Abstract: A management system outputs at least one of a start-up start time and a warming start time of a plurality of machines. An input unit receives the input of a machining start time and the largest number of the machines. An estimation unit estimates a start-up period, a warming period, and a process period of each of the plurality of machines. A determination unit determines at least one of a start-up start time and a warming start time of each of the plurality of machines based on the machining start time, the largest number of the machines, the start-up period, the warming period, and the process period. A notification unit notifies at least one of the start-up start time and the warming start time.

Abstract: A method for processing a plurality of substrates after forming a photosensitive film on each substrate includes carrying each substrate into a placement buffer including a plurality of supporters by a first transport mechanism; taking out each substrate from the placement buffer to an interface by a second transport mechanism; carrying each substrate into the exposure device; carrying each substrate out of the exposure device into the placement buffer by the second transport mechanism; taking out each substrate from the placement buffer to the processing section by the first transport mechanism; performing development processing on each substrate; making each substrate stand by at the placement buffer based on timing at which the exposure device can accept each substrate; and making each substrate stand by at the placement buffer based on timing at which the developing device can accept each substrate.

Abstract: A semiconductor manufacturing process is provided. First, a wafer with a material layer and an exposed photoresist layer formed thereon is provided, wherein the wafer has a center area and an edge area. Thereafter, the property of the exposed photoresist layer is varied, so as to make a critical dimension of the exposed photoresist layer in the center area different from that of the same in the edge area. After the edge property of the exposed photoresist layer is varied, an etching process is performed to the wafer by using the exposed photoresist layer as a mask, so as to make a patterned material layer having a uniform critical dimension formed on the wafer.

Abstract: A substrate processing apparatus is configured to provide in series a plurality of processing blocks, each block including a processing unit and a transport robot transporting a substrate. A substrate rest is provided in a connecting portion of adjacent processing blocks. A sensor plate with sensor coils is provided spanning over support pins of the substrate rest. Once a temperature-measurement substrate with temperature-measuring elements, each element formed by connecting a coil to a quartz resonator, is placed on the support pins, a transmitter-receiver transmits transmission waves corresponding to the characteristic frequencies of the quartz resonators to the temperature-measuring elements through the sensor coils. After the stop of the transmission, the transmitter-receiver receives electromagnetic waves from the temperature-measuring elements through the sensor coils, and the temperature computer computes the substrate temperature based on the frequencies of the electromagnetic waves.

Abstract: A developing apparatus has a substrate holder to hold a substrate, a heater which is provided in a substrate holder, and heats a substrate on a substrate holder for processing a resist film by PEB, a cooler to cool a substrate on a substrate holder, a developing solution nozzle to supply a developing solution to a substrate on a substrate holder, and a controller to control a heater, a cooler and a developing nozzle.

Abstract: A projector having optical components, a power source unit, and a light source unit. The projector is capable of lowering its internal temperature utilizing: a first, second, and third fan (41, 42, 43) provided near the optical components for introducing external air from outside the projector to cool the optical components; and a fourth, fifth, and sixth exhaust fan (16, 17, 18). The fourth fan (16) blows the air that was taken in by the first, second, and third fan (41, 42, 43) and has cooled the optical components, onto the light source unit to further cool the light source unit. The fifth and sixth exhaust fans (17, 18) discharge the air that has cooled the light source unit and power supply unit out of the projector.

Abstract: A semiconductor manufacturing process is provided. First, a wafer with a material layer and an exposed photoresist layer formed thereon is provided, wherein the wafer has a center area and an edge area. Thereafter, the property of the exposed photoresist layer is varied, so as to make a critical dimension of the exposed photoresist layer in the center area different from that of the same in the edge area. After the edge property of the exposed photoresist layer is varied, an etching process is performed to the wafer by using the exposed photoresist layer as a mask, so as to make a patterned material layer having a uniform critical dimension formed on the wafer.

Abstract: A forward direction-only path (first substrate transport path) is formed for transporting substrates in a forward direction to pass the substrates on to an exposing apparatus. A separate, substrate transport path (second substrate transport path) is formed exclusively for post-exposure bake (PEB). Substrate transport along each path is carried out independently of substrate transport along the other. A fourth main transport mechanism is interposed as a predetermined substrate transport mechanism between transfer points consisting of a buffer acting as a temporary storage module for temporarily storing the substrates and a post-exposure bake (PEB) unit corresponding to a predetermined treating unit. This arrangement forms the path for transporting the substrates between the buffer and the PEB unit, to allow PEB treatment of the substrates to be performed smoothly. Similarly, the substrates are transported smoothly to the buffer.

