Abstract: Memory devices are disclosed. A memory device may include a bonding pad region for coupling command-and-address (CA) input signals and a memory cell region for storing information in memory cells. The memory device may also include a centralized CA interface region including input circuits coupled to the CA input signals. At least two of the input circuits are configured in pairs. Each pair includes a swap circuit configured to select one of a first CA output and a second CA output for a first internal CA signal and select the other of the first CA output and the second CA output for a second internal CA signal responsive to a control signal. Memory systems and systems are also disclosed.

Abstract: Memories might include an array of memory cells including a string of series-connected split-gate memory cells, and a controller configured to cause the memory to selectively activate a first memory cell portion of a selected split-gate memory cell of the string of series-connected split-gate memory cells in response to a data state of the first memory cell portion of the selected split-gate memory cell and deactivate a second memory cell portion of the selected split-gate memory cell, and activate a second memory cell portion of each remaining split-gate memory cell of the string of series-connected split-gate memory cells while selectively activating the first memory cell portion of the selected split-gate memory cell and deactivating the second memory cell portion of the selected split-gate memory cell.

Abstract: An embodiment of the invention may include a semiconductor structure, method of use and method of manufacture. The structure may include a heating element located underneath a temperature-controlled portion of the device. A method of operating the semiconductor device may include providing current to a thin film heater located beneath a temperature-controlled region of the semiconductor device. The method may include performing temperature dependent operations in the temperature-controlled region.

Abstract: The present disclosure provides a memory controller including a state detector detecting whether the memory device is in an idle state, a program controller, based on detection information that indicates a state of the memory device, selecting neighboring strings that are adjacent to a string that is coupled to a memory cell, among the memory cells, on which a program operation or a read operation was performed before the detecting, selecting monitoring memory cells that are coupled to at least one word line, the memory cells being a part of the neighboring strings, and controlling the memory device to perform a plurality of loops to program the monitoring memory cells, and a bad block selector selecting a memory block with the monitoring memory cells as a bad block based on a rate of increase in threshold voltage of a threshold voltage distribution of the monitoring memory cells.

Abstract: A negative voltage switching device includes a first switching circuit configured to transmit a first negative voltage, a second switching circuit configured to transmit a second negative voltage, and a switching selection circuit configured to select one of the first switching circuit or the second switching circuit for transmitting one of the first negative voltage and the second negative voltage to an output terminal.

Abstract: According to one embodiment, a semiconductor storage device includes a first memory string including a first memory transistor, a first word line connected to a gate electrode of the first memory transistor, a source line connected to one end of the memory string, and a first connection transistor connected between the first word line and the source line.

Abstract: For a non-volatile memory that uses hard bit and soft bit data in error correction operations, to reduce the amount of soft bit data that needs to be transferred from a memory to the controller and improve memory system performance, the soft bit data can be compressed before transfer. After the soft bit data is read and stored into the internal data latches associated with the sense amplifiers, it is compressed within these internal data latches. The compressed soft bit data can then be transferred to the transfer data latches of a cache buffer, where the compressed soft bit data can be consolidated and transferred out over an input-output interface. Within the input-output interface, the compressed data can be reshuffled to put into logical user data order if needed.

Abstract: Apparatus, methods, media and systems for multiple sets of trim parameters are described. A non-volatile memory device may comprise a first register, a second register, a multiplexer, a first set of I/O lines, each coupled to the first register and the multiplexer, each associated with a particular trim set among multiple trim sets stored in the first register, one or more second I/O lines, each coupled to the second register and the multiplexer. The multiplexer is configured to receive a control signal. The multiplexer is configured to output, based on the control signal, a particular trim set among the multiple trim sets to the second register using the one or more second I/O lines.

Abstract: [Problem] To provide a semiconductor storage device capable of reducing the load on a controller. [Solution] According to one embodiment, a semiconductor storage device 2 includes a memory cell array 110 including a plurality of memory cell transistors MT, a plurality of word lines WL connected to gates of the respective memory cell arrays 110, a voltage generation circuit 43 generating a voltage applied to each of the word lines WL, and a sequencer 41 controlling an operation of the memory cell array 110. The sequencer 41 repeats a loop including a program operation and a verify operation multiple times in a write operation. The sequencer 41 controls an operation of the voltage generation circuit 43 so that a rate increase in a voltage applied to a non-selected word line in the verify operation of a last loop is smaller than the rate increase in the voltage applied to the non-selected word line in the verify operation of a first loop.

