Abstract: A vaporizer device may include a controller and a heater control circuitry. The controller may generate, based at least on a temperature of a heating coil in a cartridge coupled with the vaporizer device, an output signal for controlling a discharge of a battery of the vaporizer device. The battery may be discharged to the heating coil to increase the temperature of the heating coil and cause a vaporization of a vaporizable material contained in the cartridge. The heater control circuitry may determine the temperature of the heating coil. The heater control circuitry may further control, based on the output signal from the controller, the discharge of the battery to the heating coil. The heater control circuitry may be powered by a voltage rail coupled to a voltage regulator configured to regulate an output voltage of the battery.

Abstract: Methods and semiconductor devices are described herein which eliminate the use of additional masks. A first interconnect layer is formed. A first resistive layer is formed on top of the first interconnect layer. A dielectric layer is formed on top of the first resistive layer. A second resistive layer is formed on top of the dielectric layer.

Abstract: A strain gauge includes a flexible substrate, and a plurality of resistors each formed of a Cr composite film, on or above the substrate. The substrate is attached to a flexure element, the plurality of resistors including two resistors disposed at locations at which the two resistors are opposite to each other, such that the flexure element is interposed between the two resistors.

Abstract: A device includes a coater, a dispenser, and a treatment portion. The coater is to coat, layer-by-layer, a build material relative to a build pad to form a 3D object. The dispenser is to at least dispense a fluid including a first at least potentially electrically conductive material. In at least some selected locations of an external surface of the 3D object. The treatment portion is to treat the 3D object to substantially increase electrically conductivity on the external surface of the 3D object at the at least some selected locations.

Abstract: A resistor component includes an insulating substrate; a resistance layer disposed on one surface of the insulating substrate; and first and second terminals disposed on the insulating substrate to be spaced apart from each other and connected to the resistance layer, wherein each the first and second terminals comprises an inner electrode layer disposed on the resistance layer, and a via electrode penetrating the resistance layer to be in contact with the one surface of the insulating substrate and the inner electrode layer.

Abstract: A portable electrochemical or combustible lower explosive limit gas sensing apparatus includes a housing comprising at least one exterior surface and an interior space. At least one depression is formed in the at least one exterior surface and is adapted to accommodate, at least in part, components of an electrochemical gas sensor or a combustible LEL gas sensor. A processing unit is disposed in the interior space of the housing and is in electrical communication with the electrochemical gas sensor or the combustible LEL gas sensor.

Abstract: A catalytically activated combustible gas sensing element includes a filament of resistance wire forming a coil, wherein a first end of the resistance wire is attached to a first support post and a second end of the resistance wire is attached to a second support post, a cantilever support supporting the coil, wherein the cantilever support is attached to a third support post, and a catalytic bead substantially surrounding the coil and cantilever.

Abstract: The instant disclosure provides a thin film capacitor and a method of manufacturing the same. The method includes the following steps: placing a carrier substrate on a processing machine including at least one processing unit, and the at least one processing unit having a metal-layer forming module and an insulation-layer forming module that are arranged along a planar production line; forming a plurality of metal layers by the metal-layer forming module of the at least one processing unit, forming a plurality of insulation layers by the insulation-layer forming module of the at least one processing unit, and the metal layers and the insulation layers being alternately stacked on the carrier substrate to form a multilayer stacked structure; and then forming two terminal electrode structures to respectively enclose two opposite side end portions of the multilayer stacked structure.

Abstract: A strain gauge includes: a substrate; a dielectric layer on the substrate; a thin film electrical circuit on the dielectric layer and having input/output terminals; other layers disposed on the electrical circuit; the dielectric layer forming a first seal on one side of the electrical circuit, the other layers forming a second seal on a second side of the electrical circuit, the first and second seals having structure such that: in a first instance prior to exposure of the strain gauge to an autoclave cycle, the electrical circuit is productive of a first output voltage in response to a first input voltage; and in a second instance subsequent to exposure of the strain gauge to at least 25 autoclave cycles, the electrical circuit is productive of a second output voltage in response to a second input voltage, the first and second input voltages being equal, and the first and second output voltages being equal.

Abstract: Micro-Pirani gauge vacuum gauges are described that use low-thermal conductivity support elements. A micro-Pirani gauge or vacuum sensor can include a heating element operative to heat a gas and to produce a signal corresponding to the pressure of the gas; a platform configured to receive the heating element, with the platform having a first coefficient of thermal conductivity; and a support element connected to a substrate and configured to support the platform with the heating element within an aperture disposed in the substrate, with the support element having a second coefficient of thermal conductivity, where the second coefficient of thermal conductivity is less than the first coefficient of thermal conductivity. Multimode pressure sensing including a micro-Pirani gauge are also described.