Abstract: RFID tag to which predetermined information is written in advance is added to a replenisher cartridge, and the information is read from the RFID tag when the replenisher cartridge is loaded in a photo processing device. Whether or not a loaded replenisher cartridge is a genuine product is judged based on whether or not the predetermined information is written in the tag. When it is judged, based on whether or not the predetermined information is in the tag, that the loaded replenisher cartridge is not the genuine product, a processing speed (carrying speed of photographic paper) is reduced from normal level and at the same time a supply quantity of the replenisher to a processing solution tank is increased from a normal level. This avoids significant reduction in the photo processing performance and enables non-genuine replenisher cartridges to be also used.

Abstract: Excellent development of planographic printing plates can be achieved by exposing an imaged, negative working, photopolymerizable coating to a high pressure stream of essentially heated but otherwise untreated tap water, whereby the water completely removes only the less cohesive and adhesive (e.g., partially polymerized) regions to the substrate, thereby directly producing a printing plate having an image pattern of highly cohesive and adhesive, oleophilic regions of the coating and hydrophilic regions of the substrate. The coating removal mechanism appears to be due entirely to ablation. The process variables of spray pressure, spray volumetric flow rate, and water temperature can be traded off to achieve one or more targets for plate quality, energy conservation, production rate, and equipment availability.

Abstract: A substrate heat treatment apparatus for heat-treating a substrate includes a bake plate for supporting the substrate, and a cover disposed above the bake plate and temperature-controlled for securing a heat-treating atmosphere of the bake plate. An adjusting device adjusts a space between the cover and the bake plate. A control device adjusts the space, through the adjusting device, successively to a transport space for allowing transport of the substrate, a transitional space smaller than the transport space and close to the bake plate, and a steady space smaller than the transport space and larger than the transitional space.

Abstract: A developing apparatus has a substrate holder to hold a substrate, a heater which is provided in a substrate holder, and heats a substrate on a substrate holder for processing a resist film by PEB, a cooler to cool a substrate on a substrate holder, a developing solution nozzle to supply a developing solution to a substrate on a substrate holder, and a controller to control a heater, a cooler and a developing nozzle.

Abstract: A drying device, which dries a photosensitive layer of a photosensitive planographic printing plate using infrared rays, includes an infrared emitting device and a filter that is arranged between the photosensitive planographic printing plate conveyed through the drying device and the infrared emitting device and that blocks a predetermined range of wavelength. More specifically, the filter is arranged between a web that is conveyed through the drying device and a mid-infrared radiator, so as to block 30% or more of wavelengths of 1 ?m or less. As a result, fogging on a photosensitive coating layer can be prevented, and high heating efficiency can be achieved.

Abstract: Dry air is jetted from jet holes of a guide plate toward a conveyor belt to levitate a photosensitive sheet and to press it against the conveyor belt. The photosensitive sheet is supported and carried by the conveyor belt. The dry air dries the photosensitive sheet. A projection amount h of a guide roller projecting from the guide plate is defined so as to satisfy an expression of h?H×(W?P)/W. H is a gap between the guide plate and the conveyor belt. P is a length from a center line of the carried photosensitive sheet to an outer edge of the guide roller. W is a length from the center line to a lateral end of the photosensitive sheet. Even if a curl occurs on the photosensitive sheet, an edge thereof is prevented from contacting with the guide plate.

Abstract: In one example, a method for controlling temperature in a projection device, comprises measuring a plurality of temperatures in the projection device; averaging said plurality of temperatures to determine an averaged temperature; determining an error between a set-point temperature and said averaged temperature; and automatically adjusting a blower in said projection device based on said determined error. In another example, a method for controlling temperature in a projection device having a lamp and a blower comprises measuring temperature in the projection device; and selectively adjusting both a first signal to the blower and a second signal to the lamp based on said measured temperature to control temperature in the device.

