Abstract: A transfer apparatus includes a first vacuum transfer module; a first transfer robot disposed in the first vacuum transfer module and at least one ring. In addition, a second vacuum transfer module is provided; and a second transfer robot is disposed in the second vacuum transfer module. A tubular connecting module is disposed between the first vacuum transfer module and the second vacuum transfer module. Further, the first vacuum transfer module, the second vacuum transfer module and the tubular connecting module are arranged along a first direction, with the tubular connecting module having a first length in the first direction, and the first length is smaller than the diameter of the wafer. A wafer support is rotatably attached to the tubular connecting module and at least three ring supporting members outwardly extend from the wafer support to support the at least one ring.

Abstract: There is provided a technique that includes: a process chamber in which a substrate is processed; a gas supplier configured to supply a gas into the process chamber; at least one substrate mounting table disposed in the process chamber and including a substrate mounting surface on which the substrate is mounted; and an arm configured to transfer the substrate to the substrate mounting surface while supporting a lower surface of the substrate, wherein the arm includes a support that includes an inclination and is configured to support the substrate.

Abstract: An operating device for placing or retrieving bottle-like piece goods onto or from storage places of a picking device is provided. The operating device includes a gripping jaw assembly having two profile-rod shaped gripping jaws with opposite lying inner surfaces extending in a first horizontal direction corresponding to a direction for placing and retrieving piece goods. The gripping jaws are configured so that the distance of the inner surfaces from each other tapers in the downward direction at least in sections and the bottle-like piece goods can be lifted from below. The operating device also includes an actuation unit coupled to the gripping jaw assembly for moving the gripping jaw assembly in the first horizontal direction.

Abstract: There is disclosed a substrate processing apparatus which can align a center of a substrate with a central axis of a process stage with high accuracy to prevent a defective substrate from being produced. The substrate processing apparatus includes: an eccentricity detecting mechanism configured to obtain an amount of eccentricity and an eccentricity direction of a center of the substrate, held on the centering stage, from a central axis of the centering stage; and an aligner configured to align the center of the substrate with a central axis of a process stage. The aligner obtains, after the substrate is transferred from the centering stage to the process stage, an amount of eccentricity and an eccentricity direction of the center of the substrate from the central axis of the process stage by use of the eccentricity detecting mechanism; and confirms that the obtained amount of eccentricity of the center of the substrate from the central axis of the process stage is within a predetermined allowable range.

Abstract: A pick-and-place device of display screen substrate and a control method for picking and placing a display screen substrate are disclosed. The pick-and-place device of display screen substrate includes a housing, a support assembly and a control component. The support assembly is disposed in the housing and includes: a support plate extending in a first direction, and two sets of support bars disposed opposite to each other and spaced apart from each other in the first direction. Each set of support bars includes a plurality of support bars arranged at intervals along a second direction, and each support bars is movable in a third direction. The support plate and the support bar are connected with the housing respectively, and the support plate is provided with an opening configured to allow the support bar to move along the third direction.

Abstract: An indexing apparatus includes a fixture tool, movable relative to an operation cell, and an indexing feature, fixed relative to the fixture tool. The indexing apparatus also includes a plurality of probes, configured to engage the indexing feature. The indexing apparatus further includes a controller, in communication with the plurality of probes, wherein the controller is configured to locate the fixture tool relative to the operation cell from a plurality of probe locations of the plurality of probes, engaged with the indexing feature.

Abstract: A conveyance apparatus for conveying a substrate chuck includes a hand for supporting the substrate chuck, a main body for pivotally supporting the hand about a vertical axis and movable in horizontal and vertical directions, and a guiding portion for guiding pivotal motion of the hand. The hand includes hand distal end portions and a hand proximal end portion supported by the main body. An end surface of the hand proximal end portion facing the main body is formed in an arc shape of a circle centered about a vertical axis of a reference position between the hand distal end portions. The guiding portion includes a guiding surface that has a shape corresponding to the end surface of the hand proximal end portion and can slidably contact the end surface.

