Abstract: A copper alloy for an electronic and electric device is provided. The copper alloy includes: Mg in a range of 0.15 mass % or more and less than 0.35 mass %; and a Cu balance including inevitable impurities, wherein the electrical conductivity of the copper alloy is more than 75% IACS, and a strength ratio TSTD/TSLD, which is calculated from strength TSTD obtained in a tensile test performed in a direction perpendicular to a rolling direction and strength TSLD obtained in a tensile test performed in a direction parallel to a rolling direction, is more than 0.9 and less than 1.1. The copper alloy may further include P in a range of 0.0005 mass % or more and less than 0.01 mass %.

Abstract: A copper alloy for electronic devices has a low Young's modulus, high proof stress, high electrical conductivity and excellent bending formability and is appropriate for a component for electronic devices including a terminal, a connector, a relay and a lead frame. Also a method of manufacturing a copper alloy utilizes a copper alloy plastic working material for electronic devices, and a component for electronic devices. The copper alloy includes Mg at 3.3 to 6.9 at %, with a remainder substantially being Cu and unavoidable impurities. When a concentration of Mg is X at %, an electrical conductivity ? (% IACS) is in a range of ??{1.7241/(?0.0347×X2+0.6569×X+1.7)}×100, and an average grain size is in a range of 1 ?m-100 ?m. In addition, an average grain size of a copper material after an intermediate heat treatment and before finishing working is in a range of 1 ?m-100 ?m.

Abstract: Provided is a copper or copper alloy target/copper alloy backing plate assembly in which the anti-eddy current characteristics and other characteristics required in a magnetron sputtering target are simultaneously pursued in a well balanced manner. This copper or copper alloy target/copper alloy backing plate assembly is used for magnetron sputtering, and the copper alloy backing plate is formed from low beryllium copper alloy or Cu—Ni—Si-based alloy. Further, with this copper or copper alloy target/copper alloy backing plate assembly, the copper alloy backing plate has electrical conductivity of 35 to 60% (IACS), and 0.2% proof stress of 400 to 850 MPa.

Abstract: Copper alloys according to first to third aspects contain Mg at a content of 3.3% by atom to 6.9% by atom, with the balance substantially being Cu and unavoidable impurities, wherein an oxygen content is in a range of 500 ppm by atom or less, and either one or both of the following conditions (a) and (b) are satisfied: (a) when a Mg content is set to X % by atom, an electrical conductivity ? (% IACS) satisfies the following Expression (1), ??{1.7241/(?0.0347×X2+0.6569×X+1.7)}×100 (1); and (b) an average number of intermetallic compounds, which have grain sizes of 0.1 ?m or more and contain Cu and Mg as main components, is in a range of 1 piece/?m2 or less. A copper alloy according to a fourth aspect further contains one or more selected from a group consisting of Al, Ni, Si, Mn, Li, Ti, Fe, Co, Cr, and Zr at a total content of 0.01% by atom to 3.0% by atom, and satisfies the condition (b).

Abstract: One aspect of this copper alloy for an electronic device is composed of a binary alloy of Cu and Mg which includes Mg at a content of 3.3 to 6.9 atomic %, with a remainder being Cu and inevitable impurities, and a conductivity ? (% IACS) is within the following range when the content of Mg is given as A atomic %, ??{1.7241/(?0.0347×A2+0.6569×A+1.7)}×100. Another aspect of this copper alloy is composed of a ternary alloy of Cu, Mg, and Zn which includes Mg at a content of 3.3 to 6.9 atomic % and Zn at a content of 0.1 to 10 atomic %, with a remainder being Cu and inevitable impurities, and a conductivity ? (% IACS) is within the following range when the content of Mg is given as A atomic % and the content of Zn is given as B atomic %, ??{1.7241/(X+Y+1.7)}×100, X=?0.0347×A2+0.6569×A and Y=?0.0041×B2+0.2503×B.

