Abstract: Embodiments relate to a coating system. A substrate includes a first coating region and a second coating region adjacent to the first coating region. The coating system includes a first gravure mechanism and a second gravure mechanism, where the first gravure mechanism is configured to apply a first functional layer onto the first coating region, and the second gravure mechanism can receive the substrate having the first functional layer and apply a second functional layer made of a material different from that of the first functional layer onto the second coating region. In the coating system, with provision of first gravure mechanism and the second gravure mechanism, when the substrate is continuously transported in a same direction, the two functional layers made of different materials can be sequentially applied onto corresponding regions of the substrate.

Abstract: For correction of a source gas supply time and a dopant gas flow rate, a calculation unit in an epitaxial wafer production system performs not only correction based on a result of comparing measured thickness and resistivity of an epitaxial film respectively with a target thickness range and a target resistivity range, but also correction based on a variation in total output value of upper and lower lamps.

Abstract: Provided is an abnormality detection system that includes a first controller configured to control a substrate processing apparatus and a second controller configured to control a device provided in the substrate processing apparatus according to an instruction from the first controller, thereby detecting an abnormality in the device. The second controller includes a storage unit configured to collect status signals for the device for a predetermined time and at a predetermined sampling interval in a predetermined cycle and accumulate the collected status signals for the device, and the first controller includes an abnormality determination unit configured to acquire the accumulated status signals for the device from the second controller at a time interval equal to or longer than the predetermined time, and determine presence or absence of an abnormality in the device.

Abstract: A printing parameter acquisition device includes an acquisition section and an output section. The acquisition section acquires a printing condition for specifying a member to be used when solder is printed on a board. The output section outputs, from a database that stores the printing condition, a printing parameter used for controlling driving of a printer, and a reliability of the printing parameter in association with each other, the printing parameter which is associated with the printing condition corresponding to the printing condition acquired by the acquisition section and of which the reliability is a predetermined level or more.

Abstract: A substrate processing apparatus performs a drying process for drying a substrate with a liquid film formed on a pattern formation surface thereof, using a processing fluid in a supercritical state. The substrate processing apparatus includes a processing container, a holder, and a processing liquid supply. The processing container accommodates the substrate. The holder holds the substrate inside the processing container. The processing liquid supply supplies a processing fluid into the processing container. Further, the holder includes a base, a plurality of support members, and a lifting mechanism. The base is disposed below the substrate. The plurality of support members are provided on the base, and support the substrate from below. The lifting mechanism moves the plurality of support members up and down.

Abstract: A method of manufacturing a formed body for an electrode includes: preparing an electrode material; placing a shape retaining member having an rectangular tubular shape with one opening portion L thereof facing down, and supplying the electrode material into the shape retaining member from the other opening portion M thereof; and discharging the electrode material onto a support from the opening portion L while relatively moving the opening portion L and the support, to form a film, a bulk density D1 of the electrode material in the first step and a bulk density D2 of the electrode material at the opening portion L satisfying a relationship of D2/D1=1.1 to 30, and a width T1 of the opening portion L in a short side direction and a distance T2 between the end portion X of the opening portion L and the support satisfying a relationship of width T1>distance T2.

Abstract: Provided is a substrate holding device that inhibits drop in holding accuracy of a substrate. A Bernoulli chucking pad suctions and holds a front surface or a back surface of a substrate S. A position determiner 54 is capable of pushing the substrate S in contact with a side surface 82 of the substrate S, and positioning the suctioned substrate S. A pin 66 enables the position determiner 54 to come in contact with the side surface 82 of the substrate S. The pin 66 brings the position determiner 54 into contact with the side surface 82 of the substrate S, and the position determiner 54 thereby positions the substrate S.

Abstract: A device includes a material dispenser and a fluid dispenser. The material dispenser is to dispense a build material layer-by-layer, to at least partially additively form a first 3D object. The fluid dispenser is to dispense at least one fluid agent at selectable exterior voxel locations of the respective layers to at least partially define an external surface of the first 3D object as a first color to represent a first non-color material property of at least a first portion of the first 3D object. The selection of the first color is independent of characteristics of the first non-color material property.

