Abstract: The present invention discloses a Nb and Al-containing titanium-copper alloy strip, characterized in that the weight percentage composition of the titanium-copper alloy strip comprises: 2.00-4.50 wt % Ti, 0.005-0.4 wt % Nb, and 0.01-0.5 wt % Al, balance being Cu and unavoidable impurities. Preferably, in the microstructure of the titanium-copper alloy strip, the number of Nb and Al-containing intermetallic compound particles with a particle size of 50-500 nm is not less than 1×105/mm2, and the number of Nb and Al-containing intermetallic compound particles with a particle size greater than 1 ?m is not more than 1×103/mm2. Under the condition of ensuring excellent bendability, the titanium-copper alloy strip has excellent stability, especially the stability of mechanical properties at high temperatures. The present invention also relates to a method for producing the titanium-copper alloy strip.

Abstract: A robust hot beverage level display system and method for use in a hot beverage dispenser (12) having a sensing element (105), a level display (28), a controller (50) and an elongate probe carrying at least one elongate electrically conductive trace (202) made from annealed rolled copper with a macrocrystalline structure with elongate, metal, granule-like, cohered metal elements that are aligned with each other in parallel relationship (FIGS. 25 and 28), and an electronics module housing (108), for protectively surrounding the controller (50), formed from a pair of housing sections (109, 110) with a pair of mating connective surfaces (220, 224), potting material with adhesive properties (226) filling the housing (108) and protectively enveloping the controller (218, FIG. 39) and display (217, FIG. 3), and a gapless, voidless adhesive layer made of a contiguous, comingling of cured adhesive and cured potting material interposed between the mating surfaces (220,224).

Abstract: Provided are a high-strength and high-conductivity Cu—Ag—Sc alloy and a preparation method thereof. The preparation method includes the following steps: (1) placing metal Ag and metal Sc in an electric-arc furnace and performing smelting under a vacuum condition, performing cooling to normal temperature in the furnace to obtain an Ag—Sc intermediate alloy; (2) placing the Ag—Sc intermediate alloy, an electrolytic copper and the metal Ag in an induction furnace and performing heating to 1200-1300° C. under a vacuum condition, keeping at the temperature for 10-60 min for smelting, then performing casting and cooling to normal temperature in the furnace to obtain ingots; (3) heating the ingots to 700-850° C. under an inert atmosphere, then performing water quenching to normal temperature to obtain heat-treated ingots; and (4) heating the heat-treated ingots to 400-500° C. under an inert atmosphere, then performing air cooling to normal temperature to obtain the high-strength and high-conductivity Cu—Ag—Sc.

Abstract: A shielded communication cable that includes a twisted wire pair formed by a pair of core wires that each include a conductor and an insulator covering the conductor and that are twisted together; a first sheath covering the pair of core wires that are twisted together; a shield layer covering the first sheath; and a second sheath covering the shield layer, wherein: the shielded communication cable does not include a drain wire, the shield layer is formed by a multilayer body that includes a metal foil layer and a resin layer disposed on one surface of the metal foil layer, and the shielded communication cable is used for communications in an automobile.

Abstract: Copper alloys according to first to third aspects contain Mg at a content of 3.3% by atom to 6.9% by atom, with the balance substantially being Cu and unavoidable impurities, wherein an oxygen content is in a range of 500 ppm by atom or less, and either one or both of the following conditions (a) and (b) are satisfied: (a) when a Mg content is set to X % by atom, an electrical conductivity ? (% IACS) satisfies the following Expression (1), ??{1.7241/(?0.0347×X2+0.6569×X+1.7)}×100??(1); and (b) an average number of intermetallic compounds, which have grain sizes of 0.1 ?m or more and contain Cu and Mg as main components, is in a range of 1 piece/?m2 or less. A copper alloy according to a fourth aspect further contains one or more selected from a group consisting of Al, Ni, Si, Mn, Li, Ti, Fe, Co, Cr, and Zr at a total content of 0.01% by atom to 3.0% by atom, and satisfies the condition (b).