Abstract: Provided are memory devices and memory systems. The memory device includes a memory cell array in a first semiconductor layer and including word lines stacked in a first direction, and channel structures passing through the word lines in the first direction; a control logic circuit in a second semiconductor layer located below the first semiconductor layer in the first direction; and a physical unclonable function (PUF) circuit including a plurality of through electrodes passing through the first semiconductor layer and the second semiconductor layer, and configured to generate PUF data according to resistance values of the plurality of through electrodes, and generate the PUF data based on a node voltage between through electrodes connected in series, among the plurality of through electrodes.

Abstract: A semiconductor storage device includes a first word line, a second word line provided in the same layer with the first word line and configured to be controlled independently from the first word line, a plurality of memory pillars between the first word line and the second word line, each of the plurality of memory pillars including a first memory cell facing to the first word line and a second memory cell facing to the second word line, the plurality of memory pillars being arranged in a first direction and a second direction intersecting to the first direction and a control circuit. The control circuit is configured to perform a write operation to the second memory cell included in the plurality of memory pillars after performing a write operation to the first memory cell included in each of the plurality of memory pillars.

Abstract: A program effective time (PET) for programming at least a portion of a plurality of memory cells based on one or more program step characteristics is determined. The determined PET and a target PET is compared. In response to the determined PET being different than the target PET, the one or more program step characteristics is adjusted to adjust the determined PET to the target PET.

Abstract: The present technology relates to an electronic device. A memory device according to the present technology includes a plurality of memory cells connected to a word line, an operation controller configured to apply a first or a second read voltage to the word line and to obtain data that is stored in the plurality of memory cells through bit lines that are respectively connected to the plurality of memory cells, and a read voltage controller configured to control the operation controller to read the data that is stored in the plurality of memory cells by using the second read voltage, and to read the data that is stored in the plurality of memory cells by using the first read voltage according to the number of off cells that are counted based on the data that is read by using the second read voltage, in response to a read command.

Abstract: A method for reading data stored in a flash memory. The flash memory comprises a plurality of memory cells and each memory cell has a particular threshold voltage. The method includes: obtaining a first threshold voltage distribution representing threshold voltages of a first group of the memory cells; obtaining a second threshold voltage distribution representing threshold voltages of a second group of the memory cells, wherein the second threshold voltage distribution is different from the first threshold voltage distribution, and the first group of the memory cells comprises at least a part of the second group of the memory cells; and controlling the flash memory to perform at least one read operation upon the first group of the memory cells according to the second threshold voltage distribution.

Abstract: The present disclosure relates to a non-volatile memory device and to a method for generating overvoltage values in such a memory device structured in a plurality of sub-arrays and including at least a decoding and sensing circuitry associated with each sub-array, a charge pump architecture for each sub-array including pump stages for increasing the value of an input voltage and obtaining an overvoltage output value, a control and JTAG interface in the memory device, and at least a registers block coupled to the charge pump architecture and driven by a logic circuit portion for receiving at least an activation signal selecting a specific charge pump architecture associated with a memory sub-array of the plurality of sub-arrays.

Abstract: A memory device includes a memory cell and a controller. The memory cell includes: (a) an array of molecule chains, at least one molecule chain includes: (i) first and second binding sites positioned at first and second ends of the molecule chain, respectively, and (ii) a chain of one or more fullerene derivatives, chemically connecting between the first and second binding sites, (b) source and drain electrodes, electrically connected to the first and second binding sites, respectively, and configured to apply to the array a source-drain voltage (VSD) along a first axis, and (c) a gate electrode, configured to apply to the array a gate voltage (VG) along a second different axis. The controller is configured to perform a data storage operation in the memory cell by (i) applying to the gate electrode a signal for producing the VG, and (ii) applying the VSD between the source and drain electrodes.