Abstract: The invention relates to a resistor, in particular a low-resistance current-measuring resistor, comprising a first connection part (1) that consists of a conductor material for introducing an electrical current (I), a second connection part (2) that consists of a conductor material for discharging said electrical current (I), and a resistor element (3) that consists of a resistor material and is arranged between the two connection parts (1, 2) in the direction of the current, also comprising a resistor coating (7) that consists of a metallic material for the purpose of achieving protection from corrosion, and/or improving solderability. According to the invention, the metallic coating (7) is applied directly to the entire free surface of the resistor element (3) without any insulation layer.

Abstract: The present invention includes a wear-resistant material including: a base material formed of pure aluminum or an aluminum alloy having a projection, and a depression in a pit-like shape on a surface thereof; and a coat including a dehydrate of a hydrated oxide of aluminum, the coat being formed on a surface of the base material. Further, the present invention including a method for producing a wear-resistant material including the steps of: forming a hydrated oxide coat of aluminum on a surface of the base material by a chemical conversion coating; and heating the hydrated oxide coat. Further, the present invention also includes a puffer cylinder and a puffer-type gas circuit breaker applied to the above wear-resistant material.

Abstract: Method and apparatus for direct writing of passive structures having a tolerance of 5% or less in one or more physical, electrical, chemical, or optical properties. The present apparatus is capable of extended deposition times. The apparatus may be configured for unassisted operation and uses sensors and feedback loops to detect physical characteristics of the system to identify and maintain optimum process parameters.

Abstract: A corrosion-resistant apparatus may contain an electronic component having a first metal and a polymer coating covering the electronic component. The polymer coating includes polymer chains with unsaturated groups to scavenge sulfur and an anionic initiator dispersed in the polymer coating to convert cyclic elemental sulfur to linear polysulfide.

Abstract: The invention relates to a surface-modified RuO2 conductive and a lead-free powdered glass material formulated to make a paste suitable for application to the manufacture of a thick film resistor material. The resistance range that is most suitable to this invention is a resistor having 10 kilo-ohms to 10 mega-ohms per square of sheet resistance. The resulting resistors have ±100 ppm/° C. TCRs.

Abstract: A corrosion-resistant apparatus may contain an electronic component having a metal covered by a conformal coating. The conformal coating may contain polymer chains with unsaturated groups capable of scavenging a corrosive agent. The conformal coating may contain an accelerator or activator so that the unsaturated groups more readily scavenge the corrosive agent. In an embodiment, the conformal coating is a silicone coating with unsaturated pendant groups which scavenge a sulfur containing agent.

Abstract: A method of manufacturing a resistor paste comprising steps of: (a) preparing a basic resistor paste comprising, (i) a conductive powder, (ii) a first glass frit, and (iii) a first organic medium; and (b) preparing a glass paste as a TCR driver comprising, (iv) a second glass frit comprising manganese oxide, and (v) a second organic medium, (c) adding the glass paste to the basic resistor paste to obtain a resistor paste with a desired TCR.

Abstract: Thick film resistor paste compositions, and methods for making the thick film compositions are disclosed. The compositions include a resistor composition dispersed in an organic vehicle. The resistor composition has 3 to 60% by weight RuO2 conductive material, 5 to 75% by weight Ag conductive material, 15 to 60% by weight glass frit and optionally up to 10% by weight copper oxide or precursor thereof, and up to 20% by weight bismuth oxide or precursor thereof. The resistor composition when printed to a dry thickness and fired at a temperature between 750° C. and 950° C. achieves a sheet resistivity between 10 and 10,000 milliohms/square and a hot temperature coefficient of resistivity of 1000 ppm/C or higher. The fired resistor composition may achieve a resistance thickness ratio (Rtr) value between 0.75 and 1.50.

Abstract: There is provided a manganese oxide film forming method capable of forming a manganese oxide film having high adhesivity to Cu. In the manganese oxide film forming method, a manganese oxide film is formed on an oxide by supplying a manganese-containing gas onto the oxide. A film forming temperature for forming the manganese oxide film is set to be equal to or higher than about 100° C. and lower than about 400° C.

Abstract: A method of making a nonvolatile memory cell includes forming a steering element and forming a carbon resistivity switching material storage element by coating a carbon containing colloid.