Abstract: Provided are a copper alloy for electric and electronic devices, a copper alloy sheet for electric and electronic devices, a component for electric and electronic devices, a terminal, and a bus bar. The copper alloy for electric and electronic devices includes, as a composition: 0.01 mass % or higher and lower than 0.11 mass % of Zr; 0.002 mass % or higher and lower than 0.03 mass % of Si; and a balance including Cu and unavoidable impurities, in which a ratio Zr/Si of the Zr content (mass %) to the Si content (mass %) is within a range of 2 to 30.

Abstract: A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a conductive layer formed on at least one of surfaces of the base film. In the substrate for a printed circuit board, at least the conductive layer contains titanium in a dispersed manner. The conductive layer preferably contains copper or a copper alloy as a main component. A mass ratio of titanium in the conductive layer is preferably 10 ppm or more and 1,000 ppm or less. The conductive layer is preferably formed by application and heating of a conductive ink containing metal particles. The conductive ink preferably contains titanium or a titanium ion. The metal particles are preferably obtained by a titanium redox process including reducing metal ions using trivalent titanium ions as a reducing agent in an aqueous solution by an action of the reducing agent.

Abstract: Provided are a Cu—Zr-based copper alloy plate which retains satisfactory mechanical strength and, at the same time, has a good balance of bending formability and bending elastic limit at a high level and a process for manufacturing the Cu—Zr-based copper alloy plate. The copper alloy plate contains 0.05% to 0.2% by mass of Zr and a remainder including Cu and unavoidable impurities, and the average value of KAM values measured by an EBSD method using a scanning electron microscope equipped with a backscattered electron diffraction pattern system is 1.5° to 1.8°, the R/t ratio is 0.1 to 0.6 wherein R represents the minimum bending radius which does not cause a crack and t represents the thickness of the plate in a W bending test, and the bending elastic limit is 420 N/mm2 to 520 N/mm2.

Abstract: Disclosed is a Cu—Co—Si-based copper alloy for electronic materials, which is capable of achieving high levels of strength, electrical conductivity, and also anti-setting property; and contains 0.5 to 3.0% by mass of Co, 0.1 to 1.0% by mass of Si, and the balance of Cu and inevitable impurities; wherein out of second phase particles precipitated in the matrix a number density of the particles having particle size of 5 nm or larger and 50 nm or smaller is 1×1012 to 1×1014 particles/mm3, and a ratio of the number density of particles having particle size of 5 nm or larger and smaller than 10 nm relative to the number density of particles having particle size of 10 nm or larger and 50 nm or smaller is 3 to 6.

Abstract: A method of making dispersion-strengthened alloy particles involves melting an alloy having a corrosion and/or oxidation resistance-imparting alloying element, a dispersoid-forming element, and a matrix metal wherein the dispersoid-forming element exhibits a greater tendency to react with a reactive species acquired from an atomizing gas than does the alloying element. The melted alloy is atomized with the atomizing gas including the reactive species to form atomized particles so that the reactive species is (a) dissolved in solid solution to a depth below the surface of atomized particles and/or (b) reacted with the dispersoid-forming element to form dispersoids in the atomized particles to a depth below the surface of said atomized particles. The atomized alloy particles are solidified as solidified alloy particles or as a solidified deposit of alloy particles.

Abstract: A sheet material of a copper alloy has a chemical composition including 1.2 to 5.0 wt % of titanium, and the balance being copper and unavoidable impurities, the material having a mean crystal grain size of 5 to 25 ?m and (maximum crystal grain size?minimum crystal grain size)/(mean crystal grain size) being 0.20 or less, and the material having a crystal orientation satisfying I{420}/I0{420}>1.0, assuming that the intensities of X-ray diffraction on the {420} crystal plane of the surface of the material and the standard powder of pure copper are I{420} and I0{420}, respectively.