Abstract: This Cu alloy sputtering target includes, in terms of atomic percent: Al: 1% to 10%; and Ca: 0.1% to 2%, with the balance being Cu and 1% or less of inevitable impurities. This thin film transistor includes: a gate electrode layer joined to the surface of a glass substrate through an adhesion layer; a gate insulating layer; a Si semiconductor layer; an n-type Si semiconductor layer; a barrier layer; a wire layer composed of a drain electrode layer and a source electrode layer, both of which are mutually divided; a passivation layer; and a transparent electrode layer, wherein the barrier layer is formed by sputtering under an oxidizing atmosphere using the Cu alloy sputtering target.

Abstract: A sorption apparatus for gas purification consists of a vertical flow column with gas tight walls, inlet and outlet filters, and a disintegrator producing reactive powder in the medium of the gas to be purified at ambient temperature, i.e. without forced heating or cooling. A process of sorption purification of gas flow using the sorption apparatus, where the reactive powder is produced as needed by mechanical milling of a monolithic ingot structure in the medium of the gas to be purified and a reactive sorption material. The composition of the sorption material corresponds to an eutectic on the basis of a reactive metal Me or an intermetallic compound MenM with a relatively low melting point, where M is the second metal and n 2:1, wherein the sorption material is obtained according to the above process.

Abstract: The present invention relates to a brazing alloy, and particularly, to a brazing alloy comprising copper (Cu), phosphorus (P), and strontium (Sr) and further including any one element of indium (In), boron (B), silver (Ag), tin (Sn), cesium (Cs), germanium (Ge), and nickel (Ni). The present invention includes 5.0 to 7.5 wt % of phosphorus (P) and 0.1 to 5.0 wt % of strontium (Sr), in which the remainder is composed of copper (Cu). The brazing alloy according to an exemplary embodiment of the present invention comprises copper (Cu), phosphorus (P), and strontium (Sr) unlike the existing alloy element and further includes, as alloy components, one or more elements selected from a group consisting of indium (In), boron (B), silver (Ag), and tin (Sn), such that the brazing alloy includes no silver (Ag) or the silver (Ag) content is remarkably reduced compared to an existing brazing alloy containing silver (Ag).

Abstract: A Cu—Fe—P alloy sheet that is provided with the high strength and with the improved resistance of peel off of oxidation film, in order to deal with problems such as package cracks and peeling, is provided. A copper alloy sheet for electric and electronic parts according to the present invention is a copper alloy sheet containing Fe: 0.01 to 0.50 mass % and P: 0.01 to 0.15 mass %, respectively, with the remainder of Cu and inevitable impurities. A centerline average roughness Ra is 0.2 ?m or less and a maximum height Rmax is 1.5 ?m or less, and Kurtosis (degree peakedness) Rku of roughness curve is 5.0 or less, in measurement of the surface roughness of the copper alloy sheet in accordance with JIS B0601.

Abstract: A Cu—Fe—P alloy sheet that is provided with the high strength and with the improved resistance of peel off of oxidation film, in order to deal with problems such as package cracks and peeling, is provided. A copper alloy sheet for electric and electronic parts according to the present invention is a copper alloy sheet containing Fe: 0.01 to 0.50 mass % and P: 0.01 to 0.15 mass %, respectively, with the remainder of Cu and inevitable impurities. A centerline average roughness Ra is 0.2 ?m or less and a maximum height Rmax is 1.5 ?m or less, and Kurtosis (degree peakedness) Rku of roughness curve is 5.0 or less, in measurement of the surface roughness of the copper alloy sheet in accordance with JIS B0601.

Abstract: Magnesium-copper compositions are used for the evaporation of magnesium and container up to 43.34% by weight magnesium.