Abstract: The present disclosure includes apparatuses and methods related to selectable trim settings on a memory device. An example apparatus can store a number of sets of trim settings and select a particular set of trims settings of the number of sets of trim settings based on desired operational characteristics for the array of memory cells.

Abstract: A memory controller includes a read operation controller, an error correction circuit, and a read voltage controller. The read operation controller controls a memory device to read pieces of data from a selected page of the memory device by read voltages having different levels. The error correction circuit determines fail bit numbers of the pieces of data. The read voltage controller selects a reference voltage variation from among voltage variations included in a first read voltage table, based on an erase write cycle count of the memory device, and a reference fail bit number indicating a largest fail bit number of the fail bit numbers, and adjusts a level of each of the read voltages based on the reference voltage variation and a ratio value of a corresponding one of the fail bit numbers to the reference fail bit number.

Abstract: A data storage device stores data in non-volatile memory. In one approach, a method includes: storing software in a compressed format in a first mode (e.g., an SLC mode) in a non-volatile memory; exposing, while the software is stored in the first mode, the non-volatile memory to a temperature greater than a predetermined threshold; determining that the temperature of the non-volatile memory has fallen below the predetermined threshold; and in response to determining that the temperature of the non-volatile memory has fallen below the predetermined threshold: decompressing the stored software, and storing the decompressed software in a second mode (e.g., TLC mode) in the non-volatile memory. The second mode has a storage density higher than the first mode.

Abstract: An operating temperature of a memory sub-system is identified. It is determined whether the operating temperature satisfies a first temperature condition associated with a threshold temperature. Upon determining that the operating temperature satisfies the first temperature condition, one or more operations are performed on at least one data block at a memory component of the memory sub-system until the operating temperature changes to satisfy a second temperature condition associated with the threshold temperature. The one or more operations are selected to be performed based on a difference between the operating temperature and the threshold temperature.

Abstract: A control circuit connected to non-volatile memory cells applies a programming signal to a plurality of the non-volatile memory cells in order to program the plurality of the non-volatile memory cells to a set of data states. The control circuit performs program verification for the non-volatile memory cells, including applying bit line voltages during program verification based on word line position and data state being verified.

Abstract: According to one embodiment, a semiconductor memory device includes first and second memory cells, a first word line, first and second sense amplifiers, first and second bit lines, a controller. The first and second sense amplifiers each include first and second transistors. The first bit line is connected between the first memory cell and the first transistor. The second bit line is connected between the second memory cell and the second transistor. In the read operation, the controller is configured to apply a kick voltage to the first word line before applying the read voltage to the first word line, and to apply a first voltage to a gate of the first transistor and a second voltage to a gate of the second transistor while applying the kick voltage to the first word line.

Abstract: A memory device includes a plurality of pages arranged in columns, each page is constituted by a plurality of memory cells arranged in rows on a substrate, the memory cells included in the page are memory cells of a plurality of semiconductor base materials that stand on the substrate in a vertical direction or that extend in a horizontal direction along the substrate, voltages applied to a first gate conductor layer, a second gate conductor layer, a first impurity layer, and a second impurity layer in each memory cell are controlled to perform a page write operation of retaining, inside a channel semiconductor layer, a group of positive holes generated by an impact ionization phenomenon or by a gate-induced drain leakage current, the voltages applied to the first gate conductor layer, the second gate conductor layer, the first impurity layer, and the second impurity layer are controlled to perform a page erase operation of discharging the group of positive holes from inside the channel semiconductor layer, a

Abstract: A method of programming a nonvolatile memory device includes performing a single-pulse program operation in a program loop, determining whether a condition is satisfied in the a program loop, and performing a multi-pulse program operation in a next program loop when the condition is satisfied. The single-pulse program operation includes applying a first program pulse and applying plural verification pulses, the multi-pulse program operation includes applying a second program pulse, applying a third program pulse, and applying plural verification pulses, and each of the second program pulse and the third program pulse has a level lower than a level of the first program pulse.