Abstract: Copper alloys according to first to third aspects contain Mg at a content of 3.3% by atom to 6.9% by atom, with the balance substantially being Cu and unavoidable impurities, wherein an oxygen content is in a range of 500 ppm by atom or less, and either one or both of the following conditions (a) and (b) are satisfied: (a) when a Mg content is set to X % by atom, an electrical conductivity ? (% IACS) satisfies the following Expression (1), ??{1.7241/(?0.0347×X2+0.6569×X+1.7)}×100 (1); and (b) an average number of intermetallic compounds, which have grain sizes of 0.1 ?m or more and contain Cu and Mg as main components, is in a range of 1 piece/?m2 or less. A copper alloy according to a fourth aspect further contains one or more selected from a group consisting of Al, Ni, Si, Mn, Li, Ti, Fe, Co, Cr, and Zr at a total content of 0.01% by atom to 3.0% by atom, and satisfies the condition (b).

Abstract: There is provided cryogenic milled nanophase copper alloys and methods of making the alloys. The alloys are fine grained having grains in the size range from about 2 to about 100 nanometers, and greater. The nanophase alloys possess desirable physical properties stemming from the fine grain size, such as potentially high strength. Some embodiments of the cryogenic milled copper alloys may also be tailored for ductility, toughness, fracture resistance, corrosion resistance, fatigue resistance and other physical properties by balancing the alloy composition. In addition, embodiments of the alloys generally do not require extensive or expensive post-cryogenic milling processing.

Abstract: A copper alloy material includes an additional element M including Ti, and a balance having copper and an inevitable impurity. An atomic ratio of the additional element M to oxygen is in a range of 0.33?M/O?1.5.

Abstract: A copper alloy wire rod according to the present invention includes a copper parent phase and short fiber-shaped composite phases which are dispersed in the copper parent phase and which contain Cu8Zr3 and Cu, wherein the content of Zr is within the range of 0.2 atomic percent or more and 1.0 atomic percent or less. This copper alloy wire rod can be obtained by including the steps of melting a raw material in such a way that a copper alloy having a Zr content within the above-described range of is produced so as to obtain a molten metal in a melting step, casting the molten metal so as to obtain an ingot in a casting step, and subjecting the ingot to cold wire drawing in a wire drawing step, wherein the wire drawing step and a treatment after the wire drawing step are performed at lower than 500° C.

Abstract: There is provided cryogenic milled copper alloys and methods of making the alloys. The alloys are fine grained and possess desirable physical properties stemming from the fine grain size. Embodiments include desirable physical properties, such as potentially high strength. Some embodiments of the cryogenic milled copper alloys may also be tailored for ductility, toughness, fracture resistance, corrosion resistance, fatigue resistance and other physical properties by balancing the alloy composition. In addition, embodiments of the alloys generally do not require extensive or expensive post-cryogenic milling processing.

Abstract: The present invention provides a flexible flat cable having high conductivity and high bending durability, and a method for manufacturing the same. The present invention is a flexible flat cable comprising conductors and insulating films applied over the conductors, wherein the conductor is comprised of at least one additive element selected from the group consisting of magnesium (Mg), zirconium (Zr), niobium (Nb), calcium (Ca), vanadium (V), nickel (Ni), manganese (Mn), titanium (Ti), and chromium (Cr); 2 mass-ppm or more of oxygen; and the balance being inevitable impurity and copper, wherein the conductor has such a recrystallized texture that the size of crystal grains in the inner area of the conductor is large and that of in the surface area thereof is smaller than that of the inner area, wherein both sides of the conductor are sandwiched between insulating films.

Abstract: Provided is a copper alloy plate that is for an FPC substrate and that has superior heat dissipation, repeated bending workability, shape retaining properties, and heat resistance. The copper alloy plate contains at least 0.01 mass % of the total of at least one element selected from the group consisting of Ag, Cr, Fe, In, Ni, P, Si, Sn, Ti, Zn, and Zr, contains no more than 1.0 mass % of Ag, no more than 0.08 mass % of Ti, no more than 2.0 mass % of Ni, no more than 3.5 mass % of Zn, and no more than 0.5 mass % of Cr, Fe, In, P, Si, Sn, and Zr by the total of the at least one element selected from the group, the remainder comprising Cu and impurities, has a conductivity of at least 60% IACS, has a tensile strength of at least 350 MPa, and has I(311)/IO(311) determined by X-ray diffraction in the thickness direction of the plate surface that satisfies the formula I(311)/IO(311)?0.5.