Abstract: A substrate processing apparatus and method for effectively removing an organic material such as a photoresist without using sulfuric acid are provided. The substrate processing apparatus includes a support module, in which a substrate is inverted and seated, and an ultraviolet light source is installed, wherein the substrate is arranged so that one surface of the substrate faces the support module, and the ultraviolet light source irradiates ultraviolet rays to one surface of the substrate; a nozzle installed in the support module; and a fluid supply module for supplying a fluid to one surface of the substrate through the nozzle.

Abstract: A wafer pick-and-place method and system is provided. During the wafer pick-and-place operation, the distance between the fork of the robot and the target wafer is detected to determine whether the robot will collide with the target wafer. Furthermore, the tilted angle of the target wafer relative to the fork is calculated to determine whether the wafer will slip off. If collision or wafer slippery may occur, the pick-and-place operation is stopped. Therefore, wafer damages due to unexpected contact between the fork and the wafer can be avoided, and wafer handling safety can be improved.

Abstract: A vacuum robot adapted to grip and transport a substrate. The robot includes a robot drive coupled to an arm and having an end-effector adapted to support the substrate. A robot gripper system includes a front support having at least one hard stop, a movable contact element coupled to the end-effector, a bias device and at least one actuator coupled to the end-effector configured to move the contact element between a release position and a grip position. The bias device is configured to passively bias the contact element in the grip position such that the contact element contacts an edge of the substrate to urge the substrate against the at least one hard stop to secure the substrate in the grip position and to passively bias the contact element in the release position such that the contact element is retained in the release position.

Abstract: An apparatus is provided for lifting a substrate. The apparatus comprises a first piece and a second piece. The apparatus further comprises a set of first contact points in a plane and a set of second contact points, where at least one contact point from each set is present on the first piece and the second piece. The apparatus also comprises an actuator that translates the first piece, substantially parallel to the plane, between a first position and a second position relative to the second piece. Additionally, the first position arranges the set of first contact points so that all of the contact points of the set of first contact points are able to engage the substrate, and the second position arranges the set of second contact points so that all of the contact points of the second set of contact points are able to engage the substrate.

Abstract: In a device for machining, in particular etching and/or developing, substrates, in particular wafers, in particular etching and/or developing, having a turntable, the turntable has a Venturi gap.

Abstract: According to one embodiment, a gripping device grips a rim of a workpiece by opening and closing gripping plates. The device includes a gripping unit, a hoisting and lowering unit and a motion control unit. The gripping unit includes a first and a second gripping plate. The first gripping plate has a first gripper to contact the rim. The second gripping plate has a second gripper to contact the rim. At least one of the first and second gripping plates is moved and the first and second gripper are spaced from each other. The hoisting and lowering unit is configured to hoist and lower the gripping unit. The motion control unit is configured to control open/close operations and hoisting and lowering operations. The motion control unit mechanically controls first first hoisting and lowering operations, controls second the open/close operations, and controls third second hoisting and lowering operations.

Abstract: An apparatus for anodizing substrates immersed in an electrolyte solution. A substrate holder mounted in a storage tank includes a first support unit having first support elements for supporting, in a liquid-tight condition, only lower circumferential portions of the substrates, and a second support unit attachable to and detachable from the first support unit and having second support elements for supporting, in a liquid-tight condition, remaining circumferential portions of the substrates. A drive mechanism separates the first support unit and the second support unit when loading and unloading the substrates, and for connecting the first support unit and the second support unit after the substrates are placed in the substrate holder.

Abstract: A robot system according to the embodiments includes a robot that includes a hand including a gripping mechanism that grips a thin plate-shaped work and an arm that moves the hand, and a robot control apparatus that controls the robot. The robot control apparatus, when causing the robot to transfer the work at a predetermined work transfer position by controlling the robot, performs a presence/absence confirmation of the work by operating the gripping mechanism while causing the hand to retract after the hand reaches the work transfer position.

Abstract: A lithographic apparatus is described that comprises a support structure to hold an object. The object may be a patterning device or a substrate to be exposed. The support structure comprises a chuck, on which the object is supported, and an array of shear-compliant elongated elements normal to the chuck and the stage, such that first ends of the elongated elements contact a surface of the chuck and second ends of the elongated elements contact a stage. Through using the array of elongated elements, a transfer of stress between the stage and the chuck is substantially uniform, resulting in minimization of slippage of the object relative to the surface of the chuck during a deformation of the chuck due to the stress.