Abstract: A method of analyzing film on a substrate comprises receiving surface profile data obtained from measurements of a plurality of discrete regions on a substrate, the plurality of discrete regions comprising one or more film layers; extracting a plurality of parameters from the received surface profile data, the plurality of parameters comprising one or more parameters of the one or more film layers of each of the plurality of discrete regions, wherein the extracting is based on a predetermined pattern for the plurality of the discrete regions on the substrate; and displaying a user interface.

Abstract: The disclosure relates to a method of determining a velocity profile for the movement of a substrate to be coated relative to a coating source.

Abstract: There is provided a gas processing apparatus, including: a vacuum vessel; a mounting part installed in the vacuum vessel and configured to mount a substrate; an opposing part configured to face the mounting part and including first gas discharge ports configured to discharge a processing gas to the substrate; a first diffusion space configured to communicate with the first gas discharge ports; second gas discharge ports formed in a ceiling portion and configured to supply the processing gas to a central portion of the first diffusion space; a second diffusion space configured to communicate with the second gas discharge ports; a gas supply path installed at an upstream side of the second diffusion space and configured to supply the processing gas to the second diffusion space; and third gas discharge ports configured to be opened to an outer portion of the ceiling portion in an oblique direction.

Abstract: A potentiometric sensor that includes a housing and working electrode is provided. The housing includes a reference electrode, a first hydrogel containing hydrogel that contains a reference solution, and a salt bridge. The sensor is wearable and can be used for continuous on-body sweat measurements.

Abstract: A method and system provide for reducing gaps between two mating parts. Either or both parts may be nondestructively inspected at a plurality of locations on a surface to gather a data set relating to the part thickness. The data set may be used to calculate a set of as-built thickness values for the part and a set of deviations from a design model. A mating area may be determined for mating surfaces of the parts. One or more layers of sacrificial material in the mating area may be prepared for any deviations greater than a design allowance. The system may include a ply cutting device and an additive manufacturing device coupled to a computer to receive the sacrificial material layer data and shim data and to cut the one or more layers of sacrificial material and to construct the shim. A shim may be constructed for any deviations equal to or greater than a minimum shim thickness. The one or more layers of sacrificial material may be applied to the part, cured, and machined to a desired thickness.

Abstract: Described herein is a technique capable of improving a quality of a substrate processing. According to one aspect of the technique described herein, there is provided a method of manufacturing a semiconductor device including: (a) receiving substrate data including at least one of a stacked number of layers of a device formed on a substrate and a structure of the device; (b) setting an apparatus parameter corresponding to the substrate data; (c) supporting the substrate corresponding to the substrate data above a substrate support; (d) elevating a temperature of the substrate based on the apparatus parameter while the substrate is separated from a surface of the substrate support; (e) placing the substrate on the substrate support after (d); and (f) processing the substrate in a process chamber.

Abstract: A method for coating a surface of a substrate may involve coating the surface of the substrate with a wet coating by way of a coating station, conveying the substrate by way of a conveying device, and detecting the surface coated with the wet coating by producing a thermal image of a detection region that comprises part of the surface. The thermal image may be recorded in a spectral range that includes a wavelength between 1 micrometer and 20 micrometers. Further, the detection region may be located directly downstream of the coating station, or the detection region may at least partially include the coating station.

Abstract: System and methods for calibrating a coating system are disclosed. Initially, a material is dispensed using an applicator of the coating system for a predetermined time period. A characteristic of the dispensing of the material for the predetermined time period is then determined. The characteristic of the dispensing of the material is compared to a predetermined range and it is determined that the characteristic of the dispensing of the material is outside of the predetermined range. In response, a velocity of the applicator, a pulse rate of the applicator, a temperature of the material, a pressure of the material supplied to the applicator, or a fan width of the applicator is adjusted to change the characteristic of the dispensing of the material.

Abstract: A blade outer air seal (BOAS) or segment thereof comprises: a metallic substrate having an inner diameter (ID) surface; and a coating system along the inner diameter surface comprises: a bondcoat atop the substrate; and a ceramic barrier coat atop the bondcoat. The bondcoat has a combined content of one or more of molybdenum, chromium, and vanadium of at least 50 percent by weight.

Abstract: In some embodiments, the present disclosure relates to a method of bump metrology The method is performed by forming a through-substrate-via within a substrate, forming a plurality of metal interconnect layers within a dielectric structure over the substrate, and forming a bump on the plurality of metal interconnect layers. One or more substrate warpage parameters of the substrate are measured and an initial position of a lens within a substrate metrology module is calculated based upon the one or more substrate warpage parameters. The lens is then moved to the initial position, and a height and a width of the bump are measured using the substrate metrology module after moving the lens to the initial position.