Abstract: Provided are a soft dilute copper alloy material, a soft dilute copper alloy wire, a soft dilute copper alloy sheet, a soft dilute copper alloy stranded wire, and a cable, a coaxial cable and a composite cable using same. The disclosed soft-3dilute-copper-alloy material contains: copper; at least one additional element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Mn, and Cr; and inevitable impurities as the remainder. The soft dilute copper alloy material is characterized in that the average grain size is at most 20 ?m in the surface layer up to a depth of 50 ?m from the surface.

Abstract: The zirconium content of the alloy composition of a copper alloy foil of the present invention is 3.0 to 7.0 atomic percent, and the copper alloy foil includes copper matrix phases and composite phases composed of copper-zirconium compound phases and copper phases. As shown in FIG. 1, the copper matrix phases and the composite phases form a matrix phase-composite phase layered structure and are arranged alternately parallel to a rolling direction as viewed in a cross-section perpendicular to the width direction. In addition, the copper-zirconium compound phases and the copper phases in the composite phases form a composite phase inner layered structure and are arranged alternately parallel to the rolling direction at a phase pitch of 50 nm or less as viewed in the above cross-section. This double layered structure presumably makes the copper alloy foil densely layered to provide a strengthening mechanism similar to multilayer reinforced composite materials.

Abstract: The zirconium content of the alloy composition of a copper alloy wire is 3.0 to 7.0 atomic percent; and the copper alloy wire includes copper matrix phases and composite phases composed of copper-zirconium compound phases and copper phases. The copper matrix phases and the composite phases form a matrix phase-composite phase fibrous structure and are arranged alternately parallel to an axial direction as viewed in a cross-section parallel to the axial direction and including a central axis. The copper-zirconium compound phases and the copper phases in the composite phases also form a composite phase inner fibrous structure and are arranged alternately parallel to the axial direction at a phase pitch of 50 nm or less as viewed in the above cross-section. This double fibrous structure presumably makes the copper alloy wire densely fibrous to provide a strengthening mechanism similar to the rule of mixture for fiber-reinforced composite materials.

Abstract: A Cu—Fe—P alloy sheet that is provided with the high strength and with the improved resistance of peel off of oxidation film, in order to deal with problems such as package cracks and peeling, is provided. A copper alloy sheet for electric and electronic parts according to the present invention is a copper alloy sheet containing Fe: 0.01 to 0.50 mass % and P: 0.01 to 0.15 mass %, respectively, with the remainder of Cu and inevitable impurities. A centerline average roughness Ra is 0.2 ?m or less and a maximum height Rmax is 1.5 ?m or less, and Kurtosis (degree peakedness) Rku of roughness curve is 5.0 or less, in measurement of the surface roughness of the copper alloy sheet in accordance with JIS B0601.

Abstract: A Cu—Fe—P alloy sheet that is provided with the high strength and with the improved resistance of peel off of oxidation film, in order to deal with problems such as package cracks and peeling, is provided. A copper alloy sheet for electric and electronic parts according to the present invention is a copper alloy sheet containing Fe: 0.01 to 0.50 mass % and P: 0.01 to 0.15 mass %, respectively, with the remainder of Cu and inevitable impurities. A centerline average roughness Ra is 0.2 ?m or less and a maximum height Rmax is 1.5 ?m or less, and Kurtosis (degree peakedness) Rku of roughness curve is 5.0 or less, in measurement of the surface roughness of the copper alloy sheet in accordance with JIS B0601.

Abstract: To provide a production process of an electrode catalyst for fuel cell whose initial voltage is high and whose endurance characteristics, especially, whose voltage drop being caused by high-potential application is less. A production process according to the present invention of an electrode catalyst for fuel cell is characterized in that: it includes: a dispersing step of dispersing a conductive support in a solution; a loading step of dropping a platinum-salt solution, a base-metal-salt solution and an iridium-salt solution to the resulting dispersion liquid, thereby loading respective metallic salts on the conductive support as hydroxides under an alkaline condition; and an alloying step of heating the conductive support with metallic hydroxides loaded in a reducing atmosphere to reduce them, thereby alloying them.

