Radiation Sensitive Composition Or Product Or Process Of Making Patents (Class 430/270.1)
  • Patent number: 11960208
    Abstract: A photosensitive element comprising a support film, a barrier layer, and a photosensitive layer in this order, wherein the barrier layer contains a water-soluble resin and an ultraviolet absorber.
    Type: Grant
    Filed: May 8, 2019
    Date of Patent: April 16, 2024
    Assignee: RESONAC CORPORATION
    Inventors: Masakazu Kume, Hiroshi Ono
  • Patent number: 11926581
    Abstract: The sulfonium salt has high photosensitivity to i-rays and high compatibility with cationically polymerizable compounds such as epoxy compounds, and is excellent storage stability in formulations containing such compounds. The sulfonium salt is represented by general formula (1). In formula (1), R represents an alkyl group or an aryl group; substituents, R1 to R5, each independently represent an alkyl group, a hydroxy group, an alkoxy group, an aryl group, an aryloxy group, a hydroxy(poly)alkyleneoxy group, or a halogen atom; R6 to R9 each independently represent an alkyl group, an aryl group, or a hydrogen atom; m1 to m5 each represent the number of occurrences of each of R1 to R5, m1 and m4 represent an integer of 0 to 3, m2 and m5 represent an integer of 0 to 4, m3 represents an integer of 0 to 5, and X? represents a monovalent polyatomic anion.
    Type: Grant
    Filed: April 9, 2019
    Date of Patent: March 12, 2024
    Assignee: SAN-APRO LIMITED
    Inventors: Takuto Nakao, Yusaku Takashima
  • Patent number: 11921428
    Abstract: According to one embodiment, a substrate processing method is disclosed. The method can include treating a substrate with a first liquid. The substrate has a structural body formed on a major surface of the substrate. The method can include forming a support member supporting the structural body by bringing a second liquid into contact with the substrate wetted by the first liquid, and changing at least a portion of the second liquid into a solid by carrying out at least one of causing the second liquid to react, reducing a quantity of a solvent included in the second liquid, and causing at least a portion of a substance dissolved in the second liquid to be separated. The method can include removing the support member by changing at least a part of the support member from a solid phase to a gaseous phase, without passing through a liquid phase.
    Type: Grant
    Filed: February 25, 2022
    Date of Patent: March 5, 2024
    Assignee: Kioxia Corporation
    Inventors: Yoshihiro Uozumi, Shinsuke Kimura, Yoshihiro Ogawa, Hiroyasu Iimori, Tatsuhiko Koide, Hideaki Hirabayashi, Yuji Nagashima
  • Patent number: 11923274
    Abstract: The subject application discloses a substrate. The substrate includes a first conductive layer, a first bonding layer, a first dielectric layer, and a conductive via. The first bonding layer is disposed on the first conductive layer. The first dielectric layer is disposed on the first bonding layer. The conductive via penetrates the first dielectric layer and is electrically connected with the first conductive layer.
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: March 5, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Wen Hung Huang
  • Patent number: 11919054
    Abstract: Embodiments of the present disclosure relate to a cleaning device and a method of cleaning a nozzle, and relate to the technical field of semiconductor manufacturing. The cleaning device includes: a body configured to surround the nozzle, where the body includes a body inlet and a body outlet; and at least one row of first runners configured to introduce a cleaning agent, where the first runners are arranged along an outer circumference of the body, an outlet of each of the first runners communicates with the body, and a cleaning position is formed at the outlet of the first runner.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: March 5, 2024
    Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
    Inventor: Qilong Wu
  • Patent number: 11880134
    Abstract: New Te-salt compounds, including photoactive tellurium compounds useful for Extreme Ultraviolet Lithography.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: January 23, 2024
    Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Emad Aqad, James F. Cameron, James W. Thackeray
  • Patent number: 11860537
    Abstract: [Object] To provide a positive type photosensitive composition capable of forming a cured film having high transparency [Means] The present invention provides a positive type photosensitive siloxane composition comprising: a polysiloxane, a diazonaphthoquinone derivative, an additive having a >N—C(?O)— or >N—C(?S)— structure and the capability of interacting with the polysiloxane, and a solvent. The polysiloxane and the additive interact with each other before exposure, but they lose the interaction after exposure.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: January 2, 2024
    Assignee: Merck Patent GmbH
    Inventors: Naofumi Yoshida, Megumi Takahashi, Katsuto Taniguchi
  • Patent number: 11842896
    Abstract: A single layer process is utilized to reduce swing effect interference and reflection during imaging of a photoresist. An anti-reflective additive is added to a photoresist, wherein the anti-reflective additive has a dye portion and a reactive portion. Upon dispensing the reactive portion will react with underlying structures to form an anti-reflective coating between the underlying structure and a remainder of the photoresist. During imaging, the anti-reflective coating will either absorb the energy, preventing it from being reflected, or else modify the optical path of reflection, thereby helping to reduce interference caused by the reflected energy.
