Impact Patents (Class 425/DIG28)
  • Patent number: 5871782
    Abstract: An improved transfer molding apparatus has a laminated chase block with many sets, which is capable of fabricating a plurality of semiconductor packages. The apparatus includes an upper plate and a movable lower plate and a plurality of posts disposed between the upper and lower plates. A plurality of laminated chase blocks is fixed to the posts. A plurality of ejecting means are disposed at one side of the chase blocks and supply means concurrently supplies a molding compound to the plurality of chase blocks.
    Type: Grant
    Filed: November 26, 1996
    Date of Patent: February 16, 1999
    Assignee: LG Semicon Co. Ltd.
    Inventor: Sihn Choi
  • Patent number: 4474723
    Abstract: A plastic pipe part 1 is pushed across a head part 3 of a sealing sleeve 4, being supported by a support 8, thereby providing the plastic pipe part with a widened end 7. Subsequently the widened end is surrounded by an outer mold 11 with three successive widenings 12, 14, 15 and by means of a fluid pressure in the interior of the widened end 7, sealed by the head part 3, the widened end is provided with three socket end widenings 28, 22, 29. After removal of the support 8 the end portion 6 of the socket end is inwardly rebent around the head part 3 thus forming a groove chamber 5 retaining the head part 3 of sealing sleeve 4. Pushing the plastic pipe part across the head part is facilitated by applying a fluid pressure.
    Type: Grant
    Filed: April 22, 1983
    Date of Patent: October 2, 1984
    Assignee: Wavin B.V.
    Inventor: Adolf Irmer