Abstract: A method for fabricating a copper alloy. Cu and Cr, Zr, and Sn to be doped to the Cu are melt to cast a copper alloy material. Hot working is carried out on the copper alloy material to form a plate material having a rolled texture. Heat treatment is carried out on the plate material. Cold rolling with workability of 80% or more and less than 90% is carried out on the plate material after the heat treatment to form an intermediate plate material. Aging treatment is carried out on the intermediate plate material. Another cold rolling with workability of 20% to 40% is carried out as finish rolling on the intermediate plate material after the aging treatment step. The intermediate plate material after the finish rolling step is heated as stress relief annealing.

Abstract: A melt-solidified substance includes melt-solidified portions formed by welding, build-up spray welding, metallizing or fusing. The melt-solidified portions have the alloy composition containing Zr: 0.0005 to 0.05 mass %, P: 0.01 to 0.34 mass %, Cu: the remainder and satisfying the relationship between the contents of P and Zr, [P]/[Zr]=0.3 to 20, and the mean grain size in the macrostructure after melt-solidification is 300 ?m or less. If Fe and/or Ni are contained in the melt-solidified portion as inevitable impurities, the content of Fe or Ni is restricted to be 0.3 mass % or less when either Fe or Ni is contained, and the total content of Fe and Ni is restricted to be 0.4 mass % or less when both Fe and Ni are contained.

Abstract: A dilute copper alloy material includes, based on a total mass of the dilute copper alloy material, 2 to 12 mass ppm of sulfur, 2 to 30 mass ppm of oxygen, 4 to 55 mass ppm of titanium, and a balance consisting of pure copper and an inevitable impurity. A part of the sulfur and the titanium forms a compound or an aggregate of TiO, TiO2, TiS or Ti—O—S, and an other part of the sulfur and the titanium forms a solid solution. TiO, TiO2, TiS and Ti—O—S distributed in a crystal grain of the dilute copper alloy material are not more than 200 nm, not more than 1000 nm, not more than 200 nm and not more than 300 nm, respectively, in particle size thereof, and not less than 90% of particles distributed in a crystal grain of the dilute copper alloy material are not more than 500 nm or less in particle size.

Abstract: A copper alloy material consists of, by mass % Ti: 0.01-2.5%, Cr: 0.01-0.5%, Fe: 0.01% or more and less than 1%, and the balance Cu and impurities. The copper alloy possesses excellent strength, electrical conductivity, and workability without containing any environmentally harmful elements. These properties are attained by control of the total number and the diameter of precipitates and inclusions having a diameter of 1 ?m, and control of the relationship between tensile strength TS (MPa) and electrical conductivity, IACS (%). The copper alloy material is a sheet and the relationship between tensile strength and the bending workability in a bad way B90 of the copper alloy material as well as the relationship between elongation and tensile strength are also controlled with respect to each other for property improvement.

Abstract: The present invention relates to a nanocrystalline metallic material, particularly to nano-twin copper material with ultrahigh strength and high electrical conductivity and its preparation method. High-purity polycrystalline Cu material with a microstructure of roughly equiaxed submicron-sized grains (300-1000 nm) has been produced by pulsed electrodeposition technique, by which high density of growth-in twins with nano-scale twin spacing were induced in the grains. Inside each grain, there are high densities of growth-in twin lamellae. The twin lamellae with the same orientations are inter-parallel, and the twin spacing ranges from several nanometers to 100 nm with a length of 100-500 nm. This Cu material invented has more excellent performance than existing ones.

Abstract: A copper base alloy for electronic parts containing 2.0 to 4.0 mass % of Ti and 0.05 to 0.50 mass % of one or more of Fe, Co, Ni, Si, Cr, V, Nb, Zr, B and P, wherein the content of other impurity elements is 0.010 mass % or less in total, and the content of each of C and O is 0.010 mass % or less. This copper base alloy can be used without heat treatment after its press working into a part of a connector or the like; or can be also used in a state in which the alloy is subjected to a specific heat treatment so as to be improved in spring characteristics after its press working.