Abstract: An apparatus, particularly a chuck for retaining a thin part for micro-machining processing, is disclosed. The chuck is formed of a plate-shaped body having a first surface and a second surface opposite the first surface. The plate-shaped body includes a light-transmissive material, and at least one of the first surface or the second surface is a roughened surface. The chuck can be incorporated into a micro-machining system using a chuck support that allows light through to backlight a processed part for inspection.

Abstract: In recent years, frames have gotten larger in size and thinner, and warping of the frames has posed a problem. If a warp of a frame is large, there is a high possibility that fetching the frame may fail. If fetching the frame fails, that is, if the frame cannot be fetched, the lead time of mounting gets longer. Further, the frame that cannot be fetched has to be manually removed by an operator. Therefore, a man-hour increases. According to the present invention, before a loader feeder fetches a frame from a frame magazine, a loader lifter is moved in a Y direction. Thereafter, the loader feeder fetches the frame from the frame magazine.

Abstract: A robot arm apparatus includes an arm mechanism including a base member and a link pivotally connected to the base member for pivotal motion in a horizontal plane through a rotational shaft. The link holds a regular circular transport object at its distal end. The apparatus also includes an edge detector, provided on the base member, that detects two edges of the regular circular transport object as the link pivotally rotates with respect to the base member, a pivotal angle detector that detects a pivotal angle of the link with respect to the base member, and a center position calculator that calculates a center position of the regular circular transport object with respect to the link. The calculation is based on two pivotal angles detected by the pivotal angle detector when the edge detector detects the two edges of the regular circular transport object.

Abstract: A method of carrying out a transfer of one or more first components or of a first layer onto a second substrate including: a) application and maintaining, by electrostatic effect, of the one or more first components or of the first layer, on a first substrate, made of a ferroelectric material, electrically charged, b) placing in contact, direct or by molecular adhesion, and transfer of the components or the layer onto a second substrate, and c) dismantling of the first substrate, leaving at least one part of the components or the layer on the second substrate.

Abstract: A wafer handling system includes providing a loadlock tray assembly having a plurality of vertically-stacked loadlock trays; and mounting nipples around each of the plurality of vertically-stacked loadlock trays for supporting a plurality of wafers, each of the nipple having a flat top.

Abstract: A substrate support apparatus which can support a substrate having a center hole, comprises a support portion which can support the substrate. The support portion includes a support groove with a cross-sectional shape in which a groove width gradually increases in a counter-gravitational direction, and a width of the support groove between two end portions is larger than a width of the support groove at the center thereof.

Abstract: Provided herein are methods, apparatuses and systems for fabricating photovoltaic cells and modules. In certain embodiments, the methods, apparatuses and systems involve coating ferromagnetic substrates with thin film solar cell materials and using magnetic force to constrain, move or otherwise manipulate partially fabricated cells or modules. According to various embodiments, the methods, apparatuses and systems provide magnetically actuated handling throughout a photovoltaic cell or module fabrication process, from forming photovoltaic cell layers on a substrate to packaging the module for transport and installation. The magnetically manipulated processing provides advantages over conventional photovoltaic module processing operations, including fewer mechanical components, greater control over placement and tolerances, and ease of handling. As a result, the methods, apparatuses and systems provide highly efficient, low maintenance photovoltaic module fabrication processes.

Abstract: The present invention is an imprint system including an imprint unit transferring a transfer pattern to a coating film formed on a substrate using a template having the transfer pattern formed on a front surface thereof to form a predetermined pattern in the coating film, the imprint system including: a substrate carry-in/out station connected to the imprint unit, capable of keeping a plurality of the substrates, and carrying the substrate into/out of the imprint unit side; and a template carry-in/out station connected to the imprint unit, capable of keeping a plurality of the templates, and carrying the template into/out of the imprint unit side at a predetermined timing.

Abstract: An end effector is disclosed for use in substrate processing. The end effector includes a effector body portion, a contact pad pocket formed in the end effector body, a spring retaining pocket formed in the end effector body adjacent the contact pad pocket and extending to an edge of the end effector body, and a pair of through-holes extending from the spring retaining pocket to the contact pad pocket. The end effector can include a contact pad seated within the contact pad pocket, the contact pad having at least one retaining channel formed therein, and a retaining spring having a pair of retaining arms extending from the retaining spring pocket through the through-holes and into the contact pad pocket. The retaining arms may extend at least partially into the at least one retaining channel of the contact pad and may thereby restrict movement of the contact pad.