Abstract: A uniquely featured addition to previous three dimensional prototyping machinery without any traversing X and Y coordinate moving parts, thus saving time by focusing on only an incrementally regular Z stage and the rapidity of chemical deposition via electrically localized reaction nodes through a porous/channeled plane called the build/extrusion platen. Processes for making objects using such machine and platen are also disclosed as well as features and further indexing of extrusion location inventions. Other features including chemistry, curing material, and curing control as well as activation methods and machines are also disclosed in combination with the feature of a simultaneous two-dimensional layer-wise deposition machine and process for “growing” the object in the Z direction using the displaceable platen or object supporting stage in a rapid manner. Further due to the rapid growth and deposition manner, additional benefits to the object creation and curable material, e.g. a monomer can be realized.

Abstract: A uniquely featured addition to previous three dimensional prototyping machinery without any traversing X and Y coordinate moving parts, thus saving time by focusing on only an incrementally regular Z stage and the rapidity of chemical deposition via electrically localized reaction nodes through a porous/channeled plane called the build/extrusion platen. Processes for making objects using such machine and platen are also disclosed as well as features and further indexing of extrusion location inventions. Other features including chemistry, curing material, and curing control as well as activation methods and machines are also disclosed in combination with the feature of a simultaneous two-dimensional layer-wise deposition machine and process for “growing” the object in the Z direction using the displaceable platen or object supporting stage in a rapid manner. Further due to the rapid growth and deposition manner, additional benefits to the object creation and curable material, e.g. a monomer can be realized.

Abstract: A gas decomposition reactor for the decomposition of a gas into a mixture of solid and gaseous by-products is disclosed. The gas decomposition reactor includes a reactor vessel, a Raman spectrometer, and a processor. The reactor vessel has an inlet for receiving inlet gas and an exhaust outlet for releasing exhaust gas. The Raman spectrometer is connected with the exhaust outlet for determining a chemical conversion within the reactor chamber and generating a corresponding signal. The processor is connected with the Raman spectrometer to receive the signal from the Raman spectrometer. The processor is capable of comparing the signal with a set of values and calculating differences between the signal and the set of values. The processor is connected with the inlet to regulate a flow of the inlet gas.

Abstract: A calibration wafer may bear one or more different mark types to facilitate inspection of a lithography process. A first mark type may be located on the outer peripheral portion of the wafer to indicate the desired boundary of an edge bead removal (EBR) region. A second mark type may be located on an outer peripheral portion of the wafer to indicate the desired boundary of a wafer edge expose region (WEE). A third mark type may indicate the border of a portion of the wafer expected to bear a wafer identification mark. A fourth mark type may be located at the center of the wafer to allow for precise and uniform application of liquid photoresist material to the calibration wafer. The calibration wafer may be employed in methods of rapidly and easily assessing the accuracy of various phases of photolithography processes.

Abstract: A treatment liquid application apparatus including an application roller for applying treatment liquid; a press roller for pressing against the application roller an elongated recording medium which is placed between the press roller and the application roller; and a conveyance roller located downstream relative to the application roller on a conveyance path of the recording medium and conveying the recording medium is disclosed. The apparatus includes a control unit for causing the press roller to be pressed against the application roller when a value related to a conveyance amount of the recording medium conveyed by the conveyance roller from a re-start of conveyance exceeds a value corresponding to a slack amount of the recording medium which occurs in an upstream side of the conveyance roller at a stopping of conveyance.

Abstract: A method is described for improving the uniformity over a predetermined substrate area of a spectral response of photonic devices fabricated in a thin device layer. The method includes (i) establishing an initial device layer thickness map for the predetermined area, (ii) establishing a linewidth map for the predetermined area, and (iii) establishing an etch depth map for the predetermined area. The method further includes, based on the initial device layer thickness map, the linewidth map and the etch depth map, calculating an optimal device layer thickness map and a corresponding thickness correction map for the predetermined substrate area taking into account photonic device design data. Still further, the method includes performing a location specific corrective etch process in accordance with the thickness correction map.

