Abstract: A method for reducing gold embrittlement in solder joints, and a copper-bearing solder according to the method, are disclosed. Embodiments of the invention comprise adding copper to non-copper based solder, such as tin-lead solder. The embodiments may further comprise using the copper-bearing solder as a solder interconnect on a gold-nickel pad.

Abstract: An alloy for casting terminals for lead-acid batteries which has good corrosion resistance, produces less dross during manufacturing, has resistance to polypropylene degradation, as well as other improved features. The alloy is composed of antimony present in the range of about 2.5-4.75%; arsenic present in the range of about 0.15-0.35%; tin present in the range of about 0.2-0.6%; copper present in the range of about 0-200 ppm; sulfur present in the range of about 0-40 ppm and the balance lead. In an alternative embodiment, copper and sulfur are replaced with selenium in the range of about 40-90 ppm.

Abstract: A process for the production of sliding elements in which an overlay of lead-tin-copper is applied by electroplating to the prefabricated semi-finished product, and in which a ternary, fluoroborate-free electroplating bath is used without brighteners and with the addition of non-ionic wetting agents and free alkyl sulfonic acid. After the deposition of the galvanic overlay a heat treatment is carried out in the temperature range of 150° C. to 200° C. for between 1 and 100 hours. The multilayer material for sliding elements comprises at least a backing and an overlay of 12 to 16 wt. % tin and 7 to 11 wt. % copper, the rest being lead. The overlay comprises 15 to 25 wt. % particles of intermetallic compound Cu6Sn5.

Abstract: An overlay alloy for sliding bearing is deposited on a lining by plating and consists of from 2 to less than 5% of tin, from 0.05 to 10% of indium, from 0.05 to 5% of copper, the balance consisting of lead and unavoidable compound. Seizure at high speed travel is almost completely eliminated.

Abstract: This invention relates to a connection method for a semiconductor material enabling a formation of a bump electrode with a wire bonder, keeping always a cutting position of the wire at a specified position and improving a continuous workability and stability and to a connection material to be used in the connecting method, wherein any one of Pb, Sn, In is applied as a major element and the alloy having additive elements mixed with it is made as a fine wire under a rapid cooling and condensation process and further to a semiconductor device made by the above-mentioned connecting method.

Abstract: Low melting temperature copper-containing solders are disclosed for soldering and rework on copper surfaces. The amount of copper required in the solder in order to inhibit dissolution of the copper surface to be soldered has been found to be dopant level, below the binary tin-copper eutectic point.

Abstract: A quaternary overlay bearing alloy used as a surface layer of a sliding bearing consist by weight of Cu in an amount sufficient more than 3% to substantially improve seizure property not more than 6% of Cu, 1-10% of In, not less than 0.1 but less than 5% of Sn, and the balance lead and incidental impurities.

Abstract: Electromigration activity is decreased and lifetime is extended in solder stripes employed as conductors and terminals on microelectronic devices by forming an alloy of a solute element, such as copper, with tin in a lead/tin solder and providing a substantially uniform distribution of particles of the intermetallic compound in the solder. The concentration of the solute element is maintained at less than about three times the tin concentration and less than about 10% of the amount of the solder.

Abstract: The grain size and resistance to corrosion of lead-antimony alloys containing less than 4% of antimony and 0.005 to 0.1% copper, are improved by incorporating therein from 0.001 to 0.1% of a mixture of rare earths, preferably misch metal. The alloys may also contain up to 0.5% arsenic or up to 0.8% of tin.

Abstract: A process for metal-enrichment of lead bullion, wherein an alkali metal-desired metal intermetallic, such as sodium-antimony intermetallic, is added as a refining dross to the bullion and the desired metal is stripped from the dross and recovered as an enriched bullion. The process includes the steps of heating the lead bullion, in which the desired metal is to be recovered, to a temperature between 650.degree. F. and 900.degree. F.; agitating the molten bullion; adding said alkali metal-desired metal intermetallic to said bullion; mixing said intermetallic into said bullion; adding a stripping reagent for stripping said desired metal from said intermetallic; forming a desired metal-enriched lead bullion and a residue dross substantially void of said desired metal; and separating said enriched bullion from said residue dross. The process may also require a cleansing step to cleanse said enriched lead bullion of any said alkali metal in solution.

Abstract: A method of smelting an oxide charge containing lead and copper in a blast furnace, wherein molten lead bullion flowing to the furnace bottom and containing at least 8% by weight of copper is diluted with metallic lead of lower copper content in the furnace shaft, or in the hearth at the bottom of the furnace, or in a forehearth into which furnace products are passed from the furnace, or in a transfer ladle into which lead bullion passes from the forehearth.

Abstract: Low antimony lead alloys suitable for use as grid material in maintenance-free high capacity lead acid batteries are disclosed. The alloys comprise 0.6 to 1.1 weight percent antimony, 0.06 to 0.25 weight percent arsenic, 0.1 to 0.4 weight percent tin, 0.06 to 0.11 weight percent copper, and the balance lead. A preferred alloy contains 0.8 weight percent antimony, 0.15 weight percent arsenic, 0.25 weight percent tin and 0.08 weight percent copper.