Abstract: A table management method, a memory storage device and a memory control circuit unit are disclosed. The method includes: storing multiple table groups, wherein each of the table groups includes multiple voltage management tables; detecting a status of the memory storage device; determining one of the table groups as a target table group according to the status of the memory storage device, wherein the target table group includes multiple target voltage management tables; reading data from a rewritable non-volatile memory module by using at least one read voltage level according to at least one of the target voltage management tables.

Abstract: Embodiments of 3D memory devices and methods for forming the same are disclosed. In an example, a 3D memory device includes a substrate, a memory stack including interleaved conductive layers and dielectric layers above the substrate, and a channel structure extending vertically through the memory stack. The channel structure includes a high dielectric constant (high-k) dielectric layer disposed continuously along a sidewall of the channel structure, a memory film over the high-k dielectric layer along the sidewall of the channel structure, and a semiconductor channel over the memory film along the sidewall of the channel structure.

Abstract: A memory system reads data from non-volatile memory cells using a set of read compare voltages to determine which data state the memory cells are in, where each data state is associated with predetermined data values. The read compare voltages are determined dynamically based on a difference between memory cell current at time of programming and memory cell current at time of reading.

Abstract: A system includes a processing device and a memory device communicatively coupled to the processing device. The memory device can include a cyclic buffer partition portion and a snapshot partition portion coupled to the cyclic buffer partition portion via hold-up capacitors. The snapshot partition portion can further include a first sub-partition portion having a first programming characteristic and a second sub-partition portion having a second programming characteristic. The processing device can write received data sequentially to the cycle buffer partition portion and write, based at least in part on a determination that a trigger event has occurred, data from the cyclic buffer partition portion to the first sub-partition portion or the second sub-partition portion, or both.

Abstract: According to one embodiment, a memory system includes a semiconductor memory and a controller. The semiconductor memory includes first to fourth word lines and first to fourth memory cells. The controller is configured to issue first and second instructions. The controller is further configured to execute a first operation to obtain a first read voltage based on a threshold distribution of the first memory cell, and a second operation to read data from the second memory cell.

Abstract: A system includes a charge pump to charge wordlines of a memory array, a pump regulator coupled including a level detector, and dynamic clock logic coupled between the level detector and an oscillator. The logic provides clock signals to the charge pump and is to perform operations including causing the oscillator to output, to the charge pump during a first time period of a recovery period of the charge pump, a first clock signal having a lower frequency than output during a time period preceding the recovery period. The operations further include causing the oscillator to output, to the charge pump during a second time period of the recovery period that follows the first time period, a second clock signal having a higher frequency than output during the time period preceding the recovery period.

Abstract: A memory access operation performed on a first memory unit of a memory device is detected. A counter associated with the first memory unit is modified. It is determined that the counter satisfies a threshold criterion, wherein the threshold criterion is based on a random or pseudo-random number within a margin of an average number of memory access operations. A refresh operation is performed on a second memory unit.

Abstract: Memory devices might include an array of memory cells, a plurality of access lines, and control logic. The array of memory cells includes a plurality of strings of series-connected memory cells. Each access line of the plurality of access lines is connected to a control gate of a respective memory cell of each string of series-connected memory cells of the plurality of strings of series-connected memory cells. The control logic is configured to: open the array of memory cells for multiple read operations; read first page data from respective memory cells coupled to a selected access line of the plurality of access lines; read second page data from the respective memory cells coupled to the selected access line; and close the array of memory cells subsequent to reading the first page data and the second page data.

Abstract: A high voltage switch circuit and a semiconductor memory device having the same are provided. The high voltage switch circuit includes a switching circuit for outputting a high voltage by transmitting one of a plurality of pump voltages to an output node; and a discharge circuit connected between the output node and a terminal of an internal power voltage, the discharge circuit discharging the high voltage to a level of the internal power voltage. The discharge circuit includes a triple well transistor.

Abstract: Methods, systems, and devices for programming techniques for polarity-based memory cells are described. A method may include writing memory cells to an intermediate state based on receiving a write command. Writing the intermediate state may include applying a first pulse having a first polarity to the memory cell. The method may include isolating a first access line coupled with the memory cell from a voltage source based on applying the first pulse. The method may also include applying a second pulse to a second access line coupled with the memory cell based on isolating the first access line.