Abstract: A Cu—Fe—P copper alloy sheet which has the high strength and the high electrical conductivity compatible with excellent bendability is provided. The Cu—Fe—P copper alloy sheet contains 0.01% to 3.0% of Fe and 0.01% to 0.3% of P on a percent by mass basis wherein the orientation density of the Brass orientation is 20 or less and the sum of the orientation densities of the Brass orientation, the S orientation, and the Copper orientation is 10 or more and 50 or less in the microstructure of the copper alloy sheet.

Abstract: An age-hardenable copper alloy made of 1.2 to 2.7% cobalt, which is able to be partially replaced by nickel, 0.3 to 0.7% beryllium, 0.01 to 0.5% zirconium, optionally 0.005 to 0.1% magnesium and/or iron and in some instances up to a maximum of 0.15% of at least one element from the group including niobium, tantalum, vanadium, hafnium, chromium, manganese, titanium and cerium. The remainder is copper and includes production-conditioned impurities and usual processing-additives. This copper alloy is used as the material for producing mold blocks for the side dams of continuous strip-casting installations.

Abstract: To provide a Cu-based amorphous alloy having a glass-forming ability higher than that of a Cu—Zr—Ti amorphous alloy and a Cu—Hf—Ti amorphous alloy, as well as excellent workability and excellent mechanical properties without containing large amounts of Ti. A Cu-based amorphous alloy characterized by containing 90 percent by volume or more of amorphous phase having a composition represented by Formula: Cu100-a-b(Zr,Hf)a(Al,Ga)b [in Formula, a and b are on an atomic percent basis and satisfy 35 atomic percent?a?50 atomic percent and 2 atomic percent?b?10 atomic percent], wherein the temperature interval ?Tx of supercooled liquid region is 45 K or more, the temperature interval being represented by Formula ?Tx=Tx?Tg (where Tx represents a crystallization initiation temperature and Tg represents a glass transition temperature.

Abstract: There is provided cryogenic milled copper alloys and methods of making the alloys. The alloys are fine grained and possess desirable physical properties stemming from the fine grain size. Embodiments include desirable physical properties, such as potentially high strength. Some embodiments of the cryogenic milled copper alloys may also be tailored for ductility, toughness, fracture resistance, corrosion resistance, fatigue resistance and other physical properties by balancing the alloy composition. In addition, embodiments of the alloys generally do not require extensive or expensive post-cryogenic milling processing.

Abstract: The invention relates to a conductive material consisting of an alloy that contains copper, for use as a plug-in or clip connection. Said material comprises a cover layer that is deposited on at least some sections of the contact surface, said layer consisting at least of a support layer and an adhesive layer. The anti-friction layer has a carbon content greater or less than 40 and less than or equal to 70 atomic percent.

Abstract: This copper alloy contains at least zirconium in an amount of not less than 0.005% by weight and not greater than 0.5% by weight, includes a first grain group including grains having a grain size of not greater than 1.5 ?m, a second grain group including grains having a grain size of greater than 1.5 ?m and less than 7 ?m, the grains having a form which is elongated in one direction, and a third grain group including grains having a grain size of not less than 7 ?m, and also the sum of ? and ? is greater than ?, and ? is less than ?, where ? is a total area ratio of the first grain group, ? is a total area ratio of the second grain group, and ? is a total area ratio of the third grain group, based on a unit area, and ?+?+?=1.

Abstract: A copper-base alloy with increased melting point above 1000° C., which is resistant or immune to carburization, metal dusting and coking, resistant to oxidation at elevated temperatures. The alloy has the following composition (in weight-%): Al 4–15, Si 0.1–6, Mo 0.5–40, W 0–40, where the total of Mo and W do not exceed 40%, one or more of the group of Rare Earth Metals (REM), such as yttrium, hafnium, zirconium, lanthanum and/or cerium, up to 1.0 weight-% of each element or a total of maximum 3.0 weight-%, Cu balance and normally occurring alloying additions and impurities. A method for the alloy's production, and the alloy's use as construction components in CO-containing atmospheres, ammonia containing atmospheres, and/or hydrocarbon containing atmospheres or solid carbon containing processes, are also disclosed.