Abstract: To provide a production process of an electrode catalyst for fuel cell whose initial voltage is high and whose endurance characteristics, especially, whose voltage drop being caused by high-potential application is less. A production process according to the present invention of an electrode catalyst for fuel cell is characterized in that: it includes: a dispersing step of dispersing a conductive support in a solution; a loading step of dropping a platinum-salt solution, a base-metal-salt solution and an iridium-salt solution to the resulting dispersion liquid, thereby loading respective metallic salts on the conductive support as hydroxides under an alkaline condition; and an alloying step of heating the conductive support with metallic hydroxides loaded in a reducing atmosphere to reduce them, thereby alloying them.

Abstract: The present invention provides a forged beryllium-copper bulk material, wherein the hardness of the central portion is 0 to 10% higher than that of the front surface, the Vickers hardness of the central portion is 240 or more, the tensile strength is 800 N/mm2 or more, and the bulk material having uniformity to such an extent that variation in measured values of the tensile strength in arbitrary directions is within 5%.

Abstract: Equestrian bits are manufactured with the mouthpiece component comprising a copper alloy with composition; 65-80% by weight copper, 0-2% tin and the remainder being zinc including other elements. In a further embodiment, the copper alloy comprises 70-73% copper, 0.9-1.2% tin, 28% zinc the remainder being other elements at a %, by weight, of less than 1%. The alloy of the invention provides a horse bit mouthpiece which rapidly achieves thermal equilibration when placed in, or moved within, the mouth and has characteristic strength sufficient for the intended use.

Abstract: The present invention relates to a nanocrystalline metallic material, particularly to nano-twin copper material with ultrahigh strength and high electrical conductivity and its preparation method. High-purity polycrystalline Cu material with a microstructure of roughly equiaxed submicron-sized grains (300-1000 nm) has been produced by pulsed electrodeposition technique, by which high density of growth-in twins with nano-scale twin spacing were induced in the grains. Inside each grain, there are high densities of growth-in twin lamellae. The twin lamellae with the same orientations are inter-parallel, and the twin spacing ranges from several nanometers to 100 nm with a length of 100-500 nm. This Cu material invented has more excellent performance than existing ones.

Abstract: A Cu—Fe—P copper alloy sheet which has the high strength and the high electrical conductivity compatible with excellent bendability is provided. The Cu—Fe—P copper alloy sheet contains 0.01% to 3.0% of Fe and 0.01% to 0.3% of P on a percent by mass basis wherein the orientation density of the Brass orientation is 20 or less and the sum of the orientation densities of the Brass orientation, the S orientation, and the Copper orientation is 10 or more and 50 or less in the microstructure of the copper alloy sheet.

Abstract: A copper alloy having superior thermal conductivity comparable to that of conventional materials, can be produced at low cost. An oxygen free copper, a base material of a Cu—B alloy were melted in vacuo by a casting method, B and at least one element selected from Mg, Ni, Co, Al, Si, Fe, Zr, and Mn are added into the molten metal wherein the content of each element or the alloy of Ni—B, Fe—B, Cu—Mg, and so forth becoming the predetermined content. This alloy is cast into an ingot of 12 mm square, heated at 600 to 900° C. for 1 hour, and the cast was rolled to be 3 mm by hot rolling. After these steps, heat treatment at 600 to 900° C. was provided and processed into predetermined shape.

Abstract: In accordance with the present invention, a copper alloy wire having high strength and high conductivity is provided. The copper alloy wire is formed from a copper base alloy containing from 0.05 to 0.9 wt % magnesium and more than 15 ppm impurities in total. The wire has a single end diameter no greater than 0.10 inches, a tensile strength of at least 100 ksi, and an electrical conductivity greater than 60% IACS. A process for producing the copper wire of the present invention is also described.

Abstract: The yield strength of UNS C17460 BeCu alloy can be significantly enhanced without compromising electrical conductivity or bend formability by age hardening the alloy during manufacture using two separate heat treatment steps and cold rolling the alloy for enhancing age hardening response between these two heat treatment steps rather than before age hardening begins as in current technology.