Abstract: A developing apparatus which enables the time necessary for a development reaction to be shortened and permits uniform development includes a chuck device with a support portion whose top surface is a horizontal surface and a spinner disposed in the middle of this support portion. The support portion and the spinner are provided within an antiscattering cup. A groove which vacuum adsorbs a substrate W to be treated is formed on the top surface of the spinner, a pipe which forms a circulation path is disposed within the groove formed on the top surface of the support portion, and a cleaning nozzle which cleans a developing solution which has flown behind the rear surface of the substrate W is disposed in a position which is nearest to the inside diameter of the top surface of the support portion. On the other hand, in a nozzle device, a spray nozzle is attached to a horizontally reciprocating arm via a columnar support.

Abstract: A heat developing method having the steps of: initially making the overall surface of a heat developing photosensitive material or a photosensitive and thermosensitive recording material (hereinafter called a “heat developing recording material”) to a predetermined temperature not lower than a glass transition temperature and not higher than heat development start temperature; and performing heat development.

Abstract: In an electric conductivity-based replenishing system, a developer replenishing method for a photosensitive lithographic printing plate is provided which is capable of minimizing the fluctuations in sensitivity of a developer with respect to the changes in development treatment conditions. An electric conductivity value of the developer is measured in a predetermined given cycle, when the measured electric conductivity value of the developer is lower than the target electric conductivity value, the developer is replenished with a predetermined amount of a developer replenisher, the time interval between the previous supply of the developer replenisher and the present supply of the developer replenisher is measured, a target electric conductivity arithmetic expression is selected based on the measured replenishment time interval and the replenishment time interval threshold value.

Abstract: A system and method is provided for applying a developer to a photoresist material layer disposed on a semiconductor substrate. The developer system and method employ a developer plate having a plurality of a apertures for dispensing developer. Preferably, the developer plate has a bottom surface with a shape that is similar to the wafer. The developer plate is disposed above the wafer and substantially and/or completely surrounds the top surface of the wafer during application of the developer. A small gap is formed between the wafer and the bottom surface of the developer plate. The wafer and the developer plate form a parallel plate pair, such that the gap can be made small enough so that the developer fluid quickly fills the gap. A differential voltage is applied to the developer plate and the wafer causing an electric field to be formed in the gap. Transportation of negatively charge photoresist material is facilitated by exposure to the electric field during the development process.

Abstract: A substrate treating apparatus includes a heat-treating unit having a cooling unit and a local transport mechanism. The local transport mechanism, in time of standby, is placed in a standby position inside the cooling unit. The local transport mechanism in the standby position influences, and is influenced by, the environment outside the heat-treating unit less than where the local transport mechanism is kept on standby outside the heat-treating unit. Variations in substrate treating precision due to such adverse influences are reduced to perform substrate treatment with high precision.

Abstract: An image forming device which automatically manages temperature and humidity for stably processing a photosensitive material. A temperature sensor and a humidity sensor sense changes in temperature and humidity within a heat developing section of the image forming device. A temperature regulator computes an optimal temperature and heating time in accordance with results of sensing, and controls a heating section and conveying of the photosensitive material.

Abstract: A method and system for environmental control in film processing is disclosed. In general, photographic film is coated with a processing solution, such as a developer solution, and is then developed within a controlled air environment. In the preferred embodiments, the temperature and humidity within the air environment is strictly controlled, which allows the development process to be more accurately and consistently controlled. This also allows fewer processing chemicals to be used and reduces harmful effluents caused by photographic film processing.

Abstract: A manifold communicatively connects a plurality of coating processing units with an air conditioning unit. The manifold is formed by branching a common pipe into a plurality of distributing pipes. The air conditioning unit performs temperature control to set air passing through a branch point of the manifold to a temperature slightly lower than a target temperature in processing units. Secondary heaters secondarily heat air passing through joints between the distributing pipes and the processing units to the target temperature thereby supplying accurately temperature-controlled air to processing parts. Air from the air conditioning unit is diverted thereby suppressing the height of the overall apparatus. Thus, a substrate processing apparatus capable of inhibiting the height of the overall apparatus from remarkable increase also when vertically stacking processing parts in multiple stages and supplying temperature-controlled air to the processing parts with sufficient accuracy.

Abstract: One aspect of the invention is a system for digital dye color film processing. In one embodiment, a developer station applies a processing solution to film to initiate development of metallic silver grains and at least one dye image within the film. A scanning system illuminates the coated film with light having at least one frequency within the visible portion of the electromagnetic spectrum. The light interacts with the silver and at least one dye image within the film. The scanning station measures the light from the film and produces sensor data that is communicated to a data processing system. The data processing system processes the sensor data to produce a digital image. The digital image can then be output to an output device, such as a printer, monitor, memory device, and the like.