Abstract: The invention provides a method of forming a resistance film with even thickness and at high speed even in a substrate having micro depressions and projections in its surface. A fine particle dispersion solution is prepared by adding a solution which decreases the absolute value of a ? potential at the fine particles and a solution which decreases dispersion stability of the fine particles into a solution in which metal oxide fine particles are stably dispersed, a substrate having an insulating surface is immersed in the fine particle dispersion solution to deposit a fine particle aggregation film, and then a resistance film is obtained by performing heat treatment.

Abstract: A drying method in which a substrate on which a coating liquid such as a resist liquid containing a volatile solvent is applied is dried under a reduced pressure in an airtight container, and an inert gas is then supplied in the container, so that flows do not concentrate and accumulate in the center portion includes placing the substrate in the container, reducing pressure in the container by exhausting air through an exhaust channel using an exhaust mechanism and volatizing the solvent, and returning the container to atmospheric pressure by supplying an inert gas through a supply channel using a supply mechanism after the reducing step. The supply mechanism includes long purge nozzles ejecting the gas inside the container and spaced from and parallel to two opposed substrate edges. The returning step is performed by the nozzles ejecting the gas toward inside walls of the container opposite to the substrate.

Abstract: One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material on the device.

Abstract: In one embodiment, a read sensor for a recording head for a magnetic media storage system, has first and second shields, and a magneto-resistive sensor disposed between and shielded by the first and second shields in which the sensing axis of the sensor is tilted with respect to the recording surface of the head. In one embodiment, the sensing axis is oriented at an angle between 10 and 60 degrees with respect to the normal of the recording surface. Other embodiments are described and claimed.

Abstract: The invention relates to a film resistor (1) comprising a carbon-containing material (3) into which clusters (4) of conductive cluster material are introduced, wherein the conductive cluster material has a positive temperature coefficient. The clusters (4) are surrounded by a graphite casing and embedded in the carbon-containing material (3). Furthermore, the cluster material is present in a thermodynamically stable phase.

Abstract: There are provided a process for manufacturing a PTC device as well as a PTC device manufactured by such process wherein a resin coating for preventing the oxidation can be easily formed. The PTC device includes (A) a polymer PTC component (14) comprising: (a1) an electrically conductive filler, and (a2) a polymer material wherein the polymer PTC component is defined by opposite main surfaces and a side surface connecting outer peripheries of these main surfaces, and (B) layered metal electrodes (12, 22) placed on the main surfaces on both sides of the polymer PTC component. The PTC device has a support member (20) extending outward from a periphery of at least one of the main surfaces, and the side surface of the polymer PTC component is sealed from an ambient environment around the PTC device by a cured curable resin (24) disposed and supported on the support member.

Abstract: A method of transferring an electronic material and a method of manufacturing an electronic device using the method of transferring the electronic material. The method of transferring the electronic material includes dipping a template, on which an electronic material layer is formed, into a liquid medium, separating the electronic material layer from the template, and floating the electronic material layer on a surface of the liquid medium; raising up the electronic material layer floated on the surface of the liquid medium by using a target substrate and transferring the electronic material layer on the target substrate; and fixing the electronic material layer to the target substrate.

Abstract: A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer; bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.

Abstract: A process for forming metallic nitride film by atomic layer deposition (ALD), which comprises steps for feeding into a reaction space vapor phase alternated pulses of metal source material and silicon source material in a plurality of cycles, and feeding into the reaction space vapor phase pulses of nitrogen source material. wherein a nitrogen source pulse is fed intermittently in selected cycles such that a ratio of nitrogen source pulses to silicon source pulses is less than 1:1 and a ratio of nitrogen source pulses to metal source pulses is less than 1:1, the ratio selected to produce the thin film with a resistivity between 1,000 ??cm and 15,000 ??cm.

Abstract: A resistive component suitable for detecting electric current in a circuit and a method of manufacturing the resistive component are provided. The resistive component includes a carrier, a resistive layer, an electrode unit, an upper oxide layer and a protective layer. The resistive layer comprises copper alloy and is disposed on the carrier. The electrode unit is electrically connected to the resistive layer. The upper oxide layer is disposed on a part of a surface of the resistive layer and includes oxides of the resistive layer. The protective layer covers at least a part of the upper oxide layer.

Abstract: Electrical separators for batteries, especially lithium batteries, having a shutdown mechanism. A process for their production. An electrical separator is used in batteries and other systems in which electrodes have to be separated from each other while maintaining ion conductivity. Safety is very important in lithium batteries, since in contrast to other types of battery (Pb, NiCd, NiMeH) the solvent for the electrolyte is not water but a combustible solvent. A separator for lithium cells must possess a shutdown mechanism while not being able to melt down. This is achieved by an electrical separator having a shutdown layer which comprises particles which melt at a desired temperature, close the pores of the separator, and so stop ion flow. Since the separator also comprises a porous inorganic (ceramic) layer on a carrier, the cells cannot melt down as a result of a completely melted separator.