Abstract: The material for a metal strip for manufacturing electrical contact component parts has, expressed in percent by weight, the following composition: nickel (Ni) 0.5-3.5% silicon (Si) 0.08-1.0%  tin (Sn) 0.1-1.0% zinc (Zn) 0.1-1.0% zirconium (Zr) 0.005-0.2%  silver (Ag) 0.02- 0.5%  The remainder is copper and includes impurities caused by smelting.

Abstract: Disclosed is a copper alloy having high electrical conductivity of at least 70% IACS and a broad solid-liquid two-phase region, capable of being easily subjected to a semi-solid forming process even at various temperatures. The copper alloy is suitable for use in a rotor of small- and medium-sized electric motors. In addition, the prevent invention provides a method of manufacturing the copper alloy for semi-solid forming, including the step of melting a copper-calcium alloy having 0.1-1.5 wt % of calcium and the balance of copper at 1100-1150° C. to form a molten copper-calcium alloy, which is then maintained at 1100-1150° C. for a predetermined time period. Then, the molten copper-calcium alloy is poured into a mold preheated to 100-150° C. and cast to a copper alloy ingot.

Abstract: An age-hardenable copper alloy made of 1.2 to 2.7% cobalt, which is able to be partially replaced by nickel, 0.3 to 0.7% beryllium, 0.01 to 0.5% zirconium, optionally 0.005 to 0.1% magnesium and/or iron and in some instances up to a maximum of 0.15% of at least one element from the group including niobium, tantalum, vanadium, hafnium, chromium, manganese, titanium and cerium. The remainder is copper and includes production-conditioned impurities and usual processing additives. This copper alloy is used as the material for producing mold blocks for the side dams of continuous strip-casting installations.

Abstract: A joint body according to the invention is strong for a heat cycle and generates no local cracks. The joint body has the following features. An end portion of the metal member and the ceramic member are connected via a metal connection portion. The metal connection portion has a metallized layer formed on the ceramic member and a brazing connection portion interposing at least between the metallized layer and an end portion of the metal member. A melt point of a brazing member constructing the brazing connection portion is lower than that of a brazing member constructing the metallized layer.

Abstract: An alloy is provided containing by weight about 1 to 7% bismuth, up to 45% zinc, up to 20% tin, up to 30% nickel, up to 3% selenium, up to 2% aluminum, up to 2% antimony, up to 1% iron, up to 1% lead, up to 2% phosphorus, up to 2% carbon, and calcium and magnesium, singularly or in combination, from 0.02 to 2.0%, and the remainder copper and incidental impurities. The method for producing such an alloy is also provided.

Abstract: The present invention provides a method and apparatus for forming a copper layer on a substrate, preferably using a sputtering process. The sputtering process involves bombarding a conductive member of enhanced hardness with ions to dislodge the copper from the conductive member. The hardness of the target may be enhanced by alloying the copper conductive member with another material and/or mechanically working the material of the conductive member during its manufacturing process in order to improve conductive member and film qualities. The copper may be alloyed with magnesium, zinc, aluminum, iron, nickel, silicon and any combination thereof.

Abstract: An alloy for making weld gun arm castings comprises about 0.35 to 0.8 wt. % Be, about 0.2 to 0.9 wt. % Co and about 1.5 to 2.4 wt. % Ni, with the balance being Cu and incidental impurities, the (Ni+Co)/Be ratio in the alloy being at least about 4.

Abstract: A rolled copper foil for flexible printed circuits contains not more than 10 ppm by weight of oxygen and has a softening-temperature rise index T defined as T=0.60[Bi]+0.55[Pb]+0.60[Sb]+0.64 [Se]+1.36[S]+0.32[As]+0.09[Fe]+0.02[Ni]+0.76[Te]+0.48[Sn]+0.16[Ag]+1.24[P] (each symbol in the brackets representing the concentration in ppm by weight of the element) in the range of 4 to 34. The concentrations of the elements are in the ranges of[Bi]<5, [Pb]<10, [Sb]<5, [Se]<5, [S]<15, [As]<5, [Fe]<20, [Ni]<20, [Te]<5, [Sn]<20, [Ag]<50, and [P]<15 (each symbol in the brackets representing the concentration in ppm by weight of the element).