Abstract: A chemical delivery system and method for use in a photographic processor is disclosed. The chemical delivery system includes a heating assembly that comprises a heating chamber and a level detection sensor. The heating chamber receives a predetermined amount of processing solution from a storage tank based on the level of the level detection sensor, heats the predetermined amount of processing solution and supplies the same to an associated photograph processor.

Abstract: An imaging device for preparing a printing surface for a printing operation transfers information related to how the printing precursor should be processed to a processor. The processor is automated to make local adjustments according to the information provided. The information can be transferred for each printing precursor or only when changes occur. The transfer is automated.

Abstract: A system and method is provided for applying a developer to a photoresist material wafer disposed on a semiconductor substrate. The developer system and method employ a developer plate having a plurality of a apertures for dispensing developer. Preferably, the developer plate has a bottom surface with a shape that is similar to the wafer. The developer plate is disposed above the wafer and substantially and/or completely surrounds the top surface of the wafer during application of the developer. A small gap is formed between the wafer and the bottom surface of the developer plate. The wafer and the developer plate form a parallel plate pair, such that the gap can be made small enough so that the developer fluid quickly fills the gap. The developer plate is disposed in very close proximity with respect to the wafer, such that the developer is squeezed between the two plates thereby spreading evenly the developer over the wafer.

Abstract: There is described a thermal development apparatus, which makes it possible to prevent generation of density variations caused by changes of the processing temperature during the thermal developing operation when the thermal developing photosensitive material is continuously processed, without increasing the cost of the apparatus so much. The thermal development apparatus includes a thermal developing processor to apply a thermal development processing to the thermal developing photosensitive material, a detector to detect the thermal developing photosensitive material to be conveyed into the thermal developing processor and a controller to control the thermal developing processor in a feed forward controlling mode based on a processing condition of the thermal developing processor. The processing condition is established in advance, corresponding to a load of processing the thermal developing photosensitive material detected in advance by the detector.

Abstract: A photographic processing apparatus includes a processing bath train, which processes photographic paper. A drier is positioned downstream from the processing bath train, for heating air and for drying the photographic paper by blowing the photographic paper with the heated air. Feeding racks feed the photographic paper in a predetermined travel path which begins on an upstream side of the processing bath train, extends through the processing bath train, and ends at the drier. A memory is accessed to estimate expected travel time t1 for passing of the photographic paper through the predetermined travel path in feeding of the feeding racks. The memory is accessed to estimate expected warmup time t2 for warming up the air in the drier up to a target temperature T2.

Abstract: The present invention relates to a photographic processor and a method of processing photographic material where heat is applied to a processing drum in a manner which requires less warm up time and permits better film processing uniformity. The system of the present invention includes a circular drum and a heating material provided either on an outer surface of the drum, embedded into a side wall of the drum, or provided in an interior surface of the drum. The heating material is adapted to be heated so as to heat the processing path through which film is conveyed during processing, to an appropriate temperature for the processing of the photographic material.

Abstract: A solution delivery system for a processor holds and delivers the processing solutions at working temperature. The solutions are held in an airtight chamber in which they are heated to the correct temperature. The solution is then transferred to a holding chamber until released into the processor.

Abstract: A chemical delivery system and method for use in a photographic processor is disclosed. The chemical delivery system includes a heating assembly that comprises a heating chamber and a level detection sensor. The heating chamber receives a predetermined amount of processing solution from a storage tank based on the level of the level detection sensor, heats the predetermined amount of processing solution and supplies the same to an associated photograph processor.

Abstract: A photographic film developing apparatus maintains a photographic film, a developer solution and a second processing solution at a specific temperature while performing film development operation by directly applying the individual solutions to an emulsion side of the photographic film. After the developer solution and the second processing solution have been applied from respective processing solution application heads to the emulsion side of the photographic film, the quantity of each solution on the emulsion side is adjusted to form a layer of a specified thickness. While transfer belts advance each successive portion of the photographic film up to a processing solution wipe-out device, heaters provided close to the transfer belts heat the individual solutions applied to the photographic film through the transfer belts to maintain the solutions at the specific temperature.