Abstract: A method for manufacturing a gravure plate includes, setting a certain measurement area on a surface of the gravure plate, finding at least one of a spatial volume that is the total of the volume of a space formed by a plurality of cells located in the measurement area and an average depth obtained by dividing the spatial volume by a surface area of the measurement area, and adjusting, based on a relationship between at least one of the spatial volume and the average depth and an application thickness of a printing material after printing, at least one of the spatial volume and the average depth so as to fall within at least one of a specified value range for the spatial volume and a specified value range for the average depth determined in accordance with a target value range for the application thickness.

Abstract: A method for non-destructive evaluation of an article of manufacture (30) by coating the article with a temperature-sensitive coating (34), stimulating the article with energy (18) to induce temperature changes in the article responsive to features of the article, then evaluating (24) a resulting topography of energy-induced changes (50, 52, 53) in the coating (34). The energy imparted to the article may be, for example, electromagnetic, magnetic, or sonic energy that produces localized changes in temperature in the article (30) in response to features (32) of the article such as flaws or other discontinuities. The coating (34) may be a suspension of liquid crystals in a liquid, and the energy may be an application of sonic energy. The coating may be a material that hardens (42, 54) or softens (44, 56) upon a slight increase in temperature. Layers (34, 35) of different energy-sensitive coatings (38, 40) may be applied to indicate different aspects of features of the article.

Abstract: Provided are a crucible for vapor deposition, a vapor deposition apparatus and a vapor deposition method capable of detecting a film formation rate using a sensor in vapor deposition by proximity vapor deposition. The crucible according to the present invention includes a storage section that stores a vapor deposition source, a first guide passage that guides a vaporized material emitted from the vapor deposition source toward a substrate to be treated, a wall section for defining the first guide passage and a second guide passage that diverges from a middle part of the first guide passage, penetrates the wall section and communicates with the outside.

Abstract: A method of producing an extremely thick insulation coating on a surface of an electrical steel, comprises the following steps: 1) preparing a coating liquid—stirring sufficiently the coating liquid for 0.1˜4 hours, with the viscosity of the coating liquid being within 10˜80 S; 2) coating a strip steel—using a double-roller or a tri-roller coating machine, wherein the film thickness and evenness can be controlled by adjusting different parameters; 3) baking the coating—using three sections, that is, a drying section, a baking section and a cooling section, to bake the coating, wherein the temperature in the drying section is 100˜400° C., the temperature in the baking section is 200˜370° C.

Abstract: A method of producing a multilayer magnetoelectronic device and a related device. The method includes depositing a multilayer structure including at least two ferromagnetic layers disposed one on top of the other and each having a magnetic anisotropy with a corresponding magnetic moment. A magnetization curve is specified for the magnetoelectronic device. The number of ferromagnetic layers and, for each of the ferromagnetic layers, the magnetic moment and the magnetic hardness for obtaining the specified magnetization curve are determined. For each of the ferromagnetic layers a magnetic material, a thickness, an azimuthal angle and an angle of incidence are determined for obtaining the determined magnetic moment and magnetic hardness of the respective ferromagnetic layer. The multilayer structure is deposited using the determined material, thickness, azimuthal angle and angle of incidence for each of the ferromagnetic layers.

Abstract: Processes for real time process control of the Polymer Dispersion Index (PDI) during polymerization processes. By tuning this chain length distribution in real time, a resulting polymer can have predetermined physical properties such as thickness, physical yield strength, decomposition time, thermal stability, etc. Techniques herein can dynamically control chain length distribution through use of a mass density measurement device located within a processing chamber and providing real time feedback of polymer growth. Chamber parameters can be controlled or modified before and during polymerization based on mass density feedback. Such chamber parameters can include pressure, temperature, chemistry, and process gas flow rates and flow periods.

Abstract: It is described a method for changing parameters for controlling a transfer of solder paste onto a printed circuit board (150, 250).

Abstract: The invention relates to a material configured such as to include a plurality of layers, some layers being made of a composite material and some layers being made of a dielectric material. The layers of composite material include a mixture of host dielectric material and inclusions, such that said inclusions are embedded in the structure of the host dielectric material. Said inclusions preferably include highly conductive fibres, specifically metal microwires. Thus, the structure of the material according to the invention includes a plurality of layers, some layers being made of a composite material, which includes a host dielectric material with inclusions, and some layers being made of a dielectric material. The structure of the material according to the invention is designed so that the surface on which said material is applied is capable of absorbing a portion of the incident electromagnetic radiation, thus substantially reducing the electromagnetic radiation reflected by same curved.