Abstract: The present invention provides a Cu—Cr—Zr alloy material excellent in fatigue and intermediate temperature characteristics, which comprises 0.05 to 1.0% by mass of Cr and 0.05 to 0.25% by mass of Zr with a balance of Cu and inevitable impurities. The alloy comprises inclusion particles based on any one of Zr and a Cu—Zr alloy having a diameter of 0.1 ?m or more, and the proportion of the inclusion particles containing 10% or more of sulfur as one of the inevitable impurities is one particle/mm2.

Abstract: Copper alloys having excellent strength while suppressing irregularity of wavelengths, etc., of the fluctuations and having excellent bendability are obtained while suppressing growth of crystal grains. The copper-based alloy contains 2.0 to 4.0 mass % of Ti, and the total content of unavoidable impurity elements Pb, Sn, Zn, Mn, Fe, Co, Ni, S, Si, Al, P, As, Se, Te, Sb, Bi, Au, and Ag is not more than 0.1 mass %, and contents of each element thereof is not more than 0.01 mass %, and not less than 80% of quality of a second-phase particles having an area of not less than 0.01 &mgr;m2 observed by a cross section speculum contains not less than 3% of the total amount of the above described unavoidable impurity elements in composition.

Abstract: The present invention provides a Cu—Cr—Zr alloy material excellent in fatigue and intermediate temperature characteristics, which comprises 0.05 to 1.0% by mass of Cr and 0.05 to 0.25% by mass of Zr with a balance of Cu and inevitable impurities. The alloy comprises inclusion particles based on any one of Zr and a Cu—Zr alloy having a diameter of 0.1 &mgr;m or more, and the proportion of the inclusion particles containing 10% or more of sulfur as one of the inevitable impurities is one particle/mm2.

Abstract: The metallic material consists of an alloy including mainly Cu, Mo in an amount of 0.1 to 3.0% by weight and one or a plurality of elements selected from a group consisting of Al, Au, Ag, Ti, Ni Co and Si in a total amount of 0.1 to 3.0% by weight. In the metallic material, Mo is added to Cu so that Mo will be homogeneously mixed in a grain boundary of Cu, resulting in improvement of atmospheric corrosion resistance.

Abstract: An age-hardening copper-base alloy and processing method to make a commercially useful strip product for applications requiring high yield strength and moderately high electrical conductivity, in a strip, plate, wire, foil, tube, powder or cast form. The alloys are particularly suited for use in electrical connectors and interconnections. The alloys contain Cu—Ti—X where X is selected from Ni, Fe, Sn, P, Al, Zn, Si, Pb, Be, Mn, Mg, Ag, As, Sb, Zr, B, Cr and Co. and combinations thereof. The alloys offer excellent combinations of yield strength, and electrical conductivity, with excellent stress relaxation resistance. The yield strength is at least of 105 ksi and the electrical conductivity is at least 50% IACS.

Abstract: A copper alloy that consists essentially of, by weight, from 0.15% to 0.7% of chromium, from 0.005% to 0.3% of silver, from 0.01% to 0.15% of titanium, from 0.01% to 0.10% of silicon, up to 0.2% of iron, up to 0.5% of tin, and the balance copper and inevitable impurities has high strength, a yield strength in excess of 80 ksi, and high electrical conductivity, in excess of 80% IACS. The alloy further has substantially isotropic bend characteristics when the processing route includes a solution heat anneal above 850° C. and subsequent cold rolling into sheet, strip or foil interspersed by bell annealing. As a result, the alloy is particularly suited for forming into box-type electrical connectors for both automotive or multimedia applications. The alloy is also suitable for forming into a rod, wire or section.

Abstract: Superior bendability in a copper alloy and further strength improvement ensures characteristics which are sufficiently superior in view of essential qualities of strength of titanium-copper. 2.0 to 4.0 mass % of Ti, 0.01 to 0.50 mass % of one or more than one kind of element from among Fe, Co, Ni, Cr, V, Zr, B, and P as the third element group are contained, and not less than 50% of the total content of these elements is made to exist as second-phase particles.