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: December 12, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hung-Jui Kuo, Hsing-Chieh Lee, Ming-Tan Lee
  • Patent number: 11827786
    Abstract: A resin composition includes: (A) a polyphenylene ether resin of Formula (1) and (B) a compound of Formula (3), and/or a compound of Formula (4), and/or a compound of Formula (5). An article is made from the resin composition. The article made from the resin composition may include a prepreg, a resin film, a laminate or a printed circuit board, and one or more properties including resin filling void, glass transition temperature, Z-axis ratio of thermal expansion, dielectric constant, dissipation factor, and warpage may be improved.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: November 28, 2023
    Assignee: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.
    Inventors: Chenyu Shen, Jue Tan
  • Patent number: 11820735
    Abstract: Described are a salt and a resist composition capable of producing a resist pattern with satisfactory line edge roughness (LER). The salt is represented by formula (I): In formula (I), R1, R2, R3, R4 and R5 each independently represent a halogen atom or a perfluoroalkyl group having 1 to 6 carbon atoms, R6, R7 and R8 each independently represent a halogen atom, a hydroxy group, a fluorinated alkyl group having 1 to 6 carbon atoms or an alkyl group having 1 to 12 carbon atoms, and —CH2— included in the alkyl group may be replaced by —O— or —CO—, m5 represents an integer of 1 to 5, m6 represents an integer of 0 to 3, m7 represents an integer of 0 to 3, m8 represents an integer of 0 to 4, and AI? represents an organic anion.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: November 21, 2023
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Yukako Anryu, Koji Ichikawa
  • Patent number: 11822251
    Abstract: Methods and materials for making a semiconductor device are described. The method includes forming a photoresist over a substrate. The photoresist includes an acid-labile group (ALG) connected to a polar unit. The method also includes exposing the photoresist to a radiation beam, baking the photoresist and performing a developing process to the photoresist.
    Type: Grant
    Filed: February 9, 2016
    Date of Patent: November 21, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: An-Ren Zi, Ching-Yu Chang
  • Patent number: 11793017
    Abstract: A display device includes a display panel, a cover member disposed on the display panel, and an adhesive layer disposed between the display panel and the cover member. The adhesive layer has a first surface facing the cover member and a second surface facing the display panel, and includes a first area and a second area disposed at positions different from each other in a first direction from the first surface toward the second surface. A modulus of the first area is different from a modulus of the second area.
    Type: Grant
    Filed: June 8, 2022
    Date of Patent: October 17, 2023
    Assignee: Samsung Display Co., Ltd.
    Inventor: Kukbin Lim
  • Patent number: 11782344
    Abstract: This disclosure relates to a photosensitive composition that includes at least one fully imidized polyimide polymer having a weight average molecular weight in the range of about 20,000 Daltons to about 70,000 Daltons; at least one solubility switching compound; at least one photoinitiator; and at least one solvent. The composition is capable of forming a film or a dry film having a dissolution rate of greater than about 0.15 micron/second using cyclopentanone as a developer.
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: October 10, 2023
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Sanjay Malik, Raj Sakamuri, Ognian N. Dimov, Binod B. De, William A. Reinerth, Ahmad A. Naiini
  • Patent number: 11781028
    Abstract: An ink composition is provided. The composition includes a binder material and at least one narrow band emission phosphor being uniformly dispersed throughout the composition, wherein the narrow band emission phosphor has a D50 particle size from about 0.1 ?m to about 15 ?m and is selected from the group consisting of a green-emitting U6+-containing phosphor, a green-emitting Mn2+-containing phosphor, a red-emitting phosphor based on complex fluoride materials activated by Mn4+, and a mixture thereof. A device is also provided.