Abstract: The present invention is a template treatment apparatus forming a film of a release agent on a template having a transfer pattern formed on a front surface thereof, the template treatment apparatus including: a treatment station forming a film of a release agent on the front surface of the template; and a template carry-in/out station capable of keeping a plurality of the templates, and carrying the template into/out of the treatment station, wherein the treatment station includes: a cleaning unit cleaning the front surface of the template; a coating unit applying a release agent to the cleaned front surface of the template; a heating unit baking the applied release agent; and a carry unit carrying the template to the cleaning unit, the coating unit, and the heating unit.

Abstract: The present invention provides a seal device comprising a sealing passage which allows communication between a first space and a second space, and evacuation lines individually connected to the first space and the sealing passage. A gas feed line for feeding dry gas is connected to the sealing passage.

Abstract: An apparatus for gripping a substrate on its peripheral edge including a substrate support having proximate and distal ends, at least one distal rest pad disposed at the distal end, the at least one distal rest pad includes a back stop portion and is configured to support the peripheral edge of the substrate, at least one proximate rest pad disposed at the proximate end, the at least one proximate rest pad being configured to support the peripheral edge of the substrate, and an active contact member assembly disposed at the proximate end, the active contact member assembly including a pusher member, a contact member and a rotatable coupling member that are reciprocably movable towards the distal end for urging the substrate against the back stop portion, the contact member being rotatably secured to the pusher member and free to rotate about an axis of the rotatable coupling member.

Abstract: A semiconductor wafer processing tool has a support structure for a coarse motion positioning system. A measurement head having a rigid super structure is supported from the support structure by vibration isolators and a top plate is mounted to the super structure. A vacuum transfer chuck is releasably carried by the coarse motion positioning system and releasably adherable to the top plate by application of vacuum. The vacuum transfer chuck supports a semiconductor wafer.

Abstract: In a first aspect, a first substrate processing system is provided that includes (1) a chamber having a plurality of opening through which a substrate may be transported; (2) a substrate carrier opener coupled to a first one of the plurality of openings; (3) a thermal processing chamber coupled to a second one of the plurality of openings; and (4) a wafer handler contained within the chamber, having a substrate clamping blade and a blade adapted to transport high temperature substrates.

Abstract: A lithographic apparatus is described that comprises a support structure to hold an object. The object may be a patterning device or a substrate to be exposed. The support structure comprises a chuck, on which the object is supported, and an array of shear-compliant elongated elements normal to the chuck and the stage, such that first ends of the elongated elements contact a surface of the chuck and second ends of the elongated elements contact a stage. Through using the array of elongated elements, a transfer of stress between the stage and the chuck is substantially uniform, resulting in minimization of slippage of the object relative to the surface of the chuck during a deformation of the chuck due to the stress.

Abstract: A method for supporting a semiconductor wafer includes providing a device wafer to a magnetizable ring, providing a magnetizable carrier to the device wafer, and magnetizing the magnetizable ring and the magnetizable carrier to form a magnetized clamp having a magnetized ring and magnetized carrier. The magnetized clamp securely clamps the device wafer therebetween.

Abstract: A substrate transporting robot apparatus is disclosed which is adapted to transport a substrate to and from a chamber of an electronic device processing system. The apparatus may include an upper arm rotatable in an X-Y plane, a forearm rotatable relative to the upper arm in the X-Y plane, and a wrist member rotatable relative to the forearm in the X-Y plane, the wrist member including an end effector adapted to carry a substrate. The wrist member may be subjected to independent rotation such that various degrees of yaw may be imparted to the wrist member. In some aspects, the independent rotation is provided without a motive power device (e.g., motor) being provided on the arms or wrist member, i.e., the wrist member may be remotely driven. Systems and methods using the robot apparatus are also provided as are numerous other aspects.