Abstract: In accordance with one aspect of the present invention is the metamorphic processing of a beryllium-copper alloy. The alloy is (i) thermodynamically treated for greater than about 10 hours at a temperature generally within a range of 900° to 1500° F., (ii) warm worked at greater than about 30% strain at a strain rate {acute over (&egr;)} greater than or equal to about (2.210×107)/exp[(2.873×104)/(T+459.4°)], where T is in ° F., at the temperature, (iii) annealed at a temperature between 1375° and 1500° F. for about 15 minutes to about 3 hours, (iv) water quenched, and (v) thermal hardened at a temperature generally within a range of about 480° and 660° F. Grain size is reduced with concomitant improvements in ultimate strength, toughness, total elongation, % reduction in area and ultrasonic inspectability.

Abstract: For bonding pure beryllium to a copper alloy, a functionally gradient beryllium-copper material comprising a single layer or multiple layers having a thickness of 0.3-3.0 mm and containing at least 50 atomic % of Cu is inserted between the pure beryllium and the copper alloy to prevent bonding strength from degrading in the bonding process or during operation of a nuclear fusion reactor, by effectively mitigating formation of brittle intermetallic compounds and generation of thermal stress at the bonding interface.

Abstract: A slider suspension system for use in a magnetic recording disk file comprised of a laminated suspension positioned between an actuator arm and a read/write slider. The laminated suspension is comprised of a conductor layer, a dielectric layer and a support layer. The conductor layer is comprised of a high strength conductive copper alloy selected from the group consisting of Cu--Ni--Si--Mg alloy, Be--Cu--Ni alloy, and Cu--Ti alloy, wherein the conductive layer has a thickness less than or equal to eighteen microns. The dielectric layer is comprised of an electrically insulating material such as a polyimide. The support layer is comprised of a rigid material such as stainless steel.

Abstract: A composite for preparation of an oxide superconductor includes a primary alloy phase of constituent elements of a desired oxide superconductor; and a secondary phase comprising copper, the secondary phase supported by the primary alloy phase. The composite may additionally include a matrix material for supporting the primary alloy phase and second phase disposed therein. The composite is oxidized to form an oxide superconductor composite.

Abstract: There is provided a copper alloy sheet for forming a connector, having a chemical composition consisting essentially of:Mg: 0.3-2% by weight;P: 0.001-0.02% by weight;C: 0.0002-0.0013% by weight;O: 0.0002-0.001% by weight; andCu and inevitable impurities: the balance. The copper alloy sheet has a structure that fine particles of oxides including Mg oxide having a particle size of not more than 3 .mu.m are evenly dispersed in a matrix of the copper alloy sheet. The copper alloy sheet is excellent not only in tensile strength, elongation, electric conductivity and spring limit value before forming, but also in spring limit value after forming, and high-temperature creep strength.

Abstract: An antifouling structure in contact with seawater or at least its surface layer is made up of a beryllium copper alloy having a beryllium content lying in the range of 0.2% by weight to 2.8% by weight. While this antifouling structure is immersed in seawater, a beryllium or copper oxide film is formed on the surface layer of the beryllium copper alloy mother material and beryllium or copper ions are liberated from the exposed surface layer of the beryllium copper alloy mother material into seawater. As years go by, the beryllium or copper oxide film peels away from the beryllium copper alloy mother material. Due to indeterminate repetition of such peeling, the liberation of beryllium or copper ions from the exposed surface layer of the beryllium copper alloy mother material into seawater is sustained.

Abstract: Master alloys and methods of producing same are disclosed, wherein an intermetallic compound is first prepared via thermite processing, then size reduced, then mixed with other components in amounts yielding a mixture in the desired proportion for the master alloy. The mixture is compacted, then heated to produce the master alloy, which is used for making Nickel-based alloys used, (for example), in hydrogen battery electrodes.