Abstract: A process is disclosed for manufacturing a thick-film circuit such as a hybrid circuit on a titanium or titanium-alloy substrate. The process includes firing a glassy dielectric layer upon at least one surface of the substrate. A thick-film circuit including a titanium or titanium-alloy substrate is also disclosed.

Abstract: The present invention teaches formulations, apparatus and a method of applying high thixotropic index polymer thick-film resistive pastes for making polymer thick-film resistors with improved tolerances by providing a squeegee with a blade tilted at an angle of 10° to 85° to the surface of the printed circuit board thus causing a fluid rotational motion within the bead of the polymer thick-film resistive paste as the squeegee blade moves relative to the printed circuit board. This rotational motion increases the shear strain rate experienced by the paste within the bead and results in a more effective filling of the resistor-shaped cavity without including air bubbles, experiencing elastic recovery of the paste and, without surface fractures of the paste.

Abstract: Precursor compositions for the fabrication of electronic features such as resistors and capacitors. The precursor compositions are formulated to have a low conversion temperature, such as not greater than about 350° C., thereby enabling the fabrication of such electronic features on a variety of substrates, including organic substrates such as polymer substrates.

Abstract: Precursor compositions for the deposition of electronic features such as resistors and dielectric components and methods for the deposition of the precursor compositions. The precursor compositions have a low viscosity, such as not greater than about 1000 centipoise and can be deposited using a direct-write tool. The precursors also have a low conversion temperature, enabling the formation of electronic features on a wide variety of substrates, including low temperature substrates.

Abstract: Apparatuses and processes for maskless deposition of electronic and biological materials. The process is capable of direct deposition of features with linewidths varying from the micron range up to a fraction of a millimeter, and may be used to deposit features on substrates with damage thresholds near 100° C. Deposition and subsequent processing may be carried out under ambient conditions, eliminating the need for a vacuum atmosphere. The process may also be performed in an inert gas environment. Deposition of and subsequent laser post processing produces linewidths as low as 1 micron, with sub-micron edge definition. The apparatus nozzle has a large working distance—the orifice to substrate distance may be several millimeters—and direct write onto non-planar surfaces is possible.

Abstract: A thin film composition is made from silicon, an insulator such as alumina or silicon dioxide, and at least one additional material such as chromium, nickel, boron and/or carbon. These materials are combined to provide a thin film having a ? of at least 0.02 ?-cm (typically 0.02-1.0 ?-cm), and a TCR of less than ±1000 ppm/° C. (typically less than ±300 ppm/° C.). A sheet resistance of at least 20 k?/? may also be obtained. The resulting thin film is preferably at least 200 ? thick, to reduce surface scattering conduction currents.

Abstract: The invention relates generally to methods for creating circuitry components from binder materials having a hydrophobic phenolic component and a hydrophobic epoxy component. The phenolic/epoxy based liquids, solutions, suspensions and/or pastes can generally be screen printed or otherwise formed on an electronic substrate, pattern or device, to provide an electronic component having low water sorption properties.

Abstract: The invention provides a method of forming a resistance film with even thickness and at high speed even in a substrate having micro depressions and projections in its surface. A fine particle dispersion solution is prepared by adding a solution which decreases the absolute value of a ? potential at the fine particles and a solution which decreases dispersion stability of the fine particles into a solution in which metal oxide fine particles are stably dispersed, a substrate having an insulating surface is immersed in the fine particle dispersion solution to deposit a fine particle aggregation film, and then a resistance film is obtained by performing heat treatment.

Abstract: Methods and apparatus for the deposition of a source material (10) are disclosed. An atomizer (12) renders a supply of source material (10) into many discrete particles. A force applicator (14) propels the particles in continuous, parallel streams of discrete particles. A collimator (16) controls the direction of flight of the particles in the stream prior to their deposition on a substrate (18). In an alternative embodiment of the invention, the viscosity of the particles may be controlled to enable complex depositions of non-conformal or three-dimensional surfaces. The invention also includes a wide variety of substrate treatments which may occur before, during or after deposition. In yet another embodiment of the invention, a virtual or cascade impactor may be employed to remove selected particles from the deposition stream.

Abstract: The present invention discloses a method of manufacturing a thin film resistor with a moisture barrier by depositing a metal film layer on a substrate and depositing a layer of tantalum pentoxide film overlaying the metal film layer. The present invention also includes a thin film resistor having a substrate; a metal film layer attached to the substrate; and a tantalum pentoxide layer overlaying the metal film layer, the tantalum pentoxide layer providing a barrier to moisture, the tantalum pentoxide layer not overlaid by an oxidation process.

