Abstract: A sensor module, such as an acceleration sensor module, includes a leaded socket assembly covered by a housing. The leaded socket assembly includes a dual gauge lead frame, a sensor die, and various passive devices. The sensor die and the passive devices are mounted on the lead frame, and then the lead frame, sensor die, and passive devices are over-molded to form the leaded socket assembly. Neither the sensor module nor the socket assembly includes a printed circuit board, so many conventional sensor module assembly steps are bypassed.

Abstract: The invention relates to a device for measuring temperature in a gas duct. The device (1?) comprises a body (3?) for supporting a temperature sensor (4?), the sensor comprising a head (7?) and at least two wires (8?) connecting the head (7?) to means for acquiring a temperature-measurement signal. The supporting body (3?) is arranged so as to be inserted into an orifice of a wall of the duct in order to immerse the head (7?) of the sensor (4?) in the gases of the duct. The supporting body (3?) comprises a bottom collar (12?), having a top end surface (17a?), in which are arranged at least two channels (9?) for guiding and holding the wires (8?), arranged to allow the mounting of the sensor (4?) in the supporting body (3?) and the holding of the wires (8?) in order to hold the head (7?) of the sensor (4?) at a distance from the top end surface (17a?) of the collar (12?).