Abstract: A process for producing the beryllium-copper alloy comprises the steps of casing a beryllium-copper alloy composed essentially of 1.00 to 2.00% by weight of Be, 0.18 to 0.35% by weight of Co, and the balance being Cu, rolling the cast beryllium-copper alloy, annealing the alloy at 500.degree. to 800.degree. C. for 2 to 10 hours, then cold rolling the annealed alloy at a reduction rate of not less than 40%, annealing the cold rolled alloy again at 500.degree. to 800.degree. C. for 2 to 10 hours, thereafter cold rolling the alloy to a desired thickness, and subjecting the annealed alloy to a final solid solution treatment. The beryllium-copper alloy obtained by this producing process is also disclosed, in which an average grain size is not more than 20 .mu.m, and a natural logarithm of a coefficient of variation of the grain size is not more than 0.25.

Abstract: This invention relates to a high performance copper alloy and its manufacturing methods for electrical and electronic parts which have good electrical conductivity, superior mechanical properties, and high thermal stability of tin-lead plating. The copper alloy consisting essentially of copper and from copper-nickel-silicon-phosphor-magnesium alloys for semiconductor leadframe alloys consisting essentially of copper and from 0.5 to 2.4% by weight nickel, from 0.1 to 0.5% by weight silicon, from 0.02 to 0.16% by weight phosphorus, and from 0.02 to 0.2% by weight magnesium.

Abstract: This invention relates to a composition of a region joining two members treated thermodynamically by a process set forth by the present invention. In accordance with one aspect of the present invention, there is provided a region comprising a solidified bead containing generally between 1.6 and 2.0% beryllium, a melt and mix zone containing generally between 0.6 and 1.8% beryllium, a recrystallized zone containing generally between 0.6 and 1.0% beryllium, and an overaged zone containing generally between 0.3 and 0.8% beryllium.

Abstract: A method of hot forming beryllium-copper alloy including from 1.60 to 2.00% by weight of Be, from 0.2 to 0.35% by weight of Co and the balance being essentially Cu, under specified conditions of a working temperature, a working rate, and an amount of work strain to produce a hot formed product of an equiaxed grain structure having a uniform stable grain size.

Abstract: An elongated flexible tube that constitutes an insert part of an endoscope. The flexible tube comprises: a spiral tube made of a precipitation hardening metal and having a groove which is recessed inwardly from the outer surface of the tube, the groove extending in a straight line along the axis of the tube, the spiral tube being subjected to age hardening process after a solid solution treatment; a braided-wire tube formed by weaving fine metal wires into a braid, the braided-wire tube being closely fitted over the outer surface of the spiral tube; and a flexible skin closely and watertightly fitted over the outer surface of the braided-wire tube.

Abstract: A method for the manufacture of copper base alloys having improved resistance to thermally induced softening is provided. The alloy composition is selected so that the alloy undergoes either a peritectic or eutectic transformation during cooling. The solidification rate is controlled so that the second phase forms as a uniform dispersion of a relatively small dispersoid. The dispersoid inhibits recrystallization resulting in an alloy less susceptible to softening at elevated temperatures.

Abstract: An elongated flexible tube that constitutes an insert part of an endoscope. The flexible tube comprises: a spiral tube made of a precipitation hardening metal and having a groove which is recessed inwardly from the outer surface of the tube, the groove extending in a straight line along the axis of the tube, the spiral tube being subjected to age hardening process after a solid solution treatment; a braided-wire tube formed by weaving fine metal wires into a braid, the braided-wire tube being closely fitted over the outer surface of the spiral tube; and a flexible skin closely and watertightly fitted over the outer surface of the braided-wire tube.