Abstract: A method of forming a micropattern structure includes: coating a structure including a plurality of guide blocks extending in a first direction on a substrate and disposed to be spaced apart from each other in a second direction, which is perpendicular to the first direction, with a sacrificial material; ashing a portion of the sacrificial material to expose upper portions of the plurality of guide blocks; coating the structure with a first material having a polarity that is contrary to a polarity of a filling material filling the structure; heat-treating the structure to chemically bond the first material to the upper portions of the plurality of guide blocks; removing the sacrificial material and excess first material to form a first material cap chemically bonded to the upper portions of the plurality of guide blocks; and filling the structure with the filling material.

Abstract: A method of manufacturing a stacked thin film piezoelectric filter includes the steps of forming a lower thin film piezoelectric resonator on a substrate, measuring a frequency of the lower thin film piezoelectric resonator and adjusting the frequency, forming an acoustic coupling layer on the lower thin film piezoelectric resonator whose frequency has been adjusted, forming the stacked thin film piezoelectric filter by forming an upper thin film piezoelectric resonator on the acoustic coupling layer, and measuring a frequency of the upper thin film piezoelectric resonator and adjusting the frequency.

Abstract: The present invention includes the steps of (A) forming a solution containing zinc into mist and spraying the solution formed into mist onto a substrate under no vacuum to form a metal oxide film on the substrate, and (B) irradiating the metal oxide film with ultraviolet rays to decrease a resistance of the metal oxide film. Further, the step (B) includes the steps of (B-1) determining, in accordance with a film thickness of the metal oxide film, wavelengths of the ultraviolet rays to be radiated, and (B-2) irradiating the metal oxide film with the ultraviolet rays having the wavelengths determined in said step (B-1).

Abstract: An ultrasonic transmitting and receiving device is provided for measuring the transmission and/or reflection of ultrasonic waves on a thin material sheet, or a coating applied thereto. The device may include a plurality of ultrasonic transmitters, a plurality of ultrasonic receivers, wherein the number of the ultrasonic transmitters corresponds to the number of the ultrasonic receivers, and one receiver electronics respectively for each of the ultrasonic receivers or a group receiver electronics respectively for a predetermined number of ultrasonic receivers. A method is provided for ultrasonic absorption and/or transmission measurement, in which signals are emitted by multiple ultrasonic transmitters at the same time or nearly at the same time which are received by ultrasonic receivers and in which the received signals are evaluated in parallel.

Abstract: Provided is a substrate processing apparatus in which after a module is disabled, a substrate is provided to a carry-in module capable of placing the wafers most rapidly in the plurality of unit blocks and the substrates are sequentially transported to the module group by the transportation means to be delivered to the carry-out module according to a providing sequence of the substrate to the carry-in module in each of the plurality of unit blocks. In particular, the substrates are extracted from the carry-out module according to a providing sequence of the substrate to the carry-in module and transported to a rear module or a substrate placing part. Thereafter, the substrates are transported to the rear module from the carry-out module or the substrate placing part according to a predetermined sequence in which the substrate is provided to the carry-in module in a normal state.

Abstract: A deposition amount measuring apparatus includes a plate-shaped body having a rotating shaft, a plurality of deposition amount sensors along side surfaces of the body, the deposition amount sensors being configured to measure an amount of deposition material, and a housing surrounding the body, the housing including an inflow port that exposes one of the deposition amount sensors.

Abstract: Various embodiments relate to application of a fluid to a substrate. The fluid is locally heated, for example, to obtain a desired thickness profile.

Abstract: The invention relates to a method for hydrophilizing surfaces of polymer workpieces. The method has a step (a) of pretreating the workpiece surfaces in a high-frequency gas plasma which is produced on the basis of an inert gas in order to clean and activate the workpiece surfaces; a step (b) of precoating the pretreated workpiece surfaces with polyacrylic acid using a high-frequency gas plasma made of a gas mixture, said gas mixture being composed of an inert gas and a first gas made of biocompatible, polymerizable carboxy group-containing monomers; and a step (c) of subsequently coating the precoated workpiece surfaces using a second gas substantially containing acrylic acid monomers.

