opening of the core substrate, and a second plating film formed in the second through hole of the magnetic resin body such that the second plating film is formed in contact with the magnetic resin body.

Abstract: A surface mount inductor includes a molded body made of a composite material containing magnetic powder, and a metal plate including a first metal plate portion embedded in the molded body and a second metal plate portion extending from the first metal plate portion to an outside of the molded body. The second metal plate portion is extended from a side surface or mounting surface side of the molded body, is arranged along the molded body with a bent portion, and forms an external terminal arranged at least on the mounting surface side of the molded body. The external terminal includes a plating layer on a surface on an opposite side from a surface facing the molded body, and does not include a plating layer on the surface facing the molded body.

Abstract: A component carrier includes a base material stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and a magnet stack with a plurality of magnetic layers and at least one bonding layer, each of the at least one bonding layer bonding two respectively neighboured magnetic layers, wherein the magnet stack is embedded in the base material stack.

Abstract: A laminated electronic component having a coil formed in the laminated body of pluralities of laminated magnetic material layers and conductor patterns by electrically connecting the conductor patterns adjacent to each other via the magnetic material layers. The magnetic material layers contain a metal magnetic material. The coil has a first end portion close to a bottom surface of the laminated body and a second end portion distant from the bottom surface of the laminated body. The first end portion is electrically connected to a first external terminal disposed on the bottom surface of the laminated body. The second end portion is electrically connected to a second external terminal disposed on the bottom surface of the laminated body via an electrode disposed on a side surface of the laminated body. The electrode is covered with an insulator film.