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: October 10, 2023
    Assignee: General Electric Company
    Inventors: Mark D. Doherty, Yangang Liang, Jie Jerry Liu, Samuel Joseph Camardello, James Edward Murphy
  • Patent number: 11760865
    Abstract: The present invention relates to the use of halogen-free sulphonic acid esters and/or sulphinic acid esters as flame retardant and/or flame retardant synergists in plastics. The invention furthermore relates to the use of said compounds as radical generators in plastics, particularly in order to increase the molecular weight of the plastics, to branch and/or cross-link the plastics, to reduce the molecular weight of the plastics, to influence the molecular weight distribution of the plastics and to graft unsaturated monomers to the plastics. The present invention furthermore relates to the use of flame-retardant plastic compositions in the electrical or electronics industry, construction industry, transport industry, preferably automobiles, aircraft, trains and ships, for medical applications, for household appliances, vehicle parts, consumer products, packaging, furniture and textiles.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: September 19, 2023
    Assignee: Fraunhofer-Gesellschaft zur förderung der angewandten Forschung e.V.
    Inventors: Rudolf Pfaendner, Thomas Driever, Anina Leipold, Elke Metzsch-Zilligen
  • Patent number: 11747725
    Abstract: A radiation-sensitive resin composition includes: a resin including a structure unit having an acid-dissociable group; a radiation-sensitive acid generator; and a solvent. The radiation-sensitive acid generator includes at least two of compounds represented by formulae (1) to (3), provided that the compound represented by formula (1) and the compound represented by formula (3) within the scope of the compound represented by formula (2) are excluded. In the formulae (1) to (3), R1, R2 and R3 are each independently a group having a cyclic structure; X11, X12, X21, X22, X31 and X32 are each independently a hydrogen atom, a fluorine atom, or a fluorinated hydrocarbon group, provided that both X11 and X12, both X21 and X22, and both X31 and X32 are not a hydrogen atom, respectively.
    Type: Grant
    Filed: April 16, 2018
    Date of Patent: September 5, 2023
    Assignee: JSR CORPORATION
    Inventor: Ken Maruyama
  • Patent number: 11745531
    Abstract: The present invention provides a printing plate precursor including a layer which includes particles and is provided at a printing surface side of an aluminum support, in which a modulus of elasticity of the particles is 0.1 GPa or more, and in a case where a Bekk smoothness of an outermost layer surface at the printing surface side is denoted by A second, a specific expression (1) is satisfied; a printing plate precursor laminate; a method for making a printing plate; and a printing method.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: September 5, 2023
    Assignee: FUJIFILM Corporation
    Inventors: Shuji Shimanaka, Shumpei Watanabe
  • Patent number: 11709425
    Abstract: A resist composition including: a compound including an anion moiety and a cation moiety and represented by the following Formula (bd1); and an organic solvent having a hydroxyl group in which Rx1 to Rx4 each represent a hydrocarbon group or a hydrogen atom, or may be bonded to each other to form a ring structure; Ry1 and Ry2 each independently represent a hydrocarbon group or a hydrogen atom, or may be bonded to each other to form a ring structure; Rz1 to Rz4 each represent a hydrocarbon group or a hydrogen atom, or may be bonded to each other to form a ring structure; at least one of Rx1 to Rx4, Ry1 and Ry2 and Rz1 to Rz4 has an anionic group; and Mm+ represents an organic cation)
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: July 25, 2023
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Takaya Maehashi, Yoshitaka Komuro
  • Patent number: 11703756
    Abstract: A resist composition including a compound represented by formula (bd1), a total amount of the acid-generator component and the basic component being 20 to 70 parts by weight, relative to 100 parts by weight of the base material component. In the formula, Rx1 to Rx4 represents a hydrogen atom or a hydrocarbon group, or two or more of Rx1 to Rx4 may be mutually bonded to form a ring structure; Ry1 and Ry2 represents a hydrogen atom or a hydrocarbon group, or Ry1 and Ry2 may be mutually bonded to form a ring structure; Rz1 to Rz4 represents a hydrogen atom or a hydrocarbon group, or two or more of Rz1 to Rz4 may be mutually bonded to form a ring structure; provided that at least one of Rx1 to Rx4, Ry1, Ry2 and Rz1 to Rz4 has an anionic group; and Mm+ represents an m-valent organic cation).