Abstract: A system and method of coating a workpiece is disclosed. A controller is in electronic communication with a robotic manipulator having a coating dispenser. A layer of coating is applied to a surface of the workpiece by the robot. A wet-surface time is determined corresponding to the areas of the surface upon which the layer of coating is applied. A second layer of coating is applied prior to the expiration of the wet-surface time of the first layer. The layers of coating in adjacent segments can be applied in an overlapping manner within the boundary regions of the segments.

Abstract: The present disclosure provides, among other things, scale-coated surfaces, vessels with controlled deposits of scale, and associated methods for enhanced boiling heat transfer. It is presently found that creating and/or maintaining a scale deposit at a controlled thickness actually enhances a type of boiling called nucleate boiling, which improves heat transfer.

Abstract: According to some embodiments, a method of depositing at least one electrode on a base member of an ultrasound transducer comprises at least partially etching a surface of the base member using a first etching agent, catalyzing the surface of the base member using a first catalyst, plating copper on the surface of the base member using an electroless plating process, inspecting the copper plated on the surface of the base member, at least partially etching a surface of the copper-plated surface using a second etching agent, catalyzing the copper-plated surface using a second catalyst, plating nickel on the copper-plated surface using an electroless plating process and depositing at least one layer of gold on the nickel-plated surface.

Abstract: Disclosed are coating apparatus including flow coating and roll-coating that may be used for uniform sol-gel coating of substrates such as glass, solar panels, windows or part of an electronic display. Also disclosed are methods for substrate preparation, flow coating and roll coating. Lastly systems and methods for skin curing sol-gel coatings deposited onto the surface of glass substrates using a high temperature air-knife are disclosed.

Abstract: A method for processing a substrate in a reactor by pulsing RF power, includes: applying RF power in pulses in the reactor to process the substrate; monitoring data from the reactor indicative of anomalous pulses of RF power, including data from a photo sensor equipped in the reactor; counting the number of anomalous pulses of RF power in the monitored data; determining whether or not the number of anomalous pulses of RF power is acceptable; and initiating a pre-designated sequence if the number of anomalous pulses of RF power is determined to be unacceptable.

Abstract: An aspect of the present invention provides an ejection volume correction method for an inkjet head, including: an arranging step of ejecting functional ink as ink droplets from nozzles of an inkjet head so as to discretely arrange the ink droplets on a front surface of a substrate; a contacting step of filling the functional ink in between a mold and the substrate by causing the mold to contact the ink droplets arranged on the front surface of the substrate; a curing step of curing the filled functional ink so as to generate a functional film ; a separating step of separating the mold from the functional film; a measuring step of measuring a thickness of the functional film; and a correcting step of correcting an ejection volume from the nozzles based on the measured thickness.

Abstract: The present invention provides a method for repairing open line defect on LCD array substrate, which includes: when discovering open line defect on a pattern on LCD array substrate, identifying a repair line path of the open line on the pattern and scanning the repair line path; based on the result of scanning the repair line path, dividing the repair line path into at least two path segments and disposing corresponding coating speed for each path segment; and for each path segment, performing coating at the corresponding speed to form connected coating on the repair line path. The present invention also provides a device for repairing open line defect on LCD array substrate. As such, the present embodiment can increase success rate for repairing open lines.

Abstract: An apparatus for passivating a coating of a flexible substrate includes a coating chamber for coating the flexible substrate, a chamber separation element, the chamber separation element being arranged for separating the coating chamber from a further chamber, a coating drum, the coating drum and the chamber separation element forming a gap, and a gas inlet, the gas inlet being arranged within the chamber separation element for supplying oxygen into the gap.

Abstract: A thin film deposition apparatus and method are disclosed. In one aspect, the deposition apparatus comprises a deposition source emitting a deposition material that is to be deposited on a surface of a substrate, a transfer unit moving the deposition source, a thickness measurement sensor measuring a thickness of the deposition material deposited on the surface of the substrate, and a transfer controller adjusting a moving speed of the transfer unit according to the thickness of the deposition material deposited on the surface of the substrate per unit of time.

Abstract: The invention provides methods and compositions for monitoring and controlling the thickness of coating on a creping cylinder is disclosed. The methodologies involve a coordinated scheme of apparatuses that function to monitor various aspects of a creping cylinder coating so that the thickness of the coating can be determined.