Abstract: A robot hand having a suction holding unit on one face side holds a plate-shaped work by suction. An outer circumferential edge of the plate-shaped work is held, without contact with a surface of the plate-shaped work, by an outer circumference holding unit provided on the other face side. The robot hand can be used to hold the plate-shaped work yet to be worked by the suction holding unit, and to hold the plate-shaped work having been worked by the outer circumference holding unit. This prevents working debris from being deposited on the plate-shaped work yet to be worked and prevents defective working from occurring. In addition, since the plate-shaped work having been worked is held by the outer circumference holding unit, the robot hand does not make contact with surfaces of the worked plate-shaped work, and, accordingly, no contact marks are formed on the surfaces of the work.

Abstract: A clamping device comprising: a distal end side stationary blocks which are provided on a side of a distal end of a workpiece retaining base, and in which stationary tilt faces tilting downwardly to a central direction of the workpiece are formed; a proximal end side stationary blocks which are provided on a side of a proximal end of the workpiece retaining base, and in which upward stationary tilt faces tilting downward toward the central direction of the workpiece are formed; and a movable block which is arranged at a position proximal to the proximal end side stationary blocks, and is capable of advancing to or retracting from a side of the distal end side stationary blocks with the workpiece being held between the blocks, and in which a downward movable tilt face tilting upwardly toward the central direction of the workpiece is formed.

Abstract: An end effector blade (201) is provided which has a region (203) defined thereon for receiving an article. The end effector blade is also equipped with a plurality of tabs (213) disposed about the periphery of said region. Each tab moves from a first position when no article is present in the region, to a second position when an article is disposed in the region, and each tab pressingly engages the article when it is in the second position.

Abstract: A substrate transport apparatus including a first shaftless rotary motor including a first stator and a first rotor, the first stator being linearly distributed and the first rotor being coupled to a first arm, a second shaftless rotary motor including a second stator and second rotor, the second stator being linearly distributed and the second rotor being coupled to a second arm, the second arm being connected to the first arm and a first substrate support being coupled to at least one of the first and second arms, wherein the first stator and second stator are configured so that the first and second arms and the first substrate support are inside the stators and a motor output at a connection between the first and second shaftless rotary motors and a respective one of the first and second arms is a resultant force disposed peripheral to the first and second arms.

Abstract: After a cassette is mounted on a cassette mounting part, a control unit instructs a substrate treatment apparatus to start treatment on substrates in the cassette. Thereafter, the control unit indicates, to the substrate treatment apparatus, a cassette on the cassette mounting part to which a substrate is transferred at completion of the treatment. If the transfer destination cassette for the substrate at the completion of treatment has not been indicated when a number of remaining treatment steps for the substrate reaches a predetermined set number, an alarm is given from the substrate treatment apparatus. This alarm is sent from the substrate treatment apparatus to the control unit, and the control unit indicates a transfer destination cassette for the substrate.

Abstract: A robot hand and a robot according to an embodiment include supporting units. The supporting units are arranged on a base and contact the peripheral border of a board to grip the board. At least one of the supporting units rotates while abutting on the peripheral border of the board.

Abstract: Handling device for handling of a wafer in the processing of the wafer with the following features: a carrier with a flat receiving side for holding the wafer, an especially lattice-like grid structure which is raised on the receiving side relative to the receiving side, a flexible cover which covers the grid structure relative to the carrier, sealing it, for fixing of the wafer on the carrier, and a grid space which is bordered by the cover and the carrier can be exposed to negative pressure, characterized in that the grid structure and the cover with the receiving side form an especially trough-shaped receiving space for holding of receiving structures which are provided on the wafer and which are raised relative to the wafer receiving side.

Abstract: A semiconductor processing system and related methodology is disclosed and which includes a processing chamber having an internal cavity and a transfer port; a transfer chamber which is positioned adjacent to the processing chamber; and a transfer apparatus having at least two extendible arms which are positioned within the transfer chamber, and wherein each of the extendible arms carry a semiconductor work piece into and out of the processing chamber by way of the transfer port, and wherein the at least two extendible arms are selectively vertically moveable, and further are each selectively moveable in the direction of the transfer port.

Abstract: A grip mechanism for an end effector includes a grip member configured to be coupled to an effector body. A gripper of the grip member is movable based on movement of the grip member such that the gripper is movable along an engagement path to an engagement position where an object such as a substrate can be retained within a retaining region adjacent to the effector body. End effectors for handling objects incorporating one or more grip mechanisms, and methods of handling an object such as a substrate, are also disclosed.