Abstract: An apparatus and method for developing a selectively exposed resist pattern, on an integrated circuit wafer, which avoids damage to the resist pattern and allows greater freedom in the choice of resists. Developer is placed on a selectively exposed layer of resist for a first time. The layer of resist and developer are then immersed in a cleaning liquid time for a second time to stop the developing action and remove the developer. As an option, ultrasonic power can be delivered to the wafer or the cleaning liquid while the layer of resist is immersed in the cleaning liquid. The cleaning liquid is then removed from the layer of resist, now a resist pattern, and the wafer and resist pattern is placed in a vacuum for drying. As another option, heat can be applied to the wafer and resist pattern while they are in the vacuum. The wafer and resist pattern are then removed from the vacuum for further processing.

Abstract: An integrated apparatus for processing a resist pattern imaged on a substrate, notably a thermal lithographic printing plate, comprises a chemical development section, and a preheat oven upstream of the chemical development section. The preheat oven is controllable to provide for substantially uniform heating of the imaged lithographic plate (or other imaged resist pattern on the substrate) as the plate progresses through the apparatus. If desired a plate baking oven may be provided downstream of the chemical development section.

Abstract: A chemical or processing solution delivery system and method for use in a photographic processor is disclosed. The system includes a heating chamber which is adapted to receive a predetermined amount of processing solution therein, and heat the processing solution prior to delivery of the solution to an associated processor. The heating chamber includes a member which functions as a supply tube for supplying solution to the chamber and a level detection sensor for detecting the level of solution in the chamber.

Abstract: There is provided improvement of a light-heat conversion in a light-stimulated writing method.

Abstract: The present invention provides lithographic systems and lithographic processes in which conditions affecting critical dimensions are controlled based on a latent image signature. The latent image signature characterizes the latent pattern present in a resist coating after selective exposure of the resist to actinic radiation. The latent image signature is determined from the full latent pattern within a region of the resist. Conditions for subsequent processing steps (feed forward control) and/or prior processing steps (feed back control) to produce desired critical dimensions are determined from the latent image signature. In another aspect of the invention the latent pattern is logically divided into a plurality of regions. Within each region, a characteristic of the latent pattern is analyzed to determine conditions to apply to that region during previous and/or subsequent processing steps.

Abstract: Apparatus for processing heat processable media comprising: a rotatable heated drum for processing heat processable media having width and depth dimensions, and a plurality of rollers spaced around a portion of the periphery of said drum and in contact therewith, said rollers holding said media to said drum; wherein at least one of said drum and/or at least some of said plurality of rollers have a channel in a central region thereof, said channel having a width greater than said width dimension of said media and a depth less than said thickness dimension of said media.

Abstract: Photosensitive material is processed by passing the material through a chamber holding processing solution, the temperature of the solution being raised as the material passes through the chamber.

Abstract: An apparatus and method are provided for developing photoresist patterns on electronic component substrates such as semiconductor wafers. The method and apparatus use a specially defined developer composition in sequence with a specially defined rinse composition to develop an exposed photoresist pattern and then to rinse the developed pattern. Both the developer composition and rinse composition contain an anionic surfactant and, when the solutions are used in sequence, have been found to provide a resist pattern which avoids pattern collapse even when small features such as line widths less than 150 nm with aspect ratios of greater than about 3 are formed. It is preferred to use a puddle developing and puddle rinsing process to develop and rinse the exposed wafer. Preferred anionic surfactants are ammonium perfluoroalkyl sulfonate and ammonium perfluoroalkyl carboxylate.

Abstract: A photofinishing apparatus is designed such that full bleed durable prints are produced with a high productivity and low waste generation process. The photofinishing apparatus in this case includes a printer and a finisher or post-print treatment processor. The printer is designed to produce media segment with multiple images of various formats. This media segment is then transported to the post-print treatment processor. The post-print treatment processor includes a dryer station, a durability station, a two-axis cutting station, and a print sorting station. The dryer performs the function of drying the media segment. The durability station performs the function of applying and or fixing durability material on the media segments. The two-axis cutting station includes slitting and chopping stations that performs the required two-axis cutting that produces the full bleed prints.

Abstract: A resist pattern forming apparatus comprising a controller having a controlling portion that controls a processing of a coating and developing apparatus with a coating unit and a developing unit being provided therewith and an aligner being connected thereto, while an inspecting portion and the like measures at least one of a plurality of measurement items selected from, a reflection ratio and a film thickness of a base film and a resist film, a line width after the development, an accuracy that the base film matches with a resist pattern, a defect after the development, and so on. The measured data is transmitted to the controller. At the controller, a parameter subject to an amendment is selected based on the corresponding data of each of the measurement item such as the film thickness of the resist and the line width after the development, and the amendment of the parameters subject to the amendment is performed.