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: July 18, 2023
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Koshi Onishi, KhanhTin Nguyen, Masatoshi Arai, Yoshitaka Komuro
  • Patent number: 11693317
    Abstract: A photosensitive resin composition comprising (A) a vinyl ether compound, (B) an epoxy-containing silicone resin, and (C) a photoacid generator is provided. The composition enables pattern formation using radiation of widely varying wavelength, and the patterned film has high transparency, light resistance, and heat resistance.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: July 4, 2023
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hitoshi Maruyama, Kazunori Kondo
  • Patent number: 11693314
    Abstract: A resist composition containing: (A) a resin containing a repeating unit having an acid-labile group; (B) a photo-acid generator shown by a general formula (B-1); and (C) a solvent, where W1 represents a cyclic divalent hydrocarbon group having 4 to 12 carbon atoms and containing a heteroatom; W2 represents a cyclic monovalent hydrocarbon group having 4 to 14 carbon atoms and not containing a heteroatom; Rf represents a divalent organic group shown by the following general formula; and M+ represents an onium cation. This provides a resist composition and a patterning process that uses the resist composition that show a particularly favorable mask dimension dependency (mask error factor: MEF), LWR, and critical dimension uniformity (CDU) particularly in photolithography where a high-energy beam such as an ArF excimer laser beam is used as a light source.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: July 4, 2023
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Teppei Adachi, Shinya Yamashita, Masaki Ohashi, Tomohiro Kobayashi, Kenichi Oikawa, Takayuki Fujiwara
  • Patent number: 11687001
    Abstract: Provided are an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A), in which the resin (A) includes a repeating unit having an acidic group and a repeating unit having an acid-decomposable group, a content of the repeating unit having an acidic group is 15% by mole or more with respect to all the repeating units in the resin (A), a content of the repeating unit having an acid-decomposable group is more than 20% by mole with respect to all the repeating units in the resin (A), a glass transition temperature of the resin (A) is 145° C. or lower, and the actinic ray-sensitive or radiation-sensitive resin composition is used for formation of a film having a film thickness of 2 ?m or more; and a resist film, a pattern forming method, and a method for manufacturing an electronic device, each using the actinic ray-sensitive or radiation-sensitive resin composition.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: June 27, 2023
    Assignee: FUJIFILM Corporation
    Inventors: Tsutomu Yoshimura, Yasunori Yonekuta, Naoya Hatakeyama, Kohei Higashi, Yoichi Nishida
  • Patent number: 11675269
    Abstract: There is provided a composition for forming an EUV resist overlayer film that is used in an EUV lithography process, that does not intermix with the EUV resist, that blocks unfavorable exposure light for EUV exposure, for example, UV light and DUV light and selectively transmits EUV light alone, and that can be developed with a developer after exposure. A composition for forming an EUV resist overlayer film used in an EUV lithography process including a resin containing a naphthalene ring in a main chain or in a side chain and a solvent, in which the resin may include a hydroxy group, a carboxy group, a sulfo group, or a monovalent organic group having at least one of these groups as a hydrophilic group.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: June 13, 2023
    Assignee: NISSAN CHEMICAL INDUSTRIES, LTD.
    Inventors: Rikimaru Sakamoto, Bangching Ho, Takafumi Endo
  • Patent number: 11674053
    Abstract: A composition for forming an underlayer film necessary for facilitating alignment of self-assembled film into desired vertical pattern. Composition for forming an underlayer film of self-assembled film including a polymer having unit structure containing aliphatic polycyclic structure of aliphatic polycyclic compound in main chain. The polymer is a polymer having unit structure containing aliphatic polycyclic structure of aliphatic polycyclic compound with aromatic ring structure of aromatic ring-containing compound or polymer chain derived from vinyl group of vinyl group-containing compound in main chain. The polymer has unit structure of Formula (1): X—Y??Formula (1) wherein X is single bond, divalent group having vinyl structure as polymer chain, or divalent group having aromatic ring-containing structure as polymer chain, and Y is divalent group having aliphatic polycyclic structure as polymer chain. The aliphatic polycyclic compound is bi- to hexa-cyclic diene compound.
    Type: Grant
    Filed: September 16, 2014
    Date of Patent: June 13, 2023
    Assignee: NISSAN CHEMICAL INDUSTRIES, LTD.