Abstract: The present invention provides Cu-base amorphous alloys comprising an amorphous phase of 90% or more by volume fraction. The amorphous phase has a composition represented by the formula: Cu100−a−b(Zr+Hf)aTib or Cu100−a−b−c−d(Zr+Hf)aTibMcTd, wherein M is one or more elements selected from the group consisting of Fe, Cr, Mn, Ni, Co, Nb, Mo, W, Sn, Al, Ta and rare earth elements, T is one or more elements selected from the group consisting of Ag, Pd, Pt and Au, and a, b, c and d are atomic percentages falling within the following ranges: 5<a≦55, 0≦b≦45, 30<a+b≦60, 0.5≦c≦5, 0≦d≦10. The Cu-base amorphous alloy has a high glass-forming ability as well as excellent mechanical properties and formability, and can be formed as a rod or plate material with a diameter or thickness of 1 mm or more and an amorphous phase of 90% or more by volume fraction, through a metal mold casting process.

Abstract: The optical recording medium has a substrate (1) with a recording layer (2), a reflecting layer (3) and a protecting layer (4) laminated successively on the substrate (1). The reflecting layer (3) is a thin film of an alloy containing 99.7 to 73.0% by weight of Cu as a major component, as well as, 0.2 to 18.0% by weight of Ag and 0.1 to 9.0% by weight of Ti. The reflecting layer has a film thickness of 50 nm to 150 nm. The optical recording medium provided with the reflecting layer (3) shows improved corrosion resistance and also retains high reflectance. The present invention also provides a target for forming the reflecting layer (3).

Abstract: The material for a metal strip for manufacturing electrical contact component parts has, expressed in percent by weight, the following composition: nickel (Ni) 0.5-3.5% silicon (Si) 0.08-1.0%  tin (Sn) 0.1-1.0% zinc (Zn) 0.1-1.0% zirconium (Zr) 0.005-0.2%  silver (Ag) 0.02- 0.5%  The remainder is copper and includes impurities caused by smelting.

Abstract: A high strength copper alloy is made of a prescribed material composed of Cu and inevitable impurities as well as titanium (Ti) at 0.1 to 4 weight percent, wherein it is possible to further include at least one of Ag, Ni, Fe, Si, Sn, Mg, Zn, Cr, and P at a prescribed weight percent ranging from 0.01 to 2 in total. In a manufacturing method, the material is subjected to cold rolling, precipitation treatment, and additional cold rolling sequentially, wherein the reduction rate of the additional cold rolling is set to 3% or more, and the total reduction rate of the cold rolling and the additional cold rolling ranges from 15% to 50%, so that a ratio of yield strength versus tensile strength is set to 0.9 or more. In addition, it is possible to perform stress relaxation annealing after the additional cold rolling upon heating of the material for a prescribed time.

Abstract: In the present invention, forming is carried out by employing casting to rapidly solidify molten material comprising a copper base alloy containing 3 to 20% Ag (mass % hereinafter), 0.5 to 1.5% Cr and 0.05 to 0.5% Zr. Next, an aging treatment for precipitation is carried out at 450 to 500° C., and the formed article is obtained by precipitation strengthening. In addition, in the aforementioned copper base alloy, molten material comprising a copper base alloy containing Ag in the amount of 3 to 8.5% is solidified by casting, and the solidified article or the hot worked article thereof is subjected to an aging treatment for precipitation and a thermomechanical treatment using forging or rolling, and the casting is obtained by forming the material into a specific shape and carrying out precipitation strengthening.

Abstract: An age-hardenable copper alloy made of 1.2 to 2.7% cobalt, which is able to be partially replaced by nickel, 0.3 to 0.7% beryllium, 0.01 to 0.5% zirconium, optionally 0.005 to 0.1% magnesium and/or iron and in some instances up to a maximum of 0.15% of at least one element from the group including niobium, tantalum, vanadium, hafnium, chromium, manganese, titanium and cerium. The remainder is copper and includes production-conditioned impurities and usual processing additives. This copper alloy is used as the material for producing mold blocks for the side dams of continuous strip-casting installations.