Abstract: A method for depositing a low dielectric constant film is provided. The low dielectric constant film includes alternating sublayers, which include at least one carbon-doped silicon oxide sublayer. The sublayers are deposited by a plasma process than includes pulses of RF power. The alternating sublayers are deposited from two or more compounds that include at least one organosilicon compound. The two or more compounds and processing conditions are selected such that adjacent sublayers have different and improved mechanical properties.

Abstract: Electrically resistive material including platinum and from about 5 and about 70 molar percent of iridium, ruthenium or mixtures thereof, calculated based on platinum as 100%, are disclosed.

Abstract: A resistive paste is made by a mixture of a conductive metal powder which is made by mixing 85 to 94 percent by weight of copper powder, 5 to 10 percent by weight of manganese powder, and 1 to 5 percent by weight of tin powder; a mixture of 3 to 7 percent by weight of glass powder and 3 to 7 percent by weight of copper-oxide powder relative to the entire amount of said conductive metal powder; and 7 to 15 percent by weight of vehicle relative to the entire amount of the conductive metal powder and the mixture. The resistive paste is then sintered, and the resistive composition having the low resistance value and low TCR may be obtained. In addition, a resistor is made by forming the resistive element upon a substrate.

Abstract: Electrically resistive material including platinum and from about 5 and about 70 molar percent or iridium, ruthenium or mixtures thereof, calculated based on platinum as 100%, are disclosed.

Abstract: A metallized substrate, such as used to make a resonant circuit tag with inductive and capacitive elements in series, has a thin inorganic or polymeric dielectric layer formed on a metal layer. The inorganic layer may be formed by anodizing a surface of the metal layer. The organic layer may be formed by flexographic printing. In both cases, a via hole is formed through the dielectric layer. A second layer of very thin conductive metal is deposited on the dielectric layer and in the via hole. The substrate is subsequently patterned with an etch resist and then etched to form the inductor coil and the capacitor plates, which are interconnected via the metallized via hole.

Abstract: A method of forming a perovskite thin film includes preparing a perovskite precursor solution; preparing a silicon substrate for deposition of a perovskite thin film, including forming a bottom electrode on the substrate; securing the substrate in a spin-coating apparatus and spinning the substrate at a predetermined spin rate; injecting a perovskite precursor solution into the spin-coating apparatus thereby coating the substrate with the perovskite precursor solution to form a coated substrate; baking the coated substrate at temperatures which increase incrementally from about 90° C. to 300° C.; and annealing the coated substrate at a temperature of between about 500° C. to 800° C. for between five minutes to fifteen minutes.

Abstract: A method for producing a resistor. The method includes a process for printing, in a prescribed pattern, a mixed solution containing a good solvent having solubility to a binder good solvent, a thermosetting binder resin, and a conductive filler. The method further includes a process for driving the mixed solution: and a process for curing the binder resin by baking. The good solvent is at least one selected from dipropylene glycol monomethyl ether, diethylene glycol monomethyl ether, and dipropylene glycol monoethyl ether. The poor solvent is at least one selected from terpineol eat 2-phenoxy ethanol and 2-benzyloxy ethanol.

Abstract: A precipitate film having plating resistance may be formed on the surface of a varistor element during sintering process. Accordingly, the manufacturing process can be shortened, thereby improving the productivity. The manufacturing method comprises (a) a first process of forming the varistor element whose main component is zinc oxide; (b) a second process of sintering the varistor element and precipitating zinc compound having at least one of acid resistance and alkali resistance on the surface of the varistor. Preferably, the manufacturing method further comprises (c) a process of attaching an external electrode to the varistor element, and the external electrode attaching process is executed after finishing the varistor element sintering process.

Abstract: A method of making a low-cost metal diaphragm sensor that integrates both pressure and temperature sensing in a single sensor assembly utilizes thick-film processing to form a circuit including stress and temperature sensitive elements on the outboard or exposed surface of a thin metal diaphragm separating the circuit from a pressurized fluid. Only a thin layer of dielectric separates the stress and temperature sensitive elements from the diaphragm surface. The stress sensitive elements respond to mechanical stressing of the diaphragm due to the presence of the pressurized fluid, while the temperature sensitive element responds to the temperature of the pressurized fluid. The thermal capacity of the fluid greatly exceeds that of the diaphragm, so that the temperature responsive characteristic of the temperature sensitive element accurately reflects the temperature of the pressurized fluid.