    Inventors: Takafumi Endo, Yasunobu Someya, Hiroyuki Wakayama, Rikimaru Sakamoto
  • Patent number: 11674051
    Abstract: A stepped substrate coating composition for forming a coating film having planarity on a substrate, including: a main agent and a solvent, the main agent containing a compound (A), a compound (B), or a mixture thereof, the compound (A) having a partial structure Formula (A-1) or (A-2): and the compound (B) having at least one partial structure selected from Formulae (B-1)-(B-5), or having a partial structure including a combination of a partial structure of Formula (B-6) and a partial structure of Formula (B-7) or (B-8): where the composition is cured by photoirradiation or by heating at 30° C.-300° C.; and the amount of the main agent in the solid content of the composition is 95%-100% by mass.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: June 13, 2023
    Assignee: NISSAN CHEMICAL CORPORATION
    Inventors: Hikaru Tokunaga, Takafumi Endo, Hiroto Ogata, Keisuke Hashimoto, Makoto Nakajima
  • Patent number: 11666160
    Abstract: A monitoring and control system is provided. The system includes a plurality of sensors for obtaining readings associated with food items, such as temperature readings, freshness indications, and the like. The system is scalable and configurable with each sensor being capable of functioning as an individual sensor and/or as part of a grouping of sensors. The system is configured to obtain a variety of information, such as ambient air temperature, dwell time of food items, moisture levels, and the like, thereby enabling the system to recognize current and future concerns. The system provides audio and visual warnings and visual displays. In some embodiments, the system performs one or more physical operation based on one or more detected condition. The system is further configured to distinguish between accurate readings and inaccurate readings and/or to otherwise determine if an obstacle is preventing a sensor from obtaining an accurate reading.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: June 6, 2023
    Assignee: Unified Brands, Inc.
    Inventors: Rick Seiss, Arthur Delorenzo, Sakthivel Sandhalingam, Ryan McMartin, Gautham Ramamurthy, Athikamannil Lankayil Ajay, Begoor Gundurao Chetan
  • Patent number: 11660852
    Abstract: A planographic printing plate precursor containing in the following order: an aluminum support; an image recording layer; and a protective layer, in which a thickness of the protective layer is 0.2 ?m or greater, and in a case where a Bekk smoothness of a surface of an outermost layer at a side where the image recording layer is provided is 1000 seconds or less.
    Type: Grant
    Filed: January 28, 2021
    Date of Patent: May 30, 2023
    Assignee: FUJIFILM Corporation
    Inventors: Shuji Shimanaka, Shumpei Watanabe
  • Patent number: 11657998
    Abstract: The present invention belongs to the field of electronic display technology, and relates to a display plasma module with a patterned structure, including a pixel electrode and a transparent electrode located above the pixel electrode, characterized in that a display plasma is provided between the pixel electrode and the transparent electrode. A spacer frame is located around the display plasma. A plasma barrier array for uniformly dispersing and stabilizing the display plasma is provided on the pixel electrode and/or the transparent electrode. The plasma barrier array includes a plurality of plasma barrier frames distributed in an array. The display plasma module of the present invention replaces the existing micro-cup structure or microcapsule with the display plasma, and the plasma barrier array for uniformly dispersing and stabilizing the display plasma is provided in the display plasma.
    Type: Grant
    Filed: March 7, 2018
    Date of Patent: May 23, 2023
    Assignee: WUXI VISION PEAK TECHNOLOGY CO., LTD.
    Inventors: Jin Bao, Lei Zhang, Shan Chen
  • Patent number: 11656548
    Abstract: The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition that can provide a resist film with excellent sensitivity and a pattern with excellent LER performance, and can suppress pattern collapse during pattern formation. In addition, the present invention also provides a resist film, a pattern forming method, a mask blank with a resist film, a method for producing a photomask, and a method for manufacturing an electronic device, each using the actinic ray-sensitive or radiation-sensitive resin composition.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: May 23, 2023
    Assignee: FUJIFILM Corporation
    Inventors: Tomotaka Tsuchimura, Takashi Kawashima, Akihiro Kaneko, Michihiro Ogawa, Michihiro Shirakawa, Hajime Furutani, Kyohei Sakita
  • Patent number: 11650497