Abstract: A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.

Abstract: A disk transportation device includes a pair of rotation arms that are rotatable respectively about a fulcrum shaft extending in the same direction as the axial direction of a center shaft of a disk-shaped recording medium in both sides thereof that pinch the transportation passage of the disk-shaped recording medium transported between a disk changer and a disk drive device; and four transportation rollers of which two at a time are rotatably supported on the pair of rotation arms respectively, wherein the four transportation rollers contact the outer peripheral surface of the disk-shaped recording medium respectively and the pair of rotation arms are rotated in opposite directions to each other in a state where one of the transportation rollers at a time is supported at the pair of the rotation arms respectively contact the outer peripheral surface of the disk-shaped recording medium.

Abstract: In an embodiment, the present invention discloses a EUV cleaner system and process for cleaning a EUV carrier. The euv cleaner system comprises separate dirty and cleaned environments, separate cleaning chambers for different components of the double container carrier, gripper arms for picking and placing different components using a same robot handler, gripper arms for holding different components at different locations, horizontal spin cleaning and drying for outer container, hot water and hot air (70C) cleaning process, vertical nozzles and rasterizing megasonic nozzles for cleaning inner container with hot air nozzles for drying, separate vacuum decontamination chambers for outgassing different components, for example, one for inner and one for outer container with high vacuum (e.g., <10?6 Torr) with purge gas, heaters and RGA sensors inside the vacuum chamber, purge gas assembling station, and purge gas loading and unloading station.

Abstract: A method for replacing plural substrates to be processed by a substrate processing apparatus which includes a substrate processing chamber, a load lock chamber, and a conveying apparatus including first and second conveying members for conveying the plural substrates into and out from the substrate processing chamber and the load lock chamber. The method includes the steps of a) conveying a first substrate out from the substrate processing chamber with the first conveying member, b) conveying a second substrate into the substrate processing chamber with the second conveying member, c) conveying the second substrate out from the load lock chamber with the second conveying member, and d) conveying the first substrate into the load lock chamber with the first conveying member. The steps c) and d) are performed between step a) and step b).

Abstract: A device for use in the semiconductor industry includes a robotic arm whose end effector includes at least two prongs designed to hold a substrate carrier. A pushing member located between the prongs can move independently of the prongs and is configured to exert force against the substrate carrier while the prongs are retracted from the substrate carrier, after the substrate carrier has been brought to its intended position. In this manner, the position of the substrate carrier is maintained at its intended position as the prongs are retracted. Each of the prongs may include a claw or gripping member for grasping the substrate carrier.

Abstract: A substrate transport apparatus including a drive section having at least one drive shaft and at least two scara arms operably coupled to the at least one drive shaft, the at least one drive shaft being a common drive shaft for the at least two scara arms effecting extension and retraction of the at least two scara arms, wherein the at least two scara arms are coupled to each other so that, with the at least one drive shaft coupled to the at least two scara arms, rotation of the drive shaft effects extension and retraction of one of the at least two scara arms substantially independent of motion of another of the at least two scara arms.

Abstract: An integrated grip arm for transfer reticles and carrier boxes is disclosed for improving throughput, yield and reliability of transport equipment. The integrated grip arm comprises a plurality of grippers to accommodate a plurality of reticles and carrier boxes without the need of separate arm or gripper changes. The integrated grip arm can further comprise sensor or means to select the right gripper for the right reticles or carrier boxes.

Abstract: An endeffector for handling wafers at a relatively low temperature is disclosed along with an endeffector for handling wafers at a relatively high temperature. Both endeffectors include a base member and uniquely designed support members that are configured to only contact a wafer at the wafer's edge. Further, the support members have an arcuate shape that generally matches a radius of a semiconductor wafer. More specifically, each support member has a curved wafer contact surface that tapers from a maximum radius at a top surface to a minimum radius at a bottom surface. The endeffectors may also include a wafer detection system. The endeffector for handling wafers at relatively low temperatures may also include a pushing device that is used not only to position a wafer but to hold a wafer on the endeffector during acceleration or deceleration of the endeffector caused by a robot arm attached to the endeffector.