Abstract: Methods, systems, and devices for techniques for determining memory cell read offsets are described to support determining voltage offsets and corresponding read voltage levels for one or more memory cell levels using a relationship between read voltage levels and voltage offsets. A memory device may estimate first voltage offsets using a first procedure and may perform a read operation using the first voltage offsets. If a first voltage offset results in a read error for a corresponding memory cell level, the memory device may determine an updated voltage offset using the relationship. The relationship may predict a voltage offset for a given read voltage level, such that the memory device may use the relationship to predict an updated voltage offset for a memory cell level. The memory device may use the updated voltage offset(s) to perform a second read operation for the one or more memory cells.

Abstract: Apparatus having a controller configured to connect a string of series-connected memory cells (e.g., a NAND string) to a node, perform a sensing operation on a selected memory cell of the NAND string while the selected memory cell is connected to the node through a first field-effect transistor (FET) between the node and the NAND string and through a second FET between the first FET and the NAND string, connect a control gate of the first FET to receive a lower voltage level after performing the sensing operation, connect the control gate of the second FET to receive the lower voltage level after connecting the control gate of the first FET to receive the lower voltage level, and connect a control gate of the selected memory cell to receive the lower voltage level after connecting the control gate of the second FET to receive the lower voltage level.

Abstract: A semiconductor memory device includes a memory cell array, a memory apparatus and a power-on operation apparatus, and is capable of knowing whether a reading of the setting information which is set during the power-on operation had been completed correctly or not. The flash memory reads the fuse memory when it is detected that the power supply has reached the power-on detection level, and determines whether the reading of the fuse memory had been completed correctly. When not completed correctly, the fuse memory is read again within the maximum read count, and the setting information (which was read from the fuse memory) is written into the CF register. The identification information (that identifies whether the reading of the fuse memory has been completed correctly or not) is stored in the register.

Abstract: A semiconductor storage device includes a memory transistor and a word line connected to a gate electrode of the memory transistor. When a write sequence is interrupted before a k+1th verification operation is ended after a kth verification operation is ended in the nth write loop of the write sequence, a voltage equal to or higher than a verification voltage corresponding to a first verification operation in the nth write loop is supplied to the word line before start of the k+1th verification operation after resumption of the write sequence. A time from the resumption of the write sequence to the start of the k+1th verification operation is shorter than a time from start of the first verification operation to end of the kth verification operation in the nth write loop.

Abstract: Apparatus and methods are disclosed, such as a method that includes precharging channel material of a string of memory cells in an unselected sub-block of a block of memory cells to a precharge voltage during a first portion of a programming operation. A programming voltage can then be applied to a selected memory cell in a selected sub-block of the block of memory cells during a second portion of the programming operation. The selected memory cell is coupled to a same access line as an unselected memory cell in the unselected sub-block.

Abstract: A device might include a common source, a three-dimensional array of memory cells, a plurality of access lines, and a controller. The three-dimensional array of memory cells might include a plurality of NAND strings. Each NAND string might be selectively connected between a corresponding data line and the common source. Each access line of the plurality of access lines might be connected to a control gate of a respective memory cell of each NAND string of the plurality of NAND strings. The controller might be configured to access the three-dimensional array of memory cells to implement a source-side seeding operation.

Abstract: A NOR flash memory comprising a memory cell having a three-dimensional structure for saving power consumption is provided. The flash memory of the present invention includes a pillar part, a charge accumulating part, an insulating part, a control gate and a selecting gate. The pillar part extends in a vertical direction from a surface of a substrate and includes a conductive semiconductor material. The charge accumulating part is formed by surrounding the pillar part. The insulating part is formed by surrounding the pillar part. The control gate is formed by surrounding the charge accumulating part. The selecting gate is formed by surrounding the insulating part. One end of the pillar part is electrically connected to a bit line via a contact hole and another one end of the pillar part is electrically connected to a conductive region formed on the surface of the substrate.