    Abstract: A resist composition which generates an acid upon exposure and whose solubility in a developing solution is changed due to an action of the acid, the resist composition including a base material component whose solubility in a developing solution is changed due to the action of an acid, an acid generator component which generates an acid upon exposure, and an organic acid which contains at least one carboxy group, in which the acid generator component contains a compound represented by formula (b1) in which R2011 to R2031 represent an aryl group, an alkyl group, or an alkenyl group. R2011 to R2031 have a total of four or more substituents containing fluorine atoms, Xn? represent an n-valent anion, and n represents an integer of 1 or greater.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: May 16, 2023
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Yasuhiro Yoshii, Yoichi Hori
  • Patent number: 11650501
    Abstract: Provided are an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A), in which the resin (A) includes a repeating unit having an acidic group and a repeating unit having an acid-decomposable group, a content of the repeating unit having an acidic group is 15% by mole or more with respect to all the repeating units in the resin (A), a content of the repeating unit having an acid-decomposable group is more than 20% by mole with respect to all the repeating units in the resin (A), a glass transition temperature of the resin (A) is 145° C. or lower, and the actinic ray-sensitive or radiation-sensitive resin composition is used for formation of a film having a film thickness of 2 ?m or more; and a resist film, a pattern forming method, and a method for manufacturing an electronic device, each using the actinic ray-sensitive or radiation-sensitive resin composition.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: May 16, 2023
    Assignee: FUJIFILM Corporation
    Inventors: Tsutomu Yoshimura, Yasunori Yonekuta, Naoya Hatakeyama, Kohei Higashi, Yoichi Nishida
  • Patent number: 11642879
    Abstract: Provided are a lithographic printing plate precursor comprising: an image-recording layer on a support, in which the image-recording layer includes a dye compound having a decomposable group that is decomposed by an acid, heat, or both and a structure in which decomposition of the decomposable group opens a ring or desorbs a leaving group and an electron-donating polymerization initiator, a method for producing a lithographic printing plate in which the lithographic printing plate precursor is used, and a color-developing composition including a dye compound having a decomposable group that is decomposed by an acid, heat, or both and a structure in which decomposition of the decomposable group opens a ring or desorbs a leaving group and an electron-donating polymerization initiator.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: May 9, 2023
    Assignee: FUJIFITM Corporation
    Inventor: Kazuaki Enomoto
  • Patent number: 11640113
    Abstract: Provided is an actinic ray-sensitive or radiation-sensitive resin composition including: (A) a resin including a repeating unit (a) represented by Formula (1); (B) a compound that generates an acid by irradiation with actinic rays or radiation; and (C) an organic solvent. A concentration of solid contents of the actinic ray-sensitive or radiation-sensitive resin composition is 4 mass % or less. (in the formula, R11 and R12 each independently represent a hydrogen atom, a halogen atom, or a monovalent organic group. R13 represents a hydrogen atom, a halogen atom, or a monovalent organic group or is a single bond or an alkylene group, and is bonded to L or Ar in the formula to form a ring. L represents a single bond or a divalent linking group. Ar represents an aromatic ring group. n represents an integer of 2 or more.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: May 2, 2023
    Assignee: FUJIFILM Corporation
    Inventors: Hideaki Tsubaki, Hajime Furutani, Akihiro Kaneko, Wataru Nihashi, Shuji Hirano
  • Patent number: 11640110
    Abstract: A resin composition which is configured such that if the resin composition is formed into a resin composition film that has a thickness of 3.0 ?m after a heat treatment at a temperature within the range of 200-350° C., the resin composition film forms a heat-resistant resin film that has a light transmittance of 50% or more at a wavelength of 365-436 nm before the heat treatment, while having a light transmittance of 10% or less at a wavelength of 365-436 nm after the heat treatment. Provided is a resin composition having a function of absorbing ultraviolet light and visible light in a short wavelength range, which is suitable for the formation of a planarization film, an insulating layer and a partition wall that are used for organic light emitting devices or display devices.