Abstract: In a state where a wafer is held by a wafer holding section and a temperature controlled liquid is discharged to a rim area on a rear face of the wafer from flow channels, a developing solution is heaped on a front face of the wafer. Thereafter, the wafer is rotated for a predetermined period of time in a state where the temperature controlled liquid is discharged to the rim area on the rear face of the wafer from the flow channels, whereby developing is performed. The wafer is heated by the wafer holding section with a large heat capacity in an area close to a center of the wafer, and a liquid film of the temperature controlled liquid is formed in the rim area of the wafer, whereby the wafer is heated. At this time, the wafer is rotated, so that the developing solution is stirred.

Abstract: A method and apparatus for developing a strip of photosensitive media having image exposure area having an undeveloped exposed portion thereon. The apparatus includes a transport mechanism for moving the photosensitive media along a processing path; and a mechanism positioned along the processing path for selectively applying a coating of the processing solution only on the undeveloped exposed portion of the strip of photosensitive media. The apparatus further includes sensors for determining the location of the undeveloped exposed portion of the image exposure area. A scanner may be provided for scanning the strip of photosensitive media so as to obtain a digital record of the images developed thereon.

Abstract: The present invention relates to a processing system and method for photographic material which is adapted to use sources of heat within the processing machine for photographic processing purposes. More specifically, in the system and method of the present invention, sources of heat such as electrical, electro-mechanical and mechanical components and dryers can be utilized to provide heat in a small scale processor which uses a low volume of processing solution. Therefore, the arrangement of the present invention is designed in such a manner that permits the efficient use of heat produced as a by-product of an operation of these components. Furthermore, the arrangement of the present invention includes heat supplying members such as heaters and/or heat storage members to assist in supplying heat to those areas of the processors where the heat can be used for processing.

Abstract: A resist coating block is composed of a resist coating unit, a cooling unit group, and a first sub-conveying unit that conveys a wafer W between the resist coating unit and the cooling unit group. A developing block is composed of a developing unit, a cooling unit group, and a second sub-conveying unit that conveys a wafer W between the developing unit and the cooling unit group. Heat insulating panels are disposed to the blocks opposite to heating units. A first main-conveying unit and a second main-conveying unit are disposed between the blocks. The first main conveying unit is disposed between a first heat treatment block and a third heat treatment block. The second main conveying unit is disposed between a second heat treatment block and a fourth heat treatment block. Thus, variation of the film thickness of a resist film coated on a wafer W can be prevented against heat radiated by the heating units.

Abstract: Temperature control of heaters 8a and 8b for heating a printing original plate 2 is performed with an atmosphere temperature sensor 11, etc., and stably generated heat is shielded by controlling the rotation angles of reflecting plates 9a and 9b. The leading end of the printing original plate 2 is detected by a position detection sensor 26 and the transport speed of the printing original plate 2 is controlled. As the trailing end of the printing original plate 2 is detected, the rotation angles of the reflecting plates 9a and 9b are controlled and the heating amount is controlled in response to the parts of the printing original plate 2. Accordingly, it is possibly to heat the whole printing original plate while preventing uneven heating, when the printing original plate is heated and transported.

Abstract: A compact and energy efficient apparatus for processing and drying an elongated strip of photographic film having a succession of film processing tanks containing selected processing liquids; drive system which advances the film strip endwise through the tanks to selected depths in liquids corresponding to required exposure times of the film to the different liquids while reducing the tank to tank contamination caused by the transport of treatment of liquids from tank to tank, and a heater system which reuses the waste heat generated by the mechanical and electrical components of the apparatus to dry the film strip as it emerges from the successive processing tanks.

Abstract: A system for regulating temperature of a developer is provided. The system includes a plurality of optical fibers, each optical fiber directing radiation to respective portions of the developer. Radiation reflected from the respective portions are collected by a measuring system which processes the collected radiation. The reflected radiation are indicative of the temperature of the respective portions of the developer. The measuring system provides developer temperature related data to a processor which determines the temperature of the respective portions of the developer. The system also includes a plurality of heating devices; each heating device corresponds to a respective portion of the developer and provides for the heating thereof. The processor selectively controls the heating devices so as to regulate temperature of the respective portions of the developer.