Abstract: An electrically conductive material including 0.15% to 0.35% of Be, 0.3% to 1.5% of Al, either one or both of Ni and Co in a total amount of 1.6% to 3.5%, in terms of weight, and the balance being Cu with inevitable impurities. The alloy may further contain at least one of Si, Sn, Zn, Fe, Mg and Ti in a total amount of 0.05% to 1.0%, in terms of weight ratio. Each of the Si, Sn, Zn, Fe, Mg and Ti is in an amount of 0.05% to 0.35%.

Abstract: This invention provides a method for production of reproducible heat treated parts with improved mechanical properties. More specifically, the invention provides a process which comprises the steps of preparing, for example, a copper beryllium alloy melt, casting the alloy melt by a continuous process which uses rapid solidification process techniques or hot working a cast alloy and solution annealing the hot worked alloy, passing the alloy through one or more cold-working steps, applying mechanical and thermal treatments to decrease the residual lattice strains created by cold working the alloy, and then subjecting the alloy to a heat treatment, at temperatures ranging between 250.degree. F. and 800.degree. F., in a heat treating media that gives a rate of heat flow from the interface into the alloy that is fast enough to create those (.alpha.

Abstract: A new copper-based alloy is described, the principle characteristic of which lies in having two different age-hardening temperature intervals corresponding to which significantly different electrical and mechanical characteristics are obtained from an alloy of the same composition; the alloy is composed, in parts by weight, of from 0.05 to 1% Mg, from 0.03 to 0.9% P and from 0.002 to 0.04% Ca, the remainder being Cu with possible very small additions of other alloying elements such as Sn, Zr, Mn and Li.

Abstract: The invention relates to contact material for vacuum interrupter, and in order to be splendid in the breakdown voltage ability and increase the interrupting ability, a contact material is constituted by containing copper and chromium, and moreover adding one component selected from silicon, titanium, zirconium and aluminum as another component, and is used in a vacuum interrupter.

Abstract: A contact forming material for a vacuum valve or vacuum circuit breaker comprising (a) a conductive material consisting of copper and/or silver, and (b) an arc-proof material consisting of chromium, titanium, zirconium, or an alloy thereof wherein the amount of said arc-proof material present in said conductive material matrix is no more than 0.35% by weight. This contact forming material is produced by a process which comprises the steps of compacting arc-proof material powder into a green compact, sintering said green compact to obtain a skeleton of the arc-proof material, infiltrating the voids of said skeleton with a conductive material, and cooling the infiltrated material. The contact forming material can provide contacts for a vacuum valve or vacuum circuit breaker which has excellent characteristics such as temperature rise characteristic and contact resistance characteristic.

Abstract: A high electroconductive copper alloy is disclosed which contains 0.003 to 1.0 wt % of Zn, 0.005 to 0.1 wt % of Mg and the remainder of Cu. Not more than 0.1 wt % of the total amount of either one or more of Cr, Mn, Fe, Co, Ni, Y, Sn, Si and Zr may be contained further, while the amount of oxygen contained is confined to not more than 100 ppm in both cases.

Abstract: A copper-base alloy for leadframes consisting essentially of 0.8-4.0 weight % of Ni, 0.2-4.0 weight % of Ti and 0.05-0.6 weight % of Mg, the balance being essentially Cu and inevitable impurities, and a ratio of Ni to Ti being 1-4. This copper-base alloy has high mechanical strength of about 50 kgf/mm.sup.2 or more and electric conductivity of 30% IACS or more as well as good solderability and solder durability. Thus, it may be used as a highly reliable material for leadframes of semiconductor devices.

Abstract: The present invention relates to a copper base alloy consisting essentially of from about 3.5% to about 6.0% aluminum, from about 0.1% to about 3.0% nickel, from about 0.03% to about 1.0% magnesium and the balance essentially copper. The alloys of the present invention have been found to be cost effective and easily processable. They have also been found to have particular utility in electronic and electrical applications such as electrical connectors.

Abstract: A plasma device for use in controlling nuclear reactions within the plasma including a first wall and blanket formed in a one-piece structure composed of a solid solution containing copper and lithium and melting above about 500.degree. C.