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: May 2, 2023
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Keika Hashimoto, Kazuto Miyoshi, Masao Tomikawa
  • Patent number: 11635692
    Abstract: A resist underlayer film forming composition contains a resin containing a unit structure represented by formula (1): [in formula (1), R1 represents a thiadiazole group which is optionally substituted with a C1-6 alkyl group optionally interrupted by a carboxy group, a C1-6 alkyl group optionally substituted with a hydroxyl group, or a C1-4 alkylthio group, and R2 represents a hydrogen atom or formula (2): (in formula (2), R1 is the same as defined above, and * represents a binding moiety)]. The resist underlayer film forming composition provides a resist underlayer film which has excellent solvent resistance, excellent optical parameters, an excellent dry etching rate, and excellent embeddability.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: April 25, 2023
    Assignee: NISSAN CHEMICAL CORPORATION
    Inventors: Mamoru Tamura, Hiroto Ogata, Takahiro Kishioka
  • Patent number: 11618833
    Abstract: The present invention provides an ink composition containing light-emitting nanocrystal particles and a photopolymerizable compound, wherein the photopolymerizable compound has a Log P value in the range of ?1.5 to 7.0. The present invention also provides an ink composition containing light-emitting nanocrystal particles and a photopolymerizable compound, wherein the photopolymerizable compound has a Log P value in the range of ?1.0 to 6.5, and the ink composition has a water (H2O) content of 90 ppm or less measured with a Karl Fischer moisture meter. The present invention also provides a light conversion layer including a plurality of pixel units, wherein the plurality of pixel units include a pixel unit containing a cured product of the ink composition, and the light conversion layer is formed of the cured product of the ink composition. The present invention also provides a color filter including the light conversion layer.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: April 4, 2023
    Assignee: DIC CORPORATION
    Inventors: Sunao Yoshihara, Takayuki Miki, Hirotomo Sasaki, Ikuro Kiyoto, Minoru Tabuchi
  • Patent number: 11613519
    Abstract: A monomer has the structure wherein R is an organic group comprising a polymerizable carbon-carbon double bond or carbon-carbon triple bond; X and Y are independently at each occurrence hydrogen or a non-hydrogen substituent; EWG1 and EWG2 are independently at each occurrence an electron-withdrawing group; p is 0, 1, 2, 3, or 4; n is 1, 2, 3, or 4; and M+ is an organic cation. A polymer prepared from monomer is useful as a component of a photoresist composition.
    Type: Grant
    Filed: April 18, 2016
    Date of Patent: March 28, 2023
    Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Emad Aqad, James W. Thackeray, James F. Cameron
  • Patent number: 11609494
    Abstract: A semiconductor photoresist composition includes an organometallic compound represented by Chemical Formula 1, an organometallic compound represented by Chemical Formula 2, and a solvent, and a method of forming patterns using the same. When the semiconductor photoresist composition is irradiated with e.g., extreme ultraviolet light, radical crosslinking between Sn-containing units may occur via Sn—O—Sn bond formation, and a photoresist polymer providing excellent sensitivity, small or reduced line edge roughness, and/or excellent resolution may be formed.
    Type: Grant
    Filed: April 27, 2020
    Date of Patent: March 21, 2023
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Jaehyun Kim, Kyung Soo Moon, Seungyong Chae, Ran Namgung, Seung Han
  • Patent number: 11604413
    Abstract: Provided is a photosensitive composition including: a polymer (P) which includes a structural unit derived from a vinylbenzene derivative, a structural unit including a radical polymerizable group, and a structural unit including at least one kind of functional group selected from the group consisting of a primary hydroxyl group and an amino group, and in which the content of the structural unit derived from the vinylbenzene derivative is equal to or greater than 30% by mol; and a radical polymerization initiator.
    Type: Grant
    Filed: January 3, 2019
    Date of Patent: March 14, 2023
    Assignee: FUJIFILM Corporation
    Inventors: Takashi Aridomi, Shinichi Kanna, Satoru Yamada
  • Patent number: 11605538
    Abstract: A method includes forming protective layer over substrate edge and photoresist over substrate. Protective layer removed and photoresist exposed to radiation. Protective layer made of composition including acid generator and polymer having pendant acid-labile groups.
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: March 14, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: An-Ren Zi, Ching-Yu Chang, Chin-Hsiang Lin
  • Patent number: 11590750
    Abstract: Provided are a planographic printing plate precursor including an aluminum support, and an image recording layer and a protective layer which are provided on the aluminum support in this order, in which a thickness of the protective layer is 0.2 ?m or greater, and Expression (1) is satisfied in a case where a Bekk smoothness of a surface of an outermost layer on a side opposite to a side where the image recording layer is provided is denoted by b seconds; a planographic printing plate precursor laminate; a plate-making method for a planographic printing plate; and a planographic printing method.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: February 28, 2023
    Assignee: FUJIFILM Corporation
    Inventors: Shumpei Watanabe, Shuji Shimanaka
  • Patent number: 11579528
    Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes a resin whose solubility in an aqueous alkali solution increases by the action of an acid, a compound that generates an acid upon irradiation with actinic rays or radiation, an ester compound, and a fluorine-containing polymer, in which the ester compound has alkali decomposability and has a molecular weight of 50 or more and less than 1,500.