Abstract: A memory device includes a semiconductor column extending above a substrate, a first conductive layer on a first side of the semiconductor column, a second conductive layer on a second side of the semiconductor column, opposite to the first conductive layer, a third conductive layer above or below the first conductive layer and on the first side of the semiconductor column, a fourth conductive layer on the second side of the semiconductor column, opposite to the third conductive layer, and a bit line connected to the semiconductor column. During reading in which a positive voltage is applied to the bit line, first, second, third, and fourth voltages applied to the first, second, third, and fourth conductive layers, respectively, wherein the first voltage and the third voltage are higher than each of the second voltage and the fourth voltage, and the third voltage is higher than the first voltage.

Abstract: According to one embodiment, a semiconductor storage device includes a first memory string including a first memory transistor, a first word line connected to a gate electrode of the first memory transistor, a source line connected to one end of the memory string, and a first connection transistor connected between the first word line and the source line.

Abstract: A machine-implemented method for managing a flash storage system includes determining a projected life value for each of a plurality of flash memory devices in the flash storage system, wherein the projected life value for at least one of the plurality of flash memory devices is higher than the projected life value of at least another one of the plurality of flash memory devices. The method also includes determining operating parameters for each of the plurality of flash memory devices based on the respective projected life values for the plurality of flash memory devices. The method also includes configuring the plurality of flash memory devices based on the determined operating parameters.

Abstract: A method of programming a nonvolatile memory device includes performing a single-pulse program operation in a program loop, determining whether a condition is satisfied in the a program loop, and performing a multi-pulse program operation in a next program loop when the condition is satisfied. The single-pulse program operation includes applying a first program pulse and applying plural verification pulses, the multi-pulse program operation includes applying a second program pulse, applying a third program pulse, and applying plural verification pulses, and each of the second program pulse and the third program pulse has a level lower than a level of the first program pulse.

Abstract: The present invention includes apparatus and a method for reading one or more data states from an integrated circuitry memory cell, including the steps of connecting the memory cell to a bit line which is connected to an amplifier having an offset control which introduces an offset during the sensing portion of a read cycle to identify a data state stored in the memory cell.

Abstract: An electrically erasable programmable nonvolatile memory cell includes a semiconductor substrate having a first substrate region and a trench region apart from the first substrate region in a lateral direction, a channel region between the first substrate region and the bottom portion of the trench region, an electrically conductive control gate insulated from and disposed over the first channel portion, an electrically conductive floating gate insulated from the bottom and sidewall portions of the trench region, an insulation region disposed over the second channel portion between the control gate and the second floating gate portion, an electrically conductive source line insulated from the floating gate and electrically connected to the trench region of the substrate, and an electrically conductive erase gate insulated from and disposed over a tip of the floating gate.

Abstract: A semiconductor device includes a memory circuit, an error correction code circuit, a register circuit and a write circuit. The memory circuit is configured to output, in response to at least one address signal, first data associated with at least one memory cell in the memory circuit. The error correction code circuit is configured to convert the first data to second data and configured to generate error information when the first data is not identical to the second data. The register circuit is configured to output, based on the error information, reset information corresponding to the at least one address signal. The write circuit is configured to reset the at least one memory cell according to the reset information. A method is also disclosed herein.

Abstract: A semiconductor memory device includes a memory cell unit, word lines, a driver circuit, and first transistors. The word lines are connected to the control gates of 0-th to N-th memory cells. The (N+1) number of first transistors transfer the voltage to the word lines respectively. Above one of the first transistors which transfers the voltage to an i-th (i is a natural number in the range of 0 to N) word line, M (M<N) of the word lines close to the i-th word line pass through a region above the gate electrode by a first level interconnection without passing over the impurity diffused layers.

Abstract: Apparatus including an array of memory cells, and a controller configured to cause the apparatus to determine a first value indicative of a number of memory cells of a plurality of memory cells that are activated in response to a control gate voltage having a particular voltage level, compare the first value to a plurality of second values, and determine an expected data age of the plurality of memory cells or a plurality of read voltages in response to the comparison of the first value to the plurality of second values.