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: February 14, 2023
    Assignee: FUJIFILM Corporation
    Inventors: Ryo Nishio, Akira Takada, Akiyoshi Goto, Naohiro Tango, Kazuhiro Marumo, Keiyu O
  • Patent number: 11573492
    Abstract: The present invention relates to a chemically amplified photoresist composition including an alkali-soluble resin including a (meth)acrylate-based resin containing a (meth)acrylate-based repeating unit in which a heterocyclic compound is substituted via a divalent functional group containing an alkylene sulfide having 1 to 20 carbon atoms.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: February 7, 2023
    Assignee: LG CHEM, LTD.
    Inventors: Hyun Min Park, Minyoung Lim, Tae Seob Lee
  • Patent number: 11561470
    Abstract: The invention aims to provide a cured film that is high in sensitivity, able to form a pattern having a small-tapered shape after a development step and after a heat curing step, helpful to depress the difference in the width of patterned openings between before and after the heat curing step, and high in light-shielding capability and also aims to provide a negative type photosensitive resin composition that serves for the production thereof.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: January 24, 2023
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yugo Tanigaki, Kazuto Miyoshi
  • Patent number: 11561507
    Abstract: The invention relates to a method of creation of three-dimensional alignment patterns that includes providing a layer of optically recordable and polarization sensitive material having a thickness that is greater than, or equal to, a predefined thickness, and concurrently illuminating the optically recordable medium with two coherent beam of same or different polarization with predetermined angle between the beams such that the said beams impinge from the same side or from the opposite sides upon the layer of the recordable material. The invention further relates to polarization volume holograms based on the said alignment patterns and polarization holographic element including a single layer or a stack of several layers of optically recordable materials containing single or multiple polarization volume holograms.
    Type: Grant
    Filed: February 11, 2019
    Date of Patent: January 24, 2023
    Assignee: META PLATFORMS TECHNOLOGIES, LLC
    Inventors: Oleg Yaroshchuk, Wai Sze Tiffany Lam, Scott Charles McEldowney, Lu Lu
  • Patent number: 11556056
    Abstract: A salt represented by formula (I): wherein Q1 and Q2 each independently represent a fluorine atom or a C1 to C6 perfluoroalkyl group, R1 and R2 each independently represent a hydrogen atom, a fluorine atom or a C1 to C6 perfluoroalkyl group, z represents an integer of 0 to 6, X1 represents *—O—, *—CO—O— or *—O—CO—, * represents a binding site to CR1R2 or CQ1Q2, L1 represents a C1 to C6 alkanediyl group, R3 represents a C5 to C18 alicyclic hydrocarbon group in which a hydrogen atom may be replaced by a hydroxy group, and in which a methylene group may be replaced by an oxygen atom or a carbonyl group, and which alicyclic hydrocarbon group may have a cyclic ketal structure optionally having a fluorine atom; and Z+ represents an organic cation.
    Type: Grant
    Filed: November 27, 2015
    Date of Patent: January 17, 2023
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Yukako Anryu, Mitsuyoshi Ochiai, Koji Ichikawa
  • Patent number: 11550220
    Abstract: A negative tone photoresist and method for developing the negative tone photoresist is disclosed. For example, the negative tone photoresist includes a solvent, a dissolution inhibitor, and a polymer. The polymer includes a hydroxyl group. The polymer may be greater than 40 weight per cent of a total weight of the negative tone photoresist.
    Type: Grant
    Filed: March 5, 2020
    Date of Patent: January 10, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Li-Po Yang, Wei-Han Lai, Ching-Yu Chang
  • Patent number: 11550217
    Abstract: A photoresist composition, including an acid-sensitive polymer and photoacid generator compound having Formula (I): wherein, EWG, Y, R, and M+ are the same as described in the specification.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: January 10, 2023
    Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Emad Aqad, William Williams, III, James F. Cameron
  • Patent number: 11518876
    Abstract: A photosensitive resin composition is provided comprising (A) 100 pbw of a phenolic hydroxyl group-containing resin, and (B) 0.1-18 pbw of an epoxy additive in the form of a compound containing 1-8 epoxy groups per molecule, containing nitrogen, sulfur or phosphorus, and having a molecular weight of 50-6,000. The composition has an improved bonding force to metal wirings.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: December 6, 2022
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoichiro Ichioka, Kazunori Kondo
  • Patent number: 11515234
    Abstract: The subject application discloses a substrate. The substrate includes a first conductive layer, a first bonding layer, a first dielectric layer, and a conductive via. The first bonding layer is disposed on the first conductive layer. The first dielectric layer is disposed on the first bonding layer. The conductive via penetrates the first dielectric layer and is electrically connected with the first conductive layer.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: November 29, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Wen Hung Huang